CN216696861U - Top heat radiation assembly - Google Patents
Top heat radiation assembly Download PDFInfo
- Publication number
- CN216696861U CN216696861U CN202123348927.9U CN202123348927U CN216696861U CN 216696861 U CN216696861 U CN 216696861U CN 202123348927 U CN202123348927 U CN 202123348927U CN 216696861 U CN216696861 U CN 216696861U
- Authority
- CN
- China
- Prior art keywords
- heat dissipation
- front baffle
- heat sink
- substrate
- heat
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Classifications
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E60/00—Enabling technologies; Technologies with a potential or indirect contribution to GHG emissions mitigation
- Y02E60/10—Energy storage using batteries
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The application relates to a top radiating assembly, which comprises a radiating substrate, a plurality of L-shaped supporting frames, a front baffle and the like; the front baffle comprises a front baffle body and inwards concave curved surfaces which are arranged at the peripheral edges of the front baffle body and are concave inwards; a plurality of vertically arranged mounting plates are arranged on the inner wall of the top of the front baffle; a sliding groove which extends transversely and is vertical to the surface of the front baffle body is arranged at the vertical outer edge of the mounting plate; one end of the L-shaped support frame is fixedly connected with the other end of the heat dissipation substrate, and the other end of the L-shaped support frame is connected with a sliding groove in the mounting plate below the edge of the top of the front baffle in a sliding fit manner; the top radiating assembly related to the technical scheme has the advantages of simple structure, strong practicability and small occupied space.
Description
Technical Field
The utility model relates to the technical field of VR (virtual reality) all-in-one machine accessories, in particular to a top heat dissipation assembly.
Background
The VR all-in-one is the first equipment that shows of VR that possesses independent processor. With the development of VR head display equipment, the VR all-in-one machine gradually realizes the technical maturity of products and functions; meanwhile, the multifunctional electronic game has the entertainment functions of powerful viewing, game, virtual reality experience and the like, and is deeply loved by young people.
The existing VR all-in-one machine mainly comprises a front baffle, a host shell, a radiating substrate and other structures, and the radiating substrate can be generally a plane, and two ends of the radiating substrate are directly connected between the top edge of the host shell and the top of the front baffle, so that the top radiating of the host shell is realized; however, it has been found that there still exist some technical problems, such as: the top heat dissipation space is not enough, influences the radiating effect, but if directly increase radiating substrate's width thereby increase heat radiating area then lead to the volume of VR all-in-one not have the accident to increase, be unfavorable for the product design like this.
SUMMERY OF THE UTILITY MODEL
The present invention is directed to a top heat sink assembly to solve the above problems.
In order to achieve the above purpose of the utility model, the following technical scheme is adopted:
the application provides a top radiating assembly which comprises a radiating substrate, a plurality of L-shaped supporting frames and a front baffle; the front baffle comprises a front baffle body and inwards concave curved surfaces which are arranged at the peripheral edges of the front baffle body and are concave inwards; a plurality of vertically arranged mounting plates are arranged on the inner wall of the top of the front baffle; a sliding groove which extends transversely and is vertical to the surface of the front baffle body is arranged at the vertical outer edge of the mounting plate;
the one end of heat dissipation base plate is provided with the top border complex block tongue of pegging graft of being convenient for with the host computer casing, the one end of L type support frame with the other end fixed connection of heat dissipation base plate, the other end of L type support frame then with spout sliding fit in the mounting panel of top border below is connected on the preceding baffle.
Preferably, as one possible embodiment; the edges of the left end and the right end of the heat dissipation substrate are semicircular transition edges; and the semicircular transition edge converges from one side far away from the host shell to one side close to the host shell.
Preferably, as one possible embodiment; the heat dissipation substrate is provided with three clamping tongues, and the clamping tongues are arranged at equal intervals along the direction of the length edge of the heat dissipation substrate close to one side of the host machine shell.
Preferably, as one possible embodiment; the heat radiating base plate is provided with four L-shaped support frames, and the four L-shaped support frames are arranged along the direction of the length edge of the heat radiating base plate away from one side of the host shell at even intervals.
Preferably, as one possible embodiment; the heat dissipation substrate is provided with a first heat dissipation hole and a second heat dissipation hole; the first heat dissipation hole is arranged close to the edge of the heat dissipation substrate for a circle to form an annular heat dissipation ring; the second heat dissipation hole is arranged in the middle of the heat dissipation substrate;
the diameter of the first heat dissipation hole located at the edge of the heat dissipation substrate is larger than that of the second heat dissipation hole.
Preferably, as one possible embodiment; the annular heat dissipation ring is multi-ring.
Preferably, as one possible embodiment; a heat insulation film is arranged on the top surface of the heat dissipation substrate; the heat insulation film is provided with a through hole; the through holes on the heat insulation film correspond to the heat dissipation holes on the heat dissipation substrate.
By adopting the technical scheme, the utility model has the following beneficial effects:
analyzing the main structure of the top heat dissipation assembly, the top heat dissipation assembly mainly comprises a heat dissipation substrate, a plurality of L-shaped support frames, a front baffle and the like; the front baffle comprises a front baffle body and inwards concave curved surfaces which are arranged at the peripheral edges of the front baffle body and are concave inwards; a plurality of vertically arranged mounting plates are arranged on the inner wall of the top of the front baffle; a sliding groove which extends transversely and is vertical to the surface of the front baffle body is arranged at the vertical outer edge of the mounting plate; one end of the heat dissipation substrate is provided with a clamping tongue which is convenient to be in inserting fit with the top edge of the host casing, one end of the L-shaped support frame is fixedly connected with the other end of the heat dissipation substrate, and the other end of the L-shaped support frame is connected with a sliding groove in the mounting plate below the top edge of the front baffle in a sliding fit manner.
The technical solution adopted by the embodiment of the present application abandons the direct connection (which is not directly connected at the same height) between the heat dissipation substrate and the front baffle of the VR host casing, but the L-shaped support frame is adopted to reduce the height of the top edge of the front baffle plate and then is connected with the sliding groove at the top edge of the front baffle plate in a sliding fit manner, and finally the connection between the main machine shell and the front baffle plate is realized, obviously because the top edge of the front baffle plate is not connected, but adopts the sliding groove matching on the mounting plate realized by that one end of the radiating substrate is inserted into the lower portion of the top edge of the front baffle, thus, while the mounting and assembly of the radiating substrate are met, enough supporting radiating space (namely, the space at the bottom of the top edge of the front baffle can also be used for radiating the radiating substrate) is arranged between the radiating substrate and the bottom plane frame, so that the design can have positive influence on the internal radiation of the VR host shell; meanwhile, the design is equal to the width of hiding part of the heat dissipation substrate, so that the phenomenon that the whole product is enlarged in size due to too wide width is avoided under the condition that the heat dissipation substrate is guaranteed to dissipate heat fully.
In summary, the top heat dissipation assembly adopted in the embodiment of the utility model has the advantages of simple structure, strong practicability and small occupied space.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, and it is obvious that the drawings in the following description are some embodiments of the present invention, and other drawings can be obtained by those skilled in the art without creative efforts.
Fig. 1 is a schematic view of a three-dimensional assembly structure between a top heat dissipation assembly, a front baffle and a host provided by the utility model;
FIG. 2 is a schematic side view of an assembly structure between a top heat sink assembly and a front bezel and a host according to the present invention;
FIG. 3 is a partially enlarged schematic view of FIG. 2;
fig. 4 is a schematic view of an assembly structure between the top heat dissipation assembly and the front baffle and between the top heat dissipation assembly and the host in the rear view direction;
FIG. 5 is a partially enlarged schematic view of FIG. 4;
fig. 6 is a schematic perspective view of an assembly structure between a top heat sink assembly and a front baffle according to the present invention;
fig. 7 is a schematic perspective view of a front baffle plate in the top heat dissipation assembly according to the present invention;
fig. 8 is a schematic perspective view of a heat dissipation substrate in the top heat dissipation assembly according to the present invention;
fig. 9 is a schematic front view of a heat dissipation substrate in the top heat dissipation assembly according to the present invention.
Reference numbers: a heat dissipating substrate 10; an L-shaped support frame 11; a front baffle 12; a front baffle body 120; a concave curved surface 121; a mounting plate 122; a chute 123; a latch tongue 101; a semi-circular transition edge 102; a first heat dissipation hole 103; second louvers 104.
Detailed Description
The technical solutions of the present invention will be described clearly and completely with reference to the accompanying drawings, and it should be understood that the described embodiments are some, but not all embodiments of the present invention. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
In the description of the present invention, it should be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, e.g., as meaning either a fixed connection, a removable connection, or an integral connection; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meanings of the above terms in the present invention can be understood in specific cases to those skilled in the art.
Example one
As shown in fig. 1 to 6, a first embodiment of the present application provides a top heat dissipation assembly, which includes a heat dissipation substrate 10, a plurality of L-shaped support frames 11, and a front bezel 12 (see also fig. 7); the front baffle 12 comprises a front baffle body 120 and inwards concave curved surfaces 121 which are arranged at the peripheral edges of the front baffle body; a plurality of vertically arranged mounting plates 122 are arranged on the inner wall of the top of the front baffle plate 12; the vertical outer edge of the mounting plate 122 is provided with a sliding groove 123 which extends transversely and is perpendicular to the surface of the front baffle body 120;
as shown in fig. 8 and 9 in detail, one end of the heat dissipation substrate 10 is provided with a latch 101 which is convenient for being inserted and matched with the top edge of the host casing a, one end of the L-shaped support frame 11 is fixedly connected with the other end of the heat dissipation substrate, and the other end of the L-shaped support frame 11 is connected with a sliding groove 123 in a mounting plate 122 below the top edge of the front baffle in a sliding fit manner.
The technical solution adopted by the embodiment of the present application abandons the direct connection (which is not directly connected at the same height) between the heat dissipation substrate and the front baffle of the VR host casing, but the L-shaped support frame is adopted to reduce the height of the top edge of the front baffle plate and then is connected with the sliding groove at the top edge of the front baffle plate in a sliding fit manner, and finally the connection between the main machine shell and the front baffle plate is realized, obviously because the top edge of the front baffle plate is not connected, but adopts the sliding groove matching on the mounting plate realized by that one end of the radiating substrate is inserted into the lower portion of the top edge of the front baffle, thus, while the mounting and assembly of the heat dissipation substrate are met, sufficient supporting and heat dissipation space (namely, the space at the top edge and the bottom of the front baffle can also be used for heat dissipation of the heat dissipation substrate) is arranged between the heat dissipation substrate and the bottom plane frame at intervals, so that the design can have positive influence on the internal heat dissipation of the VR host shell; meanwhile, the design is equal to the width of hiding part of the heat dissipation substrate, so that the phenomenon that the width of the heat dissipation substrate is too wide to cause the volume of the whole product to be enlarged is avoided under the condition of ensuring the full heat dissipation of the heat dissipation substrate.
In summary, the top heat dissipation assembly adopted in the embodiment of the utility model has the advantages of simple structure, strong practicability and small occupied space.
Referring to fig. 8 and 9, in a specific technical solution of the embodiment of the present application, the edges of the left and right ends of the heat dissipation substrate 10 are semicircular transition edges 102; and the semicircular transition edge 102 converges from a side away from the main housing to a side close to the main housing.
It should be noted that, the edges of the left and right ends of the heat dissipation substrate may be preferably semicircular transition edges, and the semicircular transition edges form the specific shape and structure of the heat dissipation substrate; the semicircular transition edge with the specific shape fully realizes the expansion of the maximum shape, and ensures that the area of the radiating substrate is larger, thereby indirectly being more beneficial to the full radiation of the radiating substrate.
Referring to fig. 8 and 9, in a specific technical solution of the embodiment of the present application, there are three locking tongues 101 on the heat dissipation substrate 10, and the three locking tongues 101 are uniformly arranged at intervals along a length direction of the heat dissipation substrate close to one side of the main machine housing. The number of the L-shaped support frames 11 connected to the heat dissipation substrate 10 is four, and the four L-shaped support frames 11 are arranged at equal intervals along the direction of the length edge of the heat dissipation substrate away from one side of the host casing.
Referring to fig. 8 and 9, in a specific technical solution of the embodiment of the present application, a first heat dissipation hole 103 and a second heat dissipation hole 104 are disposed on the heat dissipation substrate 10; the first heat dissipation hole 103 is disposed close to the periphery along the edge of the heat dissipation substrate to form an annular heat dissipation ring; the second heat dissipation holes 104 are disposed at the middle position of the heat dissipation substrate;
the diameter of the first heat dissipation hole 103 located at the edge of the heat dissipation substrate is larger than the diameter of the second heat dissipation hole 104.
It should be noted that, the heat dissipation substrate has a specific shape and a specific material (preferably, a metal heat dissipation fin is selected), the heat dissipation substrate is provided with a plurality of heat dissipation holes (including a first heat dissipation hole and a second heat dissipation hole), the second heat dissipation hole located in the middle has a smaller diameter size but a higher density, and the heat dissipation hole located at the edge (the first heat dissipation hole) has a larger diameter but a lower density; the design can ensure that the radiating substrate can fully exert the radiating performance;
analyzing the above structure, it can be known that the first heat dissipation hole located at the edge is actually susceptible to the edge of the host housing or the edge of the front baffle connected thereto, which results in the obstructed heat dissipation, so the diameter of the first heat dissipation hole is preferably larger than that of the second heat dissipation hole.
In a specific technical solution of an embodiment of the present application, the annular heat dissipation ring has a plurality of rings.
It should be noted that, the annular heat dissipation ring is an annular heat dissipation ring formed by a plurality of first heat dissipation holes with a specific structure, and in a specific technical solution of the embodiment of the present application, the number of the annular heat dissipation ring is preferably 3 or 5.
In a specific technical solution of the embodiment of the present application, a heat insulation film (not shown in the figure) is disposed on a top surface of the heat dissipation substrate 10; the heat insulation film is provided with a through hole; the through holes on the heat insulation film correspond to the heat dissipation holes on the heat dissipation substrate.
It should be noted that the diameter, shape and position relationship of the through holes on the heat insulation film are completely in one-to-one correspondence with the heat dissipation holes on the heat dissipation substrate; only the heat insulation film can play a stable heat dissipation role, and a player or a user can not feel hot when touching the heat dissipation substrate while ensuring sufficient heat dissipation. Therefore, the heat insulation film serves as a heat insulation protective layer, and a composite plastic heat insulation membrane with a strong structure is preferably used.
Finally, it should be noted that: the above embodiments are only used to illustrate the technical solution of the present invention, and not to limit the same; while the utility model has been described in detail and with reference to the foregoing embodiments, it will be understood by those skilled in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some or all of the technical features may be equivalently replaced; and the modifications or the substitutions do not make the essence of the corresponding technical solutions depart from the scope of the technical solutions of the embodiments of the present invention.
Claims (7)
1. A top heat radiation component is characterized by comprising a heat radiation substrate, a plurality of L-shaped support frames and a front baffle; the front baffle comprises a front baffle body and inwards concave curved surfaces which are arranged at the peripheral edges of the front baffle body and are concave inwards; a plurality of vertically arranged mounting plates are arranged on the inner wall of the top of the front baffle; a sliding groove which extends transversely and is vertical to the surface of the front baffle body is arranged at the vertical outer edge of the mounting plate;
the one end of heat dissipation base plate is provided with the top border complex block tongue of pegging graft of being convenient for with the host computer casing, the one end of L type support frame with the other end fixed connection of heat dissipation base plate, the other end of L type support frame then with spout sliding fit in the mounting panel of top border below is connected on the preceding baffle.
2. The top heat sink assembly of claim 1 wherein the heat sink base plate has semicircular transition edges at the left and right edges; and the semicircular transition edge converges from one side far away from the host shell to one side close to the host shell.
3. The top heat sink assembly of claim 2, wherein there are three locking tongues on the heat sink base plate, and the three locking tongues are evenly spaced along the length of the heat sink base plate near one side of the host housing.
4. The top heatsink assembly of claim 3, wherein the number of the L-shaped supporting frames connected to the heatsink base plate is four, and the four L-shaped supporting frames are uniformly spaced along the length of the heatsink base plate away from the host housing.
5. The top heat sink assembly of claim 4, wherein the heat sink substrate is configured with a first heat sink hole and a second heat sink hole; the first heat dissipation hole is arranged close to the edge of the heat dissipation substrate for a circle to form an annular heat dissipation ring; the second heat dissipation hole is arranged in the middle of the heat dissipation substrate;
the diameter of the first heat dissipation hole located at the edge of the heat dissipation substrate is larger than that of the second heat dissipation hole.
6. The top heat sink assembly of claim 5 wherein the annular heat sink ring is multi-turn.
7. The top heat sink assembly of claim 6, wherein a thermal insulating film is disposed on a top surface of the heat sink substrate; the heat insulation film is provided with a through hole; the through holes on the heat insulation film correspond to the heat dissipation holes on the heat dissipation substrate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202123348927.9U CN216696861U (en) | 2021-12-28 | 2021-12-28 | Top heat radiation assembly |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202123348927.9U CN216696861U (en) | 2021-12-28 | 2021-12-28 | Top heat radiation assembly |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN216696861U true CN216696861U (en) | 2022-06-07 |
Family
ID=81844270
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202123348927.9U Active CN216696861U (en) | 2021-12-28 | 2021-12-28 | Top heat radiation assembly |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN216696861U (en) |
-
2021
- 2021-12-28 CN CN202123348927.9U patent/CN216696861U/en active Active
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN102985892B (en) | Small form factor desk top computer | |
| CN202310414U (en) | Electronic instrument cover for realizing passive cooling and reducing electromagnetic interference radiation | |
| TWI357800B (en) | Display device | |
| CN113050777A (en) | Electronic device | |
| CN105683700A (en) | Multi-layer heat spreader assembly with isolated convective fins | |
| CN216696861U (en) | Top heat radiation assembly | |
| US9532486B1 (en) | Card edge connector with heat spreader plate | |
| TWM618039U (en) | Streaming integration and recording and playback device and heat dissipation module thereof | |
| CN219660270U (en) | Electronic component radiating assembly | |
| US7460368B2 (en) | Cooling-fan-free system module | |
| US11832421B2 (en) | Control device | |
| CN214042221U (en) | Mini computer with bottom hidden air inlet mode | |
| CN212696447U (en) | Shielding heat dissipation structure, single board and terminal | |
| US20130258205A1 (en) | Television receiver and electronic apparatus | |
| CN103379805B (en) | Electronic equipment | |
| JP2003060374A (en) | Electronic apparatus and rack housing the same | |
| JP3097903U (en) | Improved structure of computer frame | |
| CN219802887U (en) | Heat dissipation support and heat dissipation structure | |
| JP3243722U (en) | Disassembleable case with good heat dissipation | |
| TWI484321B (en) | Portable electronic device | |
| CN216700772U (en) | Heat radiation structure, casing and controller | |
| CN206877250U (en) | A kind of computer housing of convenient radiating | |
| CN206431551U (en) | A kind of shockproof tilting computer housing | |
| CN206400466U (en) | One kind tilts radiating type computer case | |
| CN109757051A (en) | The host of seperated display device and seperated display device |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant |