CN216718605U

CN216718605U - Electronic chip detection jig

Info

Publication number: CN216718605U
Application number: CN202221169727.9U
Authority: CN
Inventors: 李小理
Original assignee: Guangzhou Tower Testing Technology Co ltd
Current assignee: Guangzhou Tower Testing Technology Co ltd
Priority date: 2022-05-16
Filing date: 2022-05-16
Publication date: 2022-06-10
Anticipated expiration: 2032-05-16

Abstract

The utility model relates to the technical field of chip detection equipment, in particular to an electronic chip detection jig which comprises a detection base plate, wherein a detection base is arranged on the detection base plate, a group of detection probes are arranged on the detection base plate, a flip cover is arranged at one end of the detection base plate, an adsorption block opposite to the detection probes is arranged in the middle of the flip cover, a buffer component is arranged on the outer side of the adsorption block, an adsorption cavity is arranged inside the adsorption block, a plurality of air exhaust hoses extending out of the adsorption block and penetrating through the buffer component are arranged in the adsorption cavity, and a micro vacuum pump is arranged at one end of the detection base plate; the electronic chip can be contacted with the detection probe by covering the flip cover, so that the detection work is convenient, after the detection is finished, the flip cover is lifted, the electronic chip is separated from the adsorption block under the action of gravity by closing the micro vacuum pump, and the electronic chip can be caught by hand, so that the traditional operation of buckling the electronic chip is avoided, and the electronic chip detection device is simple in structure and convenient to operate.

Description

Electronic chip detection jig

Technical Field

The utility model relates to the technical field of chip detection equipment, in particular to an electronic chip detection jig.

Background

The electronic chip generally needs to detect the electronic chip in the condition selection such as the quality inspection that dispatches from the factory, the inspection of recovery article, performance detection, and under the normal conditions, detection tool is including setting up detection circuitry's tool bottom plate, fixed detection base on the tool bottom plate, sets up on the tool bottom plate and connects detection circuitry and with the electronic chip matching detection probe that sets up.

When detecting, need place electronic chip at the detection base, the corresponding check point that contacts corresponding electronic chip of test probe, can set up a spacing groove with chip looks adaptation on most current detection bases for to the injecing of chip position, nevertheless because the chip is less and thinner, the chip is difficult to be withheld after detecting, need operate repeatedly, and the too big damage that causes the chip easily of exerting oneself when withholding, influences the efficiency and the quality that detect.

SUMMERY OF THE UTILITY MODEL

Solves the technical problem

Aiming at the defects in the prior art, the utility model provides an electronic chip detection jig which can effectively solve the problems that in the prior art, due to the fact that a chip is small and thin, the chip is not easy to take off after detection, repeated operation is needed, and the chip is easy to damage due to too much force during taking off, and the detection efficiency and quality are affected.

Technical scheme

In order to achieve the purpose, the utility model is realized by the following technical scheme:

the utility model provides an electronic chip detection jig which comprises a detection bottom plate, wherein a detection base is arranged on the detection bottom plate, a group of detection probes are arranged on the detection base, a flip cover is arranged at one end of the detection base, an adsorption block opposite to the detection probes is arranged in the middle of the flip cover, a buffer assembly is arranged on the outer side of the adsorption block, an adsorption cavity is arranged inside the adsorption block, a plurality of air exhaust hoses extending out of the adsorption block and penetrating through the buffer assembly are arranged in the adsorption cavity, a micro vacuum pump is arranged at one end of the detection base, and the output end of the micro vacuum pump is communicated with the adsorption cavity through a connecting hose.

Further, the buffer assembly comprises two buffer plates, a plurality of springs and a set of through holes are arranged between the two buffer plates, a set of mounting holes are formed in the buffer plates in a one-to-one correspondence mode through the two sets of through holes, and the air exhaust hose is arranged in the mounting holes.

Furthermore, an outer surface layer is arranged on the outer side of the buffer plate, a group of adsorption holes opposite to the mounting holes are formed in the outer surface layer, and a group of rubber bulges are arranged around the outer edge of the outer surface layer.

Further, the outer skin is made of a leather material.

Further, the one end of detecting the base is equipped with the mounting groove, micro vacuum pump establishes in the mounting groove, the top of mounting groove is equipped with the fixed plate, be equipped with the notch that supplies coupling hose to pass on the fixed plate.

Advantageous effects

Compared with the known public technology, the technical scheme provided by the utility model has the following beneficial effects:

1. according to the utility model, the electronic chip is adsorbed on the adsorption block by arranging the micro vacuum pump, the connection hose, the adsorption block, the air exhaust hose and other structures, so that the position of the electronic chip is fixed, the electronic chip can be contacted with the detection probe by covering the flip cover, the detection work is convenient, after the detection is finished, the flip cover is lifted, the electronic chip is separated from the adsorption block under the action of gravity by closing the micro vacuum pump and is manually connected, the operation of buckling the electronic chip is avoided, the structure is simple, and the operation is convenient.

2. The buffer component is arranged on the outer side of the adsorption block to buffer and protect the electronic chip, so that the electronic chip is prevented from being damaged, the electronic chip is convenient to contact with the detection probe along with the turnover cover, and the detection work is finished.

Drawings

In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below. It is obvious that the drawings in the following description are only some embodiments of the utility model, and that for a person skilled in the art, other drawings can be derived from them without inventive effort.

FIG. 1 is a schematic structural view of an electronic chip inspection apparatus according to the present invention;

FIG. 2 is a schematic view of the backside of the present invention;

FIG. 3 is a schematic diagram showing a structural separation of the adsorption block of the present invention;

FIG. 4 is a schematic view showing a structural separation of the damper assembly of the present invention.

The reference numerals in the drawings denote: 1. detecting the bottom plate; 2. detecting a base; 3. detecting the probe; 4. a cover is turned; 5. an adsorption block; 501. an adsorption chamber; 502. an air extraction hose; 6. a buffer assembly; 601. a buffer plate; 602. a spring; 603. a through hole; 604. mounting holes; 7. a micro vacuum pump; 8. a connecting hose; 9. an outer skin layer; 901. an adsorption hole; 10. a rubber bulge; 11. mounting grooves; 12. a fixing plate; 1201. a notch.

Detailed Description

In order to make the objects, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention. It is to be understood that the embodiments described are only a few embodiments of the present invention, and not all embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.

The present invention will be further described with reference to the following examples.

Example (b): referring to the attached drawings 1-4, an electronic chip detection jig comprises a detection bottom plate 1, a detection circuit is arranged on the detection bottom plate 1, a detection base 2 is arranged on the detection bottom plate 1, a group of detection probes 3 are arranged on the detection base 2, the detection probes 3 are electrically connected with the detection circuit, a flip 4 is arranged at one end of the detection base 2, the flip 4 is closed with the detection base 2 through a buckle, an adsorption block 5 opposite to the detection probes 3 is arranged at the middle part of the flip 4, an adsorption cavity 501 is arranged inside the adsorption block 5, a plurality of air-extracting hoses 502 penetrating through the adsorption cavity 501 are arranged in the adsorption cavity 501, a mounting groove 11 is arranged at one end of the detection base 2, a micro vacuum pump 7 is arranged in the mounting groove 11, the output end of the micro vacuum pump 7 is communicated with the adsorption cavity 501 through a connecting hose 8, a fixing plate 12 is arranged at the top of the mounting groove 11, a notch 1201 for the connecting hose 8 to pass through is arranged on the fixing plate 12, one end of the detection base 2 is also provided with a switch button for controlling the on-off of the micro vacuum pump 7, the electronic chip is adsorbed on the adsorption block 5, the position of the electronic chip is fixed, the electronic chip can be contacted with the detection probe 3 by covering the flip cover 4, the detection work is convenient, after the detection is finished, the flip cover 4 is lifted, the micro vacuum pump 7 is closed, the electronic chip is separated from the adsorption block 5 under the action of gravity and is caught by hands, the traditional operation of buckling the electronic chip is avoided, the structure is simple, and the operation is convenient; the outside of adsorbing piece 5 is equipped with buffering subassembly 6, it is concrete, buffering subassembly 6 includes two buffer boards 601, be equipped with a plurality of springs 602 between two buffer boards 601, all be equipped with a set of through-hole 603 on two buffer boards 601, two sets of through-hole 603 one-to-ones form a set of mounting hole 604, air exhaust hose 502 is established in mounting hole 604, buffering through spring 602, effectively cushion the protection when being adsorbed electronic chip, avoid electronic chip's damage, and at the in-process that flip 4 was covered, buffer board 601 rotates along with flip 4, the inner one side of buffer board 601 earlier with detection base 2 contact, can be by extrusion shrink, and can be under spring 602's elasticity, make the pin on the electronic chip and the stable contact of detection probe 3.

Referring to fig. 3, the outer surface 9 is arranged on the outer side of the buffer board 601, the outer surface 9 is made of leather material, the outer surface is conveniently scrubbed, the cleanness of the outer surface 9 is guaranteed, a group of adsorption holes 901 opposite to the installation holes 604 are formed in the outer surface 9, a group of rubber bulges 10 are arranged around the outer edge of the outer surface 9, and the electronic chip is conveniently, quickly and accurately placed on the adsorption block 5 through the limitation of the rubber bulges 10.

The above examples are only intended to illustrate the technical solution of the present invention, and not to limit it; although the present invention has been described in detail with reference to the foregoing embodiments, it will be understood by those of ordinary skill in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some technical features may be equivalently replaced; and the modifications or the substitutions do not cause the essence of the corresponding technical solutions to depart from the scope of the technical solutions of the embodiments of the present invention.

Claims

1. An electronic chip detection jig comprises a detection bottom plate (1), wherein a detection base (2) is arranged on the detection bottom plate (1), a group of detection probes (3) are arranged on the detection base (2), it is characterized in that one end of the detection base (2) is provided with a flip cover (4), the middle part of the flip cover (4) is provided with an adsorption block (5) opposite to the position of the detection probe (3), the outer side of the adsorption block (5) is provided with a buffer component (6), the interior of the adsorption block (5) is provided with an adsorption cavity (501), a plurality of air exhaust hoses (502) which extend out of the adsorption blocks (5) and penetrate through the buffer component (6) are arranged in the adsorption cavity (501), one end of the detection base (2) is provided with a micro vacuum pump (7), and the output end of the micro vacuum pump (7) is communicated with the adsorption cavity (501) through a connecting hose (8).

2. The electronic chip detection jig according to claim 1, wherein the buffer assembly (6) comprises two buffer plates (601), a plurality of springs (602) are arranged between the two buffer plates (601), a set of through holes (603) are formed in each of the two buffer plates (601), a set of mounting holes (604) are formed by the two sets of through holes (603) in a one-to-one correspondence manner, and the air-extracting hose (502) is arranged in the mounting holes (604).

3. The electronic chip detection jig according to claim 2, wherein an outer surface layer (9) is disposed on an outer side of the buffer plate (601), a set of absorption holes (901) opposite to the mounting holes (604) is disposed on the outer surface layer (9), and a set of rubber bumps (10) is disposed around an outer edge of the outer surface layer (9).

4. An electronic chip detection tool as claimed in claim 3, characterized in that the outer surface layer (9) is made of leather material.

5. The electronic chip detection jig according to claim 1, wherein one end of the detection base (2) is provided with a mounting groove (11), the micro vacuum pump (7) is arranged in the mounting groove (11), a fixing plate (12) is arranged at the top of the mounting groove (11), and a notch (1201) for the connection hose (8) to pass through is formed in the fixing plate (12).