CN216708124U - Packaging mold with temperature control function - Google Patents

Abstract

The utility model relates to an encapsulation die with a temperature control function, which comprises a bearing mechanism, wherein an encapsulation mechanism is arranged at the top of the bearing mechanism, a connecting mechanism is arranged at the top of the encapsulation mechanism, a driving mechanism is arranged outside the connecting mechanism, an adjusting mechanism is arranged inside the driving mechanism, the adjusting mechanism comprises a first threaded rod, a transmission worm wheel, a second threaded rod and an adjusting worm, the left side of the inner wall of the driving mechanism is movably provided with the first threaded rod, the right side of the first threaded rod is fixedly provided with the transmission worm wheel, and one end of the right side of the transmission worm wheel is fixedly connected with the second threaded rod which is movably connected with the driving mechanism. This packaging mold with accuse temperature function, through adjustment mechanism, fastening device and coupling mechanism's setting, make packaging mechanism be convenient for demolish the maintenance with actuating mechanism, so, avoid user's use tools to demolish the maintenance effectively, just also avoid causing the injury to packaging mold wholly.

Description

Packaging mold with temperature control function

Technical Field

The utility model relates to the technical field of packaging molds, in particular to a packaging mold with a temperature control function.

Background

The semiconductor packaging refers to a process of processing a wafer passing a test according to a product model and a function requirement to obtain an independent chip; the packaging mold is a tool for packaging and protecting the independent wafer by using the plastic shell, so that the outside of the chip has certain protection performance.

At present, after the packaging mold is used for a long time, the packaging mold generally needs to be taken down and cleaned and maintained, but the existing packaging mold is inconvenient for people to dismantle and maintain the packaging mold, needs tools, is easy to damage the packaging mold and causes unnecessary loss.

SUMMERY OF THE UTILITY MODEL

Aiming at the defects of the prior art, the utility model provides the packaging mold with the temperature control function, which has the advantages of convenience in disassembly and maintenance and the like, and solves the problem that the packaging mold is inconvenient for people to disassemble and maintain.

In order to achieve the purpose, the utility model provides the following technical scheme: a packaging mold with a temperature control function comprises a bearing mechanism, wherein a packaging mechanism is arranged at the top of the bearing mechanism, a connecting mechanism is arranged at the top of the packaging mechanism, a driving mechanism is arranged outside the connecting mechanism, an adjusting mechanism is arranged inside the driving mechanism, a fastening mechanism is arranged outside the adjusting mechanism, and a feeding mechanism is arranged inside the packaging mechanism;

adjustment mechanism includes first threaded rod, transmission worm wheel, second threaded rod and regulation worm, actuating mechanism's inner wall left side movable mounting has first threaded rod, the right side fixed mounting of first threaded rod has the transmission worm wheel, the right side fixed mounting of transmission worm wheel has one end and actuating mechanism swing joint second threaded rod, actuating mechanism's positive movable mounting has one end to run through actuating mechanism and one end and actuating mechanism swing joint's regulation worm, the regulation worm meshes with the transmission worm wheel mutually, the screw thread opposite direction of first threaded rod and second threaded rod.

Further, the bearing mechanism comprises a bearing lower die and a chip body, and the chip body is placed at the top of the bearing lower die.

Further, encapsulation mechanism is including the encapsulation mould, encapsulation die cavity, heat transfer pipeline and controller, it has the encapsulation to bear lower mould top movable mounting and go up the mould, the bottom fixed mounting who goes up the mould in the encapsulation has one end to run through and extend to the encapsulation die cavity of the mould inside in the encapsulation, the encapsulation die cavity is located the inside of chip body, the outside winding of encapsulation die cavity has one end to run through and extend to the encapsulation and goes up the left heat transfer pipeline of mould, the right side fixed mounting who goes up the mould in the encapsulation has the controller.

Further, coupling mechanism includes locating piece and constant head tank, the top fixed mounting of mould has the locating piece on the encapsulation, the constant head tank has all been seted up to the left and right sides of locating piece.

Further, actuating mechanism is including connecting storehouse and drive assembly, the connection storehouse has been cup jointed to the outside of locating piece, the top fixed mounting who connects the storehouse has drive assembly.

Further, fastening device includes thread bush, stopper and T joint pole, the interior diapire fixed mounting who connects the storehouse has the equal fixed mounting in the left and right sides that is located the locating piece to have the stopper, the quantity of thread bush is two, and left side thread bush movable mounting is in the outside of first threaded rod, the right side thread bush movable mounting is in the outside of second threaded rod, the bottom fixed mounting of thread bush has one end to run through the stopper and extend to the inside T joint pole of constant head tank, the outside fixed mounting of T joint pole has the restriction ring.

Further, feed mechanism includes inlet pipe, heater and infrared temperature sensor, the top fixed mounting of mould has one end to run through the mould in the encapsulation and the inlet pipe that one end is linked together with the encapsulation die cavity, the equal fixed mounting in the left and right sides of inlet pipe has the heater, the positive fixed mounting of heater has infrared temperature sensor, infrared temperature sensor and heater all are connected with the controller electricity.

Compared with the prior art, the technical scheme of the application has the following beneficial effects:

1. according to the packaging mold with the temperature control function, the packaging mechanism is convenient to detach and maintain with the driving mechanism through the arrangement of the adjusting mechanism, the fastening mechanism and the connecting mechanism, so that a user is effectively prevented from detaching and maintaining by using a tool, and the whole packaging mold is prevented from being damaged;

2. this packaging mold with accuse temperature function through the setting of feed mechanism and packaging mechanism, not only makes the chip body by quick plastic envelope shaping drawing of patterns, also makes the temperature of moulding plastics regulate and control, avoids the high temperature to cause the damage to the injection molding material, has made things convenient for the use.

Drawings

FIG. 1 is a schematic structural view of the present invention;

FIG. 2 is an enlarged view taken at A of FIG. 1 in accordance with the present invention;

fig. 3 is a front view of the present invention.

In the figure: the device comprises a bearing mechanism 1, a bearing lower die 11, a chip body 12, a packaging mechanism 2, a packaging upper die 21, a packaging die cavity 22, a heat exchange pipeline 23, a controller 24, a connecting mechanism 3, a positioning block 31, a positioning groove 32, a driving mechanism 4, a connecting bin 41, a driving assembly 42, an adjusting mechanism 5, a first threaded rod 51, a transmission worm gear 52, a second threaded rod 53, an adjusting worm 54, a fastening mechanism 6, a thread bush 61, a limiting block 62, a clamping rod 63T, a feeding mechanism 7, a feeding pipe 71, a heater 72 and an infrared temperature measuring sensor 73.

Detailed Description

The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.

Referring to fig. 1-3, the packaging mold with temperature control function in this embodiment includes a bearing mechanism 1, a packaging mechanism 2 is disposed on the top of the bearing mechanism 1, a connecting mechanism 3 is disposed on the top of the packaging mechanism 2, a driving mechanism 4 is disposed outside the connecting mechanism 3, an adjusting mechanism 5 is disposed inside the driving mechanism 4, a fastening mechanism 6 is disposed outside the adjusting mechanism 5, and a feeding mechanism 7 is disposed inside the packaging mechanism 2;

the adjusting mechanism 5 comprises a first threaded rod 51, a transmission worm wheel 52, a second threaded rod 53 and an adjusting worm 54, the first threaded rod 51 is movably mounted on the left side of the inner wall of the driving mechanism 4, the transmission worm wheel 52 is fixedly mounted on the right side of the first threaded rod 51, the second threaded rod 53 with one end movably connected with the driving mechanism 4 is fixedly mounted on the right side of the transmission worm wheel 52, the adjusting worm 54 with one end penetrating through the driving mechanism 4 and one end movably connected with the driving mechanism 4 is movably mounted on the front side of the driving mechanism 4, the adjusting worm 54 is meshed with the transmission worm wheel 52, the thread directions of the first threaded rod 51 and the second threaded rod 53 are opposite, in use, the adjusting worm 54 is rotated to rotate the transmission worm wheel 52, so as to drive the first threaded rod 51 and the second threaded rod 53 to rotate, so that the fastening mechanism 6 is conveniently detached from the connecting mechanism 3, and the packaging mechanism 2 is conveniently cleaned and maintained.

In this embodiment, the supporting mechanism 1 includes a supporting lower mold 11 and a chip body 12, and the chip body 12 is placed on the top of the supporting lower mold 11.

In this embodiment, encapsulation mechanism 2 includes mould 21 on the encapsulation, encapsulation die cavity 22, heat transfer pipeline 23 and controller 24, bear lower mould 11 top movable mounting and have mould 21 on the encapsulation, the bottom fixed mounting of mould 21 on the encapsulation has one end to run through and extend to the encapsulation die cavity 22 of mould 21 inside on the encapsulation, encapsulation die cavity 22 is located the inside of chip body 12, the outside winding of encapsulation die cavity 22 has one end to run through and extend to the left heat transfer pipeline 23 of mould 21 on the encapsulation, the right side fixed mounting of mould 21 on the encapsulation has controller 24, setting through controller 24, it is inseparable to make the cooperation between the part.

In this embodiment, the connecting mechanism 3 includes a positioning block 31 and a positioning groove 32, the positioning block 31 is fixedly mounted at the top of the upper die 21 in the package, and the positioning grooves 32 are formed in the left and right sides of the positioning block 31.

In this embodiment, the driving mechanism 4 includes a connecting bin 41 and a driving component 42, the connecting bin 41 is sleeved outside the positioning block 31, the driving component 42 is fixedly mounted at the top of the connecting bin 41, and the whole packaging mold can be used by the arrangement of the driving component 42.

In this embodiment, fastening device 6 includes thread bush 61, stopper 62 and T joint pole 63, the equal fixed mounting in the left and right sides that connects storehouse 41 has the locating piece 31 has stopper 62, the quantity of thread bush 61 is two, left side thread bush 61 movable mounting is in the outside of first threaded rod 51, right side thread bush 61 movable mounting is in the outside of second threaded rod 53, the bottom fixed mounting of thread bush 61 has one end to run through stopper 62 and extend to the inside T joint pole 63 of constant head tank 32, the outside fixed mounting of T joint pole 63 has the restriction ring, setting through the restriction ring, effectively avoid T joint pole 63 to be driven by thread bush 61 and break away from the restriction of stopper 62.

In this embodiment, feed mechanism 7 includes inlet pipe 71, heater 72 and infrared temperature sensor 73, the top fixed mounting of mould 21 in the encapsulation has one end to run through mould 21 in the encapsulation and inlet pipe 71 that one end is linked together with encapsulation die cavity 22, the equal fixed mounting in the left and right sides of inlet pipe 71 has heater 72, the front fixed mounting of heater 72 has infrared temperature sensor 73, infrared temperature sensor 73 and heater 72 all are connected with controller 24 electricity, setting through infrared temperature sensor 73, it is monitored constantly to make the plastic envelope material temperature, effectively avoid the plastic envelope material by high temperature carbonization.

The working principle of the above embodiment is as follows:

(1) in use, the adjusting worm 54 is rotated to rotate the transmission worm wheel 52, so as to drive the first threaded rod 51 and the second threaded rod 53 to rotate, so that the threaded sleeves 61 are driven, and the T clamping rod 63 connected with the threaded sleeves 61 can only move inside the limiting block 62, so that the two threaded sleeves 61 can perform relative displacement and opposite displacement under the driving of the first threaded rod 51 and the second threaded rod 53, so that the T clamping rod 63 can be separated from the inside of the positioning groove 32, and the packaging mechanism 2 can be separated from the driving mechanism 4 for maintenance, thus effectively avoiding the users from using tools to remove and maintain, and avoiding the damage to the whole packaging mold;

(2) in use, the plastic package material is fed into the package mold cavity 22 through the feeding pipe 71, at the moment, the opened heater 72 heats the plastic package material, so that the plastic package material is effectively melted and covers the outside of the chip body 12, meanwhile, the infrared temperature measurement sensor 73 monitors the temperature of the plastic package material in real time and transmits data to the controller 24, when the heating temperature exceeds the bearing temperature of the plastic package material, the controller 24 closes the heater 72, so that the temperature of the plastic package material is adjusted, then, cooling liquid is input through the heat exchange pipeline 23, so that the plastic package material filled in the package mold cavity 22 is rapidly cooled and solidified, therefore, the chip body 12 is rapidly demolded by plastic package molding, the injection molding temperature is regulated, the damage to the injection molding material due to overhigh temperature is avoided, and the use is convenient.

It is noted that, herein, relational terms such as first and second, and the like may be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising an … …" does not exclude the presence of other identical elements in a process, method, article, or apparatus that comprises the element.

Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the utility model, the scope of which is defined in the appended claims and their equivalents.

Claims (7)

1. The utility model provides an encapsulation mould with accuse temperature function, includes bearing mechanism (1), its characterized in that: a packaging mechanism (2) is arranged at the top of the bearing mechanism (1), a connecting mechanism (3) is arranged at the top of the packaging mechanism (2), a driving mechanism (4) is arranged outside the connecting mechanism (3), an adjusting mechanism (5) is arranged inside the driving mechanism (4), a fastening mechanism (6) is arranged outside the adjusting mechanism (5), and a feeding mechanism (7) is arranged inside the packaging mechanism (2);

adjustment mechanism (5) include first threaded rod (51), transmission worm wheel (52), second threaded rod (53) and regulation worm (54), the inner wall left side movable mounting of actuating mechanism (4) has first threaded rod (51), the right side fixed mounting of first threaded rod (51) has transmission worm wheel (52), the right side fixed mounting of transmission worm wheel (52) has one end and actuating mechanism (4) swing joint second threaded rod (53), the positive movable mounting of actuating mechanism (4) has one end to run through actuating mechanism (4) and one end and actuating mechanism (4) swing joint's regulation worm (54), regulation worm (54) mesh with transmission worm wheel (52) mutually, the screw direction of first threaded rod (51) and second threaded rod (53) is opposite.

2. The packaging mold with temperature control function according to claim 1, wherein: the bearing mechanism (1) comprises a bearing lower die (11) and a chip body (12), and the chip body (12) is placed at the top of the bearing lower die (11).

3. The packaging mold with temperature control function according to claim 2, wherein: encapsulation mechanism (2) are including encapsulating last mould (21), encapsulation die cavity (22), heat transfer pipeline (23) and controller (24), bear lower mould (11) top movable mounting and have the encapsulation to go up mould (21), the bottom fixed mounting who moulds (21) in the encapsulation has one end to run through and extend to the encapsulation die cavity (22) of encapsulating the mould (21) inside, encapsulation die cavity (22) are located the inside of chip body (12), the outside winding of encapsulation die cavity (22) has one end to run through and extend to the encapsulation to go up left heat transfer pipeline (23) of mould (21), the right side fixed mounting who moulds (21) in the encapsulation has controller (24).

4. The packaging mold with temperature control function according to claim 3, wherein: coupling mechanism (3) include locating piece (31) and constant head tank (32), the top fixed mounting of mould (21) has locating piece (31) on the encapsulation, constant head tank (32) have all been seted up to the left and right sides of locating piece (31).

5. The packaging mold with temperature control function according to claim 4, wherein: the driving mechanism (4) comprises a connecting bin (41) and a driving assembly (42), the connecting bin (41) is sleeved outside the positioning block (31), and the driving assembly (42) is fixedly mounted at the top of the connecting bin (41).

6. The packaging mold with temperature control function according to claim 5, wherein: fastening device (6) include thread bush (61), stopper (62) and T joint pole (63), the equal fixed mounting in both sides has stopper (62) about connecting the interior diapire fixed mounting in storehouse (41) and being located locating piece (31), the quantity of thread bush (61) is two, and left side thread bush (61) movable mounting is in the outside of first threaded rod (51), the right side thread bush (61) movable mounting is in the outside of second threaded rod (53), the bottom fixed mounting of thread bush (61) has one end to run through stopper (62) and extends to the inside T joint pole (63) of constant head tank (32), the outside fixed mounting of T joint pole (63) has the restriction ring.

7. The packaging mold with temperature control function according to claim 3, wherein: feed mechanism (7) include inlet pipe (71), heater (72) and infrared temperature sensor (73), the top fixed mounting of mould (21) has one end to run through inlet pipe (71) that mould (21) and one end and encapsulation die cavity (22) are linked together on the encapsulation, the equal fixed mounting in the left and right sides of inlet pipe (71) has heater (72), the positive fixed mounting of heater (72) has infrared temperature sensor (73), infrared temperature sensor (73) and heater (72) all are connected with controller (24) electricity.

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