CN216748439U - Photoresist matching material drying equipment - Google Patents
Photoresist matching material drying equipment Download PDFInfo
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- CN216748439U CN216748439U CN202122562662.6U CN202122562662U CN216748439U CN 216748439 U CN216748439 U CN 216748439U CN 202122562662 U CN202122562662 U CN 202122562662U CN 216748439 U CN216748439 U CN 216748439U
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- bearing
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- material drying
- wafer
- matching material
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Abstract
The utility model relates to the field of drying equipment, and adopts the technical scheme that: the utility model provides a supporting material drying equipment of photoresist, includes the box and sets up bearing frame in the box, bear and to dismantle the connection loading board on the frame, it is connected with the runner assembly who is used for placing the wafer to rotate on the loading board, and be equipped with drive assembly in the box, drive assembly links to each other with the runner assembly transmission. The drying equipment has an electric heating drying function, the wafer is placed on the rotating assembly on the bearing plate, the rotating assembly can rotate under the driving of the driving assembly, and meanwhile, the wafer also rotates, so that the wafer can be fully and uniformly heated, and the photoresist on the upper surface of the wafer can be prevented from being heated unevenly. The bearing frame and the bearing plate adopt a detachable connection structure, so that the wafer is convenient to take and place.
Description
Technical Field
The utility model relates to the field of drying equipment, in particular to photoresist matching material drying equipment.
Background
In wafer processing, a photoetching process is crucial, and a general procedure is that a wafer is pretreated and then subjected to rotary gluing, then exposure and development are carried out, and finally photoresist is removed, after the wafer is subjected to rotary gluing, the wafer needs to be dried at a high temperature to volatilize a solvent, and simultaneously, film stress caused by rotary gluing is eliminated, so that the adhesiveness of the photoresist on a substrate is improved.
The existing drying causes uneven heating of the photoresist at the center and the edge of the wafer and the photoresist on the upper surface and the upper surface of the wafer, so that the hardness degree of the dried photoresist is different, and even the photoresist can crack.
Disclosure of Invention
The utility model aims to provide photoresist matching material drying equipment.
In order to realize the purpose of the utility model, the technical proposal adopted by the utility model is as follows: the utility model provides a supporting material drying equipment of photoresist, includes the box and sets up bearing frame in the box, bear and to dismantle the connection loading board on the frame, it is connected with the runner assembly who is used for placing the wafer to rotate on the loading board, and be equipped with drive assembly in the box, drive assembly links to each other with the runner assembly transmission.
Preferably, heating plates are arranged on the top wall and the bottom wall of the box body.
Preferably, the rotating assembly comprises a plurality of mounting holes formed in the bearing plate, an annular inner cavity corresponding to the mounting holes is formed in the bearing plate, rotating rings are arranged in the annular inner cavity, two adjacent annular inner cavities are communicated, the two adjacent rotating rings are in transmission connection, and one rotating ring is in transmission connection with the driving assembly; the inner wall of the mounting hole is provided with a plurality of through holes communicated with the annular inner cavity, a bearing column penetrates through the through holes, one end of the bearing column is in transmission connection with the rotating ring, and the inner end of the bearing column extends into the mounting hole.
Preferably, the inner wall of the through hole is provided with a limiting groove, the outer wall of the bearing column is provided with a limiting bulge, and the limiting bulge is inserted in the limiting groove.
Preferably, the bearing frame is provided with slots, and the two sides of the bearing plate are respectively inserted into the corresponding slots.
Preferably, the driving assembly comprises a motor arranged inside the box body, an output shaft of the motor is connected with a driving gear, the outer wall of the rotating ring is provided with driven teeth, and the driving gear is meshed with the rotating ring.
Preferably, the bearing column and the rotating ring are in gear transmission.
Preferably, the bearing column positioned in the mounting hole is provided with anti-skid grains.
Preferably, the edge of the mounting hole is provided with a mounting groove for taking and placing the wafer.
The beneficial effects of the utility model are concentrated and expressed as follows:
1. the drying equipment has an electric heating drying function, the wafer is placed on the rotating assembly on the bearing plate, the rotating assembly can rotate under the driving of the driving assembly, and meanwhile, the wafer also rotates, so that the wafer can be fully and uniformly heated, and the photoresist on the upper surface of the wafer can be prevented from being heated unevenly.
2. The bearing frame and the bearing plate adopt a detachable connection structure, so that the wafer is convenient to take and place.
Drawings
FIG. 1 is a schematic view of the overall structure of the present invention;
FIG. 2 is a top view of the carrier plate of the present invention;
FIG. 3 is a view from A-A in the configuration of FIG. 2;
illustration of the drawings: 1. a box body; 2. a carrier; 3. a carrier plate; 4. heating the plate; 5. mounting holes; 6. an annular inner cavity; 7. a rotating ring; 8. a through hole; 9. a load bearing column; 10. a limiting groove; 11. a limiting bulge; 12. inserting slots; 13. anti-skid lines; 14. and placing the groove.
Detailed Description
In order to make the technical solutions of the present invention better understood by those skilled in the art, the present invention will be further described in detail with reference to the accompanying drawings and specific embodiments.
As shown in fig. 1-3, a photoresist matching material drying apparatus includes a box 1 and a bearing frame 2 disposed in the box 1, in this embodiment, the box 1 has a box door, and the box door is hinged on the box 1; the bearing frame 2 can be a pair of mounting plates arranged in the box body 1 and distributed on two sides of the interior of the box body 1; or the inner wall of the box body 1 can be directly used as the bearing frame 2; bear and to dismantle on the frame 2 and connect loading board 3, can in this embodiment bear and be equipped with slot 12 on the frame 2, the both sides of loading board 3 are inserted and are established respectively in corresponding slot 12, are convenient for get to putting of loading board 3, it is connected with the runner assembly who is used for placing the wafer to rotate on the loading board 3, and be equipped with drive assembly in the box 1, drive assembly links to each other with the runner assembly transmission, and loading board 3 inserts and bears the back on frame 2, and the runner assembly just can combine together with drive assembly.
Further, all be equipped with hot plate 4 on the roof of box 1 and the diapire, the mode of heating simultaneously is dried the wafer about adopting, can improve the efficiency of drying.
Furthermore, the rotating assembly can be a turntable arranged on the bearing plate 3, and the wafer is directly placed on the turntable, because the drying mode of heating up and down simultaneously is adopted in the embodiment, after the turntable is arranged below the wafer, the heating plate 4 heats other components such as the turntable firstly, and then the heat is transferred to the wafer; therefore, the heating efficiency of the lower surface of the wafer is weakened to a certain extent, the temperature difference between the upper surface and the lower surface in the early drying period is too large, and the drying efficiency and the quality of the wafer are influenced.
In order to avoid the above problems, another rotating assembly is provided in this embodiment, that is, the rotating assembly includes a plurality of mounting holes 5 disposed on the bearing plate 3, an annular inner cavity 6 corresponding to the mounting holes 5 is disposed in the bearing plate 3, a rotating ring 7 is disposed in the annular inner cavity 6, two adjacent annular inner cavities 6 are communicated, and two adjacent rotating rings 7 are in transmission connection, wherein one rotating ring 7 is in transmission connection with the driving assembly; the inner wall of the mounting hole 5 is provided with a plurality of through holes 8 communicated with the annular inner cavity 6, the through holes 8 are internally provided with bearing columns 9 in a penetrating way, one ends of the bearing columns 9 are in transmission connection with a rotating ring 7, the inner ends of the bearing columns 9 extend into the mounting hole 5, the edges of the wafers are placed on the bearing columns 9 in the mounting hole 5, in the embodiment, the bearing columns 9 and the rotating ring 7 adopt gear transmission, one ends of the bearing columns 9 are in a bevel gear structure, the rotating ring 7 is provided with teeth which are meshed with each other, the rotating ring 7 rotates to drive the bearing columns 9 to rotate, the simulation turntable drives the wafers to rotate, at the moment, the heating plate 4 can directly dry the lower surfaces of the wafers, the bearing columns 9 drive the wafers to rotate, uneven heating of the lower surfaces of the wafers due to shielding of the bearing columns 9 can also be avoided, and the number of the bearing columns 9 in the embodiment is as large as possible, such as six, eight, etc.
Furthermore, a limiting groove 10 is formed in the inner wall of the through hole 8, a limiting protrusion 11 is formed in the outer wall of the bearing column 9, and the limiting protrusion 11 is inserted into the limiting groove 10, so that the bearing column 9 is prevented from moving in the through hole 8 to affect the joint of the bearing column 9 and the rotating ring 7.
Further, the driving assembly comprises a motor arranged inside the box body 1, an output shaft of the motor is connected with a driving gear, in the embodiment, the motor and the driving gear are not shown in the figure, the outer wall of the rotating ring 7 is provided with driven teeth, and the driving gear is meshed with the rotating ring 7; and the adjacent two rotating rings 7 adopt tooth meshing transmission.
Furthermore, the bearing column 9 positioned in the mounting hole 5 is provided with anti-skid grains 13, so that the friction force between the bearing column 9 and the wafer is increased, and the wafer can be normally driven to rotate and dry.
Furthermore, a mounting groove 14 for taking and placing the wafer is arranged at the edge of the mounting hole 5.
It should be noted that, for simplicity of description, the above-mentioned embodiments of the method are described as a series of acts or combinations, but those skilled in the art should understand that the present application is not limited by the order of acts described, as some steps may be performed in other orders or simultaneously according to the present application. Further, those skilled in the art should also appreciate that the embodiments described in the specification are preferred embodiments and that the acts and elements referred to are not necessarily required in this application.
Claims (9)
1. The utility model provides a supporting material drying equipment of photoresist which characterized in that: including box (1) and set up bearing frame (2) in box (1), bear and dismantle on bearing frame (2) and connect loading board (3), it is connected with the runner assembly that is used for placing the wafer to rotate on loading board (3), and be equipped with drive assembly in box (1), drive assembly links to each other with the runner assembly transmission.
2. The photoresist matching material drying device according to claim 1, characterized in that: heating plates (4) are arranged on the top wall and the bottom wall of the box body (1).
3. The photoresist matching material drying device according to claim 2, characterized in that: the rotating assembly comprises a plurality of mounting holes (5) formed in the bearing plate (3), annular inner cavities (6) corresponding to the mounting holes (5) are formed in the bearing plate (3), rotating rings (7) are arranged in the annular inner cavities (6), two adjacent annular inner cavities (6) are communicated, the two adjacent rotating rings (7) are in transmission connection, and one rotating ring (7) is in transmission connection with the driving assembly; the inner wall of the mounting hole (5) is provided with a plurality of through holes (8) communicated with the annular inner cavity (6), the through holes (8) are internally provided with bearing columns (9) in a penetrating manner, one ends of the bearing columns (9) are in transmission connection with the rotating ring (7), and one inner ends of the bearing columns (9) extend into the mounting hole (5).
4. The photoresist matching material drying device according to claim 3, characterized in that: the inner wall of the through hole (8) is provided with a limiting groove (10), the outer wall of the bearing column (9) is provided with a limiting bulge (11), and the limiting bulge (11) is inserted in the limiting groove (10).
5. The photoresist matching material drying device according to claim 3, characterized in that: be equipped with slot (12) on bearing frame (2), the both sides of bearing board (3) are inserted and are established respectively in corresponding slot (12).
6. The photoresist matching material drying device according to claim 3, characterized in that: the driving assembly comprises a motor arranged inside the box body (1), an output shaft of the motor is connected with a driving gear, the outer wall of the rotating ring (7) is provided with driven teeth, and the driving gear is meshed with the rotating ring (7).
7. The photoresist matching material drying device according to claim 3, characterized in that: the bearing column (9) and the rotating ring (7) adopt gear transmission.
8. The photoresist matching material drying device according to claim 3, characterized in that: the bearing column (9) positioned in the mounting hole (5) is provided with anti-skid grains (13).
9. The photoresist matching material drying device according to claim 3, characterized in that: and a placing groove (14) for taking and placing the wafer is arranged at the edge of the mounting hole (5).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202122562662.6U CN216748439U (en) | 2021-10-25 | 2021-10-25 | Photoresist matching material drying equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202122562662.6U CN216748439U (en) | 2021-10-25 | 2021-10-25 | Photoresist matching material drying equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN216748439U true CN216748439U (en) | 2022-06-14 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202122562662.6U Active CN216748439U (en) | 2021-10-25 | 2021-10-25 | Photoresist matching material drying equipment |
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| Country | Link |
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| CN (1) | CN216748439U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116682766A (en) * | 2023-08-01 | 2023-09-01 | 北京特思迪半导体设备有限公司 | Oven for heating wafer and waxing machine |
-
2021
- 2021-10-25 CN CN202122562662.6U patent/CN216748439U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116682766A (en) * | 2023-08-01 | 2023-09-01 | 北京特思迪半导体设备有限公司 | Oven for heating wafer and waxing machine |
| CN116682766B (en) * | 2023-08-01 | 2023-10-10 | 北京特思迪半导体设备有限公司 | Oven for heating wafer and waxing machine |
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