CN216682809U - Mortar pipe guiding mechanism suitable for semiconductor crystal bar slicer - Google Patents
Mortar pipe guiding mechanism suitable for semiconductor crystal bar slicer Download PDFInfo
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- CN216682809U CN216682809U CN202123262267.2U CN202123262267U CN216682809U CN 216682809 U CN216682809 U CN 216682809U CN 202123262267 U CN202123262267 U CN 202123262267U CN 216682809 U CN216682809 U CN 216682809U
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Abstract
The utility model discloses a mortar tube adjusting mechanism suitable for a semiconductor crystal bar slicing machine, which comprises a mortar tube body, wherein the length direction of the mortar tube body is parallel to the axial direction of a crystal bar to be cut; the mortar pipe body is provided with a first sliding block, the arc-shaped sliding rail which is in sliding fit with the first sliding block is arranged on the lower side of the feeding device, and the concave part of the arc-shaped sliding rail faces the crystal bar to be cut. With the aid of the adjusting mechanism, when a round semiconductor crystal bar is cut, the feeding device drives the arc-shaped slide rail to move downwards along the vertical direction along with the change of the cutting depth, the arc-shaped slide rail synchronously drives the mortar pipe body to move along the horizontal direction, so that the distance between the mortar pipe main body and a cutting area is always kept unchanged, the heat dissipation, lubrication and dispersion effects of cutting liquid are ensured, and the surface quality of a silicon wafer obtained by cutting is improved.
Description
Technical Field
The utility model belongs to the technical field of semiconductor crystal bar processing, and particularly relates to a mortar pipe adjusting mechanism suitable for a semiconductor crystal bar slicing machine.
Background
Along with the development of the industry, the surface quality requirement of a silicon wafer after crystal bar cutting is higher and higher, the existing semiconductor crystal bar cutting equipment is mainly a multi-wire cutting machine, a mortar pipe in the traditional multi-wire cutting machine is installed in a fixed mode, and the installation mode is difficult to meet the high-quality trend of semiconductor crystal bar cutting, and the specific reasons are as follows: in the multi-wire cutting machine, a plurality of steel wires are uniformly and densely distributed on the guide wheels along the axial direction of the guide wheels, the guide wheels which run at high speed drive the steel wires to reciprocate, a semiconductor crystal bar driven by a feeding device is fed along the vertical direction of the steel wires, the semiconductor crystal bar is cut into silicon wafers with uniform thickness, cutting liquid is uniformly brought into a cutting area through a mortar pipe in the process, the effects of heat dissipation, lubrication and dispersion are achieved, and the surface quality of the silicon wafers obtained by cutting is improved. When the semiconductor crystal bar is a round bar, along with the change of cutting depth, the distance between the mortar pipe and the cutting area is changed because the mortar pipe is fixedly arranged on the multi-wire cutting machine, so that the effects of heat dissipation, lubrication and dispersion are changed, and after the distance is changed, the cutting liquid flowing out of the mortar pipe generates different impact forces on densely distributed steel wires, and finally the surface quality of the silicon wafer obtained by cutting is influenced.
Disclosure of Invention
The utility model aims to provide a mortar pipe adjusting mechanism suitable for a semiconductor crystal bar slicing machine, aiming at the technical problem that the surface quality of a silicon wafer is influenced because a mortar pipe is fixedly arranged in a traditional multi-wire cutting machine.
The purpose of the utility model is realized by adopting the following technical scheme. The mortar tube adjusting mechanism suitable for the semiconductor crystal bar slicing machine comprises a mortar tube body 6, wherein the length direction of the mortar tube body is parallel to the axial direction of a crystal bar to be sliced, two ends of the mortar tube body along the length direction are in sliding connection with corresponding inner walls 1 of the machine on the slicing machine, and the sliding direction of the mortar tube body is the horizontal direction; the mortar pipe body is provided with a first sliding block 3, an arc-shaped sliding rail 5 which is in sliding fit with the first sliding block is arranged on the lower side of a feeding device for driving the crystal bar to move along the vertical direction, and the concave part of the arc-shaped sliding rail faces the crystal bar to be cut.
Furthermore, the two ends of the mortar pipe along the length direction are respectively provided with a second sliding block 4, and the inner wall of the corresponding machine is provided with a side sliding rail 2 which extends along the horizontal direction and is in sliding fit with the second sliding block.
Further, a first slide block 3 is arranged on at least one second slide block 4.
Furthermore, the circle center of the section of the arc-shaped slide rail is positioned on the axis of the crystal bar.
Further, the angle of the section of the arc-shaped slide rail is less than 180 degrees.
By means of the adjusting mechanism provided by the utility model, when a round semiconductor crystal bar is cut, the feeding device simultaneously drives the arc-shaped slide rail to move downwards along the vertical direction along with the change of the cutting depth, and the arc-shaped slide rail synchronously drives the mortar pipe body to move along the horizontal direction, so that the mortar pipe body generates position change in the horizontal direction, the distance between the mortar pipe body and a cutting area is kept unchanged all the time, the heat dissipation, lubrication and dispersion effects of cutting liquid are ensured, and the surface quality of a silicon wafer obtained by cutting is improved.
The foregoing description is only an overview of the technical solutions of the present invention, and in order to make the technical means of the present invention more clearly understood, the present invention may be implemented in accordance with the content of the description, and in order to make the above and other objects, features, and advantages of the present invention more clearly understood, the following preferred embodiments are described in detail with reference to the accompanying drawings.
Drawings
FIG. 1 is a schematic perspective view of a mortar tube adjustment mechanism suitable for a semiconductor crystal bar slicing machine according to the present invention.
Fig. 2 is a front view of fig. 1.
Detailed Description
To further illustrate the technical means and effects of the present invention for achieving the predetermined purpose, the following detailed description will be given to the structure, features and effects of a mortar tube adjusting mechanism for a semiconductor crystal bar slicing machine according to the present invention with reference to the accompanying drawings and preferred embodiments.
Referring to fig. 1 and 2, the mortar tube adjusting mechanism for a semiconductor crystal bar slicing machine of the present invention comprises a mortar tube body 6, wherein the length direction of the mortar tube body is parallel to the axial direction of a semiconductor crystal bar to be sliced, two ends of the mortar tube body along the length direction are respectively provided with a second slider 4, the inner wall 1 of the slicing machine on the same side is provided with a side slide rail 2, the mortar tube body is assembled on the inner wall of the slicing machine main body in a sliding manner by means of the cooperation of the second slider and the side slide rail, and the mortar tube body moves along the horizontal direction under the action of external force and approaches or leaves the semiconductor crystal bar during the slicing process; a first slide block 3 is arranged on one second slide block, an arc slide rail 5 which is in sliding fit with the first slide block is arranged on the lower side of a feeding device for driving a semiconductor crystal bar to move along the vertical direction of a steel wire (defined as the vertical direction), and a concave part of the arc slide rail faces the semiconductor crystal bar to be cut (namely the arc slide rail protrudes away from the semiconductor crystal bar), when the circular semiconductor crystal bar is cut, along with the change of the cutting depth, the feeding device simultaneously drives the arc slide rail to move downwards along the vertical direction, and by means of the fit of the arc slide rail and the corresponding slide block, the arc slide rail synchronously drives a mortar pipe body to move along the horizontal direction, so that the mortar pipe body generates position change in the horizontal direction, further the distance between the mortar pipe body and the cutting area is always kept unchanged, the fluctuation of the impact force of cutting liquid on the densely distributed steel wire caused by the distance change between the mortar pipe and the cutting area in the traditional multi-wire cutting machine is reduced, the heat dissipation, lubrication and dispersion effects of the cutting liquid are ensured, and the surface quality of the cut silicon wafer is improved. The mortar pipe body and the feeding device are basic components of the existing multi-wire cutting machine, and detailed description is omitted.
In order to obtain better cutting quality, the circle center of the section of the arc-shaped slide rail can be positioned on the axis of the semiconductor crystal bar, the arc-shaped slide rail and the outer wall of the partial circumference of the crystal bar are in a parallel and level state, and the angle of the section of the arc-shaped slide rail can be further limited to be smaller than 180 degrees.
Of course, in other embodiments of the present invention, the first slide block may be disposed on both the second slide blocks, and in this case, two arc-shaped slide rails are disposed on the lower side of the feeding device.
The above description is only a preferred embodiment of the present invention, and any person skilled in the art can make any simple modification, equivalent change and modification to the above embodiments according to the technical essence of the present invention without departing from the scope of the present invention, and still fall within the scope of the present invention.
Claims (5)
1. A mortar tube adjusting mechanism suitable for a semiconductor crystal bar slicing machine comprises a mortar tube body (6), wherein the length direction of the mortar tube body is parallel to the axis direction of a crystal bar to be sliced, and the mortar tube adjusting mechanism is characterized in that two ends of the mortar tube body along the length direction are in sliding connection with the corresponding inner wall (1) of the machine on the slicing machine, and the sliding direction of the mortar tube body is the horizontal direction; a first sliding block (3) is arranged on the mortar pipe body, an arc-shaped sliding rail (5) which is in sliding fit with the first sliding block is arranged on the lower side of a feeding device used for driving the crystal bar to move along the vertical direction, and a concave part of the arc-shaped sliding rail faces towards the crystal bar to be cut.
2. The mortar pipe adjusting mechanism suitable for the slicing machine of the semiconductor crystal bar according to claim 1, wherein the mortar pipe is provided with second sliding blocks (4) at two ends along the length direction, and the inner wall of the corresponding machine is provided with side sliding rails (2) which extend along the horizontal direction and are in sliding fit with the second sliding blocks.
3. The mortar pipe adjusting mechanism suitable for the slicing machine of the semiconductor crystal bar according to claim 2, wherein the first slide block (3) is arranged on at least one second slide block (4).
4. The mortar tube adjustment mechanism of claim 1, wherein the center of the arc-shaped slide rail is located on the axis of the ingot.
5. The mortar pipe adjusting mechanism of claim 1 or 4, wherein the angle of the arc-shaped slide rail is less than 180 degrees.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202123262267.2U CN216682809U (en) | 2021-12-23 | 2021-12-23 | Mortar pipe guiding mechanism suitable for semiconductor crystal bar slicer |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202123262267.2U CN216682809U (en) | 2021-12-23 | 2021-12-23 | Mortar pipe guiding mechanism suitable for semiconductor crystal bar slicer |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN216682809U true CN216682809U (en) | 2022-06-07 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202123262267.2U Active CN216682809U (en) | 2021-12-23 | 2021-12-23 | Mortar pipe guiding mechanism suitable for semiconductor crystal bar slicer |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN216682809U (en) |
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2021
- 2021-12-23 CN CN202123262267.2U patent/CN216682809U/en active Active
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Denomination of utility model: A mortar tube adjustment mechanism suitable for semiconductor crystal bar slicing machines Effective date of registration: 20230607 Granted publication date: 20220607 Pledgee: Bank of China Limited by Share Ltd. Luoyang branch Pledgor: LuoYang HongTai Semiconductor Co.,Ltd. Registration number: Y2023980043127 |