CN216683640U

CN216683640U - Anti-static composite environment-friendly packaging film

Info

Publication number: CN216683640U
Application number: CN202122617567.1U
Authority: CN
Inventors: 邹剑明
Original assignee: Shenzhen Sante Packaging Products Co ltd
Current assignee: Shenzhen Sante Packaging Products Co ltd
Priority date: 2021-10-28
Filing date: 2021-10-28
Publication date: 2022-06-07
Anticipated expiration: 2031-10-28

Abstract

The application discloses prevent compound environmental protection packaging film of static relates to product packaging technical field, improves the present problem that prevents that static film does not have buffer structure. Including the base film layer, the equal fixedly connected with gluing layer in both sides of base film layer, it is two sets of gluing layer is kept away from the equal fixedly connected with buffer layer in one side of base film layer, this application passes through the buffer layer setting to set up the dashpot on the buffer layer, make the foaming hole that distributes in the buffer layer can provide good elastic action, thereby play good cushioning effect to the electronic product of packing, and the cavity that forms between dashpot on the buffer layer and the gluing layer can further play and play good cushioning effect to the electronic product of packing, thereby can reduce the use amount of gas column bag or bubble bag when electronic product packing, reduce electronic product's packaging cost.

Description

Anti-static composite environment-friendly packaging film

Technical Field

The application relates to the technical field of product packaging, in particular to an anti-static composite environment-friendly packaging film.

Background

With the rapid development of the electronic industry, the integration level of electronic circuit boards is higher and higher, and the high density of electronic components on a mainboard, the compactness of wiring and even the wide adoption of surface-mounted components are easy to cause the electrostatic damage to the circuit board card.

The anti-static film is utilized to package electronic products, so that the integrated circuit of the electronic products can be effectively reduced and damaged by breakdown, but most of the existing anti-static films do not have a buffer structure, so that when the electronic products are packaged, a plurality of layers of air column bags or air bubble bags with buffer effect need to be wrapped on the outer layer, and the packaging cost of the whole electronic products is higher.

SUMMERY OF THE UTILITY MODEL

In order to improve the problem that present antistatic film does not have buffer structure, this application provides an antistatic composite environmental protection packaging film.

The application provides a prevent compound environmental protection packaging film of static adopts following technical scheme:

the utility model provides a prevent compound environmental protection packaging film of static, includes the base membrane layer, the equal fixedly connected with gluing layer in both sides of base membrane layer is two sets of gluing layer is kept away from the equal fixedly connected with buffer layer in one side of base membrane layer, the buffer layer is close to one side of gluing layer evenly is equipped with the dashpot, one side the buffer layer is kept away from the one end fixedly connected with antistatic layer of base membrane layer.

Optionally, a heat insulation layer is fixedly connected to one end of the buffer layer on the other side, which is far away from the base film layer, and the heat insulation layer is a flexible aluminum foil film.

Optionally, one side of the heat insulation layer, which is far away from the base film layer, is fixedly connected with a first reinforcing layer, and the first reinforcing layer is a polycarbonate film.

Optionally, one side of the first reinforcing layer, which is far away from the base film layer, is fixedly connected with a second reinforcing layer, and the second reinforcing layer is a BOPP film.

Optionally, a waterproof layer is fixedly connected to one side of the second reinforcing layer, which is far away from the first reinforcing layer, and the waterproof layer is a polyethylene film.

Optionally, the antistatic layer is kept away from one side fixedly connected with third enhancement layer of base film layer, the third enhancement layer is the BOPET film.

Optionally, the base film layer is a polyvinyl alcohol film.

Optionally, the buffer layer is an EPE pearl cotton film.

To sum up, the beneficial effect of this application is as follows:

this application passes through the buffer layer setting, and set up the dashpot on the buffer layer, make the foaming hole that distributes in the buffer layer can provide good elastic action, thereby play good cushioning effect to the electronic product of packing, and the cavity that forms between dashpot on the buffer layer and the gluing layer can further play and play good cushioning effect to the electronic product of packing, thereby can reduce the use amount of gas column bag or bubble bag when electronic product packs, reduce electronic product's packaging cost.

Drawings

FIG. 1 is a side cross-sectional view of the overall structure of the present application;

fig. 2 is a schematic view of the overall structure of the present application.

Description of reference numerals: 1. a base film layer; 2. an adhesive layer; 3. a buffer layer; 4. a buffer tank; 5. a thermal insulation layer; 6. a first reinforcing layer; 7. a second reinforcing layer; 8. an antistatic layer; 9. a waterproof layer; 10. and a third reinforcing layer.

Detailed Description

The present application is described in further detail below with reference to figures 1-2.

Referring to fig. 1-2, an antistatic composite environment-friendly packaging film comprises a base film layer 1, wherein the base film layer 1 is a polyvinyl alcohol film, the polyvinyl alcohol film can be degraded in a short time under the action of bacteria and enzymes, so that the whole film is more environment-friendly, two sides of the base film layer 1 are fixedly connected with adhesive layers 2 for bonding with the base film layer 1, one sides of the two groups of adhesive layers 2 far away from the base film layer 1 are fixedly connected with buffer layers 3 for buffering, the buffer layers 3 are EPE pearl cotton films, and foaming holes distributed in the buffer layers 3 can provide good elastic effects, so that the electronic product to be packaged can be buffered well, the usage amount of air column bags or air bubble bags can be reduced when the electronic product is packaged, buffer grooves 4 are uniformly arranged on one side of the buffer layers 3 close to the adhesive layers 2, and a cavity formed between the buffer grooves 4 and the adhesive layers 2 can further buffer the packaged electronic product, thereby further reducing the usage amount of the air column bag or the air bubble bag when the electronic product is packaged.

Referring to fig. 1, one end of the buffer layer 3 on one side, which is far away from the base film layer 1, is fixedly connected with an antistatic layer 8 with an antistatic effect, the antistatic performance of the antistatic layer 8 can be effectively improved, the probability that packaged electrons are damaged due to the electrostatic effect is reduced, one end of the buffer layer 3 on the other side, which is far away from the base film layer 1, is fixedly connected with a heat insulation layer 5 with a heat insulation effect, and the heat insulation layer 5 is a flexible aluminum foil film to improve the protection effect on packaged electronic products.

Referring to fig. 1, a first reinforcing layer 6 for improving the strength of the heat insulating layer 5 is fixedly connected to a side of the heat insulating layer away from the base film layer 1, the first reinforcing layer 6 is a polycarbonate film, and the strength of the whole film can be effectively improved by using the characteristics of good toughness and high strength of the polycarbonate film, so that the package is not easily torn and damaged, a second reinforcing layer 7 is fixedly connected to a side of the first reinforcing layer 6 away from the base film layer 1, the second reinforcing layer 7 is a BOPP film, the strength of the film can be further improved by using the characteristics of high tensile strength, impact strength, rigidity and toughness of the BOPP film, a waterproof layer 9 is fixedly connected to a side of the second reinforcing layer 7 away from the first reinforcing layer 6, the waterproof layer 9 is a polyethylene film, the mode performance of the film can be effectively improved by using the waterproof and moisture resistance of the polyethylene film, so as to reduce the moisture of the packaged electronic product, one side fixedly connected with third enhancement layer 10 that base film layer 1 was kept away from to antistatic layer 8, and third enhancement layer 10 utilizes the characteristics of BOPET film high strength, high rigidity for BOPET film, can effectively reduce the probability that is impaled this film by the circuit stitch of electronic product.

The implementation principle of the application is as follows:

when using, the foaming hole that distributes in the buffer layer 3 can provide good elastic action, thereby play good cushioning effect to the electronic product of packing, and the cavity that forms between buffer slot 4 on the buffer layer 3 and the gluing layer 2 can further play and play good cushioning effect to the electronic product of packing, thereby can reduce the use amount of air column bag or bubble bag when electronic product packing, the antistatic properties of this film can effectively be improved to antistatic layer 8's high resistance value performance, reduce the probability that the electron production by the packing received the electrostatic action and damaged, the high strength of third enhancement layer 10, the high rigidity can effectively reduce the probability that the circuit stitch that is impaled this film by electronic product.

The above embodiments are preferred embodiments of the present application, and the protection scope of the present application is not limited by the above embodiments, so: equivalent changes in structure, shape and principle of the present application shall be covered by the protection scope of the present application.

Claims

1. The utility model provides an prevent compound environmental protection packaging film of static, includes base film layer (1), its characterized in that: the equal fixedly connected with gluing layer (2) in both sides of base rete (1), it is two sets of gluing layer (2) is kept away from the equal fixedly connected with buffer layer (3) in one side of base rete (1), buffer layer (3) are close to one side of gluing layer (2) evenly is equipped with dashpot (4), one side buffer layer (3) are kept away from the one end fixedly connected with antistatic layer (8) of base rete (1).

2. The antistatic composite environment-friendly packaging film as claimed in claim 1, wherein: the buffer layer (3) is far away from one end of the base film layer (1) and is fixedly connected with a heat insulation layer (5) on the other side, and the heat insulation layer (5) is a flexible aluminum foil film.

3. The antistatic composite environment-friendly packaging film as claimed in claim 2, wherein: one side of the heat insulation layer (5) far away from the base film layer (1) is fixedly connected with a first reinforcing layer (6), and the first reinforcing layer (6) is a polycarbonate film.

4. The antistatic composite environment-friendly packaging film as claimed in claim 3, wherein: one side, far away from the base film layer (1), of the first reinforcing layer (6) is fixedly connected with a second reinforcing layer (7), and the second reinforcing layer (7) is a BOPP thin film.

5. The antistatic composite environment-friendly packaging film as claimed in claim 4, wherein: one side, far away from the first reinforcing layer (6), of the second reinforcing layer (7) is fixedly connected with a waterproof layer (9), and the waterproof layer (9) is a polyethylene film.

6. The antistatic composite environment-friendly packaging film as claimed in claim 1, wherein: antistatic layer (8) are kept away from one side fixedly connected with third enhancement layer (10) of base film layer (1), third enhancement layer (10) are the BOPET film.

7. The antistatic composite environment-friendly packaging film as claimed in claim 1, wherein: the base film layer (1) is a polyvinyl alcohol film.

8. The antistatic composite environment-friendly packaging film as claimed in claim 1, wherein: the buffer layer (3) is an EPE pearl cotton film.