CN216749492U - Water-cooling resistor of ultra-high-power solid-liquid heat exchange structure - Google Patents

Abstract

The application discloses super large power solid-liquid heat transfer structure's water-cooling resistance relates to in resistor technical field. The water-cooling resistor of the ultra-high power solid-liquid heat exchange structure comprises a shell and a resistor unit; the shell is provided with a first accommodating cavity, and the top of the first accommodating cavity is provided with a plurality of first openings; the number of the resistance units is several; the resistance unit comprises an inner shell and a resistance structure, the resistance structure is arranged in the inner shell, and a connecting structure is arranged on the inner shell; the inner shell one-to-one sets up in first opening part and wears to locate first opening to make the inner shell at least part stretch into first holding the intracavity, and make connection structure and shell top butt, so that connection structure covers first opening. The water-cooling resistor unit is convenient to mount, dismount and replace, and has small difficulty and pulse absorption capacity of the water-cooling resistor of the single ultra-high-power solid-liquid heat exchange structure.

Description

Water-cooling resistor of ultra-high-power solid-liquid heat exchange structure

Technical Field

The application relates to the technical field of resistors, in particular to a water-cooling resistor of a super-power solid-liquid heat exchange structure.

Background

With the rapid development of power electronic technology, high-power electronic equipment is continuously emerging, but the heat emitted by a conventional resistor in the use process is large, so that the high-power electronic equipment usually adopts a water-cooling type resistor with high heat dissipation efficiency.

The existing water-cooling resistors are generally of three types, the first type is that the resistors are installed on a water-cooling plate, rapid heat dissipation is realized through a heat dissipation bottom plate with higher heat conductivity coefficient, for some working conditions with extremely high heat, a good heat dissipation effect is required to be achieved, and the installation type heat dissipation mode requires that the bottom plate of the resistor has a large enough contact area; secondly, deionized water is introduced into the resistor and directly contacts with the resistor part for heat dissipation, and the cost of a direct contact type heat dissipation mode is higher; the third is to directly place the cylinder with the resistor into a container containing cold water to cool the resistor, but the sealing requirement of the structure is high, so when the cylinder with the resistor is fixedly connected with the container containing cold water, a flange structure, bolts and other connecting pieces are usually required to be arranged between the cylinder and the container for matching and installation, and the installation or disassembly process is complicated and difficult.

SUMMERY OF THE UTILITY MODEL

The present application is directed to solving at least one of the problems in the prior art. For this, this application provides a water-cooling resistance of super power solid-liquid heat transfer structure, and its pulse absorption ability is strong, and it is not only comparatively convenient to install, dismantle and change resistance unit moreover, and the degree of difficulty is less moreover.

According to the water-cooling resistance of super large power solid-liquid heat transfer structure of this application embodiment, include: the shell is provided with a first accommodating cavity and a first opening communicated with the first accommodating cavity, and the first opening is provided with a plurality of openings and is arranged at the top of the shell; the resistor units are provided with a plurality of resistors; the resistor unit comprises an inner shell and a resistor structure, the resistor structure is arranged in the inner shell, and a connecting structure is arranged on the inner shell; the inner shell is arranged in the first opening in a penetrating mode in a one-to-one correspondence mode and extends into the first accommodating cavity, and the connecting structure is abutted to the top of the outer shell and covers the first opening.

According to the water-cooling resistance of super large power solid-liquid heat transfer structure of this application embodiment, following beneficial effect has at least:

the top of the outer shell is provided with a plurality of first openings communicated with the first accommodating cavities, the resistor units are correspondingly provided with a plurality of inner shells, the inner shells correspondingly penetrate through the first openings one by one and extend into the first accommodating cavities, the first accommodating cavities of the outer shell are used for accommodating cold water or other liquid, so that the outer walls of the inner shells can be in direct contact with the cold water or other liquid in the first accommodating cavities, the heat exchange between the resistor structures and the cold water or other liquid in the first accommodating cavities through the inner shells is realized, and the resistor structures are cooled; and after the inner shell stretches into the first accommodating cavity, the connecting structure on the inner shell can be abutted against the top of the outer shell, so as to limit the position of the inner shell relative to the outer shell, thereby limiting the depth of the inner shell stretching into the first accommodating cavity, and the connecting structure can cover and seal the first opening, thereby avoiding cold water or other liquid in the first accommodating cavity from flowing out from the first opening, and the connecting structure can further improve the sealing property of sealing the first opening by relying on the gravity of the resistance unit, therefore, the water-cooling resistor of the ultra-high-power solid-liquid heat exchange structure can be installed, disassembled or replaced one by one, and when the resistor unit is installed, disassembled and replaced, the resistor unit is taken down from the first opening, so that the resistor unit is convenient to install, disassemble and replace, and the difficulty is small; a resistance unit can be placed at each first opening, and a plurality of resistance units can be electrically connected with one another so as to improve the pulse absorption capacity of the water-cooling resistor of a single ultra-high-power solid-liquid heat exchange structure.

According to some embodiments of the application, the first opening is circular, the connection structure is ring-shaped, and the radius of the first opening is smaller than the outer radius of the connection structure.

According to some embodiments of the present application, the connection structure is provided at an upper portion of the inner case.

According to some embodiments of the present application, the resistor structure includes a first electrode sheet, a resistor body, a connector, and a second electrode sheet; the first electrode plate is connected with the top of the resistor body, the connecting piece is connected with the bottom of the resistor body, and the second electrode plate is connected with the connecting piece.

According to some embodiments of the present application, the inner case is provided with a second receiving chamber and a second opening communicating with the second receiving chamber, the second opening being provided at a top of the inner case; the resistor body and the connecting piece are arranged in the second accommodating cavity, and the first electrode plate and the second electrode plate are arranged on one side, close to the second opening, of the resistor body.

According to some embodiments of the present application, the resistive structure further comprises an insulating sleeve; the connecting piece including the connecting rod and with the connecting block that the connecting rod is connected, the connecting block set up in the resistive element with the bottom of connecting rod, insulating cover sleeve is located the connecting rod.

According to some embodiments of the application, the resistor body is provided with a through hole extending in a height direction, and the connecting rod and the insulating sleeve are both arranged in the through hole and extend to two ends of the resistor body.

According to some embodiments of the present application, a potting layer is further included; the potting layer is filled between the inner shell and the resistor body.

According to some embodiments of the application, a water inlet and a water outlet are provided on the side wall of the housing, the water outlet being higher than the water inlet.

Additional aspects and advantages of the present application will be set forth in part in the description which follows and, in part, will be obvious from the description, or may be learned by practice of the present application.

Drawings

The above and additional aspects and advantages of the present application will become apparent and readily appreciated from the following description of the embodiments, taken in conjunction with the accompanying drawings of which:

fig. 1 is a schematic structural diagram of a water-cooling resistor of an ultra-high-power solid-liquid heat exchange structure of the present application;

FIG. 2 is a schematic structural diagram of a housing of a water-cooling resistor of the ultra-high power solid-liquid heat exchange structure of the present application;

FIG. 3 is a sectional view of a water-cooled resistor of the ultra-high power solid-liquid heat exchange structure of FIG. 1;

fig. 4 is a sectional view of a resistance unit of the water-cooling resistance of the ultra-high power solid-liquid heat exchange structure of the present application;

fig. 5 is a schematic structural diagram of a resistor structure of a water-cooling resistor of the ultra-high-power solid-liquid heat exchange structure of the present application.

Reference numerals:

a housing 100; a first accommodating chamber 110; a first opening 120; a water inlet 130; a water outlet 140;

a resistance unit 200; an inner case 210; the connecting structure 211; a second opening 212; a resistive structure 220; a first electrode sheet 221; a resistor body 222; a connecting member 223; a connecting rod 2231; a connecting block 2232; a second electrode sheet 224; a potting layer 230; an insulating sleeve 240.

Detailed Description

Reference will now be made in detail to the embodiments of the present application, examples of which are illustrated in the accompanying drawings, wherein like or similar reference numerals refer to the same or similar elements or elements having the same or similar function throughout. The embodiments described below with reference to the drawings are exemplary only for the purpose of explaining the present application and are not to be construed as limiting the present application.

In the description of the present application, it is to be understood that the positional descriptions, such as the directions of up, down, left, right, front, rear, and the like, referred to as positional or positional relationships are based on the directions or positional relationships shown in the drawings, and are only for convenience of description and simplification of description, but do not indicate or imply that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation, and thus, should not be construed as limiting the present application.

In the description of the present application, if there are first and second described only for the purpose of distinguishing technical features, it is not understood that relative importance is indicated or implied or that the number of indicated technical features or the precedence of the indicated technical features is implicitly indicated or implied.

In the description of the present application, unless otherwise specifically limited, terms such as set, installed, connected and the like should be understood broadly, and those skilled in the art can reasonably determine the specific meanings of the above terms in the present application in combination with the specific contents of the technical solutions.

The water-cooling resistor of the ultra-high-power solid-liquid heat exchange structure according to the embodiment of the application is described below with reference to fig. 1 to 5.

According to the water-cooling resistor of the ultra-high-power solid-liquid heat exchange structure, the water-cooling resistor of the ultra-high-power solid-liquid heat exchange structure comprises a shell 100 and a resistor unit 200; the housing 100 is provided with a first accommodating cavity 110 and a first opening 120 communicated with the first accommodating cavity 110, and the first opening 120 is provided with a plurality of openings and arranged at the top of the housing 100; the resistance units 200 are provided in number; the resistor unit 200 includes an inner housing 210 and a resistor structure 220, the resistor structure 220 is disposed in the inner housing 210, and the inner housing 210 is provided with a connecting structure 211; the inner shells 210 are correspondingly inserted into the first openings 120 and extend into the first accommodating cavities 110, and the connecting structures 211 are abutted against the top of the outer shell 100 and cover the first openings 120.

A plurality of first openings 120 communicated with the first accommodating cavity 110 are arranged at the top of the outer shell 100, a plurality of resistor units 200 are correspondingly arranged, the inner shells 210 correspondingly penetrate through the first openings 120 one by one and extend into the first accommodating cavity 110, and the first accommodating cavity 110 of the outer shell 100 is used for accommodating cold water or other liquid, so that the outer wall of the inner shell 210 can be directly contacted with the cold water or other liquid in the first accommodating cavity 110, and the resistor structure 220 and the cold water or other liquid in the first accommodating cavity 110 exchange heat through the inner shell 210 to cool the resistor structure 220; after the inner housing 210 extends into the first accommodating cavity 110, the connecting structure 211 on the inner housing 210 can abut against the top of the outer housing 100 to define the position of the inner housing 210 relative to the outer housing 100, so as to define the depth of the inner housing 210 extending into the first accommodating cavity 110, and the connecting structure 211 can cover and close the first opening 120, so as to prevent cold water or other liquid in the first accommodating cavity 110 from flowing out from the first opening 120, and the connecting structure 211 can further improve the sealing property of closing the first opening 120 by means of the gravity of the resistor unit 200, therefore, the water-cooled resistor can be used for installing, disassembling or replacing the resistor units 200 one by one, and when installing, disassembling and replacing the resistor units 200, only the resistor unit 200 needs to be directly put into the first accommodating cavity 110 from the first opening 120, or directly take the resistor unit 200 out from the first opening 120, which makes it more convenient to install, disassemble and replace the resistor unit 200, the difficulty is small; one resistance unit 200 can be placed at each first opening 120, and a plurality of resistance units 200 can be electrically connected with one another so as to improve the pulse absorption capacity of the water-cooling resistor of a single ultra-high-power solid-liquid heat exchange structure.

Referring to fig. 1 to 4, it can be understood that the first opening 120 has a circular shape and the connection structure 211 has a circular ring shape, and the radius of the first opening 120 is smaller than the outer radius of the connection structure 211.

Connection structure 211 encircles the setting on the inner shell 210 lateral wall, connection structure 211 is the ring shape, connection structure 211's excircle radius is greater than first opening 120's radius, inner shell 210 stretches into first chamber 110 back that holds from first opening 120, connection structure 211 can cover and seal first opening 120, furthermore, because first opening 120 is circular, connection structure 211 is the ring shape, inner shell 210 is when first opening 120 internal horizontal migration, connection structure 211 can be located first opening 120 top and cover first opening 120 all the time, and can avoid connection structure 211 to drop to first chamber 110 that holds from first opening 120 in, improve the security.

Specifically, the connection structure 211 is a flange structure; the connecting structure 211 is integrally formed with the inner housing 210; connection structure 211's bottom is provided with the butt face that is used for with shell 100 top butt, specifically, connection structure 211 encircles the setting of inner shell 210 lateral wall, and the terminal surface at shell 100 top is the horizontal plane, and correspondingly, connection structure 211's bottom terminal surface also is the horizontal plane, and connection structure 211's bottom and shell 100's top laminating can better cover and seal first opening 120.

Specifically, the inner housing 210 is a cylinder, and the radius of the inner housing 210 is less than or equal to the radius of the first opening 120; because the inner shell 210 is cylindrical and the first opening 120 is circular, the surfaces of the inner shell 210 contacting with the inner wall of the first opening 120 are both arc surfaces, and the damage caused by collision between the inner shell 210 and the inner wall of the first opening 120 can be reduced; the radius of the inner shell 210 is smaller than that of the first opening 120, so that the cylindrical inner shell 210 can smoothly pass through the first opening 120; specifically, the radius of the inner case 210 may be equal to the radius of the first opening 120, so that the inner case 210 is caught at the first opening 120 to further improve the stability of the inner case 210 mounted on the outer case 100.

Specifically, the distance between the top wall and the bottom wall of the first receiving cavity 110 is greater than or equal to the length of the inner shell 210 extending in the height direction; connecting structure 211 sets up in the inner shell 210 lateral wall, the inner shell 210 stretches into in the first chamber 110 that holds from first opening 120 until connecting structure 211's bottom and inner shell 210 top butt, because the distance between the first top wall that holds the chamber 110 and the diapire, be greater than the length that the inner shell 210 extends along the direction of height, this makes the inner shell 210 stretch into the first chamber 110 that holds in the back the bottom of inner shell 210 and the first certain distance of interval between the diapire that holds the chamber 110, the area of contact between the liquid that has increased inner shell 210 and the first chamber 110 that holds has increased, and can avoid the inner shell 210 to stretch into the first chamber 110 in the bottom of back inner shell 210 and the first diapire that holds the chamber 110 to collide.

In other embodiments of the present application, a distance between the top wall and the bottom wall of the first accommodating cavity 110 is equal to a length of the inner shell 210 extending in the height direction, and the connecting structure 211 is disposed at a top position of the side wall of the inner shell 210, so that after the inner shell 210 extends into the first accommodating cavity 110, the bottom of the inner shell 210 can abut against the bottom wall of the first accommodating cavity 110, thereby improving stability of the inner shell 210 in the first accommodating cavity 110, and reducing a degree of movement or inclination of the inner shell 210 caused by collision of liquid flowing in the first accommodating cavity 110.

Referring to fig. 1 and 3, it can be understood that the connection structure 211 is disposed at the upper portion of the inner casing 210 such that most of the structure below the inner casing 210 is located in the first receiving cavity 110, such that the contact area between the inner casing 210 and the cold water or other liquid in the first receiving cavity 110 is increased, thereby improving the cooling efficiency of the resistance unit 200; specifically, according to specific circumstances, the connection structure 211 may be disposed at the top of the inner case 210 so that the inner case 210 of the resistance unit 200 is completely in contact with the first receiving cavity 110, thereby maximizing the heat dissipation area of the resistance unit 200 to further improve the heat dissipation efficiency.

Referring to fig. 4 and 5, it can be understood that the resistor structure 220 includes a first electrode sheet 221, a resistor body 222, a connector 223, and a second electrode sheet 224; the first electrode sheet 221 is connected to the top of the resistor 222, the connector 223 is connected to the bottom of the resistor 222, and the second electrode sheet 224 is connected to the connector 223.

The resistor structure 220 includes a first electrode plate 221, a resistor 222, a connector 223, and a second electrode plate 224, which are connected in sequence, the first electrode plate 221 and the second electrode plate 224 are used for electrically connecting with external devices, the resistor 222 and the connector 223 are disposed in the second receiving cavity, and the inner shell 210 covers the resistor 222 and the connector 223 therein to protect the resistor 222 and the connector 223.

Since the first electrode sheet 221 is connected to the top of the resistor 222, and the connecting member 223 is connected to the bottom of the resistor 222, the resistor 222 can be formed by connecting a plurality of resistors in series, and the pulse-carrying capacity of the whole resistor is further enhanced. Specifically, since the top of the housing 100 is provided with the plurality of first openings 120, one resistor unit 200 is placed at each first opening 120, and the first electrode piece 221 or the second electrode piece 224 of the resistor structure 220 of any one resistor unit 200 can be electrically connected with the first electrode piece 221 or the second electrode piece 224 of the resistor structure 220 of another resistor unit 200, so as to connect the resistor bodies 222 of different resistor units 200 in series, thereby further enhancing the pulse tolerance of the water-cooled resistor.

Referring to fig. 4, it can be understood that the inner case 210 is provided with a second receiving chamber and a second opening 212 communicating with the second receiving chamber, the second opening 212 being provided at the top of the inner case 210; the resistor 222 and the connector 223 are both disposed in the second accommodating cavity, and the first electrode piece 221 and the second electrode piece 224 are both disposed on the side of the resistor 222 close to the second opening 212.

The top of the inner shell 210 is provided with a second opening 212, the second opening 212 is communicated with a second accommodating cavity of the inner shell 210, and the resistor structure 220 can extend into the second accommodating cavity from the second opening 212; the first electrode piece 221 and the second electrode piece 224 are both disposed near the second opening 212 to facilitate electrical connection of an external device with the resistor 222 through the first electrode piece 221 and the second electrode piece 224, specifically, the first electrode piece 221 and the second electrode piece 224 are disposed in the second accommodating cavity, and portions of the first electrode piece 221 and the second electrode piece 224 protrude out of the second opening 212, so that the first electrode piece 221 and the second electrode piece 224 are prevented from being bent by an external factor.

Referring to fig. 4, it can be appreciated that the resistive structure 220 further includes an insulating sleeve 240; the connecting member 223 includes a connecting rod 2231 and a connecting block 2232 connected to the connecting rod 2231, the connecting block 2232 is disposed at the bottom of the resistor 222 and the connecting rod 2231, and the insulating sleeve 240 is disposed on the connecting rod 2231.

The insulating sleeve 240 is sleeved on the connecting rod 2231 to prevent the side wall of the connecting rod 2231 from contacting with the resistor 222, the connecting block 2232 is arranged at the bottom of the resistor 222 and the connecting rod 2231, the connecting block 2232 and the connecting rod 2231 are integrally formed and abutted against the bottom of the resistor 222, and the connecting block 2232 and the connecting rod 2231 are made of conductive materials to electrically connect the resistor 222 and the connecting piece 223; specifically, the first electrode piece 221 and the second electrode piece 224 are both disposed near the top of the inner casing 210, wherein the first electrode piece 221 is located at the top of the insulating sleeve 240, and the insulating sleeve 240 can prevent the first electrode piece 221 from directly contacting the second electrode piece 224.

Since the first electrode plate 221 is connected to the top of the resistor body 222, the second electrode plate 224 is connected to the top of the connecting rod 2231, and the connecting block 2232 is connected to the connecting rod 2231 and the bottom of the resistor body 222, when the external device electrically connects the first electrode plate 221 and the second electrode plate 224, the current output from the external device travels along a long path in the resistor body 222, thereby ensuring the effect of the resistor body 222 on blocking the current.

Referring to fig. 4, it can be understood that the resistor body 222 is provided with a through hole extending in a height direction, and the connection rod 2231 and the insulation sleeve 240 are both provided in the through hole and extend to both ends of the resistor body 222.

A through hole penetrating through the resistor body 222 is formed in the resistor body 222, the connecting piece 223 comprises a connecting rod 2231 and a connecting block 2232 connected with the connecting rod 2231, and the connecting rod 2231 and the insulating sleeve 240 are arranged in the through hole, so that the whole structure of the resistor structure 220 is more compact, the connecting rod 2231 can play a role in positioning the resistor structure 220, and the insulating sleeve 240 can fully ensure the safety and avoid electric leakage of the resistor structure 220; specifically, since the inner case 210 is a cylinder, the resistor 222 is also a cylinder.

Referring to fig. 4 and 5, it can be appreciated that the resistive structure 220 further includes a potting layer 230; the potting layer 230 is filled between the inner case 210 and the resistor 222.

The potting layer 230 is connected with the inner wall of the inner shell 210 and the outer wall of the resistor body 222, the potting layer 230 can be connected with the resistor body 222 and the inner shell 210, the stability of connection of the resistor body 222 and the inner shell 210 is improved, and meanwhile the heat dissipation effect and the safety of the resistor structure 220 in use can be guaranteed; a through hole penetrating through the resistor body 222 is formed in the resistor body 222, the connector 223 is arranged in the through hole, the potting layer 230 is arranged on the side wall of the inner shell 210, so that the potting layer 230 can be in contact with the peripheral wall of the resistor body 222, and the potting layer 230 is formed by solidifying a material with good heat conductivity and insulation effect, so that the potting layer 230 can uniformly conduct heat emitted by the resistor body 222 to the inner shell 210 and then to cold water or other liquid in contact with the inner shell 210, and the resistor body 222 is cooled.

Specifically, since the inner case 210 is a cylinder, the resistor 222 is also a cylinder; a through hole, a connecting rod 2231 and a connecting block 2232 are arranged on the resistor body 222, the potting layer 230 is contacted with the peripheral wall of the resistor body 222, and the heat exchange efficiency between the resistor body 222 and the cold water or other liquid in the first accommodating cavity 110 is improved; after the resistor structure 220 is placed in the second accommodating cavity, a potting material is poured between the inner wall of the inner shell 210 and the resistor body 222, and then the potting material is cured to form a potting layer 230; the heat dissipation efficiency of the resistor 222 is improved by mounting extended heat dissipation fins on the upper and lower end surfaces of the resistor 222 and increasing the surface area of the resistor 222.

Referring to fig. 1 and 2, it can be understood that the housing 100 is provided at a side wall thereof with a water inlet 130 and a water outlet 140, and the water outlet 140 is higher than the water inlet 130.

In order to increase the time for the first accommodating chamber 110 to contact with the inner casing 210, the water outlet 140 is located higher than the water inlet 130 by adopting a low-in-high water flow mode, that is, the water inlet 130 is located at the lower part of the side wall of the first accommodating chamber 110, and the water outlet 140 is located at the upper part of the side wall of the first accommodating chamber 110; cold water can enter the second accommodating cavity from the water inlet 130, flow in the second accommodating cavity and flow out from the water outlet 140, and the time for the cold water to stay in the second accommodating cavity can be prolonged because the water outlet 140 is higher than the water inlet 130, so that the effect of cooling the resistor structure 220 is improved; according to the specific situation, the water inlet 130 can also be arranged at the bottom of the casing 100, the water outlet 140 can also be arranged at the top of the casing 100, and a plurality of water inlets 130 and water outlets 140 can be arranged.

In the description herein, references to the description of "one embodiment," "some embodiments," or "some examples," etc., mean that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the application. In this specification, the schematic representations of the terms used above do not necessarily refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.

While embodiments of the present application have been shown and described, it will be understood by those of ordinary skill in the art that: various changes, modifications, substitutions and alterations can be made to the embodiments without departing from the principles and spirit of the application, the scope of which is defined by the claims and their equivalents.

Claims (9)

1. Super high power solid-liquid heat transfer structure's water-cooling resistance, its characterized in that includes:

the shell is provided with a first accommodating cavity and a first opening communicated with the first accommodating cavity, and the first opening is provided with a plurality of openings and is arranged at the top of the shell;

the resistor units are provided with a plurality of resistors; the resistor unit comprises an inner shell and a resistor structure, the resistor structure is arranged in the inner shell, and a connecting structure is arranged on the inner shell; the inner shell is arranged in the first opening in a penetrating mode in a one-to-one correspondence mode and extends into the first accommodating cavity, and the connecting structure is abutted to the top of the outer shell and covers the first opening.

2. The water-cooling resistor of the ultra-high power solid-liquid heat exchange structure of claim 1, wherein the first opening is circular, the connection structure is circular, and the radius of the first opening is smaller than the outer radius of the connection structure.

3. The water-cooled resistor of the ultra-high power solid-liquid heat exchange structure of claim 1, wherein the connection structure is arranged at the upper part of the inner shell.

4. The water-cooled resistor of the ultra-high-power solid-liquid heat exchange structure according to claim 1, wherein the resistor structure comprises a first electrode plate, a resistor, a connector and a second electrode plate; the first electrode plate is connected with the top of the resistor body, the connecting piece is connected with the bottom of the resistor body, and the second electrode plate is connected with the connecting piece.

5. The water-cooled resistor of the ultra-high-power solid-liquid heat exchange structure according to claim 4, wherein the inner shell is provided with a second accommodating cavity and a second opening communicated with the second accommodating cavity, and the second opening is arranged at the top of the inner shell; the resistor body and the connecting piece are arranged in the second accommodating cavity, and the first electrode plate and the second electrode plate are arranged on one side, close to the second opening, of the resistor body.

6. The water-cooling resistor of the ultra-high-power solid-liquid heat exchange structure of claim 5, wherein the resistor structure further comprises an insulating sleeve; the connecting piece including the connecting rod and with the connecting block that the connecting rod is connected, the connecting block set up in the resistive element with the bottom of connecting rod, insulating cover sleeve is located the connecting rod.

7. The water-cooled resistor with the ultra-high power solid-liquid heat exchange structure according to claim 6, wherein the resistor body is provided with a through hole extending along a height direction, and the connecting rod and the insulating sleeve are both arranged in the through hole and extend to two ends of the resistor body.

8. The water-cooled resistor of the ultra-high-power solid-liquid heat exchange structure of claim 5, wherein the resistor structure further comprises an encapsulation layer; the potting layer is filled between the inner shell and the resistor body.

9. The water-cooled resistor of the ultra-high power solid-liquid heat exchange structure of claim 1, wherein a water inlet and a water outlet are arranged on the side wall of the housing, and the water outlet is higher than the water inlet.

Images