CN216732480U - Diamond wire slicer - Google Patents

Diamond wire slicer Download PDF

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Publication number
CN216732480U
CN216732480U CN202122941108.9U CN202122941108U CN216732480U CN 216732480 U CN216732480 U CN 216732480U CN 202122941108 U CN202122941108 U CN 202122941108U CN 216732480 U CN216732480 U CN 216732480U
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hole
bottom plate
locking spring
screw
plate
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张祥
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Funing Xiexin Photovoltaic Technology Co ltd
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Funing Xiexin Photovoltaic Technology Co ltd
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Abstract

The utility model relates to a buddha's warrior attendant line slicer, include: elevating system, work piece board and crystal bar that set gradually press from both sides tight screw, wherein: the clamping screw comprises a screw rod and a locking spring, and the locking spring is sleeved on the screw rod; the lower side of the workpiece plate is connected with the crystal bar, and the upper side of the workpiece plate is provided with an inverted T-shaped groove; the lifting mechanism comprises a workbench, the workbench comprises a bottom plate, a first through hole is formed in the bottom plate, and an opening of the first through hole is formed in the surface, opposite to the workpiece plate, of the bottom plate; the screw passes through the first through hole to be clamped with the inverted T-shaped groove, and the clamping screw, the workbench and the workpiece plate are fixed into a whole; the locking spring is located the upside of bottom plate, and locking spring is in compression state in the direction of bottom plate, and the decurrent effort of locking spring is applyed on the bottom plate, and the ascending bounce-back of locking spring drives the screw rod and passes first through-hole and shift up, and the work piece board is hugged closely with the bottom plate, and the crystal bar location that links to each other with the work piece board is firm, prevents that the crystal bar from being controlled about in the cutting process, guarantees silicon wafer quality.

Description

Diamond wire slicer
Technical Field
The utility model relates to a silicon chip processing technology field especially relates to a diamond wire slicer.
Background
With the development of economy, social progress and improvement of environmental awareness, people put forward higher and higher requirements on energy. The existing electric power energy sources mainly comprise four sources, namely thermal power, hydroelectric power, nuclear power and wind power generation. Fossil fuels such as coal and petroleum are required to be combusted in thermal power, the fossil fuels have a limited storage amount and are facing the problem of exhaustion, and the combustion of fossil fuels discharges carbon dioxide and sulfur oxides, which cause greenhouse effect and acid rain and deteriorate the global environment. Hydroelectric power is susceptible to seasonal influences. The nuclear power is inherently clean under normal conditions, but in case of nuclear leakage, the consequences are not reasonable. Wind power generation is used as a clean renewable energy source, the wind energy storage capacity is large, the method is an effective way for reducing greenhouse gas emission, but the wind power generation is easy to generate noise and can influence bird survival.
Under the large environment, compared with thermal power, hydroelectric power, wind power, nuclear power and the like, the solar power generation has no emission and noise, and the application technology is mature, safe and reliable, so that the solar power generation gradually becomes the mainstream trend. Solar power generation refers to a power generation mode of directly converting light energy into electric energy without a thermal process, and includes photovoltaic power generation, photochemical power generation, photoinduction power generation and photobiological power generation. Photovoltaic power generation is a direct power generation method that utilizes a solar-grade semiconductor electronic device to effectively absorb solar radiation energy and convert the solar radiation energy into electric energy, and is the mainstream of current solar power generation. The photovoltaic power generation system mainly comprises a solar cell, a storage battery, a controller and an inverter, wherein the solar cell is a key part of the photovoltaic power generation system, and the quality and the cost of a solar cell panel directly determine the quality and the cost of the whole system. The solar cell mainly comprises a crystalline silicon cell and a polycrystalline silicon cell, wherein crystalline silicon (divided into single crystal and polycrystalline) is used as a main material for solar power generation, the single crystal and the polycrystalline silicon are mainly used as single and polycrystalline silicon wafers, and equipment used in the slicing process is a diamond wire slicing machine.
The principle of the diamond wire slicer is that: inlay the diamond of tiny granule on the copper-wire to the copper-wire has had the miniature sawtooth of diamond, has knitted into the buddha's warrior attendant gauze with the buddha's warrior attendant gauze, through the high-speed motion of buddha's warrior attendant gauze, cuts crystal bar or crystal block, and work efficiency is high, and slicing effect is good.
However, the existing diamond wire slicing machine is unstable in positioning of the crystal bar, the crystal bar is easily pulled by the diamond wire net in the using process to cause the cut silicon wafer to be abnormal, and the slicing precision and the qualification rate of the crystal bar are reduced.
SUMMERY OF THE UTILITY MODEL
In view of this, it is necessary to provide a diamond wire slicing machine for solving the problems of unstable positioning of the ingot, which results in low precision and low yield of slicing of the ingot.
A diamond wire slicer comprising: elevating system, work piece board and crystal bar that set gradually press from both sides tight screw, wherein:
the clamping screw comprises a screw rod and a locking spring, and the locking spring is sleeved on the screw rod;
the lower side of the workpiece plate is connected with the crystal bar, and the upper side of the workpiece plate is provided with an inverted T-shaped groove;
the lifting mechanism comprises a workbench, the workbench comprises a bottom plate, a first through hole is formed in the bottom plate, and an opening of the first through hole is formed in the surface, opposite to the workpiece plate, of the bottom plate;
the screw rod penetrates through the first through hole and is clamped with the inverted T-shaped groove, and the clamping screw rod, the workbench and the workpiece plate are fixed into a whole;
the locking spring is located on the upper side of the bottom plate, and the locking spring is in a compressed state in the direction towards the bottom plate.
Above-mentioned buddha's warrior attendant line slicer, the crystal bar links to each other with the work piece board downside, the screw rod passes first through-hole and type of falling T groove looks joint, can conveniently realize the fixed and separation of work piece board and workstation, locking spring is located the upside of bottom plate, locking spring is in compression state in the direction of bottom plate, locking spring decurrent effort is applyed on the bottom plate promptly, meanwhile, the ascending bounce-back of locking spring drives the screw rod and passes first through-hole and shift up, the lower surface realization that makes the upper surface of work piece board and bottom plate is hugged closely, thereby make the crystal bar location firm that links to each other with the work piece board downside, prevent that the crystal bar from being controlled about in cutting process, and then be favorable to guaranteeing the machining precision and the qualification rate of silicon wafer.
In one embodiment, the clamping screw further comprises a limiting structure and a lock nut, wherein:
the limiting structure comprises a bottom wall, and a second through hole penetrating through the wall thickness of the bottom wall is formed in the bottom wall;
the screw rod sequentially penetrates through the second through hole and the locking spring and is matched with the locking nut, the screw rod, the limiting structure, the locking spring and the locking nut are fixed into a whole, and the screw rod is in transition fit with the second through hole;
the upper surface of the bottom plate is abutted against the bottom wall, and one surface of the bottom wall, which is far away from the workbench, is abutted against the locking spring;
the lock nut is used for compressing the lock spring.
In one embodiment, the elastic force of the locking spring is at least 1000 KG.
In one embodiment, the lower surface of the base plate mates with the upper surface of the workpiece plate.
In one embodiment, the lower surface of the base plate and the upper surface of the workpiece plate are both planar.
In one embodiment, the lifting mechanism further comprises a working chamber, the working chamber is located on one side, away from the workpiece plate, of the working table, the working chamber is provided with a third through hole, the opening of the third through hole is located on the surface, facing the clamping screw, of the working chamber, and the third through hole is movably covered on the portion, exceeding the upper surface of the bottom plate, of the clamping screw.
In one embodiment, a jacking cylinder is arranged in the third through hole, a pressure head is arranged on the jacking cylinder, the pressure head coincides with the axis of the screw, the pressure head is located at one end, far away from the workbench, of the screw, and the pressure head moves towards the direction of the screw.
In one embodiment, the table is connected to a drive mechanism, and the table is moved in a vertical direction at a set process speed.
In one embodiment, the diamond wire slicing machine further comprises a diamond wire net, and the diamond wire net faces to one end of the crystal bar far away from the workpiece plate.
In one embodiment, the diamond wire slicing machine further comprises two rollers which are positioned on the same horizontal line, the diamond wire net is wound on the rollers, and the rollers are used for driving the diamond wire net to move.
Drawings
Fig. 1 is a schematic view of a diamond wire slicer according to the present invention;
fig. 2 is a workpiece plate provided by the present invention;
fig. 3 is a working table provided by the present invention;
fig. 4 is a schematic diagram of another diamond wire slicing provided by the present invention;
fig. 5 is a schematic view of a clamping screw of fig. 4.
Wherein:
10. a diamond wire slicing machine;
100. a crystal bar;
200. a workpiece plate; 210. a T-shaped groove is inverted;
300. a lifting mechanism; 310. a work table; 311. a base plate; 3111. a first through hole; 320. a working chamber; 322. a third through hole;
400. clamping the screw rod; 410. a locking spring; 420. a screw; 430. a limiting structure; 431. a sleeve; 432. a bottom wall; 440. a lock nut;
500. jacking a cylinder; 510. a pressure head;
600. a diamond wire mesh;
700. a roller;
Detailed Description
In order to make the above objects, features and advantages of the present invention more comprehensible, embodiments of the present invention are described in detail below with reference to the accompanying drawings. In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present invention. The present invention may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein, as those skilled in the art will be able to make similar modifications without departing from the spirit and scope of the present invention.
In the description of the present invention, it is to be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", and the like, indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings, and are only for convenience of description and simplicity of description, and do not indicate or imply that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore, should not be construed as limiting the present invention.
Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one such feature. In the description of the present invention, "a plurality" means at least two, e.g., two, three, etc., unless specifically limited otherwise.
In the present invention, unless otherwise expressly stated or limited, the terms "mounted," "connected," and "fixed" are to be construed broadly and may, for example, be fixedly connected, detachably connected, or integrally formed; can be mechanically or electrically connected; they may be directly connected or indirectly connected through intervening media, or they may be connected internally or in any other suitable relationship, unless expressly stated otherwise. The specific meaning of the above terms in the present invention can be understood according to specific situations by those skilled in the art.
In the present application, unless expressly stated or limited otherwise, the first feature may be directly on or directly under the second feature or indirectly via intermediate members. Also, a first feature "on," "over," and "above" a second feature may be directly or diagonally above the second feature, or may simply indicate that the first feature is at a higher level than the second feature. A first feature being "under," "below," and "beneath" a second feature may be directly under or obliquely under the first feature, or may simply mean that the first feature is at a lesser elevation than the second feature.
It will be understood that when an element is referred to as being "secured to" or "disposed on" another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present. The terms "vertical," "horizontal," "upper," "lower," "left," "right," and the like as used herein are for illustrative purposes only and do not denote a unique embodiment.
The technical solution provided by the embodiments of the present invention is described below with reference to the accompanying drawings. As shown in fig. 1, fig. 2 and fig. 3, an embodiment of the present invention provides a diamond wire slicing machine 10, which is applied to the technical field of silicon wafer processing, and includes: elevating system 300, work piece board 200 and crystal bar 100 that set gradually, clamping screw 400, wherein:
the clamping screw 400 comprises a screw 420 and a locking spring 410, wherein the locking spring 410 is sleeved on the screw 420;
the lower side of the workpiece plate 200 is connected with the crystal bar 100, the upper side of the workpiece plate 200 is provided with an inverted T-shaped groove 210, and during specific arrangement, the upper end and the lower end of the crystal bar 100 and the lower side of the workpiece plate 200 are all planes, so that the other end, away from the lower side of the workpiece plate 200, of the crystal bar 100 is parallel to the horizontal plane;
the lifting mechanism 300 comprises a workbench 310, the workbench 310 comprises a bottom plate 311, a first through hole 3111 is arranged on the bottom plate 311, an opening of the first through hole 3111 is arranged on the surface of the bottom plate 311 opposite to the workpiece plate 200, when the lifting mechanism 300 is specifically arranged, the lifting mechanism is arranged on a support and suspended on the ground for a certain height, the workbench 310 further comprises two side walls connected with the bottom plate 311, the two side walls are symmetrically arranged relative to the bottom plate 311, the connection between the bottom plate 311 and the side walls can be welding, gluing, clamping and integral forming, usually, an integral forming mode is adopted, the forming mode between the bottom plate 311 and the side walls can be die pressing or casting forming, the bottom plate 311 and the side walls are usually made of alloy steel, and the lifting mechanism has high static strength, impact toughness and high fatigue limit;
the screw 420 penetrates through the first through hole 3111 and is clamped with the inverted T-shaped groove 210, the clamping screw 400, the workbench 310 and the workpiece plate 200 are fixed into a whole, when the clamping screw 400 and the workpiece plate 200 are specifically arranged, a screw head is arranged at one end of the screw 420, when one end with the screw head penetrates through the first through hole 3111 from the upper surface of the bottom plate 311, the screw rod body can be in transition fit with the first through hole 3111, the screw rod body is embedded into the first through hole 3111, and at the moment, the size of the screw head is smaller than that of the screw rod body; or a nut is arranged at one end without the screw head, the nut can cover the locking spring 410 and is positioned on the locking spring 410, and the locking spring 410 is positioned at the upper side of the bottom plate 311, so that when the screw head passes through the first through hole 3111 from the upper surface of the bottom plate 311, the screw 420 can be in clearance fit with the first through hole 3111 and suspended in the first through hole 3111, it needs to be noted that the inverted T-shaped groove 210 is in clamping connection with the screw head, the shape of the groove on the workpiece plate 200 can be other shapes, and the shape of the groove is matched with the screw 420 head;
the locking spring 410 is located on the upper side of the bottom plate 311, and the locking spring 410 is in a compressed state in a direction toward the bottom plate 311, that is, a downward acting force of the locking spring 410 is applied to the bottom plate 311, and meanwhile, an upward rebounding force of the locking spring 410 drives the rod body of the screw rod 420 to move upwards through the first through hole 3111, so that the upper surface of the workpiece plate 200 is tightly attached to the lower surface of the bottom plate 311.
According to the diamond wire slicing machine 10, the crystal bar 100 is connected with the lower side of the workpiece plate 200, the screw 420 penetrates through the first through hole 3111 and is clamped with the inverted T-shaped groove 210, fixing and separation of the workpiece plate 200 and the workbench 310 can be conveniently achieved, the locking spring 410 is located on the upper side of the bottom plate 311, the locking spring 410 is in a compression state in the direction towards the bottom plate 311, namely the downward acting force of the locking spring 410 is applied to the bottom plate 311, meanwhile, the upward rebound force of the locking spring 410 drives the screw 420 to penetrate through the first through hole 3111 to move upwards, the upper surface of the workpiece plate 200 is enabled to be attached to the lower surface of the bottom plate 311, and therefore the crystal bar 100 connected with the lower side of the workpiece plate 200 is firmly positioned, the crystal bar 100 is prevented from being moved left and right in the cutting process, and further the processing accuracy and the qualification rate of silicon wafers are guaranteed.
In order to conveniently realize that the clamping screw 400, the working platform 310 and the workpiece plate 200 are fixed as a whole and the locking spring 410 is in a compressed state in a direction towards the bottom plate 311, as shown in fig. 2, 3, 4 and 5, an embodiment of the present invention provides another diamond wire slicer 10, and in a preferred embodiment, the clamping screw 400 further comprises a limiting structure 430 and a locking nut 440, wherein:
the limiting structure 430 comprises a bottom wall 432, and a second through hole penetrating through the wall thickness of the bottom wall 432 is formed in the bottom wall 432;
the screw rod 420 sequentially penetrates through the second through hole and the locking spring 410 and is matched with the locking nut 440, the screw rod 420, the limiting structure 430, the locking spring 410 and the locking nut 440 are fixed into a whole, and the screw rod 420 is in transition fit with the second through hole;
the upper surface of the bottom plate 311 abuts against the bottom wall 432, one surface of the bottom wall 432, which is far away from the workbench 310, abuts against the locking spring 410, so that when the screw 420 penetrates through the first through hole 3111, the screw 420 is suspended in the first through hole 3111, in specific arrangement, the limiting structure 430 further comprises a sleeve 431, the sleeve 431 is connected with one side of the bottom wall 432, which is far away from the locking spring 410, the aperture of the sleeve 431 is consistent with that of the second through hole, the axis of the aperture of the sleeve 431 is coincident with that of the second through hole, the sleeve 431 is located in the first through hole 3111, the sleeve 431 is generally in clearance fit with the first through hole 3111, and the sleeve 431 enables the bottom wall 432 to be more firmly abutted against the upper surface of the workbench 310;
the lock nut 440 is used for compressing the lock spring 410, and in particular, the lock nut 440 is engaged with the screw 420 through threads, and the lock nut 440 is rotated downward, so that the lock spring 410 is compressed toward the bottom plate 311.
When the screw 420 passes through the first through hole 3111: if the length of the screw rod 420 beyond the lower surface of the bottom plate 311 can be matched with the inverted T-shaped groove 210 on the upper surface of the workpiece plate 200, after the screw rod 420 passes through the first through hole 3111 to be matched with the inverted T-shaped groove 210, the lock nut 440 is rotated downwards, the lock spring 410 is in a compressed state towards the bottom plate 311, the downward acting force of the spring is applied to the bottom wall 432, meanwhile, the upward rebound force of the spring drives the screw rod 420 to pass through the second through hole to move upwards, so that the compressed spring recovers a certain length until the lock spring 410 enables the upper surface of the workpiece plate 200 to be tightly attached to the lower surface of the bottom plate 311, and the lock nut 410 is still in a compressed state, so that the upper surface of the workpiece plate 200 is enabled to be tightly attached to the lower surface of the bottom plate 311, and then the lock nut 440 is stopped to rotate;
if the length of the screw 420 beyond the lower surface of the base plate 311 fails to engage the inverted T-shaped groove 210 on the upper surface of the workpiece plate 200, pressure is applied to one end of the screw rod 420 far away from the limiting structure 430, at the moment, the screw rod 420 drives the locking nut 440 to move towards the bottom plate 311 together, the locking spring 410 is in a compression state, the length of the screw rod 420 exceeding the lower surface of the bottom plate 311 is lengthened, the inverted T-shaped groove 210 on the upper surface of the workpiece plate 200 is conveniently clamped with the part of the screw rod 420 exposed out of the bottom plate 311, the clamping screw rod 400, the workbench 310 and the workpiece plate 200 are fixed into a whole, at the moment, the force applied to one end of the screw rod 420 far away from the limiting structure 430 is removed, the downward acting force of the spring is applied to the bottom wall 432, meanwhile, the resilience of the spring drives the screw rod 420 to move upwards through the second through hole, so that the compressed spring is restored to a certain length, but still in compression, the upper surface of the workpiece plate 200 is brought into close contact with the lower surface of the base plate 311.
In order to enhance the adhesion between the upper surface of the workpiece plate 200 and the lower surface of the bottom plate 311, according to a preferred embodiment, the elastic force of the locking spring 410 is at least 1000KG, and the inventors have found through research that when the elastic force of the locking spring 410 is not less than 1000KG, and the elastic force of the locking spring 410 may be 1000KG, 1100KG, 1200KG or more, the adhesion between the upper surface of the workpiece plate 200 and the lower surface of the bottom plate 311 is stronger, the ingot 100 connected to the lower side of the workpiece plate 200 is less likely to move left and right during cutting, and the slicing accuracy and yield of the ingot 100 are improved.
In order to secure the positioning of the ingot 100, in a preferred embodiment, the lower surface of the base plate 311 is mated with the upper surface of the workpiece plate 200. In a specific arrangement, the lower surface of the bottom plate 311 may be a convex surface, and accordingly, the upper surface of the workpiece plate 200 is a concave surface matched with the convex surface, the upper surface of the workpiece plate 200 and the lower surface of the bottom plate 311 may have various shapes, and the upper surface of the workpiece plate 200 and the lower surface of the bottom plate 311 may be matched with each other.
The inventor researches and discovers that in the prior art, the inner surface of the side wall of the workbench 310 is usually matched with the inclined surface of the workpiece plate 200 to match the workbench 310 with the inclined surface of the workpiece plate 200, so that the contact area is small, a gap of 1mm-2mm is left between the upper plane of the workpiece plate 200 and the lower plane of the bottom plate 311 of the workpiece plate 200, and the inclined surface is worn to a certain extent along with the increase of service time, so that the crystal bar 100 is easy to shake left and right during cutting, and the cut silicon wafer is abnormal. In order to ensure that the crystal bar 100 is firmly positioned and the crystal bar 100 is more flat when entering into the cutting process, in a preferred embodiment, the lower surface of the bottom plate 311 and the upper surface of the workpiece plate 200 are both flat, and when the bottom plate 311 is specifically arranged, the upper surface and the lower surface are parallel. With the above arrangement, on one hand, the contact area between the lower surface of the bottom plate 311 and the upper surface of the workpiece plate 200 is larger than the contact area between the inner surface of the sidewall of the table 310 and the inclined surface of the workpiece plate 200 when the inner surface of the sidewall is engaged with the inclined surface of the workpiece plate 200, and the friction force is also increased, so that the ingot 100 is not easily moved left and right when the ingot 100 is cut; on the other hand, the matching that the lower surface of the bottom plate 311 and the upper surface of the workpiece plate 200 are both planar conveniently enables the crystal bar 100 connected with the lower side of the bottom plate 311 to be more flat when entering cutting, and improves the slicing precision and qualification rate of the crystal bar 100.
In order to better protect the clamping screw 400, in a preferred embodiment, the lifting mechanism 300 further includes a working chamber 320, the working chamber 320 is located on a side of the working table 310 facing away from the workpiece plate 200, the working chamber 320 is provided with a third through hole 322, the third through hole 322 is opened on a surface of the working chamber 320 facing the clamping screw 400, and the third through hole 322 movably covers a portion of the clamping screw 400 exceeding the upper surface of the bottom plate 311. When the third through hole 322 is moved as required and covered on the part of the clamping screw 400 exceeding the upper surface of the bottom plate 311, the working chamber 320 is also abutted to the upper surface of the workbench 310, and through the arrangement, the clamping screw 400 can be arranged in the third through hole 322, so that a certain protection effect is provided for the clamping screw 400.
In order to conveniently apply pressure to the end of the clamping screw 400 away from the workpiece plate 200, specifically, a jacking cylinder 500 is arranged in the third through hole 322, a pressure head 510 is arranged on the jacking cylinder 500, the pressure head 510 coincides with the axis of the screw 420, the pressure head 510 is located at the end of the screw 420 away from the workbench 310, and the pressure head 510 moves towards the screw 420. When the clamping device is used specifically, a motor connected with the working chamber 320 is started, the third through hole 322 covers the part, exceeding the upper surface of the bottom plate 311, of the clamping screw 400, at the moment, the pressing head 510 and the screw 420 do not have mutual acting force, an operator starts an operating button to enable the jacking cylinder 500 to drive the pressing head 510 to move downwards, the pressing head 510 applies pressure to one end, far away from the workpiece plate 200, of the clamping screw 400, the screw 420 drives the locking nut 440 to move downwards together, the length, exceeding the lower surface of the bottom plate 311, of the screw 420 is lengthened, clamping of the inverted T-shaped groove 210 in the upper surface of the workpiece plate 200 and the screw 420 is facilitated, and after clamping is completed, the pressing head 510 can move away from the screw 420 through the operating button. Through the arrangement, the pressure is applied to the end, away from the workpiece plate 200, of the clamping screw rod 400 conveniently.
In order to achieve the up-and-down movement of the ingot 100, it is preferable that the table 310 is connected to a driving mechanism, and the table 310 is moved in a vertical direction at a set process speed. Through the above arrangement, the driving mechanism is started to move the worktable 310 up and down according to the set speed, and the worktable 310 and the workpiece plate 200 are tightly connected through the screw 420, so that the crystal bar 100 connected with the lower side of the workpiece plate 200 is driven to move up and down according to the set speed, and the crystal bar 100 is moved to a required position.
In order to cut the ingot 100, the diamond wire slicer 10 further includes a diamond wire mesh 600, and the diamond wire mesh 600 faces an end of the ingot 100 away from the workpiece plate 200. In specific use, the diamond wire mesh 600 can be used to cut the ingot 100 when the ingot 100 enters the diamond wire mesh 600 at a set speed.
In order to ensure the cutting quality of the ingot 100, in particular, the diamond wire slicing machine 10 further includes two rollers 700 located on the same horizontal line, and the diamond wire mesh 600 is wound on the rollers 700, and the rollers 700 are used for driving the diamond wire mesh 600 to move. When specifically setting up, two running roller 700 intervals set up, and when specifically using, the rotation of running roller 700 drives diamond wire net 600 on the running roller 700 and removes, and two running rollers 700 are located same water flat line and have guaranteed leveling of the diamond wire net 600 of winding on running roller 700 to level cutting crystal bar 100 is favorable to improving the qualification rate of crystal bar 100 cutting.
The technical features of the embodiments described above may be arbitrarily combined, and for the sake of brevity, all possible combinations of the technical features in the embodiments described above are not described, but should be considered as being within the scope of the present specification as long as there is no contradiction between the combinations of the technical features.
The above-mentioned embodiments only represent some embodiments of the present invention, and the description thereof is specific and detailed, but not to be construed as limiting the scope of the present invention. It should be noted that, for those skilled in the art, without departing from the spirit of the present invention, several variations and modifications can be made, which are within the scope of the present invention. Therefore, the protection scope of the present invention should be subject to the appended claims.

Claims (10)

1. A diamond wire slicer, comprising: elevating system, work piece board and crystal bar that set gradually press from both sides tight screw, wherein:
the clamping screw comprises a screw rod and a locking spring, and the locking spring is sleeved on the screw rod;
the lower side of the workpiece plate is connected with the crystal bar, and the upper side of the workpiece plate is provided with an inverted T-shaped groove;
the lifting mechanism comprises a workbench, the workbench comprises a bottom plate, a first through hole is formed in the bottom plate, and an opening of the first through hole is formed in the surface, opposite to the workpiece plate, of the bottom plate;
the screw rod penetrates through the first through hole and is clamped with the inverted T-shaped groove, and the clamping screw rod, the workbench and the workpiece plate are fixed into a whole;
the locking spring is located on the upper side of the bottom plate, and the locking spring is in a compressed state in the direction towards the bottom plate.
2. The diamond wire slicer of claim 1, wherein the clamping screw further comprises a stop and a lock nut, wherein:
the limiting structure comprises a bottom wall, and a second through hole penetrating through the wall thickness of the bottom wall is formed in the bottom wall;
the screw rod sequentially penetrates through the second through hole and the locking spring and is matched with the locking nut, the screw rod, the limiting structure, the locking spring and the locking nut are fixed into a whole, and the screw rod is in transition fit with the second through hole;
the upper surface of the bottom plate is abutted against the bottom wall, and one surface of the bottom wall, which is far away from the workbench, is abutted against the locking spring;
the lock nut is used for compressing the lock spring.
3. The wire slicer of claim 1, wherein the locking spring has a spring force of at least 1000 KG.
4. The diamond wire slicer of any one of claims 1-3, wherein the lower surface of the base plate mates with the upper surface of the workpiece plate.
5. The diamond wire slicer of claim 1 wherein the lower surface of the base plate and the upper surface of the workpiece plate are both planar.
6. The diamond wire slicer according to claim 1, wherein the lifting mechanism further comprises a working chamber, the working chamber is located at a side of the working table away from the work plate, the working chamber is provided with a third through hole, the third through hole is opened on a surface of the working chamber facing the clamping screw, and the third through hole movably covers a portion of the clamping screw exceeding the upper surface of the bottom plate.
7. The diamond wire slicer according to claim 6, wherein a jacking cylinder is arranged in the third through hole, a pressure head is arranged on the jacking cylinder, the pressure head is coincided with the axis of the screw, the pressure head is arranged at one end of the screw far away from the workbench, and the pressure head moves towards the screw.
8. The wire slicer of claim 1, wherein the table is coupled to a drive mechanism, the table moving in a vertical direction at a set process speed.
9. The diamond wire slicer of claim 1, further comprising a diamond wire mesh facing an end of the crystal bar distal from the workpiece plate.
10. The diamond wire slicer of claim 9, further comprising two rollers positioned at the same horizontal line, and the diamond wire mesh is wound around the rollers, and the rollers are used for moving the diamond wire mesh.
CN202122941108.9U 2021-11-27 2021-11-27 Diamond wire slicer Active CN216732480U (en)

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Application Number Priority Date Filing Date Title
CN202122941108.9U CN216732480U (en) 2021-11-27 2021-11-27 Diamond wire slicer

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Application Number Priority Date Filing Date Title
CN202122941108.9U CN216732480U (en) 2021-11-27 2021-11-27 Diamond wire slicer

Publications (1)

Publication Number Publication Date
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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113910477A (en) * 2021-11-27 2022-01-11 阜宁协鑫光伏科技有限公司 Diamond wire slicer

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113910477A (en) * 2021-11-27 2022-01-11 阜宁协鑫光伏科技有限公司 Diamond wire slicer

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