CN216747814U - Chip fixing device and mechanical arm assembly - Google Patents

Chip fixing device and mechanical arm assembly Download PDF

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Publication number
CN216747814U
CN216747814U CN202123429848.0U CN202123429848U CN216747814U CN 216747814 U CN216747814 U CN 216747814U CN 202123429848 U CN202123429848 U CN 202123429848U CN 216747814 U CN216747814 U CN 216747814U
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chip
piece
horizontal
base
groove
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CN202123429848.0U
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Chinese (zh)
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王慧
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Suzhou Huatai Electronics Co Ltd
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Suzhou Huatai Electronics Co Ltd
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Priority to CN202123429848.0U priority Critical patent/CN216747814U/en
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Abstract

The utility model provides a chip fixing device and a mechanical arm component, wherein the chip fixing device comprises: a base having a placement groove for placing a chip; the base body is movably arranged above the base along the vertical direction; the first pressing piece and the second pressing piece are arranged on the base body; the floating pressure head is arranged at the bottom end of the first lower pressing piece; and the horizontal ejection piece is telescopically arranged at the bottom end of the second pressing piece. The technical scheme of the application effectively solves the problem that the pin pressing block in the related technology can damage the chip.

Description

Chip fixing device and mechanical arm assembly
Technical Field
The utility model relates to the field of mass production of radio frequency chips, in particular to a chip fixing device and a mechanical arm assembly.
Background
In the mass production test of the radio frequency chip, for fixing the chip, a groove needs to be formed in the base, the flange of the chip is clamped by the side edge of the groove, and the chip is pressed by the mechanical arm. However, due to the manufacturing error of the chip package, in order to obtain an accurate measurement result and avoid lengthening the impedance matching junction of the output end of the chip, the root side of the fin of the chip drain needs to be pushed to the edge of the PCB drain before the chip is fixed. The chip is generally placed through the arm in traditional volume production chip fixing device, and manual side pushes away the chip again, uses the device to push down the chip in the test again. The chip fixing device has the advantages of multiple links, long consumed time, low efficiency and incapability of accurately fixing the horizontal position of the chip.
A pin pressing block and a tube shell pressing block of a chip fixing device in the related technology are separated, the pin pressing block is connected with a top layer through a metal plate, the metal plate is dug into an inclined rail, and two sliding rods penetrate through the pin pressing block and the inclined rail. When the mechanical arm is pressed down, the sliding rod moves along the inclined groove, the spring is deformed to provide an inclined right downward force, the pin pressing block is pulled to move rightwards integrally, and therefore the chip moves rightwards, and meanwhile the chip is compacted through vertical component force. The downward pressing force of the mechanical arm is more than 30Kg, so that the horizontal component force applied to the cover of the chip by the pin pressing block is too large, the cover of the chip is separated from the chip body of the chip, and the chip is damaged.
SUMMERY OF THE UTILITY MODEL
The utility model mainly aims to provide a chip fixing device and a mechanical arm assembly so as to solve the problem that a pin pressing block in the related technology can damage a chip.
In order to achieve the above object, according to an aspect of the present invention, there is provided a chip fixing apparatus including: a base having a placement groove for placing a chip; the base body is movably arranged above the base along the vertical direction; the first pressing piece and the second pressing piece are arranged on the base body; the floating pressure head is arranged at the bottom end of the first lower pressing piece; and the horizontal ejection piece is telescopically arranged at the bottom end of the second pressing piece.
Further, be provided with the mounting groove on the lateral wall of the bottom of second pushing down the piece, the level is pushed up the piece and is installed in the mounting groove, and the tip of level pushes up the piece stretches out outside the mounting groove.
Furthermore, the chip fixing device also comprises an elastic piece which is arranged in the mounting groove and connected with the horizontal ejection piece.
Furthermore, the horizontal ejecting piece is a wedge block, the wedge block is provided with a first end far away from the first pressing piece and a second end close to the first pressing piece, and the distance between the bottom surface of the wedge block and the base is gradually increased from the first end to the second end of the wedge block.
Furthermore, a first mounting hole is formed in the base body, the first lower pressing piece comprises a first stand column arranged in the first mounting hole, and the floating pressing head is arranged on the lower end face of the first stand column.
Furthermore, a sinking groove is formed in the lower end face of the first upright column, and the upper end of the floating pressure head is arranged in the sinking groove.
Furthermore, the floating pressure head comprises an expansion piece and a suction nozzle piece connected with the expansion piece, the suction nozzle piece is in adsorption fit with the chip, the expansion piece is arranged in a telescopic mode so that the suction nozzle piece can have an extending position located outside the sinking groove and a retracting position located in the sinking groove, the horizontal ejection piece pushes the chip in the process that the suction nozzle piece is switched from the extending position to the retracting position, and when the suction nozzle piece is located at the retracting position, the end portion of the first upright column presses the chip downwards; when the expansion piece is located at the extending position, the sum of the height of the first upright post and the length of the floating pressure head is larger than the height of the second lower pressing piece, and the horizontal pushing piece is located between the lower end of the expansion piece and the chip.
Furthermore, the second pushing piece comprises a second upright column and a fixing part detachably connected with the second upright column, and the horizontal pushing piece is arranged on the fixing part.
Furthermore, an inserting structure is arranged between the fixing portion and the second stand column, the inserting structure comprises an inserting groove and an inserting block arranged in the inserting groove, one of the inserting groove and the inserting block is arranged on the fixing portion, and the other one of the inserting groove and the inserting block is arranged on the second stand column.
Further, the base body is provided with a first mounting hole and a second mounting hole at intervals, the first lower pressing piece can be arranged in the first mounting hole in a floating mode, and the second lower pressing piece can be arranged in the second mounting hole in a floating mode.
According to another aspect of the present invention, there is provided a robot arm assembly comprising a robot arm and a chip holding device as described above, wherein a base of the chip holding device is detachably attached to the robot arm, and a horizontal pushing member horizontally pushes a cover of a chip to move so that a chip main body of the chip is engaged with a side wall stopper of a placing groove.
By applying the technical scheme of the utility model, the chip fixing device comprises: the device comprises a base, a base body, a first pressing piece, a second pressing piece, a floating pressure head and a horizontal ejection piece. The base is provided with a placing groove for placing the chip. The base body is movably arranged above the base in the vertical direction. The first lower pressing piece and the second lower pressing piece are arranged on the base body. The pressure head that floats sets up the bottom at first casting die down. The horizontal ejection piece is telescopically arranged at the bottom end of the second lower pressing piece. In chip volume production test, can connect chip fixing device on the arm, control the arm and remove, will have the unsteady pressure head stop of chip in the sky of standing groove, first casting die pushes down and makes the chip place on the standing groove. And in the process that the first lower pressing piece is pressed continuously, the horizontal ejecting piece is contacted with the cover of the chip, and the horizontal ejecting piece horizontally pushes the chip to move rightwards, so that the chip is abutted against the right side wall of the placing groove to be fixed. The first pressing member continues to be pressed down, and the lower end of the first pressing member presses the cover of the chip. Therefore, an oblique right downward force provided by spring deformation in the related technology is decomposed into vertical force and horizontal force of two pieces through the vertical downward force of the first downward pressing piece and the horizontal pushing force of the horizontal pushing piece, so that the horizontal component force generated by spring deformation is greatly reduced, the phenomenon that the cover of the chip is separated from the chip body of the chip due to the fact that the horizontal component force applied to the cover of the chip by the pin pressing block in the related technology is too large is avoided, and the chip can be protected. Therefore, the technical scheme of the application can solve the problem that the pin pressing block in the related technology can damage the chip.
Drawings
The accompanying drawings, which are incorporated in and constitute a part of this application, illustrate embodiments of the utility model and, together with the description, serve to explain the utility model and not to limit the utility model. In the drawings:
FIG. 1 shows a schematic perspective view of a nozzle piece in an extended position according to an embodiment of the chip holding device of the present invention;
FIG. 2 is a partial schematic structural view of the chip holding apparatus of FIG. 1;
FIG. 3 is a schematic diagram showing a three-dimensional chip structure of the chip holder of FIG. 1;
FIG. 4 is a schematic perspective view showing the nozzle member of the chip holding apparatus of FIG. 1 during switching from the extended position to the retracted position;
FIG. 5 shows a schematic perspective view of the nozzle member of the chip holding apparatus of FIG. 1 in a retracted position;
fig. 6 is a perspective view of the chip holder of fig. 1 without a submount.
Wherein the figures include the following reference numerals:
1. a chip; 101. a chip body; 102. a cover; 103. a pin fin; 10. a base; 11. a placement groove; 20. a base; 21. a first mounting hole; 22. a second mounting hole; 30. a first lower pressing member; 31. a first upright post; 40. a second hold-down member; 41. mounting grooves; 411. inserting a block; 42. a second upright post; 421. a slot; 43. a fixed part; 50. a floating pressure head; 51. an expansion member; 52. a mouthpiece; 60. a horizontal ejector; 70. an elastic member; 71. a first spring; 72. a second spring; 73. and (6) buckling metal.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. The following description of at least one exemplary embodiment is merely illustrative in nature and is in no way intended to limit the utility model, its application, or uses. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
It is noted that the terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of example embodiments according to the present application. As used herein, the singular forms "a", "an" and "the" are intended to include the plural forms as well, and it should be understood that when the terms "comprises" and/or "comprising" are used in this specification, they specify the presence of stated features, steps, operations, devices, components, and/or combinations thereof, unless the context clearly indicates otherwise.
The relative arrangement of the components and steps, the numerical expressions and numerical values set forth in these embodiments do not limit the scope of the present invention unless specifically stated otherwise. Meanwhile, it should be understood that the sizes of the respective portions shown in the drawings are not drawn in an actual proportional relationship for the convenience of description. Techniques, methods, and apparatus known to those of ordinary skill in the relevant art may not be discussed in detail but are intended to be part of the specification where appropriate. In all examples shown and discussed herein, any particular value should be construed as merely illustrative, and not limiting. Thus, other examples of the exemplary embodiments may have different values. It should be noted that: like reference numbers and letters refer to like items in the following figures, and thus, once an item is defined in one figure, further discussion thereof is not required in subsequent figures.
As shown in fig. 1 to 5, the chip fixing device of the present embodiment includes: the base 10, the base body 20, the first lower pressing member 30, the second lower pressing member 40, the floating ram 50 and the horizontal ejector 60. The base 10 has a placing groove 11 in which the chip 1 is placed. The base 20 is movably disposed above the base 10 in a vertical direction. The first lower pressing member 30 and the second lower pressing member 40 are disposed on the base 20. A floating ram 50 is disposed at the bottom end of the first lower pressing member 30. A horizontal ejector 60 is telescopically disposed at the bottom end of the second lower pressing member 40.
With the solution of the present embodiment, the floating ram 50 is disposed at the bottom end of the first lower pressing member 30. The horizontal ejector 60 is telescopically disposed at the bottom end of the second pressing member 40. In the test of mass production of chips, the chip fixing device can be connected to the robot arm, the robot arm is controlled to move, the floating ram 50 with the chip 1 stays above the placing groove 11, and the first hold-down member 30 is pressed down to place the chip 1 on the placing groove 11. During the process of further pressing down the first pressing member 30, the horizontal pushing member 60 contacts the cover 102 of the chip 1, and the horizontal pushing member 60 horizontally pushes the chip 1 to move right, so that the chip 1 abuts against the right side wall of the placing groove 11 to be fixed. The first lower pressing member 30 continues to be pressed down, and the lower end of the first lower pressing member 30 compacts the lid 102 of the chip 1. Thus, an oblique right downward force provided by the spring deformation in the related art is decomposed into a vertical force and a horizontal force of two pieces by the vertical downward force of the first lower pressing piece 30 and the horizontal side thrust of the horizontal ejecting piece 60, so that the horizontal component force generated by the spring deformation is greatly reduced, the phenomenon that the cover of the chip is separated from the chip body of the chip due to the fact that the horizontal component force applied to the cover of the chip by the pin pressing block in the related art is too large is avoided, and the chip can be protected. Therefore, the technical scheme of the embodiment can solve the problem that the pin pressing block in the related art can damage the chip. Moreover, the chip fixing device of the embodiment can simply and efficiently realize the integration of chip side pushing and downward pressing, and improve the chip tabletting efficiency and the measurement accuracy. The substrate 20 is preferably a substrate block.
As shown in fig. 1 to 5, a side wall of the bottom end of the second lower pressing member 40 is provided with a mounting groove 41, the horizontal pushing member 60 is mounted in the mounting groove 41, and an end of the horizontal pushing member 60 extends out of the mounting groove 41. The mounting groove 41 can flexibly provide a lateral movement stroke of the horizontal ejector 60 and can retract when the horizontal ejector 60 is pressed by the cover 102 of the chip 1.
As shown in fig. 1 to 5, the chip fixing device further includes an elastic member 70 disposed in the mounting groove 41 and connected to the horizontal push member 60. The mounting grooves 41 provide different retraction spaces for the elastic members 70, and when the horizontal push-top member 60 is pushed back by the cover 102 of the chip 1, the elastic members 70 contract and provide a reverse force. In this way, the elastic member 70 is arranged to provide an elastic side pushing stroke for the horizontal pushing member 60, so that the horizontal pushing member 60 can be compatible with chips with different packaging errors. The elastic member 70 is preferably a compression spring. Specifically, one end of the elastic member 70 is connected to the groove side wall of the mounting groove 41, and the other end of the elastic member 70 is connected to the horizontal ejector 60.
As shown in fig. 1 to 5, the horizontal pushing member 60 is a wedge having a first end far from the first pressing member 30 and a second end near the first pressing member 30, and the distance between the bottom surface of the wedge and the base 10 is gradually increased from the first end to the second end of the wedge. During the process of further pressing down the first pressing member 30, the bottom surface of the wedge first contacts the cover 102, and the bottom surface of the wedge contacts the upper left corner of the cover 102, so that the horizontal pushing member 60 pushes the chip 1 horizontally to move right. The horizontal ejector 60 is preferably made of polyetheretherketone (Peek) material with high strength, high temperature resistance and wear resistance. Thus, the horizontal ejector 60 is convenient for later maintenance, and the service life of the horizontal ejector 60 is prolonged. The distance between the bottom surface of the second presser member 40 and the bottom surface of the wedge is greater than (2 × M) mm, where M is the maximum tolerance of the placement groove 11.
As shown in fig. 2, 4 and 5, the horizontal length of the wedge is (X + M) mm, X is the size of the gap between the first hold-down 30 and the second hold-down 40, M is the maximum tolerance of the placement groove 11, M is between 0.2mm and 0.4mm, the vertical height of the wedge is slightly less than Y mm, and Y is the height of the cover 102 of the chip 1. After the bottom end of the second pressing piece 40 compacts the pin fins 103 of the chip 1, the wedge block retracts by N millimeters, the chip 1 moves to the right by N millimeters, N is the distance from the root of the pin fin 103 to the right side wall of the placing groove 11 actually, and the chip is fixed by the wedge block and the right side wall of the placing groove 11 in the horizontal direction.
As shown in fig. 1 to 6, the base 20 is provided with a first mounting hole 21, the first lower pressing member 30 includes a first pillar 31 provided in the first mounting hole 21, and the floating ram 50 is provided on a lower end surface of the first pillar 31. The arrangement of the first mounting hole 21 provides a guiding function for the vertical movement of the first upright 31.
As shown in fig. 1 to 6, a lower end surface of the first column 31 is provided with a sinking groove, and an upper end of the floating ram 50 is disposed in the sinking groove. The sinking groove is arranged to enable the floating pressure head 50 to have a retraction space, and the floating pressure head 50 can be compressed into the sinking groove during the process of further pressing down the first upright post 31.
As shown in fig. 1 to 6, the floating ram 50 includes an expansion member 51 and a suction nozzle member 52 connected to the expansion member 51. The suction nozzle piece 52 is in suction fit with the chip 1, the expansion piece 51 is arranged in a telescopic mode so that the suction nozzle piece 52 has an extending position located outside the sinking groove and a retracting position located inside the sinking groove, in the process that the suction nozzle piece 52 is switched from the extending position to the retracting position, the horizontal ejection piece 60 ejects the chip 1, and when the suction nozzle piece 52 is located at the retracting position, the end portion of the first upright column 31 presses the chip 1 downwards. The expansion piece 51 is arranged to lengthen the suction nozzle piece 52, so as to prolong the stroke of the first upright post 31, and ensure that the horizontal ejection piece 60 is firstly contacted with the chip 1 in the process of switching the suction nozzle piece 52 from the extending position to the retracting position. When the expansion member 51 is in the extended position, the sum of the height of the first upright 31 and the length of the floating ram 50 is greater than the height of the second lower pressing member 40, and the horizontal ejector 60 is located between the lower end of the expansion member 51 and the chip 1. The nozzle piece 52 is not in contact with the horizontal ejector 60, and the lower end of the nozzle piece 52 extends 2mm beyond the bottom surface of the second lower press piece 40.
As shown in fig. 1 to 6, the second pressing member 40 includes a second upright column 42 and a fixing portion 43 detachably connected to the second upright column 42, and the horizontal pushing member 60 is disposed on the fixing portion 43. Thus, the second upright post 42 and the fixing portion 43 can be conveniently detached, and the horizontal pushing member 60 and the elastic member 70 can be conveniently replaced and maintained.
As shown in fig. 1 to 6, an insertion structure is disposed between the fixing portion 43 and the second upright post 42, the insertion structure includes a slot and an insertion block 411 disposed in the slot 421, the slot 421 is disposed on the fixing portion 43, and the insertion block 411 is disposed on the second upright post 42. Thus, the slot 421 and the insertion block 411 are matched to enable the fixing portion 43 to be conveniently detached from the second upright post 42, the connection precision is high, and the assembly error is reduced.
Of course, in an embodiment not shown in the figures, the insert may be provided on the fixing portion and the slot may be provided on the second upright.
As shown in fig. 1 to 6, the base 20 is provided with a first mounting hole 21 and a second mounting hole 22 at a distance, the first lower pressing member 30 is floatably mounted to the first mounting hole 21, and the second lower pressing member 40 is floatably mounted to the second mounting hole 22. The arrangement of the second mounting hole 22 provides a guide for the vertical movement of the second press member 40. And the first mounting hole 21 is provided such that the first lower pressing member 30 has a retraction space, a portion of the first lower pressing member 30 can be compressed back into the first mounting hole 21 during the continued pressing of the first lower pressing member 30. The second mounting hole 22 is provided such that the second push member 40 has a space for retraction, and a portion of the second push member 40 can be compressed back into the second mounting hole 22 during the continued pushing of the second push member 40.
Specifically, the depth of the first mounting hole 21 is greater than the depth of the second mounting hole 22, a first spring 71 is disposed in the first mounting hole 21, one end of the first spring 71 is connected to the hole wall of the first mounting hole 21, the other end of the first spring 71 is connected to the upper end of the first hold-down 30, a second spring 72 is disposed in the second mounting hole 22, one end of the second spring 72 is connected to the hole wall of the second mounting hole 22, and the other end of the second spring 72 is connected to the upper end of the second hold-down 40.
The application also provides a mechanical arm assembly, the mechanical arm assembly of the embodiment comprises a mechanical arm and a chip fixing device, and the chip fixing device is the chip fixing device. Because the chip fixing device can solve the problem that the pin pressing block in the related technology can damage the chip, the mechanical arm assembly with the chip fixing device can solve the same technical problem. The base body 20 of the chip holding apparatus is detachably attached to a robot arm, and the horizontal ejector 60 horizontally pushes the cover 102 of the chip 1 to move so that the chip body 101 of the chip 1 is engaged with the sidewall stopper of the placing groove 11.
Specifically, in the test of mass production of chips, the chip fixing device is fixed to the robot arm by the metal buttons 73 of the side wall of the base body 20. The mechanical arm is controlled to move, so that the suction nozzle piece 52 sucks the cover 102 of the chip and puts the chip over the placing groove 11 of the base, then the mechanical arm presses downwards, so that the first pressing piece 30 drives the bottom of the chip to contact with the groove bottom wall of the placing groove 11, and the suction nozzle piece 52 is at the extending position at the moment. The mechanical arm continues to press down to enable the first downward pressing piece 30 to continue to press down the chip 1, the horizontal pushing piece 60 firstly contacts the cover 102, the bottom surface of the horizontal pushing piece 60 contacts the upper left corner of the cover 102, the horizontal pushing piece 60 pushes the chip 1 to move right, at this time, the nozzle piece 52 is located in the process of switching from the extending position to the retracting position, after the second downward pressing piece 40 compacts the pin fins 103 (the grid fins of the chip) of the chip 1, the horizontal pushing piece 60 retracts by N millimeters, the corresponding chip 1 moves right by N millimeters, N is the distance from the root of the pin fin 103 (the drain fin of the chip) to the right side wall of the placing groove 11, and the chip 1 is fixed with the right side wall of the placing groove 11 by the horizontal pushing piece 60 in the horizontal direction, namely, the chip body 101 of the chip 1 and the side wall of the placing groove 11 are located at the stop matching position. The robot arm continues to press down so that the first pressing member 30 continues to press down the chip 1, the suction nozzle member is located at the retracted position, and the end of the first column 31 of the first pressing member 30 compacts the chip 1. Therefore, the testing process in the related technology is simplified, the manual operation of laterally pushing the chip is omitted, the laterally pushing action is completed in the pressing process, and the testing efficiency is improved. And the chip is favorable to laterally moving to a position close to the drain electrode measuring end, the accuracy of a test result is improved, the chip is protected from being damaged in the test process, the mass production test link of the chip is simplified, and the test time is saved.
In the description of the present invention, it is to be understood that the orientation or positional relationship indicated by the orientation words such as "front, rear, upper, lower, left, right", "lateral, vertical, horizontal" and "top, bottom", etc. are usually based on the orientation or positional relationship shown in the drawings, and are only for convenience of description and simplicity of description, and in the case of not making a reverse description, these orientation words do not indicate and imply that the device or element being referred to must have a specific orientation or be constructed and operated in a specific orientation, and therefore, should not be considered as limiting the scope of the present invention; the terms "inner and outer" refer to the inner and outer relative to the profile of the respective component itself.
Spatially relative terms, such as "above … …," "above … …," "above … … surface," "above," and the like, may be used herein for ease of description to describe one device or feature's spatial relationship to another device or feature as illustrated in the figures. It will be understood that the spatially relative terms are intended to encompass different orientations of the device in use or operation in addition to the orientation depicted in the figures. For example, if a device in the figures is turned over, devices described as "above" or "on" other devices or configurations would then be oriented "below" or "under" the other devices or configurations. Thus, the exemplary term "above … …" can include both an orientation of "above … …" and "below … …". The device may be otherwise variously oriented (rotated 90 degrees or at other orientations) and the spatially relative descriptors used herein interpreted accordingly.
It should be noted that the terms "first", "second", and the like are used to define the components, and are only used for convenience of distinguishing the corresponding components, and the terms have no special meanings unless otherwise stated, and therefore, the scope of the present invention should not be construed as being limited.
The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention, and various modifications and changes may be made by those skilled in the art. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.

Claims (11)

1. A chip mounting apparatus, comprising:
a base (10) having a placement groove (11) for placing a chip (1);
a base (20) movably disposed above the base (10) in a vertical direction;
a first hold-down member (30) and a second hold-down member (40), the first hold-down member (30) and the second hold-down member (40) being provided to the base (20);
a floating ram (50) disposed at a bottom end of the first lower pressing member (30);
and the horizontal ejecting piece (60) is telescopically arranged at the bottom end of the second lower pressing piece (40).
2. The die fixing device according to claim 1, wherein a mounting groove (41) is provided on a side wall of a bottom end of the second pressing member (40), the horizontal pushing member (60) is mounted in the mounting groove (41), and an end of the horizontal pushing member (60) protrudes out of the mounting groove (41).
3. The die attach apparatus of claim 2 further comprising a resilient member (70) disposed within said mounting groove (41) and connected to said horizontal ejector (60).
4. The die attach apparatus according to claim 1, wherein the horizontal ejector (60) is a wedge having a first end distal from the first hold-down member (30) and a second end proximal to the first hold-down member (30), and wherein a distance between a bottom surface of the wedge and the base (10) increases from the first end to the second end of the wedge.
5. The die holding apparatus according to claim 1, wherein the base (20) is provided with a first mounting hole (21), the first pressing member (30) includes a first pillar (31) provided in the first mounting hole (21), and the floating ram (50) is provided on a lower end surface of the first pillar (31).
6. The die holding apparatus according to claim 5, wherein a lower end surface of the first stud (31) is provided with a sunken groove, and an upper end of the floating ram (50) is disposed in the sunken groove.
7. The chip holder according to claim 6,
the floating pressure head (50) comprises an expansion piece (51) and a suction nozzle piece (52) connected with the expansion piece (51), the suction nozzle piece (52) is in suction fit with the chip (1), the expansion piece (51) is arranged in a telescopic mode so that the suction nozzle piece (52) has an extending position located outside the sinking groove and a retracting position located inside the sinking groove, the horizontal ejecting piece (60) ejects the chip (1) in the process that the suction nozzle piece (52) is switched from the extending position to the retracting position, and when the suction nozzle piece (52) is located at the retracting position, the end portion of the first upright column (31) downwards presses the chip (1);
when the expansion piece (51) is in the extending position, the sum of the height of the first upright post (31) and the length of the floating pressure head (50) is larger than the height of the second lower pressing piece (40), and the horizontal pushing piece (60) is positioned between the lower end of the expansion piece (51) and the chip (1).
8. The die attach apparatus according to claim 1, wherein the second pressing member (40) comprises a second pillar (42) and a fixing portion (43) detachably connected to the second pillar (42), and the horizontal pushing member (60) is disposed on the fixing portion (43).
9. The chip fixing device according to claim 8, wherein an insertion structure is disposed between the fixing portion (43) and the second upright (42), the insertion structure comprises an insertion slot and an insertion block (411) disposed in the insertion slot (421), one of the insertion slot (421) and the insertion block (411) is disposed on the fixing portion (43), and the other is disposed on the second upright (42).
10. The die attach apparatus according to claim 1, wherein the base (20) is provided with a first mounting hole (21) and a second mounting hole (22) at a distance, the first hold-down member (30) is floatingly mounted to the first mounting hole (21), and the second hold-down member (40) is floatingly mounted to the second mounting hole (22).
11. A robot arm assembly comprising a robot arm and a chip holding device, wherein the chip holding device is the chip holding device of any one of claims 1 to 10, the base (20) of the chip holding device is detachably attached to the robot arm, and the horizontal pushing member (60) horizontally pushes the cover (102) of the chip (1) to move so that the chip main body (101) of the chip (1) is engaged with the sidewall stopper of the placing groove (11).
CN202123429848.0U 2021-12-31 2021-12-31 Chip fixing device and mechanical arm assembly Active CN216747814U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202123429848.0U CN216747814U (en) 2021-12-31 2021-12-31 Chip fixing device and mechanical arm assembly

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202123429848.0U CN216747814U (en) 2021-12-31 2021-12-31 Chip fixing device and mechanical arm assembly

Publications (1)

Publication Number Publication Date
CN216747814U true CN216747814U (en) 2022-06-14

Family

ID=81911291

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202123429848.0U Active CN216747814U (en) 2021-12-31 2021-12-31 Chip fixing device and mechanical arm assembly

Country Status (1)

Country Link
CN (1) CN216747814U (en)

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