CN216700816U - Intelligent Internet of things platform - Google Patents

Intelligent Internet of things platform Download PDF

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Publication number
CN216700816U
CN216700816U CN202220057203.4U CN202220057203U CN216700816U CN 216700816 U CN216700816 U CN 216700816U CN 202220057203 U CN202220057203 U CN 202220057203U CN 216700816 U CN216700816 U CN 216700816U
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air
platform
dust cover
air inlet
platform main
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CN202220057203.4U
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Chinese (zh)
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刘鸿飞
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Hangzhou Boyuan Information Technology Co ltd
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Hangzhou Boyuan Information Technology Co ltd
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Abstract

The utility model discloses an intelligent Internet of things platform, which relates to the technical field of Internet of things and comprises a base, a dust cover and a platform main body, wherein the dust cover is installed on the upper surface of the base through screws, the platform main body is placed on the upper surface of the base and positioned inside the dust cover, air suction pipes and exhaust pipes are respectively welded on the left side surface and the right side surface inside the platform main body, an air outlet area and an air inlet area are respectively formed in the left end and the right end of the top of the dust cover, filter cartridges for filtering air are inserted into the air inlet area, a first connecting pipe for conveying air to the exhaust pipes is inserted into the right end of the bottom of the air inlet area, a second connecting pipe for exhausting air to the air suction pipes is inserted into the bottom of the air outlet area, a heat conducting plate is embedded in the upper surface of the base, and a plurality of semiconductor refrigerating sheets are installed at the bottom of the heat conducting plate. According to the utility model, the intelligent Internet of things platform is prevented from dust, and meanwhile, air flow can be formed in the platform main body, so that electronic components in the platform main body are radiated.

Description

Intelligent Internet of things platform
Technical Field
The utility model relates to the technical field of Internet of things, in particular to an intelligent Internet of things platform.
Background
The intelligent Internet of things platform is an integrated platform integrating the capabilities of equipment management, data security communication, message subscription and the like. Supporting and connecting mass equipment downwards, and acquiring equipment data cloud; and a cloud API is provided upwards, and the server can issue the command to the equipment end by calling the cloud API to realize remote control.
The utility model discloses a utility model patent with publication number CN214756726U in the existing patent discloses an intelligent Internet of things platform, which comprises a mounting plate, wherein a chute is arranged in the mounting plate, the interior of the chute is connected with a drawer in a sliding manner, one side of the drawer is fixed with a handle, an outer limit ring is arranged in the mounting plate, an outer cover chute is arranged on the upper surface of the mounting plate, the interior of the outer cover chute is connected with an outer cover in a sliding manner, an inner cover chute is arranged on the upper surface of the mounting plate, the interior of the inner cover chute is connected with an inner cover in a sliding manner, the inner surface of the inner cover is movably connected with an inner limit ring, a bearing plate is fixed on the inner surface of the inner limit ring, and the upper surface of the bearing plate is movably connected with the intelligent Internet of things platform;
the utility model discloses a through placing intelligent thing networking platform on the mounting panel, and the outside of intelligent thing networking platform sets up the dust cover again, can dispel the heat and prevent dust to intelligent thing networking platform, but when dispelling the heat to intelligent thing networking platform, can only dispel the heat to the casing outside of intelligent thing networking platform, but be difficult to dispel the heat in the casing, the heat-sinking capability is not enough, for this reason we have proposed an intelligent thing networking platform to solve the above-mentioned technical problem that proposes.
SUMMERY OF THE UTILITY MODEL
The utility model provides an intelligent Internet of things platform, which aims to solve the problem that the existing intelligent Internet of things platform in the background art can only radiate the outside of a shell, but is difficult to radiate the inside of the shell.
In order to achieve the purpose, the utility model adopts the following technical scheme:
an intelligent Internet of things platform comprises a base, a dust cover and a platform main body, wherein the dust cover is installed on the upper surface of the base through screws, and the platform main body is placed on the upper surface of the base and located inside the dust cover;
the utility model discloses a platform, including platform main part, dust cover, air inlet zone, air outlet zone, heat-conducting plate, suction pipe and blast pipe have been welded respectively to the inside left and right sides face of platform main part, air outlet zone and air inlet zone have been seted up respectively to both ends about the dust cover top, air inlet zone's inside is inserted and is used for the cartridge filter to air filter, air inlet zone bottom's right-hand member is pegged graft and is had the first connecting pipe that is used for toward blast pipe gas transmission, air outlet zone's bottom is pegged graft and is used for toward the second connecting pipe that the suction pipe bled, the upper surface of base has been inlayed and is connected the heat-conducting plate, polylith semiconductor refrigeration piece is installed to the bottom of heat-conducting plate.
Furthermore, conical holes are formed in the left end and the right end of the top of the platform main body, and the exhaust pipe and the air suction pipe penetrate through the lower ends of the inner portions of the conical holes in the same side.
Furthermore, the lower end of the first connecting pipe is inserted into the right end of the upper end inside the conical hole, and the lower end of the second connecting pipe is inserted into the left end of the lower end inside the conical hole.
Furthermore, an air inlet is formed in the left end of the top surface inside the air inlet area, the filter cartridge is located between the air inlet and the first connecting pipe, and a sealing plug is embedded into the right end of the air inlet area.
Furthermore, filter screens are installed at the left end and the right end of the interior of the filter cartridge, and drying agents are filled between the two filter screens.
Further, the air exhauster is installed to the left end edge at dust cover top, the air inlet department of air exhauster is pegged graft and is had the exhaust tube, the bottom of exhaust tube is pegged graft with the top in gas outlet area.
Further, the platform main part is located directly over the heat-conducting plate, the upper surface bonding of heat-conducting plate has heat conduction silica gel pad, heat conduction silica gel pad is filled between heat-conducting plate and platform main part, heat radiation fins has all been welded to the left and right sides face of platform main part, the front surface of dust cover articulates there is the access door.
Compared with the prior art, the utility model has the following beneficial effects:
through arranging the exhaust pipe and the air suction pipe in the platform main body, the air inlet area on the dust cover can discharge cold air into the exhaust pipe, so that the cold air in the exhaust pipe can be discharged into the platform main body, the air outlet area on the dust cover can extract and discharge the air in the air suction pipe, and the air suction pipe can suck the air in the platform main body;
semiconductor refrigeration piece through the heat-conducting plate bottom can refrigerate the platform main part to further improve the radiating effect of intelligence thing networking platform, low temperature in the platform main part can distribute the inside of dust cover through heat radiation fins simultaneously, with this make in the dust cover be in the low temperature state, thereby play thermal-insulated effect.
Drawings
Fig. 1 is a schematic view of the internal structure of the present invention.
FIG. 2 is an enlarged view of a portion of FIG. 1 according to the present invention.
FIG. 3 is an enlarged view of a portion of FIG. 1B according to the present invention.
Fig. 4 is an external structural view of the present invention.
In FIGS. 1-4: 1-base, 2-dust cover, 201-gas outlet area, 202-gas inlet area, 203-gas inlet, 3-platform main body, 301-conical hole, 4-heat conducting plate, 5-semiconductor refrigerating sheet, 6-filter cylinder, 7-filter screen, 8-desiccant, 9-exhaust fan, 10-exhaust pipe, 11-first connecting pipe, 12-second connecting pipe, 13-sealing plug, 14-exhaust pipe, 15-air suction pipe, 16-heat dissipation fin, 17-heat conduction silica gel pad, and 18-access door.
Detailed Description
Please refer to fig. 1 to 4:
the utility model provides an intelligent Internet of things platform, which comprises a base 1, a dust cover 2 and a platform main body 3, wherein the dust cover 2 is installed on the upper surface of the base 1 through screws, the platform main body 3 is placed on the upper surface of the base 1 and is positioned inside the dust cover 2, an air suction pipe 15 and an exhaust pipe 14 are respectively welded on the left side surface and the right side surface inside the platform main body 3, an air outlet area 201 and an air inlet area 202 are respectively arranged at the left end and the right end of the top of the dust cover 2, a filter cartridge 6 for filtering air is inserted into the air inlet area 202, a first connecting pipe 11 for conveying air to the exhaust pipe 14 is inserted at the right end of the bottom of the air inlet area 202, a second connecting pipe 12 for exhausting air to the air suction pipe 15 is inserted at the bottom of the air outlet area 201, a heat conducting plate 4 is embedded on the upper surface of the base 1, and a plurality of semiconductor refrigerating sheets 5 are installed at the bottom of the heat conducting plate 4;
specifically, the left end and the right end of the top of the platform main body 3 are both provided with a conical hole 301, the tops of the exhaust pipe 14 and the air suction pipe 15 penetrate through the lower end of the inner part of the conical hole 301 on the same side, the lower end of the first connecting pipe 11 is inserted into the upper end of the inner part of the conical hole 301 on the right end, and the lower end of the second connecting pipe 12 is inserted into the lower end of the inner part of the conical hole 301 on the left end;
the dust cover 2 can protect and prevent dust from the platform body 3, and when the dust cover 2 covers the outside of the platform body 3, the first connection pipe 11 and the second connection pipe 12 can be inserted into the corresponding conical holes 301, so that the first connection pipe 11 communicates with the exhaust pipe 14 and the second connection pipe 12 communicates with the suction pipe 15;
when the platform main body 3 needs to be detached from the base 1, the screws inserted between the dust cover 2 and the base 1 are firstly detached, and then the dust cover 2 is lifted upwards, so that the first connecting pipe 11 and the second connecting pipe 14 can be pulled out from the corresponding conical holes 301, and the dust cover 2 can be detached, and after the dust cover 2 is detached, the platform main body 3 can be detached from the base 1;
according to the above, the left end of the top surface inside the air inlet area 202 is provided with the air inlet 203, the filter cartridge 6 is positioned between the air inlet 203 and the first connecting pipe 11, the right end of the air inlet area 202 is embedded with the sealing plug 13, the left end and the right end inside the filter cartridge 6 are both provided with the filter screens 7, the drying agent 8 is filled between the two filter screens 7, the left end edge of the top of the dust cover 2 is provided with the exhaust fan 9, the air inlet of the exhaust fan 9 is spliced with the exhaust pipe 10, and the bottom of the exhaust pipe 10 is spliced with the top of the air outlet area 201;
specifically, one side of the air suction pipe 15 opposite to the exhaust pipe 14 is provided with a plurality of air holes, the exhaust fan 9 can pump the air outlet area 201 into a negative pressure state through the exhaust pipe 10, so that the air outlet area 201 in the negative pressure state can pump the air suction pipe 15 into the negative pressure state through the second connecting pipe 12, and the air suction pipe 15 can suck air in the platform main body 3, so that the inside of the platform main body 3 is also in the negative pressure state;
when the interior of the platform main body 3 is in a negative pressure state, the cold air outside the dust cover 2 enters the air inlet area 202 through the air inlet 203, the cold air in the air inlet area 202 is introduced into the exhaust pipe 14 through the first connecting pipe 11, and the exhaust pipe 14 discharges the cold air into the interior of the platform main body 3;
then, the exhaust pipe 14 is matched with the air suction pipe 15, so that air flow is formed inside the platform main body 3, and the electronic components inside the platform main body 3 can be radiated;
when the cold air passes through the air inlet area 202, the cold air passes through the filter cartridge 6, so that the filter screen 7 and the drying agent 8 in the filter cartridge 6 can filter, remove dust and dehumidify the cold air, thereby reducing the dust and moisture entering the platform body 1, and the filter cartridge 6 can be taken out from the air inlet area 202 by opening the sealing plug 13, so that the filter screen 7 and the drying agent 8 in the filter cartridge 6 can be conveniently replaced;
according to the above, the platform main body 3 is positioned right above the heat conducting plate 4, the heat conducting silica gel pad 7 is bonded on the upper surface of the heat conducting plate 4, the heat conducting silica gel pad 7 is filled between the heat conducting plate 4 and the platform main body 3, the left side surface and the right side surface of the platform main body 3 are both welded with the heat radiating fins 16, and the front surface of the dust cover 2 is hinged with the access door 18;
it is specific, the heat-conducting plate 4, platform main part 3 and heat radiation fins 16 are the aluminum alloy material, semiconductor refrigeration piece 5 can refrigerate heat-conducting plate 4, heat-conducting plate 4 rethread heat conduction silica gel pad 17 after the low temperature transmits the low temperature to platform main part 3 on, with this radiating effect that can further improve intelligent thing networking platform, low temperature in the platform main part 3 can give off the inside of protection casing 2 through heat radiation fins 16 simultaneously, with this inside that makes protection casing 2 is in the low temperature state, thereby play thermal-insulated effect to platform main part 3, access door 18 can be opened, thereby can conveniently overhaul platform main part 3.
In summary, the following steps:
by arranging the exhaust pipe 14 and the air suction pipe 15 in the platform main body 3, the air inlet area 202 on the dust cover 2 can discharge cold air into the exhaust pipe 14, so that the cold air in the exhaust pipe 14 can be discharged into the platform main body 1, the air outlet area 201 on the dust cover 2 can extract and discharge the air in the air suction pipe 15, and the air suction pipe 15 can suck the air in the platform main body 1, so that the intelligent Internet of things platform can be prevented from dust, air flow can be formed in the platform main body 3, electronic components in the platform main body 3 can be cooled, and the cooling effect is better;
semiconductor refrigeration piece 5 through 4 bottoms of heat-conducting plate can refrigerate platform main part 3 to further improve the radiating effect of intelligence thing networking platform, low temperature in the platform main part 3 can give off the inside of dust cover 2 through heat radiation fins 16 simultaneously, with this make to be in the low temperature state in the dust cover 2, thereby play thermal-insulated effect.

Claims (7)

1. The utility model provides an intelligence thing networking platform, includes base (1), dust cover (2) and platform main part (3), dust cover (2) pass through the upper surface of mounting screw at base (1), place the inside at the upper surface of base (1) and be located dust cover (2) in platform main part (3), its characterized in that:
suction pipe (15) and blast pipe (14) have been welded respectively to the inside left and right sides face of platform main part (3), air outlet area (201) and air inlet area (202) have been seted up respectively to both ends about dust cover (2) top, air inlet area's (202) inside is inserted and is used for cartridge filter (6) to air filter, air inlet area's (202) bottom right-hand member is pegged graft and is had first connecting pipe (11) that are used for toward blast pipe (14) gas transmission, air outlet area's (201) bottom is pegged graft and is had second connecting pipe (12) that are used for toward suction pipe (15) bleed, the upper surface of base (1) has been inlayed heat-conducting plate (4), polylith semiconductor refrigeration piece (5) are installed to the bottom of heat-conducting plate (4).
2. The intelligent internet of things platform according to claim 1, wherein: the air suction platform is characterized in that conical holes (301) are formed in the left end and the right end of the top of the platform main body (3), and the tops of the exhaust pipe (14) and the air suction pipe (15) penetrate through the lower ends of the insides of the conical holes (301) on the same side.
3. The intelligent internet of things platform according to claim 2, wherein: the lower end of the first connecting pipe (11) is inserted into the right end of the upper end inside the conical hole (301), and the lower end of the second connecting pipe (12) is inserted into the left end of the lower end inside the conical hole (301).
4. The intelligent internet of things platform according to claim 1, wherein: an air inlet (203) is formed in the left end of the inner top face of the air inlet area (202), the filter cartridge (6) is located between the air inlet (203) and the first connecting pipe (11), and a sealing plug (13) is embedded in the right end of the air inlet area (202).
5. The intelligent internet of things platform according to claim 1, wherein: filter screens (7) are installed at the left end and the right end inside the filter cartridge (6), and drying agents (8) are filled between the two filter screens (7).
6. The intelligent internet of things platform of claim 1, wherein: air exhauster (9) are installed to the left end edge at dust cover (2) top, the grafting of air inlet department of air exhauster (9) has exhaust tube (10), the bottom of exhaust tube (10) is pegged graft with the top in gas outlet area (201).
7. The intelligent internet of things platform according to claim 1, wherein: platform main part (3) are located heat-conducting plate (4) directly over, the upper surface bonding of heat-conducting plate (4) has heat conduction silica gel pad (17), heat conduction silica gel pad (17) are filled between heat-conducting plate (4) and platform main part (3), heat radiation fins (16) have all been welded to the left and right sides face of platform main part (3), the front surface of dust cover (2) articulates there is access door (18).
CN202220057203.4U 2022-01-11 2022-01-11 Intelligent Internet of things platform Active CN216700816U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202220057203.4U CN216700816U (en) 2022-01-11 2022-01-11 Intelligent Internet of things platform

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202220057203.4U CN216700816U (en) 2022-01-11 2022-01-11 Intelligent Internet of things platform

Publications (1)

Publication Number Publication Date
CN216700816U true CN216700816U (en) 2022-06-07

Family

ID=81825704

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202220057203.4U Active CN216700816U (en) 2022-01-11 2022-01-11 Intelligent Internet of things platform

Country Status (1)

Country Link
CN (1) CN216700816U (en)

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