CN216685329U

CN216685329U - Constant temperature box

Info

Publication number: CN216685329U
Application number: CN202121574878.8U
Authority: CN
Inventors: 覃凤飞; 黄慧; 黄彩村
Original assignee: Youjiang Medical University for Nationalities Affiliated Hospital
Current assignee: Youjiang Medical University for Nationalities Affiliated Hospital
Priority date: 2021-07-12
Filing date: 2021-07-12
Publication date: 2022-06-07
Anticipated expiration: 2031-07-12

Abstract

The utility model provides a constant temperature box which comprises a shell and a lifting belt, wherein four bottom feet are arranged at the bottom of the shell and are symmetrically arranged relative to the center line of the shell, and the height of each bottom foot is greater than that of an air inlet cover; the portable heat-insulation device is provided with a storage bin, a heat absorbing plate, a semiconductor refrigeration module, a heat dissipation plate and a fan, wherein the semiconductor refrigeration module continuously absorbs heat inside the storage bin through the heat absorbing plate so as to play a role in cooling the inside of the storage bin, the heat generated by the semiconductor refrigeration module is continuously transmitted to the heat dissipation plate, and the heat dissipation plate is continuously dissipated through air flow driven by the fan, so that the inside of the storage bin is continuously kept in a low-temperature state, and the practicability is improved.

Description

Constant temperature box

Technical Field

The utility model belongs to the technical field related to medical instruments, and particularly relates to a constant temperature box.

Background

The medical apparatus refers to instruments, equipment, appliances, in-vitro diagnostic reagents, calibrators, materials and other similar or related articles which are directly or indirectly used for human bodies, the medical apparatus comprises medical equipment and medical consumables, the utility is mainly obtained in a physical mode and the like, the purpose of the medical apparatus is to diagnose, prevent, monitor, treat or relieve diseases, materials such as blood plasma and mannitol are often needed in the medical process, and the blood plasma and the mannitol need to be kept at low temperature in the storage and transportation processes, so a refrigerating device is needed.

At present, when the blood plasma and mannitol are used, crystals can be formed inside the blood plasma and mannitol when the blood plasma and mannitol are lower than a certain temperature, the blood plasma and mannitol cannot be directly used, and the blood plasma and mannitol can be denatured when the temperature is too high, so that the blood plasma and mannitol cannot be used.

SUMMERY OF THE UTILITY MODEL

In view of the above-mentioned shortcomings, the present invention provides an incubator.

The technical scheme adopted by the utility model for solving the technical problems is as follows: a constant temperature box comprises a shell and a lifting belt, wherein four bottom feet are arranged at the bottom of the shell and are symmetrically arranged relative to the center line of the shell, and the height of each bottom foot is larger than that of an air inlet cover; the two ends of the lifting belt are respectively connected with the upper ends of the inner walls of the two sides of the shell.

Furthermore, a battery bin is arranged at the lower end inside the shell, a storage battery and a control module are installed inside the battery bin, and the storage battery is electrically connected with the control module; the lower end of the interior of the shell is provided with two semiconductor refrigeration modules which are symmetrically arranged around the center line of the shell, the two semiconductor refrigeration modules are respectively arranged on two sides of the battery compartment, and the two semiconductor refrigeration modules are electrically connected with the control module; the bottom of semiconductor refrigeration module installs the heating panel, and the heating panel is the matrix and distributes.

Further, the top cap is installed at the top of shell, and one side of top cap is rotated with the top one end of shell and is connected, and the opposite side buckle of top cap is connected with the other end block at shell top simultaneously.

Furthermore, the top ends of the semiconductor refrigeration modules are provided with heat absorbing plates, and the heat absorbing plates are arranged at the bottoms of the storage bins; the heat absorbing plate and the storage bins are symmetrically arranged about the central line of the shell, and the two storage bins are respectively arranged on two sides of the upper end in the shell; the utility model discloses a storage storehouse, including storage storehouse, baffle, storage storehouse, be equipped with first heat preservation on the inside lateral wall in storehouse, and the baffle is the grid structure simultaneously installed to the inside lower extreme on first heat preservation.

Furthermore, the two air inlet covers are symmetrically arranged about the center line of the shell, the two air inlet covers are both arranged at the bottom of the shell, and the center line of the air inlet covers and the center line of the semiconductor refrigeration module are on the same vertical straight line; the air inlet cover penetrates through the bottom of the shell and is communicated with the lower end of the interior of the shell, a fan is arranged in the air inlet cover, and the fan is electrically connected with the control module; air outlet grooves are formed in the two sides of the heat dissipation plate and are respectively formed in the outer walls of the two sides of the shell.

Furthermore, two temperature relays are arranged inside the storage bin, are symmetrically arranged relative to the center line of the shell, and are respectively arranged at the lower parts of the inner walls of the two first heat-preservation layers; the temperature relay is arranged between the heat absorbing plate and the partition plate and is electrically connected with the control module.

Furthermore, a second heat-insulating layer is installed at the bottom of the top cover, and the second heat-insulating layer is in fit connection with the inner wall of the top of the shell.

The utility model has the beneficial effects that:

1. the portable solar energy heat preservation box is provided with the shell, the top cover and the lifting belt, the shell is combined with the top cover to form a closed box body structure, the lifting belt is matched to be convenient to carry, the storage battery is arranged in the box body, the box body can continuously work for a period of time under the condition that the box body is separated from an external power supply, and the heat preservation duration is prolonged.

2. The semiconductor refrigeration device is provided with the storage bin, the heat absorbing plate, the semiconductor refrigeration module, the heat dissipation plate and the fan, the semiconductor refrigeration module continuously absorbs heat inside the storage bin through the heat absorbing plate, so that the effect of cooling the inside of the storage bin is achieved, the heat generated by the semiconductor refrigeration module can be continuously transmitted to the heat dissipation plate, the heat dissipation plate can be continuously dissipated through air flow driven by the fan, the inside of the storage bin is continuously kept in a low-temperature state, and the practicability is improved.

3. The semiconductor refrigeration module is provided with the partition plate, the temperature relay and the control module, the surface temperature of the heat absorbing plate is too low, so that the direct contact between the plasma and mannitol stored in the heat absorbing plate and the heat absorbing plate can be effectively avoided through the partition plate, the temperature relay can detect the temperature near the heat absorbing plate in real time, the start-stop state of the semiconductor refrigeration module is controlled in real time by matching with the control module, the crystallization of the plasma and the mannitol due to too low internal temperature is avoided, the energy consumption is reduced, and the service time is prolonged.

Drawings

Fig. 1 is a schematic perspective view of the present invention.

Fig. 2 is a schematic bottom view of fig. 1 according to the present invention.

Fig. 3 is a schematic cross-sectional view of the housing of the present invention.

Fig. 4 is a schematic view showing an internal perspective structure of the outer case of the present invention.

Fig. 5 is a schematic diagram of an oblique cross-sectional structure of the battery compartment of the present invention.

In the figure:

1. a housing; 2. footing; 3. a battery compartment; 4. a storage battery; 5. a control module; 6. a semiconductor refrigeration module; 7. a heat dissipation plate; 8. a fan; 9. an air inlet cover; 10. an air outlet groove; 11. a heat absorbing plate; 12. a storage bin; 13. a first insulating layer; 14. a partition plate; 15. a temperature relay; 16. a top cover; 17. a second insulating layer; 18. buckling; 19. and (5) lifting the belt.

Detailed Description

In order to make the objects, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are some, but not all, embodiments of the present invention. The components of embodiments of the present invention generally described and illustrated in the figures herein may be arranged and designed in a wide variety of different configurations. Thus, the following detailed description of the embodiments of the present invention, presented in the figures, is not intended to limit the scope of the utility model, as claimed, but is merely representative of selected embodiments of the utility model. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.

It should be noted that: like reference numbers and letters refer to like items in the following figures, and thus, once an item is defined in one figure, it need not be further defined and explained in subsequent figures.

In the description of the present invention, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings or orientations or positional relationships that the products of the present invention are conventionally placed in use, and are only for convenience of describing the present invention and simplifying the description, but do not indicate or imply that the device or element to which the description refers must have a specific orientation, be constructed in a specific orientation, and be operated, and thus should not be construed as limiting the present invention. Furthermore, the terms "first," "second," "third," and the like are used solely to distinguish one from another, and are not to be construed as indicating or implying relative importance.

The constant temperature box shown in the attached figures 1 to 5 comprises a shell 1 and a lifting belt 19, wherein four feet 2 are arranged at the bottom of the shell 1, the four feet 2 are symmetrically arranged relative to the center line of the shell 1, and the height of each foot 2 is greater than that of an air inlet cover 9; the two ends of the lifting belt 19 are respectively connected with the upper ends of the inner walls of the two sides of the shell 1.

In this embodiment, a battery compartment 3 is disposed at the lower end of the interior of the housing 1, a storage battery 4 and a control module 5 are mounted in the battery compartment 3, and the storage battery 4 is electrically connected to the control module 5; the semiconductor refrigeration modules 6 are mounted at the lower end of the interior of the shell 1, two semiconductor refrigeration modules 6 are symmetrically arranged about the center line of the shell 1, the two semiconductor refrigeration modules 6 are respectively arranged on two sides of the battery compartment 3, and the two semiconductor refrigeration modules 6 are electrically connected with the control module 5; the bottom of semiconductor refrigeration module 6 is installed heating panel 7, and heating panel 7 is the matrix and distributes.

Through adopting above-mentioned technical scheme, can continuously absorb the heat in the storehouse 12 of storing through semiconductor refrigeration module 6, and then continuously keep storing the inside low temperature state that is in of storehouse 12.

In this embodiment, a top cover 16 is installed on the top of the housing 1, and one side of the top cover 16 is rotatably connected with one end of the top of the housing 1, while the other side of the top cover 16 is snap-connected with the other end of the top of the housing 1.

Through adopting above-mentioned technical scheme, form a inclosed box structure, portable through top cap 16 cooperation shell 1.

In this embodiment, the top ends of the semiconductor refrigeration modules 6 are all provided with heat absorbing plates 11, and the heat absorbing plates 11 are arranged at the bottom of the storage bin 12; the heat absorbing plate 11 and the storage bins 12 are symmetrically arranged about the center line of the shell 1, and the two storage bins 12 are respectively arranged on two sides of the upper end inside the shell 1; store and be equipped with first heat preservation 13 on the inside lateral wall of storehouse 12, and baffle 14 is installed to the inside lower extreme on first heat preservation 13, and baffle 14 is the grid construction simultaneously.

Through adopting above-mentioned technical scheme, reduce the heat exchange rate of storing 12 inside and outside through first heat preservation 13, improve the heat preservation effect.

In this embodiment, two air inlet covers 9 are symmetrically arranged about the center line of the housing 1, and both the two air inlet covers 9 are installed at the bottom of the housing 1, and the center line of the air inlet cover 9 and the center line of the semiconductor refrigeration module 6 are on the same vertical line; the air inlet cover 9 penetrates through the bottom of the shell 1 and is communicated with the lower end inside the shell 1, a fan 8 is installed inside the air inlet cover 9, and meanwhile, the fan 8 is electrically connected with the control module 5; air outlet grooves 10 are formed in the two sides of the heat dissipation plate 7, and the air outlet grooves 10 are formed in the outer walls of the two sides of the shell 1 respectively.

Through adopting above-mentioned technical scheme, drive the heating panel 7 of air current cooperation matrix through fan 8 and continuously dispel the heat to semiconductor refrigeration module 6, stability when improving the use.

In this embodiment, two temperature relays 15 are disposed inside the storage chamber 12, and the two temperature relays 15 are symmetrically disposed about the center line of the housing 1, and the two temperature relays 15 are respectively mounted on the lower portions of the inner walls of the two first thermal insulation layers 13; the temperature relay 15 is arranged between the heat absorbing plate 11 and the partition plate 14, and the temperature relay 15 is electrically connected with the control module 5.

Through adopting above-mentioned technical scheme, can real-time supervision store the inside temperature of storehouse 12 through temperature relay 15, and then cooperate control module 5 real time control semiconductor refrigeration module 6 to open and stop the state.

In this embodiment, a second insulating layer 17 is installed at the bottom of the top cover 16, and the second insulating layer 17 is engaged with the top inner wall of the housing 1.

Through adopting above-mentioned technical scheme, improve top cap 16's heat preservation effect through second heat preservation 17.

The working principle is as follows: in the utility model, firstly, the plasma or mannitol to be used is respectively placed on the partition plates 14 in the two storage bins 12, then the top cover 16 is closed, the connection between the top cover 16 and the shell 1 is reinforced through the buckle 18, meanwhile, the whole device can be driven to rapidly move through the lifting belt 19, in the moving process, the internal power supply is switched on, simultaneously the two semiconductor refrigeration modules 6 are started, the heat in the two storage bins 12 is absorbed through the heat absorption plate 11, the absorbed heat is rapidly transferred to the heat dissipation plate 7, the two fans 8 are synchronously started to drive the external air flow to pass through the air inlet cover 9 to enter the shell 1, then the air flow passes through the heat dissipation plate 7 and then is discharged from the two sides through the air outlet grooves 10, in the process, the heat dissipation plate 7 is dissipated, and simultaneously, when the temperature relay 15 monitors that the internal temperature of the storage bins 12 is lower than the threshold value, the semiconductor refrigeration module 6 and the fan 8 are turned off in real time through the control module 5, and when the temperature relay 15 monitors that the internal temperature of the storage bin 12 is higher than a threshold value, the semiconductor refrigeration module 6 and the fan 8 are turned on in real time through the control module 5.

The above embodiments are only specific examples of the present invention, and the protection scope of the present invention includes but is not limited to the product forms and styles of the above embodiments, and any suitable changes or modifications made by those skilled in the art according to the claims of the present invention shall fall within the protection scope of the present invention.

Claims

1. An incubator, characterized in that: the novel air inlet hood comprises a shell (1) and a lifting belt (19), wherein bottom feet (2) are arranged at the bottom of the shell (1), the number of the bottom feet (2) is four, the four bottom feet are symmetrically arranged relative to the center line of the shell (1), and the height of the bottom feet (2) is larger than that of an air inlet hood (9); the two ends of the lifting belt (19) are respectively connected with the upper ends of the inner walls of the two sides of the shell (1).

2. Oven according to claim 1, characterized in that: a battery bin (3) is arranged at the lower end of the interior of the shell (1), a storage battery (4) and a control module (5) are installed in the battery bin (3), and the storage battery (4) is electrically connected with the control module (5); the semiconductor refrigeration device is characterized in that the lower end in the shell (1) is provided with two semiconductor refrigeration modules (6), the two semiconductor refrigeration modules (6) are symmetrically arranged relative to the center line of the shell (1), the two semiconductor refrigeration modules (6) are respectively arranged on two sides of the battery compartment (3), and the two semiconductor refrigeration modules (6) are electrically connected with the control module (5); heating panel (7) are installed to the bottom of semiconductor refrigeration module (6), and heating panel (7) are the matrix and distribute.

3. The incubator of claim 1, wherein: top cap (16) are installed at the top of shell (1), and one side of top cap (16) is rotated with the top one end of shell (1) and is connected, and the other end block at the opposite side buckle (18) and shell (1) top of top cap (16) is connected simultaneously.

4. The incubator of claim 2, wherein: the top ends of the semiconductor refrigeration modules (6) are respectively provided with a heat absorbing plate (11), and the heat absorbing plates (11) are arranged at the bottom of the storage bin (12); the heat absorbing plate (11) and the storage bins (12) are symmetrically arranged about the center line of the shell (1), and the two storage bins (12) are respectively arranged on two sides of the upper end in the shell (1); the utility model discloses a heat preservation warehouse, including storage storehouse (12), be equipped with first heat preservation (13) on the inside lateral wall of storage storehouse (12), and baffle (14) are installed to the inside lower extreme on first heat preservation (13), and baffle (14) are the grid structure simultaneously.

5. Oven according to claim 2, characterized in that: the two air inlet covers (9) are symmetrically arranged relative to the center line of the shell (1), the two air inlet covers (9) are arranged at the bottom of the shell (1), and simultaneously the center line of the air inlet cover (9) and the center line of the semiconductor refrigeration module (6) are on the same vertical straight line; the air inlet cover (9) penetrates through the bottom of the shell (1) and is communicated with the lower end of the interior of the shell (1), a fan (8) is installed in the air inlet cover (9), and meanwhile, the fan (8) is electrically connected with the control module (5); air outlet grooves (10) are formed in the two sides of the heat dissipation plate (7), and the air outlet grooves (10) are formed in the outer walls of the two sides of the shell (1) respectively.

6. Oven according to claim 4, characterized in that: the temperature relays (15) are arranged in the storage bin (12), two temperature relays (15) are symmetrically arranged on the center line of the shell (1), and the two temperature relays (15) are respectively arranged on the lower parts of the inner walls of the two first heat-preservation layers (13); the temperature relay (15) is arranged between the heat absorbing plate (11) and the partition plate (14), and the temperature relay (15) is electrically connected with the control module (5).

7. Oven according to claim 3, characterized in that: and a second heat-insulating layer (17) is installed at the bottom of the top cover (16), and the second heat-insulating layer (17) is in fit connection with the inner wall of the top of the shell (1).