CN216683030U

CN216683030U - Heat dissipation mechanism for notebook computer key casting mold

Info

Publication number: CN216683030U
Application number: CN202122842662.1U
Authority: CN
Inventors: 常鹤辉
Original assignee: Individual
Current assignee: Shanghai Kegai Cooling Technology Co ltd
Priority date: 2021-11-19
Filing date: 2021-11-19
Publication date: 2022-06-07
Anticipated expiration: 2031-11-19

Abstract

The utility model discloses a heat dissipation mechanism for a notebook computer key casting mold, which comprises a bottom plate, wherein the top of the bottom plate is fixedly connected with a lower mold base through a bolt, a top plate is arranged above the bottom plate, the bottom of the top plate, which is close to the position right above the lower mold base, is fixedly connected with an upper mold base through a bolt, a lead screw is rotatably connected inside the bottom plate, one end of the lead screw is welded with a first bevel gear, the outer wall of one side of the lead screw is connected with a screw nut base through a thread in a screwing manner, and the top of the screw nut base is fixedly connected with a supporting plate through a bolt. This heat dissipation mechanism that notebook computer button cast mould was used through mutually supporting of first heating seat and second heating seat, can accomplish the shaping back at the mould with first heating seat and second heating seat removal break away from the die holder to make the heating structure of mould leave, avoid the waste heat conduction of heating structure to mould to cause the poor problem of mould radiating effect.

Description

Heat dissipation mechanism for notebook computer key casting mold

Technical Field

The utility model relates to the technical field of notebook computers, in particular to a heat dissipation mechanism for a notebook computer key casting mold.

Background

A notebook computer, also called a notebook, a portable or a laptop, is a small-sized personal computer that can be conveniently carried, and the weight of the notebook computer is usually 1-3 kg, and the development trend is to have a smaller and smaller size, a lighter and lighter weight, and a more and more powerful function.

However, most of existing notebook computer keys are formed by die-casting, because the notebook computer keys are made of plastic, a hot-pressing die is needed for casting, after the existing hot-pressing die is processed, because an internal heating element contains high residual heat, the heat dissipation effect of the die is always poor, the residual heat of the heating element needs to be dissipated well, so that the formed notebook computer keys can be better dissipated, and the heat dissipation efficiency is low.

SUMMERY OF THE UTILITY MODEL

The utility model aims to provide a heat dissipation mechanism for a notebook computer key casting mold, which aims to solve the problems that after the existing hot-pressing mold is processed, the heat dissipation effect of the mold is always poor due to the fact that an internal heating element contains higher residual temperature, the formed notebook computer key can be better dissipated by the residual temperature of the heating element, and the heat dissipation efficiency is low.

In order to achieve the purpose, the utility model provides the following technical scheme: a heat dissipation mechanism for a notebook computer key casting mold comprises a bottom plate, wherein the top of the bottom plate is fixedly connected with a lower mold base through a bolt, a top plate is arranged at the position above the bottom plate, the bottom of the top plate is close to the position right above the lower mold base and is fixedly connected with an upper mold base through a bolt, a lead screw is rotatably connected inside the bottom plate, a first bevel gear is welded at one end of the lead screw, a screw nut base is screwed and connected onto the outer wall of one side of the lead screw through threads, the top of the screw nut base is fixedly connected with a supporting plate through a bolt, a first heating base is fixedly connected onto the outer wall of one side of the supporting plate through a bolt, a second heating base is fixedly connected onto the outer wall of one side of the first heating base, which is far away from the supporting plate, through a bolt, a first electric heating pipe is arranged inside the first heating base, and a second electric heating pipe is arranged inside the second heating base, the bottom center position department of bottom plate rotates and is connected with the bull stick, the top welding of bull stick has second bevel gear, and the bottom welding of bull stick has the hand wheel, the heating chamber has been seted up to one side position department that is close to first heating seat and second heating seat on the outer wall of one side of die holder.

Preferably, the first bevel gear and the second bevel gear are in meshing connection through gear teeth.

Preferably, the number of the screw rods is four, and the four screw rods are symmetrically arranged inside the bottom plate.

Preferably, the cross sections of the first electric-heating pipe and the second electric-heating pipe are both S-shaped structures.

Preferably, the top of the lower die holder is provided with a concave cavity.

Preferably, the support plate and the bottom plate are slidably connected.

Compared with the prior art, the utility model has the beneficial effects that: this heat dissipation mechanism that notebook computer button casting die used, through mutually supporting of first heating seat and second heating seat, can accomplish the removal with first heating seat and second heating seat after the shaping at the mould and break away from the die holder, thereby make the heating structure of mould leave, the waste heat conduction of avoiding heating structure leads to the fact the poor problem of mould radiating effect to the mould, the inner wall attenuation of die holder is also made in breaking away from of first heating seat and second heating seat, heat-conducting medium diminishes, heat-conduction efficiency increases, fashioned notebook computer button can be quick in the die holder dispels the heat, realize high-efficient heat dissipation.

Drawings

FIG. 1 is a front view of the present invention;

FIG. 2 is a top view of the base plate of the present invention;

FIG. 3 is a schematic top view of the internal structure of the lower die holder according to the present invention;

FIG. 4 is a schematic top view of the bottom plate of the present invention;

FIG. 5 is a front view of the first heating base of the present invention.

In the figure: 1. a base plate; 2. a lower die holder; 3. a top plate; 4. an upper die holder; 5. a lead screw; 6. a first bevel gear; 7. a screw nut seat; 8. a support plate; 9. a first heating base; 10. a second heating base; 11. a first electric heating tube; 12. a second electric heating tube; 13. a rotating rod; 14. a second bevel gear; 15. a hand wheel; 16. a chamber is heated.

Detailed Description

The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.

Referring to fig. 1-5, the present invention provides a technical solution: a heat dissipation mechanism for a notebook computer key casting mold comprises a bottom plate 1, wherein the top of the bottom plate 1 is fixedly connected with a lower mold base 2 through bolts, a top plate 3 is arranged at the position above the bottom plate 1, the position, close to the position right above the lower mold base 2, of the bottom of the top plate 3 is fixedly connected with an upper mold base 4 through bolts, the inside of the bottom plate 1 is rotatably connected with a lead screw 5, one end of the lead screw 5 is welded with a first bevel gear 6, the outer wall of one side of the lead screw 5 is connected with a screw nut base 7 in a screwing manner through threads, the top of the screw nut base 7 is fixedly connected with a supporting plate 8 through bolts, the outer wall of one side of the supporting plate 8 is fixedly connected with a first heating base 9 through bolts, the outer wall of one side, far away from the supporting plate 8, of the first heating base 9 is fixedly connected with a second heating base 10 through bolts, a first electric heating pipe 11 is arranged inside the first heating base 9, a second electric heating pipe 12 is arranged inside the second heating base 10, the bottom center of the bottom plate 1 is rotatably connected with a rotating rod 13, a second bevel gear 14 is welded at the top end of the rotating rod 13, a hand wheel 15 is welded at the bottom end of the rotating rod 13, and a heating cavity 16 is formed in the position, close to the first heating seat 9 and the second heating seat 10, on the outer wall of one side of the lower die holder 2.

In the utility model: the first bevel gear 6 and the second bevel gear 14 are in gear meshing connection; so that the screw rod 5 can be driven to rotate through the rotating rod 13.

In the utility model: the number of the screw rods 5 is four, and the four screw rods 5 are symmetrically arranged inside the bottom plate 1; so as to synchronously drive the four supporting plates 8 to move.

In the utility model: the cross sections of the first electric-heating pipe 11 and the second electric-heating pipe 12 are both S-shaped structures; the heating efficiency of the first electric-heating tube 11 and the second electric-heating tube 12 is improved.

In the utility model: the top of the lower die holder 2 is provided with a concave cavity; the molding of the keys of the notebook computer is convenient.

In the utility model: the supporting plate 8 is connected with the bottom plate 1 in a sliding way; the stability of the horizontal movement of the support plate 8 is ensured.

The working principle is as follows: when the device is used, the bottom plate 1 is placed on a horizontal ground, when the keys of a notebook computer are cast, materials required by the key casting of the notebook computer are injected into a concave cavity at the top of the lower die holder 2, the materials in the concave cavity are melted by heat generated by the work of the first electric heating tube 11 and the second electric heating tube 12, the top plate 3 moves downwards under the drive of an external drive structure, the upper die holder 4 on the top plate 3 moves downwards, the materials are extruded and formed after the upper die holder 4 is contacted with the lower die holder 2, after the casting is finished, the hand wheel 15 is rotated, the hand wheel 15 drives the second bevel gear 14 to rotate through the rotating rod 13, the second bevel gear 14 is connected with the first bevel gear 6 in a meshing manner, the second bevel gear 14 drives the first bevel gear 6 to rotate, the first bevel gear 6 drives the screw 5 to rotate, the screw nut seat 7 moves on the screw 5 through the screwing connection of the screw 5 and the screw nut seat 7, screw nut seat 7 drives 8 horizontal lateral shifting of backup pad, first heating seat 9 and the separation of second heating seat 10 and lower die holder 2 in the backup pad 8, first heating seat 9 and the removal of second heating seat 10 go out heating chamber 16, first heating seat 9 and the second heating seat 10 in the lower die holder 2 are taken out, the heat that contains on first heating seat 9 and the second heating seat 10 is taken out, outside flowing air also can the maximize with the contact of lower die holder 2, the notebook computer button of molding can be quick in the cavity dispel the heat, realize high-efficient heat dissipation.

In summary, the following steps: this heat dissipation mechanism that notebook computer button casting mold used, through mutually supporting of first heating seat 9 and second heating seat 10, can accomplish the shaping back at the mould and remove first heating seat 9 and second heating seat 10 and break away from die holder 2, thereby make the heating structure of mould leave, the waste heat conduction of avoiding heating structure leads to the fact the poor problem of mould radiating effect to the mould, the inner wall attenuation of die holder 2 is also made in breaking away from of first heating seat 9 and second heating seat 10, heat-conducting medium diminishes, heat conduction efficiency increases, fashioned notebook computer button can be quick in the die holder 2 dispels the heat, realize high-efficient heat dissipation.

It is noted that, herein, relational terms such as first and second, and the like may be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus.

Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the utility model, the scope of which is defined in the appended claims and their equivalents.

Claims

1. The utility model provides a heat dissipation mechanism that notebook computer button casting mold used, includes bottom plate (1), its characterized in that: the top of the bottom plate (1) is fixedly connected with a lower die holder (2) through bolts, a top plate (3) is arranged at the position above the bottom plate (1), the bottom of the top plate (3) is close to the position right above the lower die holder (2) and is fixedly connected with an upper die holder (4) through bolts, a lead screw (5) is rotatably connected inside the bottom plate (1), a first bevel gear (6) is welded at one end of the lead screw (5), a screw nut seat (7) is rotatably connected on the outer wall of one side of the lead screw (5) through threads, a supporting plate (8) is fixedly connected at the top of the screw nut seat (7) through bolts, a first heating seat (9) is fixedly connected on the outer wall of one side of the supporting plate (8) through bolts, and a second heating seat (10) is fixedly connected on the outer wall of one side of the first heating seat (9) far away from the supporting plate (8) through bolts, the inside of first heating seat (9) is provided with first electric heating pipe (11), the inside of second heating seat (10) is provided with second electric heating pipe (12), the bottom central point department of putting of bottom plate (1) rotates and is connected with bull stick (13), the top welding of bull stick (13) has second bevel gear (14), and the bottom welding of bull stick (13) has hand wheel (15), heating chamber (16) have been seted up to one side position department that is close to first heating seat (9) and second heating seat (10) on the outer wall of one side of die holder (2).

2. The heat dissipation mechanism for the notebook computer key casting mold according to claim 1, wherein: the first bevel gear (6) and the second bevel gear (14) are connected through gear teeth meshing.

3. The heat dissipation mechanism for the notebook computer key casting mold according to claim 1, wherein: the number of the screw rods (5) is four, and the four screw rods (5) are symmetrically arranged in the bottom plate (1).

4. The heat dissipation mechanism for the notebook computer key casting mold according to claim 1, wherein: the cross sections of the first electric heating pipe (11) and the second electric heating pipe (12) are both S-shaped structures.

5. The heat dissipation mechanism for the notebook computer key casting mold according to claim 1, wherein: the top of the lower die holder (2) is provided with a concave cavity.

6. The heat dissipation mechanism for the notebook computer key casting mold according to claim 1, wherein: the supporting plate (8) is connected with the bottom plate (1) in a sliding mode.