CN216732487U

CN216732487U - Slicing device for semiconductor production

Info

Publication number: CN216732487U
Application number: CN202123100058.8U
Authority: CN
Inventors: 方玉龙
Original assignee: Kunshan Chaohan Electronic Technology Co ltd
Current assignee: Kunshan Chaohan Electronic Technology Co ltd
Priority date: 2021-12-10
Filing date: 2021-12-10
Publication date: 2022-06-14
Anticipated expiration: 2031-12-10

Abstract

The utility model discloses a semiconductor production is with section device, including first cylinder body, be fixed with the counterpoint piece on the piston rod of first cylinder body, the cover that slides on the counterpoint piece is equipped with the counterpoint seat, is fixed with the linkage plate on the counterpoint seat, is fixed with the motor on the linkage plate, is fixed with the mounting panel in the pivot of motor, is fixed with the disc on the mounting panel, is fixed with the second cylinder body on the disc, is provided with the clamp splice on the second cylinder body, and the centre gripping has the crystal bar between the adjacent clamp splice. The utility model discloses a clamp splice can be stabilized fixedly to the crystal bar, and the rotation of cooperation motor can be realized rotating the adjustment, and the piston rod of first cylinder body is flexible, can realize the altitude mixture control, through the swift dismantlement mode of bayonet lock and locating pin for two connection positions can be changed according to different specification crystal bars processing.

Description

Slicing device for semiconductor production

Technical Field

The utility model relates to a semiconductor production technical field specifically is a section device is used in semiconductor production.

Background

A semiconductor refers to a material having a conductivity between a conductor and an insulator at normal temperature. The semiconductor has wide application in radio, television and temperature measurement.

The semiconductor wafer is formed by slicing the crystal bar, and meanwhile, the crystal bar is processed, so that the production of wafers with different thicknesses can be realized.

The cutting process is mainly through the winding cutting of wire rope winding on the crystal bar, but at present because the wafer shape of production is different, and most equipment is when fixed to the crystal bar, mostly single structure, dismantles the adjustment position with the bolt fastening, when many specifications production, the change process is comparatively loaded down with trivial details.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to provide a semiconductor production is with section device to solve the problem to different crystal bars processing location.

In order to achieve the above object, the utility model provides a following technical scheme: the utility model provides a slicing device for semiconductor production, includes first cylinder body, be fixed with the counterpoint piece on the piston rod of first cylinder body, sliding sleeve is equipped with the counterpoint seat on the counterpoint piece, be fixed with the linkage plate on the counterpoint seat, be fixed with the motor on the linkage plate, be fixed with the mounting panel in the pivot of motor, be fixed with the disc on the mounting panel, be fixed with the second cylinder body on the disc, be provided with the clamp splice on the second cylinder body, the centre gripping has the crystal bar between the adjacent clamp splice.

Preferably, the disk is fixed with a storage seat, and the crystal bar and the storage seat are inserted into each other to limit one end of the crystal bar.

Preferably, the alignment block is provided with a groove, a bayonet lock is sleeved in the groove in a sliding mode, and the bayonet lock is connected with the groove through a first spring, so that the telescopic reset stability of the bayonet lock is guaranteed.

Preferably, the aligning seat is provided with a through hole, and the clamping pin is sleeved with the through hole in a sliding manner, so that the aligning block and the aligning seat can be conveniently mounted and dismounted.

Preferably, a mounting seat is fixed on the clamping block, and a piston rod of the second cylinder body is inserted into the mounting seat, so that the clamping block and the second cylinder body can be mounted and dismounted.

Preferably, the mounting seat is provided with a positioning hole, a positioning pin is slidably sleeved in the positioning hole, and the positioning pin is connected with the mounting seat through a second spring, so that the telescopic resetting stability of the positioning pin is ensured.

Preferably, be provided with the constant head tank on the piston rod of second cylinder body, the locating pin sets up with constant head tank sliding insertion, and the locating pin can manual direct drawing, compares the bolt and dismantles more conveniently.

Compared with the prior art, the beneficial effects of the utility model are that:

1. the utility model discloses a clamp splice can be stabilized fixedly to the crystal bar, and the rotation of cooperation motor can be realized rotating the adjustment, and the piston rod of first cylinder body is flexible, can realize the altitude mixture control.

2. The utility model discloses a swift dismantlement mode of bayonet lock and locating pin for two connection positions can be changed according to different specification crystal bars processing.

Drawings

Fig. 1 is a schematic view of the overall structure of the present invention;

FIG. 2 is a partially enlarged view of the latch portion of the present invention;

fig. 3 is an enlarged schematic view of the position a of the present invention.

In the figure: 1. a first cylinder; 11. a positioning block; 12. a positioning seat; 13. a connector tile; 14. a motor; 15. mounting a plate; 16. a disc; 17. a second cylinder; 18. a clamping block; 19. crystal bar; 2. a placement seat; 3. a groove; 31. a bayonet lock; 32. a first spring; 33. a through hole; 4. a mounting seat; 41. positioning holes; 42. positioning pins; 43. a second spring; 44. and (6) positioning a groove.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.

Example I

Referring to fig. 1, a slicing device for semiconductor production includes a first cylinder 1, a positioning block 11 is fixed on a piston rod of the first cylinder 1, a positioning seat 12 is slidably sleeved on the positioning block 11, a connecting plate 13 is fixed on the positioning seat 12, a motor 14 is fixed on the connecting plate 13, an installation plate 15 is fixed on a rotating shaft of the motor 14, a disc 16 is fixed on the installation plate 15, a second cylinder 17 is fixed on the disc 16, clamping blocks 18 are arranged on the second cylinder 17, and a crystal bar 19 is clamped between the adjacent clamping blocks 18.

Referring to fig. 1 and 3, the placing base 2 is fixed on the disk 16, and the crystal bar 19 is inserted into the placing base 2, so as to limit one end of the crystal bar 19.

This embodiment is used: the model of the motor 14 is a stepping type, and is connected with an indoor 220V power strip through a wire plug in a plugging mode for electrifying, the switch connected with the motor 14 through a wire in an external mode is a forward and reverse rotation switch, the model is HY2-8, and a brake pad is arranged at the tail of the motor 14, so that power-off braking can be achieved.

Example II

Referring to fig. 1, in this embodiment, as further described in embodiment 1, a slicing apparatus for semiconductor production includes a first cylinder 1, a positioning block 11 is fixed on a piston rod of the first cylinder 1, a positioning seat 12 is slidably sleeved on the positioning block 11, a connecting plate 13 is fixed on the positioning seat 12, a motor 14 is fixed on the connecting plate 13, an installation plate 15 is fixed on a rotating shaft of the motor 14, a circular disc 16 is fixed on the installation plate 15, a second cylinder 17 is fixed on the circular disc 16, clamping blocks 18 are arranged on the second cylinder 17, and a crystal bar 19 is clamped between adjacent clamping blocks 18.

Referring to fig. 1 and 2, a groove 3 is formed in the alignment block 11, a bayonet 31 is slidably sleeved in the groove 3, and the bayonet 31 is connected with the groove 3 through a first spring 32, so that the telescopic reset stability of the bayonet 31 is ensured.

Referring to fig. 1 and 2, the aligning base 12 is provided with a through hole 33, and the pin 31 is slidably sleeved with the through hole 33, so that the aligning block 11 and the aligning base 12 can be conveniently mounted and dismounted.

This embodiment is used: the number of the clamping blocks 18 is at least two, preferably four, and the clamping blocks are uniformly distributed.

Example III

Referring to fig. 1, in this embodiment, for further description of other embodiments, a slicing apparatus for semiconductor production includes a first cylinder 1, an alignment block 11 is fixed on a piston rod of the first cylinder 1, an alignment seat 12 is slidably sleeved on the alignment block 11, a connection plate 13 is fixed on the alignment seat 12, a motor 14 is fixed on the connection plate 13, an installation plate 15 is fixed on a rotating shaft of the motor 14, a disc 16 is fixed on the installation plate 15, a second cylinder 17 is fixed on the disc 16, clamping blocks 18 are arranged on the second cylinder 17, and a crystal bar 19 is clamped between adjacent clamping blocks 18.

Referring to fig. 1 and 3, the mounting seat 4 is fixed on the clamping block 18, and the piston rod of the second cylinder 17 is inserted into the mounting seat 4, so that the clamping block 18 and the second cylinder 17 can be mounted and dismounted.

Referring to fig. 1 and 3, a positioning hole 41 is formed in the mounting seat 4, a positioning pin 42 is slidably sleeved in the positioning hole 41, and the positioning pin 42 is connected with the mounting seat 4 by a second spring 43, so as to ensure the stable extension and retraction of the positioning pin 42.

Referring to fig. 1 and 3, the piston rod of the second cylinder 17 is provided with a positioning slot 44, the positioning pin 42 and the positioning slot 44 are slidably inserted, and the positioning pin 42 can be directly pulled manually, which is more convenient than a bolt.

This embodiment is used: when needs add man-hour to crystal bar 19, insert it earlier in putting thing seat 2, then impel through the piston rod of second cylinder body 17 for clamping splice 18 can carry out the centre gripping to crystal bar 19 and fix, guarantees the stability of wire rope winding cutting, through the adjustable crystal bar 19 of first cylinder body 1 the height of putting, motor 14 can realize rotating the adjustment.

When the clamping block 18 needs to be replaced, the positioning pin 42 is pulled outwards, and the positioning pin 42 is separated from the positioning groove 44 through the stretching of the second spring 43, so that the alignment block 11 is detached from the alignment seat 12.

When a different power motor 14 needs to be replaced, the bayonet 31 is pressed to compress the first spring 32 into the groove 3, so that the bayonet is separated from the through hole 33, and the motor is detached.

It should be noted that, in this document, relational terms such as first and second, and the like are used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus.

Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.

Claims

1. The utility model provides a slicing device for semiconductor production, includes first cylinder body (1), its characterized in that: be fixed with counterpoint piece (11) on the piston rod of first cylinder body (1), sliding sleeve is equipped with counterpoint seat (12) on counterpoint piece (11), be fixed with linkage plate (13) on counterpoint seat (12), be fixed with motor (14) on linkage plate (13), be fixed with mounting panel (15) in the pivot of motor (14), be fixed with disc (16) on mounting panel (15), be fixed with second cylinder body (17) on disc (16), be provided with clamp splice (18) on second cylinder body (17), the centre gripping has crystal bar (19) between adjacent clamp splice (18).

2. The dicing apparatus for semiconductor production according to claim 1, wherein: the disc (16) is fixed with an object placing seat (2), and the crystal bar (19) and the object placing seat (2) are inserted.

3. The dicing apparatus for semiconductor production according to claim 1, wherein: a groove (3) is formed in the aligning block (11), a clamping pin (31) is sleeved in the groove (3) in a sliding mode, and the clamping pin (31) is connected with the groove (3) through a first spring (32).

4. The dicing apparatus for semiconductor production according to claim 3, wherein: the aligning seat (12) is provided with a through hole (33), and the bayonet (31) is sleeved with the through hole (33) in a sliding manner.

5. The dicing apparatus for semiconductor production according to claim 1, wherein: and a mounting seat (4) is fixed on the clamping block (18), and a piston rod of the second cylinder body (17) is inserted into the mounting seat (4).

6. The dicing apparatus for semiconductor production according to claim 5, wherein: the mounting seat (4) is provided with a positioning hole (41), a positioning pin (42) is slidably sleeved in the positioning hole (41), and the positioning pin (42) is connected with the mounting seat (4) through a second spring (43).

7. The dicing apparatus for semiconductor production according to claim 6, wherein: and a positioning groove (44) is formed in a piston rod of the second cylinder body (17), and the positioning pin (42) and the positioning groove (44) are arranged in an inserted mode in a sliding mode.