CN216708037U - Mould is used in production of building energy-saving sound insulation material - Google Patents

Mould is used in production of building energy-saving sound insulation material Download PDF

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Publication number
CN216708037U
CN216708037U CN202121955179.8U CN202121955179U CN216708037U CN 216708037 U CN216708037 U CN 216708037U CN 202121955179 U CN202121955179 U CN 202121955179U CN 216708037 U CN216708037 U CN 216708037U
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CN
China
Prior art keywords
water
water tank
cooling
pipe
fixedly connected
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN202121955179.8U
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Chinese (zh)
Inventor
贾鹤婉
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Li Shuangshuang
Liang Qianqian
Niu Yingxin
Peng Fei
Weng Zhibo
Original Assignee
Chen Fengpeng
Han Yiwei
Weng Zhibo
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Chen Fengpeng, Han Yiwei, Weng Zhibo filed Critical Chen Fengpeng
Priority to CN202121955179.8U priority Critical patent/CN216708037U/en
Application granted granted Critical
Publication of CN216708037U publication Critical patent/CN216708037U/en
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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Abstract

The utility model discloses a mold for producing a building energy-saving sound-insulating material, which comprises a mold body, wherein a structure for cooling the mold body is arranged on the surface of the mold body, the structure for cooling the mold body comprises a water tank arranged on the right side of the mold body, a water pump is fixedly connected to the left side of the top of the water tank, the input end of the water pump is communicated with a water pumping pipe, the bottom of the water pumping pipe penetrates into the water tank, and the output end of the water pump is communicated with a water delivery pipe. According to the utility model, the water pump is arranged to start to operate, the water pump transports the cooling liquid into the cooling pipe through the water pumping pipe, the water delivery pipe and the joint I, the cooling pipe cools the die body, and the semiconductor refrigerating sheet cools the cooling liquid, so that the problems that the existing die is poor in cooling effect, cannot rapidly cool the die, needs a large amount of time and cannot meet the use requirements of a user on the die are solved.

Description

Mould is used in production of building energy-saving sound insulation material
Technical Field
The utility model relates to the technical field of sound insulation materials, in particular to a mold for producing an energy-saving sound insulation material for a building.
Background
The mould is used for the fashioned instrument of article, and mainly used moulds the appearance of article, and current mould cooling effect is relatively poor, can't carry out quick cooling to the mould, needs to use a large amount of time, can't satisfy the user demand of user to the mould.
SUMMERY OF THE UTILITY MODEL
In order to solve the problems in the background art, the utility model aims to provide a mold for producing an energy-saving sound-insulating material for a building, which has the advantage of rapid cooling and solves the problems that the cooling effect of some molds is poor, the molds cannot be rapidly cooled, a large amount of time is required, and the use requirements of users on the molds cannot be met.
In order to achieve the purpose, the utility model provides the following technical scheme: a mold for producing a building energy-saving sound-insulation material comprises a mold body, wherein a structure for cooling the mold body is arranged on the surface of the mold body, the structure for cooling the mold body comprises a water tank arranged on the right side of the mold body, a water pump is fixedly connected to the left side of the top of the water tank, the input end of the water pump is communicated with a water pumping pipe, the bottom of the water pumping pipe penetrates into the water tank, the output end of the water pump is communicated with a water delivery pipe, one end, away from the water tank, of the water delivery pipe is communicated with a first connector, the left end of the first connector is communicated with a cooling pipe, one end, away from the mold body, of the cooling pipe is communicated with a return pipe, the right end of the return pipe is communicated with a second connector, the right end of the second connector is communicated with a connecting pipe, the right end of the connecting pipe penetrates into the water tank, and a connecting plate is fixedly connected to the front side of the mold body, the top fixedly connected with long board of connecting plate, the shifting chute has been seted up at the top of long board, the inside sliding connection of shifting chute has the sliding block, the top fixedly connected with fixed plate of sliding block, the top fixedly connected with fan of fixed plate.
Preferably, a water level observation window is arranged on the front side of the water tank, and scale marks are arranged on the front side of the water level observation window.
Preferably, the semiconductor refrigeration piece is fixedly connected to the right side of the water tank, the supporting block is fixedly connected to the right side of the water tank, and the cooling fan is fixedly connected to the right side of the supporting block.
Preferably, the surfaces of the long plate and the water tank are provided with antirust coatings, and the number of the semiconductor refrigeration sheets is two.
Compared with the prior art, the utility model has the following beneficial effects:
1. according to the utility model, the water pump is arranged to start to operate, the water pump transports the cooling liquid into the cooling pipe through the water pumping pipe, the water delivery pipe and the joint I, the cooling pipe cools the die body, and the semiconductor refrigerating sheet cools the cooling liquid, so that the problems that the existing die is poor in cooling effect, cannot rapidly cool the die, needs a large amount of time and cannot meet the use requirements of a user on the die are solved.
2. According to the utility model, the water tank, the water pump and the cooling pipe are arranged, so that the mold body can be cooled, and the cooling speed of the mold body is improved.
3. According to the utility model, the fan is arranged, so that the auxiliary heat dissipation can be carried out on the die body, and the cooling speed of the die body is increased.
4. According to the utility model, through arranging the water level observation window and the scale marks, a user can conveniently and visually know the liquid level condition in the water tank, and the practicability of the water tank is improved.
5. According to the utility model, by arranging the semiconductor refrigerating sheet and the radiating fan, the cooling liquid in the water tank can be cooled through the water tank, and the practicability of the water tank is improved.
6. The utility model can prevent the long plate and the water tank from rusting by arranging the antirust coating, thereby prolonging the service life of the long plate and the water tank.
Drawings
FIG. 1 is a schematic view of the structure of the present invention;
FIG. 2 is an enlarged view taken at A in FIG. 1 according to the present invention;
fig. 3 is a schematic perspective view of the long plate of the present invention.
In the figure: 1. a mold body; 2. a water tank; 3. a water pump; 4. a water pumping pipe; 5. a water delivery pipe; 6. a first connector; 7. a cooling tube; 8. a return pipe; 9. a second joint; 10. a connecting pipe; 11. A connecting plate; 12. a long plate; 13. a moving groove; 14. a slider; 15. a fixing plate; 16. a fan; 17. a water level observation window; 18. a semiconductor refrigeration sheet; 19. a support block; 20. a heat dissipation fan.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
As shown in fig. 1 to 3, the die for producing a building energy-saving sound-insulating material provided by the utility model comprises a die body 1, wherein a structure for cooling the die body 1 is arranged on the surface of the die body 1, the structure for cooling the die body 1 comprises a water tank 2 arranged on the right side of the die body 1, a water pump 3 is fixedly connected to the left side of the top of the water tank 2, an input end of the water pump 3 is communicated with a water pumping pipe 4, the bottom of the water pumping pipe 4 penetrates into the water tank 2, an output end of the water pump 3 is communicated with a water delivery pipe 5, one end of the water delivery pipe 5, which is far away from the water tank 2, is communicated with a first connector 6, the left end of the first connector 6 is communicated with a cooling pipe 7, one end of the cooling pipe 7, which is far away from the die body 1, is communicated with a return pipe 8, the right end of the return pipe 8 is communicated with a second connector 9, the right end of the second connector 9 is communicated with a connecting pipe 10, and the right end of the connecting pipe 10 penetrates into the water tank 2, the front side fixedly connected with connecting plate 11 of mould body 1, the top fixedly connected with long board 12 of connecting plate 11, shifting chute 13 has been seted up at the top of long board 12, and the inside sliding connection of shifting chute 13 has sliding block 14, sliding block 14's top fixedly connected with fixed plate 15, fixed plate 15's top fixedly connected with fan 16.
As a technical optimization scheme of the utility model, the water tank 2, the water pump 3 and the cooling pipe 7 are arranged, so that the mold body 1 can be cooled, and the cooling speed of the mold body 1 is improved.
As a technical optimization scheme of the utility model, the fan 16 is arranged to perform auxiliary heat dissipation on the die body 1, so that the cooling speed of the die body 1 is increased.
Referring to fig. 1, a water level observation window 17 is provided at a front side of a water tank 2, and scale lines are provided at a front side of the water level observation window 17.
As a technical optimization scheme of the utility model, the water level observation window 17 and the scale marks are arranged, so that a user can conveniently and intuitively know the liquid level condition in the water tank 2, and the practicability of the water tank 2 is improved.
Referring to fig. 2, a semiconductor cooling plate 18 is fixedly connected to the right side of the water tank 2, a supporting block 19 is fixedly connected to the right side of the water tank 2, and a cooling fan 20 is fixedly connected to the right side of the supporting block 19.
As a technical optimization scheme of the present invention, by providing the semiconductor refrigeration sheet 18 and the cooling fan 20, the coolant inside the water tank 2 can be cooled by the water tank, and the practicability of the water tank 2 is improved.
Referring to fig. 1, the surfaces of the long plate 12 and the water tank 2 are provided with an antirust coating, and the number of the semiconductor chilling plates 18 is two.
As a technical optimization scheme of the utility model, the long plate 12 and the water tank 2 can be prevented from rusting by arranging the antirust coating, and the service lives of the long plate 12 and the water tank 2 are prolonged.
The working principle and the using process of the utility model are as follows: during the use, the user starts water pump 3, water pump 3 passes through drinking-water pipe 4, raceway 5 and joint 6, transport the inside coolant liquid of 2 inside water tanks to the inside of cooling tube 7, cooling tube 7 cools down mould body 1, the coolant liquid after the cooling passes through back flow 8, joint two 9 and the inside that connecting pipe 10 flowed into water tank 2, then start semiconductor refrigeration piece 18 and radiator fan 20, semiconductor refrigeration piece 18 cools down the coolant liquid through water tank 2, radiator fan 20 dispels the heat to semiconductor refrigeration piece 18, can possess quick refrigerated advantage.
In summary, the following steps: this mould is used in energy-conserving acoustic material production of building, through 3 start operations of water pump, water pump 3 is through drinking-water pipe 4, raceway 5 transports the coolant liquid to cooling tube 7 with a joint 6 in, cooling tube 7 cools down to mould body 1, semiconductor refrigeration piece 18 cools down to the coolant liquid, it is relatively poor to have solved current mould cooling effect, can't carry out quick cooling to the mould, need use a large amount of time, can't satisfy the problem of user demand to the mould.
It is noted that, herein, relational terms such as first and second, and the like may be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus.
Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the utility model, the scope of which is defined in the appended claims and their equivalents.

Claims (4)

1. A mold for producing building energy-saving sound insulation materials comprises a mold body (1);
the method is characterized in that: the surface of the die body (1) is provided with a structure for cooling the die body (1), the structure for cooling the die body (1) comprises a water tank (2) arranged on the right side of the die body (1), a water pump (3) is fixedly connected to the left side of the top of the water tank (2), an input end of the water pump (3) is communicated with a water pumping pipe (4), the bottom of the water pumping pipe (4) penetrates into the water tank (2), an output end of the water pump (3) is communicated with a water delivery pipe (5), one end, far away from the water tank (2), of the water delivery pipe (5) is communicated with a first connector (6), the left end of the first connector (6) is communicated with a cooling pipe (7), one end, far away from the die body (1), of the cooling pipe (7) is communicated with a return pipe (8), and the right end of the return pipe (8) is communicated with a second connector (9), the right-hand member intercommunication that connects two (9) has connecting pipe (10), the right-hand member of connecting pipe (10) runs through to the inside of water tank (2), front side fixedly connected with connecting plate (11) of mould body (1), top fixedly connected with long board (12) of connecting plate (11), shifting chute (13) have been seted up at the top of long board (12), the inside sliding connection of shifting chute (13) has sliding block (14), top fixedly connected with fixed plate (15) of sliding block (14), the top fixedly connected with fan (16) of fixed plate (15).
2. The mold for producing the building energy-saving sound-insulating material as claimed in claim 1, wherein: the water level observation window (17) is arranged on the front side of the water tank (2), and scale marks are arranged on the front side of the water level observation window (17).
3. The mold for producing the building energy-saving sound-insulating material as claimed in claim 1, wherein: the refrigerator is characterized in that a semiconductor refrigeration piece (18) is fixedly connected to the right side of the water tank (2), a supporting block (19) is fixedly connected to the right side of the water tank (2), and a cooling fan (20) is fixedly connected to the right side of the supporting block (19).
4. The mold for producing the building energy-saving sound-insulating material as claimed in claim 3, wherein: the long plate (12) and the water tank (2) are provided with antirust coatings, and the number of the semiconductor refrigeration pieces (18) is two.
CN202121955179.8U 2021-08-19 2021-08-19 Mould is used in production of building energy-saving sound insulation material Expired - Fee Related CN216708037U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202121955179.8U CN216708037U (en) 2021-08-19 2021-08-19 Mould is used in production of building energy-saving sound insulation material

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202121955179.8U CN216708037U (en) 2021-08-19 2021-08-19 Mould is used in production of building energy-saving sound insulation material

Publications (1)

Publication Number Publication Date
CN216708037U true CN216708037U (en) 2022-06-10

Family

ID=81872395

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202121955179.8U Expired - Fee Related CN216708037U (en) 2021-08-19 2021-08-19 Mould is used in production of building energy-saving sound insulation material

Country Status (1)

Country Link
CN (1) CN216708037U (en)

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Date Code Title Description
GR01 Patent grant
GR01 Patent grant
TR01 Transfer of patent right

Effective date of registration: 20230615

Address after: 050000 No.3, No.9, Yuhua West Road, Qiaoxi District, Shijiazhuang City, Hebei Province

Patentee after: Peng Fei

Patentee after: Niu Yingxin

Patentee after: Liang Qianqian

Patentee after: Weng Zhibo

Patentee after: Li Shuangshuang

Address before: 050700 No. 101, West unit, dormitory of No. 1 Design Institute, No. 46, auditorium North Street, Xinle City, Shijiazhuang City, Hebei Province

Patentee before: Wang Xinying

Patentee before: Gao Jing

Patentee before: Chen Fengpeng

Patentee before: Weng Zhibo

Patentee before: Han Yiwei

TR01 Transfer of patent right
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20220610

CF01 Termination of patent right due to non-payment of annual fee