CN216680610U

CN216680610U - Chip batch transfer and welding device

Info

Publication number: CN216680610U
Application number: CN202123026034.2U
Authority: CN
Inventors: 黄招凤
Original assignee: Individual
Current assignee: Individual
Priority date: 2021-12-02
Filing date: 2021-12-02
Publication date: 2022-06-07
Anticipated expiration: 2031-12-02

Abstract

The utility model belongs to the technical field of semiconductor processing, and particularly relates to a chip batch transferring and welding device, which comprises a base, a welding device and a welding device, wherein the base is provided with a plurality of welding holes; the laser module is arranged on the base and comprises a laser; the printed board carrier conveying module is arranged on the base and used for conveying the printed board to be processed to a laser welding station; a chip carrier transport module; the printed board feeding module is fixedly arranged on the base; the CCD module is used for matching the printed board and aligning and attaching the chip on the chip carrier; compared with the prior art of the same type, the chip carrier conveying module can quickly convey a plurality of chips to the welding station, and the chips are welded on the printed board through the laser module, so that the chips are not required to be placed one by adopting a suction nozzle in the prior art, and reflow soldering is not required; therefore, the device can transfer chips in batches, and the transfer efficiency is high; the welding device is small in size and small in occupied space by adopting laser welding; the laser welding speed is fast, and is efficient, and the energy consumption is low moreover, and the yields is high.

Description

Chip batch transfer and welding device

Technical Field

The utility model relates to the technical field of semiconductor processing, in particular to equipment capable of quickly transferring chips in batches, realizing alignment of a plurality of chips and a PCB (printed circuit board) and welding the chips on the PCB.

Background

At present, the way of fixing a plurality of chips with different functions on a printed board is as follows: the chips are placed on the printed board welding pads coated with the soldering flux one by adopting the suction nozzles on the swing arms, and then the die bonding operation is realized through multiple steps of reflow soldering and the like, so that the process is complicated and the efficiency is low. Reflow soldering is a soldering method for heating a soldered part by forcing airflow to circulate through a convection spray nozzle or a heat-resistant fan, a reflow oven is large in size, and a workpiece consumes a long time when passing through the reflow oven; therefore, the current SMT process at least has the defects of more equipment, more working procedures, large occupied space, high energy consumption, low yield, long maintenance and cleaning time and the like.

SUMMERY OF THE UTILITY MODEL

In order to overcome the defects of the prior art, the utility model aims to provide a chip batch transferring and welding device, which aims to solve the problems of multiple working procedures, low efficiency, high equipment energy consumption and large occupied space in the chip transferring and welding process in the prior art.

In order to achieve the purpose, the utility model adopts the technical scheme that: a chip batch transferring and welding device comprises a base;

the laser module is arranged on the base and comprises a laser;

the printed board carrier transmission module is arranged on the base, can drive the printed board to move and rotate in the XYZ direction, and is used for transmitting the printed board to be processed to a laser welding station;

the chip carrier transmission module is used for transmitting the chip carriers with the chips to a laser welding station;

the printed board feeding module is fixedly arranged on the base and used for placing a printed board to be processed on the printed board carrier conveying module;

the CCD module is used for matching the printed board and aligning and attaching the chip on the chip carrier;

the printed board carrier transmission module can drive the printed board to align with the chip on the chip carrier; the laser module is used for welding the chip which is aligned and attached with the printed board together.

Preferably, the chip carrier transfer module is arranged on the laser module; a chip carrier for placing a chip is fixed on the laser module and is positioned below the laser; the printed board to be processed is positioned below the chip carrier.

Preferably, the laser module comprises a gantry support fixedly arranged on the base and provided with a mounting plate, a power assembly arranged on the mounting plate, a transmission assembly arranged on the mounting plate and connected with the power assembly, a laser assembly arranged on the transmission assembly, and an adsorption assembly arranged on the lower surface of the mounting plate.

Preferably, the power assembly comprises: the X-axis laser device comprises an X flange seat fixedly arranged on the upper surface of the mounting plate, a coupler arranged in the X flange seat, a motor and a bearing seat which are arranged on the X flange seat and are respectively connected with the coupler, a screw rod with one end penetrating through the bearing seat and connected with the coupler, and an X-axis laser seat connected with the screw rod.

Preferably, the transmission assembly comprises two parallel guide rails arranged on the upper surface of the mounting plate, and a sliding block arranged on each guide rail and fixedly connected with the bottom surface of the X-axis laser seat.

Preferably, the laser module comprises a laser and a laser horizontal seat arranged on the X-axis laser seat and used for mounting the laser; and the mounting plate, the laser horizontal seat and the X-axis laser seat are internally provided with through holes for laser to pass through.

Preferably, the adsorption component comprises two pressing frames arranged on the bottom surface of the mounting plate, pressing frames with two ends respectively fixedly connected with the two pressing frames, a plurality of suction nozzles arranged in the bottom surface of the pressing frames, and a glass plate connected with the bottom surface of the pressing frames; the glass plate is located below the laser.

Preferably, a reading head seat A is arranged on one side surface of the X-axis laser seat, and an optical reading head A is arranged on the lower surface of the reading head seat A; one side and the front end of the X-axis laser seat are respectively provided with an optical ruler.

Preferably, the printing plate carrier delivery module comprises a Y-direction delivery mechanism arranged on the upper surface of the base, an X-direction delivery mechanism arranged on the Y-direction delivery mechanism, a Z-direction lifting mechanism arranged on the X-direction delivery mechanism, and an R-direction rotating mechanism arranged on the Z-direction lifting mechanism.

Preferably, the Y-direction conveying mechanism includes a Y-direction base plate fixedly disposed on the upper surface of the base, two mutually parallel Y-direction guide rails disposed on the Y-direction base plate, a Y-direction slider disposed on each Y-direction guide rail, a Y-direction linear motor stator disposed between the two Y-direction guide rails and fixed on the Y-direction base plate, a Y-direction linear motor mover movably disposed on the Y-direction linear motor stator, a Y-direction mover fixing block disposed on the Y-direction linear motor mover, and a Y-direction support plate disposed above the Y-direction mover fixing block and fixedly connected to the Y-direction mover fixing block.

Preferably, the X-direction conveying mechanism includes two parallel X-direction guide rails disposed on the Y-direction support plate, an X-direction slider disposed on each X-direction guide rail, an X-direction linear motor stator disposed between the two X-direction guide rails and fixed on the Y-direction support plate, an X-direction linear motor mover movably disposed on the X-direction linear motor stator, an X-direction mover fixing block disposed on the X-direction linear motor mover, and an X-direction support housing disposed above and fixedly connected to the X-direction mover fixing block, and the X-direction support housing is connected to the X-direction slider.

Preferably, the Z-direction lifting mechanism comprises a Z-direction base fixedly arranged in the X-direction support shell, two groups of horizontal cross roller slide rails arranged on the upper surface of the Z-direction base in the horizontal direction, horizontal sliding tables arranged on the two groups of horizontal cross roller slide rails and provided with support inclined planes, and a Z-direction sliding table movably arranged on the horizontal sliding tables and provided with Z-direction inclined planes attached to the support inclined planes; the horizontal power assembly is arranged on the Z-direction base and connected with the horizontal sliding table and used for driving the horizontal sliding table to do reciprocating linear motion on the Z-direction base; the Z-direction auxiliary sliding table is arranged on the upper surface of one end part of the Z-direction base; one end of the Z-direction sliding table is movably connected with a Z-direction guide rail in one side surface of the Z-direction auxiliary sliding table through two groups of Z-direction crossed roller slide rails; when the horizontal sliding table does reciprocating linear motion on the Z-direction base, the Z-direction sliding table is lifted relative to the Z-direction auxiliary sliding table.

Preferably, the horizontal power assembly comprises a horizontal motor arranged on the outer side surface of the Z-direction auxiliary sliding table, a horizontal coupling arranged in the Z-direction auxiliary sliding table and connected with an output shaft of the horizontal motor, a horizontal bearing seat arranged on the Z-direction auxiliary sliding table, and a horizontal screw rod, wherein one end of the horizontal screw rod penetrates through the horizontal bearing seat and is connected with the horizontal coupling; the other end of the horizontal screw rod is movably connected with the horizontal sliding table.

Preferably, two sides of the supporting inclined plane are respectively provided with a group of oblique crossed roller slide rails, and the Z-direction inclined plane is connected with the oblique crossed roller slide rails.

Preferably, the R-direction rotating mechanism comprises an R-direction bottom plate, an R-direction base, a DD motor, an R-direction swivel base and an adsorption plate, which are sequentially arranged on the Z-direction sliding table from bottom to top; the DD motor is arranged on the R direction base, the R direction rotating base is connected with an output shaft of the DD motor, and the adsorption plate is arranged on the upper surface of the R direction rotating base.

Preferably, a reading head seat B is arranged on one side surface of the X-direction supporting shell, and an optical reading head B is arranged on the lower surface of the reading head seat B; one side surface of the Y-direction supporting plate is provided with a reading head seat C, the lower surface of the reading head seat C is provided with an optical reading head C, and the inner side of the optical reading head C is provided with a grating ruler connected with the optical reading head C.

Preferably, the chip carrier conveying module comprises a linear module, a driving motor arranged at one end of the linear module, a sliding table cylinder arranged on the linear module and capable of linearly moving on the linear module, a Z-direction auxiliary sliding block arranged on the sliding table cylinder and capable of lifting relative to the sliding table cylinder, a chip carrier acquisition board arranged on the bottom surface of the Z-direction auxiliary sliding block, and a connecting board arranged on the rear surface of the linear module and used for being fixedly connected with the laser module.

Preferably, the printed board feeding module comprises a supporting square pipe fixedly arranged on the base, a magnetic couple type rodless cylinder fixedly arranged on the upper surface of the supporting square pipe, a cylinder connecting plate fixedly arranged on the upper surface of one end part of the magnetic couple type rodless cylinder, a three-shaft belt guide rail cylinder fixedly arranged on the outer surface of the cylinder connecting plate, and a printed board conveying plate arranged at one end of the three-shaft belt guide rail cylinder and used for placing a printed board.

Preferably, the CCD module is disposed on the laser module and above the printed board carrier transport module and the chip carrier transport module; the CCD horizontal moving assembly is arranged on the laser module and located on one side of the laser, the CCD vertical moving assembly is arranged on the CCD horizontal moving assembly, and the camera assembly is arranged on the CCD vertical moving assembly.

Preferably, the CCD horizontal moving assembly includes a horizontal mounting plate fixedly disposed on the laser module, an actuator disposed on the upper surface of the horizontal mounting plate, a CCD horizontal screw rod disposed in the actuator, a CCD horizontal slider movably disposed on the CCD horizontal screw rod, a CCD horizontal coupling disposed in an end portion of the actuator and connected to one end of the CCD horizontal screw rod, and a CCD horizontal driving motor disposed at one end of the actuator and connected to the CCD horizontal coupling; the CCD sliding table base is arranged on the upper surface of the CCD horizontal sliding block, the sliding table base is arranged on the CCD sliding table base, and the flange mounting plate is arranged on the upper surface of the sliding table base.

Preferably, the CCD vertical moving assembly comprises a CCD vertical driving motor fixedly arranged on the flange mounting plate, a vertical guide rail and a vertical sliding block, wherein the vertical guide rail and the vertical sliding block are connected with an output shaft of the CCD vertical driving motor and are positioned outside the sliding table seat; the output shaft of the CCD vertical driving motor extends downwards into the sliding table seat.

Preferably, the camera assembly comprises a camera support fixedly arranged on the outer surface of the vertical sliding block, a light source support arranged on the camera support, a lens clamp arranged on the camera support, a lens fixedly connected with the lens clamp at the upper end, a camera arranged at the upper end of the lens, a first light source and a second light source which are arranged on the light source support and are positioned below the lens, and a line arranging board arranged at the upper end of the camera support.

Preferably, a reading head seat D is arranged on one side surface of the CCD sliding table base, a reading head seat E fixedly connected with the reading head seat D is arranged on the reading head seat D, and an optical reading head D fixedly connected with the reading head seat E is arranged on the lower surface of the reading head seat E.

The beneficial technical effects are as follows: by adopting the device, a chip semi-finished product from the previous process is placed on a chip carrier according to a certain rule, the chip carrier at the position generally refers to a glass plate, and then the chip is welded at a laser welding station and is fixed on the chip carrier through a chip carrier conveying module, the laser welding station at the position refers to a light coverage area of a laser on a laser module, the printed board carrier conveying module can drive a printed board to move and rotate in the XYZ direction, the printed board can be conveyed to the lower part of the chip carrier through the printed board carrier conveying module, and the chip and the printed board can be aligned by means of high-speed identification of a CCD module, and then the chip is welded on a bonding pad of the printed board through the laser module; compared with the prior art of the same type, the chip carrier conveying module can quickly convey a plurality of chips to the welding station, and the chips are quickly aligned and attached to the printed board at the station by virtue of the CCD module, and are welded on the printed board by the laser module, so that suction nozzles in the prior art are not required to be used for placing the chips one by one, and reflow soldering is not required; therefore, the device can transfer chips in batches, and the transfer efficiency is high; the welding device is small in size and small in occupied space by adopting laser welding; the laser welding speed is fast, and is efficient, and the energy consumption is low moreover, and the yields is high.

Drawings

FIG. 1 is a perspective view of an embodiment of the present invention;

FIG. 2 is a perspective view from another perspective of an embodiment of the present invention;

FIG. 3 is an exploded view of an embodiment of the present invention;

FIG. 4 is a perspective view of a laser module according to an embodiment of the present invention;

FIG. 5 is a perspective view of another embodiment of the laser module of the present invention;

FIG. 6 is a perspective view of another embodiment of the laser module of the present invention;

FIG. 7 is an exploded view of a laser module according to an embodiment of the present invention;

FIG. 8 is a perspective view of a printed board carrier transport module according to an embodiment of the present invention;

FIG. 9 is another perspective view of a printed board carrier transport module in accordance with an embodiment of the present invention;

fig. 9a is a schematic diagram of a positional relationship between a chip carrier and a printed board according to an embodiment of the present invention;

FIG. 10 is an exploded view of a printed board carrier transport module according to an embodiment of the present invention;

FIG. 11 is a perspective view of a chip carrier transport module according to an embodiment of the utility model;

FIG. 12 is a perspective view of another perspective view of a chip carrier transport module according to an embodiment of the present invention;

FIG. 13 is an exploded view of a chip carrier transport module according to an embodiment of the present invention;

fig. 14 is a perspective view of a printed board feeding module according to an embodiment of the present invention;

fig. 15 is a perspective view of another perspective view of a printed board feeding module according to an embodiment of the present invention;

fig. 16 is an exploded view of a printed board feeding module according to an embodiment of the present invention;

FIG. 17 is a perspective view of a CCD module according to an embodiment of the present invention;

FIG. 18 is a perspective view of another angle of view of the CCD module according to the embodiment of the present invention;

fig. 19 is an exploded view of a CCD module according to an embodiment of the present invention.

Detailed Description

In order that those skilled in the art will better understand the technical solution of the present invention, the present invention will be further described in detail with reference to the accompanying drawings and embodiments.

As shown in fig. 1 to 3, an embodiment of the present invention provides a device for batch transferring and soldering chips, including a base 100, which is a flat plate made of marble; the laser module 200 is arranged on the base 100, comprises a laser used for laser welding, and is also used for fixing a chip carrier during alignment, and a plurality of chips are placed on the chip carrier according to a certain rule; the printed board carrier transmission module 300 is arranged on the base 100, can drive a printed board (workpiece) to move and rotate in the XYZ direction, and is used for transmitting the printed board to be processed to a laser welding station; a chip carrier transfer module 400 for transferring a chip carrier on which a plurality of chips are placed to a laser welding station, which is provided on the laser module; the printed board feeding module 500 is fixedly arranged on the base 100 and used for placing a printed board to be processed on the printed board carrier conveying module 300; the CCD module 600 is used for matching with a printed board and aligning and attaching a chip on a chip carrier through high-speed scanning and identification of a camera; here, the printed board carrier transport module 300 may drive the printed board to align with the chip on the chip carrier, that is, after the chip carrier is fixed, the printed board carrier transport module 300 finely adjusts the position of the printed board to realize the alignment of the printed board with the chip on the chip carrier; the laser module 200 is used for welding the chip which is aligned and attached to the printed board.

Specifically, the laser module 200 is fixed on the base 100; the chip carrier transmission module 400 transmits the chip carrier with the chip placed under the laser module 200, and the chip carrier is fixed by the suction device (a plurality of suction nozzles) of the laser module 200; the printed board feeding module 500 transmits a printed board to the printed board carrier conveying module 300, the printed board carrier conveying module 300 conveys the printed board to the lower side of the laser module 200, at the moment, the printed board carrier conveying module 300 is positioned below a chip carrier, the chip and the printed board are aligned and attached under the cooperation of the CCD module 600, and then the chip is welded on the printed board through the laser module 200, so that the chip is fixedly connected on the printed board.

As shown in fig. 1-3, in the present embodiment, the chip carrier transport module 400 is disposed on the laser module 200; a chip carrier for placing a chip is fixed on the laser module 200 and is positioned below the laser; the printed board to be processed is positioned below the chip carrier. In fact, the mounting position of the chip carrier transfer module 400 is not particularly limited as long as the chip carrier can be transferred to the bonding station, i.e., it can be fixed to the base 100 as well.

As shown in fig. 4-5, in the present embodiment, the laser module 200 adopts the following structure: the gantry comprises a gantry support 201 fixedly arranged on a base 100, and a mounting plate 201a is arranged on the gantry support; locate the power component on the mounting panel 201a, locate the transmission assembly that just is connected with the power component on the mounting panel 201a, locate the laser instrument subassembly on the transmission assembly, locate the absorption subassembly on the mounting panel lower surface.

As shown in fig. 4-7, specifically, the power assembly includes: the X-axis laser device comprises an X-flange seat 202 fixedly arranged on the upper surface of the mounting plate 201a, a coupler 203 arranged in the X-flange seat 202, a motor 204 and a bearing seat 205 which are arranged on the X-flange seat 202 and are respectively connected with the coupler 203, a screw rod 206 with one end penetrating through the bearing seat 205 and connected with the coupler 203, and an X-axis laser seat 207 connected with the screw rod 206.

The transmission assembly comprises two parallel guide rails 208 arranged on the upper surface of the mounting plate 201a, and a sliding block 209 arranged on each guide rail 208 and fixedly connected with the bottom surface of the X-axis laser seat 207; in this embodiment, two sliders 209 are provided on each guide rail 208.

The laser module comprises a laser 210 and a laser horizontal seat 211 which is arranged on an X-axis laser seat 207 and used for mounting the laser; the mounting plate 201a, the laser horizontal seat 211 and the X-axis laser seat 207 are internally provided with through holes 2a for laser to pass through; as shown in fig. 7, the laser 210 is marked with its light irradiation range 210 a.

The adsorption component comprises two pressing frames 212 arranged on the bottom surface of the mounting plate 201a, a pressing frame 213 with two ends fixedly connected with the two pressing frames respectively, a plurality of suction nozzles 214 arranged in the bottom surface of the pressing frame, a glass plate 215 connected with the bottom surface of the pressing frame, and a chip carrier positioned below the glass plate 215; the glass plate 215 is positioned below the laser 210; several suction nozzles 214 are located in a square area, as mainly shown with reference to fig. 6; the suction nozzle 214 is a commercially available standard.

A reading head seat A216 is arranged on one side surface of the X-axis laser seat 207, and an optical reading head A217 is arranged on the lower surface of the reading head seat A; an optical ruler 218 is disposed on one side and the front end of the X-axis laser mount 207, as shown in fig. 5 and 7.

As shown in fig. 4, four blocking pieces 219 are further disposed on the upper surface of the mounting plate 201a, and each blocking piece 219 is provided with an anti-collision rubber column 220; the post of pre-crash glue 220 is directed toward the X-axis laser mount 207.

By adopting the structure, after the motor 204 is started, the screw rod 206 is driven to rotate, and then the X-axis laser seat 207 is driven to do linear motion along two parallel guide rails 208, so that the position of the laser 210 is adjusted.

As shown in fig. 1 and 8-10, the board carrier transfer module 300 includes a Y-direction transfer mechanism disposed on the upper surface of the base 100, an X-direction transfer mechanism disposed on the Y-direction transfer mechanism, a Z-direction lifting mechanism disposed on the X-direction transfer mechanism, and an R-direction rotating mechanism disposed on the Z-direction lifting mechanism.

Specifically, the Y-direction conveying mechanism includes a Y-direction base plate 301 fixed on the upper surface of the base 100, two mutually parallel Y-direction guide rails 302 arranged on the Y-direction base plate 301, a Y-direction slider 303 arranged on each Y-direction guide rail, a Y-direction linear motor stator 304 arranged between the two Y-direction guide rails and fixed on the Y-direction base plate 301, a Y-direction linear motor mover 305 movably arranged on the Y-direction linear motor stator 304, a Y-direction mover fixing block 306 arranged on the Y-direction linear motor mover, and a Y-direction support plate 307 arranged above and fixedly connected with the Y-direction mover fixing block 306; here, there are two Y-direction sliders 303 on each Y-direction rail.

In the mechanism, a Y-direction linear motor stator 304 and a Y-direction linear motor mover 305 form a linear motor, and after the linear motor is started, the Y-direction linear motor mover 305 makes linear motion in the Y-direction linear motor stator 304 to drive a Y-direction mover fixing block 306 to move synchronously, and a Y-direction support plate 307 connected with the Y-direction mover fixing block 306 moves linearly along a Y-direction rail 302 along with the Y-direction linear motor stator, so that a structure on the Y-direction support plate 307 is driven to move linearly in the Y-direction.

The X-direction transmission mechanism comprises two X-direction guide rails 308 which are arranged on a Y-direction supporting plate 307 and are parallel to each other, an X-direction sliding block 309 which is arranged on each X-direction guide rail 308, an X-direction linear motor stator 310 which is arranged between the two X-direction guide rails 308 and is fixed on the Y-direction supporting plate 307, an X-direction linear motor rotor 311 which is movably arranged on the X-direction linear motor stator, an X-direction rotor fixing block 312 which is arranged on the X-direction linear motor rotor, an X-direction supporting shell 313 which is arranged above the X-direction rotor fixing block 312 and is fixedly connected with the X-direction rotor fixing block 312, and the X-direction supporting shell 313 is connected with the X-direction sliding block 309.

In the mechanism, an X-direction linear motor stator 310 and an X-direction linear motor mover 311 form a linear motor, and after the linear motor is started, the X-direction linear motor mover 311 makes linear motion in the X-direction linear motor stator 310 to drive an X-direction mover fixing block 312 to synchronously move, and an X-direction support housing 313 connected with the X-direction mover fixing block 312 makes linear motion along an X-direction guide 308 along with the X-direction linear motion, so that a structure on the X-direction support housing 313 is driven to make linear motion in the X-direction.

The Z-direction lifting mechanism comprises a Z-direction base 314 fixedly arranged in an X-direction supporting shell 313, two groups of horizontal crossed roller slide rails 315 arranged on the upper surface of the Z-direction base 314 in the horizontal direction, and a horizontal sliding table 316 arranged on the two groups of horizontal crossed roller slide rails 315, wherein a supporting inclined plane 316a is arranged on the horizontal sliding table 316, a Z-direction sliding table 317 movably arranged on the horizontal sliding table 316, and a Z-direction inclined plane 317a attached to the supporting inclined plane 316a is arranged on the Z-direction sliding table 317; the horizontal power assembly is arranged on the Z-direction base 314 and is connected with the horizontal sliding table 316 and is used for driving the horizontal sliding table 316 to do reciprocating linear motion on the Z-direction base 314; a Z-direction auxiliary sliding table 318 arranged on the upper surface of one end part of the Z-direction base 314; one end of the Z-direction sliding table 317 is movably connected with a Z-direction guide rail 318a in one side surface of the Z-direction auxiliary sliding table 318 through two groups of Z-direction crossed roller slide rails 318 b; when the horizontal sliding table 316 moves linearly in a reciprocating manner on the Z-direction base 314, the Z-direction sliding table 317 is lifted relative to the Z-direction auxiliary sliding table 318.

Specifically, the horizontal power assembly comprises a horizontal motor 319 arranged on the outer side surface of the Z-direction auxiliary sliding table 318, a horizontal coupling 320 arranged in the Z-direction auxiliary sliding table 318 and connected with an output shaft of the horizontal motor, a horizontal bearing seat 321 arranged on the Z-direction auxiliary sliding table 318, and a horizontal screw rod 322 with one end penetrating through the horizontal bearing seat 321 and connected with the horizontal coupling 320; the other end of the horizontal screw rod 322 is movably connected with the horizontal sliding table 316.

In the mechanism, after a horizontal motor 319 is started, a horizontal screw rod 322 is driven to rotate through a horizontal coupling 320, and when the horizontal screw rod 322 rotates, a horizontal sliding table 316 movably connected with the horizontal screw rod is driven to do reciprocating linear motion along the horizontal screw rod 322; the horizontal motor 319 has two states of positive rotation and reverse rotation, and the horizontal screw rod 322 rotates along with the positive rotation or the reverse rotation; if the horizontal sliding table 316 moves along the horizontal screw 322 in the direction approaching the horizontal motor 319 when the horizontal motor 319 drives the horizontal screw 322 to rotate forward, the supporting inclined plane 316a pushes the Z-directional sliding table 317 to ascend along the Z-directional guide rail 318a along with the advance of the horizontal sliding table 316, and the horizontal motor 319 drives the horizontal screw 322 to rotate backward, the horizontal sliding table 316 moves along the horizontal screw 322 in the direction away from the horizontal motor 319, and the Z-directional sliding table 317 descends along the Z-directional guide rail 318a along with the advance of the horizontal sliding table 316; so that the mechanism can drive the structure on the Z-direction sliding table 317 to lift in the Z direction.

Two sides of the supporting inclined plane 316a are respectively provided with a group of oblique crossed roller slide rails 323, and the Z-direction inclined plane 317a is connected with the oblique crossed roller slide rails 323.

The R-direction rotating mechanism comprises an R-direction bottom plate 324, an R-direction base 325, a DD motor 326, an R-direction rotating seat 327 and an adsorption plate 328 which are sequentially arranged on the Z-direction sliding table 317 from bottom to top; the DD motor 326 is arranged on the R-direction base 325, the R-direction rotating seat 327 is connected with an output shaft of the DD motor, and the adsorption plate 328 is arranged on the upper surface of the R-direction rotating seat 327; the printed board workpiece is placed on the adsorption plate 328; here, when the DD motor 326 is activated, the R-direction rotary base 327 is rotated, and the printed board workpiece and the suction plate 328 are rotated accordingly.

A head base B329 provided on one side surface of the X-direction support case 313, and an optical head B330 provided on a lower surface of the head base B329; a head base C331 is provided on one side surface of the Y-direction support plate 307, an optical head C332 is provided on the lower surface of the head base C, and a grating scale 333 connected to the optical head C is provided inside the optical head C.

A stopper plate 334 is provided at each end of the Y-guide rail 302 and the X-guide rail 308.

As shown in fig. 9a, which is used to show the positional relationship between chip carrier 2b and printed board 3a to be processed during processing, chip 2c is located on the bottom surface of chip carrier 2b and above printed board 3 a; here, a transfer film similar to a double-sided tape is provided on the chip carrier 2b, and the chip is attached to the chip carrier 2b through the transfer film.

As shown in fig. 1 and fig. 11-13, the chip carrier transfer module 400 includes a linear module 401, a driving motor 402 disposed at one end of the linear module, a slide cylinder 403 disposed on the linear module 401 and capable of moving linearly thereon, a Z-direction sub-slider 404 disposed on the slide cylinder 403 and capable of moving up and down relative thereto, a chip carrier capture board 405 disposed on a bottom surface of the Z-direction sub-slider 404, and a connecting board 406 disposed on a rear surface of the linear module 401 and configured to be fixedly connected to the laser module 200; specifically, the connecting plate 406 is fixedly connected with the bottom surface of the mounting plate 201a on the laser module 200; the linear module 401 and the sliding table cylinder 403 are all commercially available standard parts.

As shown in fig. 1 and 14-16, the printed board feeding module 500 includes a square supporting tube 501 fixed on the base 100, a magnetic couple type rodless cylinder 502 fixed on the upper surface of the square supporting tube, a cylinder connecting plate 503 fixed on the upper surface of one end of the magnetic couple type rodless cylinder, a three-axis cylinder with guide rails 504 fixed on the outer surface of the cylinder connecting plate 503, and a printed board conveying plate 505 arranged at one end of the three-axis cylinder with guide rails 504 and used for placing a printed board 506; here, the magnetic couple type rodless cylinder 502 and the three-axis guide-rail cylinder 504 are all commercially available standard components.

As shown in fig. 1 and fig. 17 to 19, the CCD module 600 is disposed on the laser module 200 and above the printed board carrier transport module 300 and the chip carrier transport module 400; the CCD horizontal moving assembly is arranged on the laser module 200 and located on one side of the laser 210, the CCD vertical moving assembly is arranged on the CCD horizontal moving assembly, and the camera assembly is arranged on the CCD vertical moving assembly.

Specifically, the CCD horizontal moving assembly includes a horizontal mounting plate 601 fixedly disposed on the laser module 200, an actuator 602 disposed on the upper surface of the horizontal mounting plate, a CCD horizontal screw 603 disposed in the actuator, a CCD horizontal slider 604 movably disposed on the CCD horizontal screw, a CCD horizontal coupling 605 disposed in an end portion of the actuator 602 and connected to one end of the CCD horizontal screw 603, and a CCD horizontal driving motor 606 disposed at one end of the actuator 602 and connected to the CCD horizontal coupling 605; a CCD sliding table base 607 arranged on the upper surface of the CCD horizontal sliding block 604, a sliding table base 608 arranged on the CCD sliding table base, and a flange mounting plate 609 arranged on the upper surface of the sliding table base 608; the horizontal mounting plate 601 is fixed to the upper surface of the mounting plate 201a of the laser module 200.

The CCD vertical moving assembly comprises a CCD vertical driving motor 610 fixedly arranged on the flange mounting plate 609, a vertical guide rail 611 and a vertical sliding block 612, wherein the vertical guide rail 611 is connected with an output shaft of the CCD vertical driving motor and is positioned outside the sliding table seat; the output shaft of the CCD vertical drive motor extends down into the slide block 608.

The camera component comprises a camera support 613 fixedly arranged on the outer surface of the vertical sliding block 612, a light source support 614 arranged on the camera support, a lens clamp 615 arranged on the camera support, a lens 616 fixedly connected with the lens clamp at the upper end, a camera 617 arranged at the upper end of the lens, a first light source 618 and a second light source 619 arranged on the light source support and positioned below the lens 616, and a wire arranging plate 620 arranged at the upper end of the camera support 613.

A reading head seat D621 is arranged on one side face of the CCD sliding table base 607, a reading head seat E622 fixedly connected with the reading head seat D is arranged on the reading head seat D, and an optical reading head D623 fixedly connected with the reading head seat E is arranged on the lower surface of the reading head seat E.

The CCD module adopts the above structure, when the CCD horizontal driving motor 606 is started, the CCD horizontal screw 603 is driven to rotate, thereby driving the CCD sliding table base 607, the sliding table base 608 arranged on the CCD sliding table base, the flange mounting plate 609 arranged on the upper surface of the sliding table base 608 moves in the horizontal direction, the CCD vertical driving motor 610, the vertical guide rail 611 and the vertical slider 612 move in the horizontal direction, and at the same time, the camera support 613 and the light source support 614 move in the horizontal direction, thereby the lens 616 and the camera 617 can move in the horizontal direction; meanwhile, the camera support 613 and the light source support 614 are fixedly connected with the vertical slider 612, and when the vertical slider 612 can move in the vertical direction along the vertical guide rail 611, the camera support 613 and the light source support 614 move in the vertical direction, so that the lens 616 and the camera 617 can move in the vertical direction; therefore, the lens 616 and the camera 617 can be adjusted in position in the horizontal direction and the vertical direction, so that the positions of the lenses can be adjusted appropriately according to the position of the workpiece.

It should be noted that although different names are used for the reading heads installed at different positions in this document, such as the optical reading head a, the optical reading head B, the optical reading head C, etc., for the purpose of easy differentiation, actually, the reading head, the optical ruler, and the grating ruler used in the present apparatus are all used for positioning the mover of the linear motor, wherein the positioning accuracy of the optical ruler and the grating ruler can reach 0.05 nm.

In summary, compared with the prior art of the same type, the chip carrier transport module 400 can rapidly transport a plurality of chips to the soldering station, and rapidly align and attach the chips to the printed board at the soldering station by means of the CCD module 600, and solder the chips on the printed board by the laser module 200, without using the suction nozzle of the prior art to place the chips one by one, and without using reflow soldering; therefore, the device can transfer chips in batches, and the transfer efficiency is high; the welding device is small in size and small in occupied space by adopting laser welding; the laser welding speed is fast, and is efficient, and the energy consumption is low moreover, and the yields is high.

In the above description, it should be noted that the terms "mounted," "connected," and the like are used broadly and can be, for example, fixedly connected, detachably connected, or integrally connected; the connection may be direct or indirect via an intermediate medium, and the connection may be internal to the two components.

It is to be understood that the above-described embodiments are merely illustrative of some, but not restrictive, of the broad invention, and that the appended drawings illustrate preferred embodiments of the utility model without limiting its scope. This invention may be embodied in many different forms and, on the contrary, these embodiments are provided so that this disclosure will be thorough and complete. All equivalent structures made by using the contents of the specification and the attached drawings of the utility model can be directly or indirectly applied to other related technical fields, and are also within the protection scope of the patent of the utility model.

Claims

1. A chip batch transferring and welding device is characterized by comprising a base;

the laser module is arranged on the base and comprises a laser;

2. The apparatus of claim 1, wherein the chip carrier transfer module is disposed on the laser module; a chip carrier for placing a chip is fixed on the laser module and is positioned below the laser; the printed board to be processed is positioned below the chip carrier.

3. The apparatus according to claim 2, wherein the laser module comprises a gantry frame fixed on the base and provided with a mounting plate, a power assembly arranged on the mounting plate, a transmission assembly arranged on the mounting plate and connected with the power assembly, a laser assembly arranged on the transmission assembly, and an adsorption assembly arranged on the lower surface of the mounting plate.

4. The apparatus of claim 3, wherein the power assembly comprises: the X-axis laser device comprises an X flange seat fixedly arranged on the upper surface of the mounting plate, a coupler arranged in the X flange seat, a motor and a bearing seat which are arranged on the X flange seat and are respectively connected with the coupler, a screw rod with one end penetrating through the bearing seat and connected with the coupler, and an X-axis laser seat connected with the screw rod.

5. The device for batch chip transfer and soldering as claimed in claim 4, wherein the driving assembly comprises two parallel guide rails disposed on the upper surface of the mounting plate, and a slider disposed on each guide rail and fixedly connected to the bottom surface of the X-axis laser holder.

6. The device for batch transferring and welding of chips as claimed in claim 5, wherein the laser module comprises a laser, a laser horizontal seat arranged on the X-axis laser seat for mounting the laser; and the mounting plate, the laser horizontal seat and the X-axis laser seat are internally provided with through holes for laser to pass through.

7. The device for batch transferring and welding of chips as claimed in claim 3, wherein the suction assembly comprises two press frames disposed on the bottom surface of the mounting plate, press frames having two ends fixedly connected to the two press frames, respectively, a plurality of suction nozzles disposed in the bottom surface of the press frames, and a glass plate connected to the bottom surface of the press frames; the glass plate is located below the laser.

8. The apparatus for chip batch transfer and bonding as claimed in claim 6, wherein a head base a is provided at one side of said X-axis laser base, and an optical head a is provided at a lower surface of the head base a; one side and the front end of the X-axis laser seat are respectively provided with an optical ruler.

9. The apparatus according to claim 2, wherein the module for transferring the carrier of the printed board comprises a Y-direction transfer mechanism disposed on the upper surface of the base, an X-direction transfer mechanism disposed on the Y-direction transfer mechanism, a Z-direction lifting mechanism disposed on the X-direction transfer mechanism, and an R-direction rotating mechanism disposed on the Z-direction lifting mechanism.

10. The apparatus for batch transferring and welding of chips as claimed in claim 9, wherein the Y-direction transferring mechanism comprises a Y-direction base plate fixed to an upper surface of the base, two Y-direction guide rails disposed on the Y-direction base plate in parallel with each other, a Y-direction slider disposed on each of the Y-direction guide rails, a Y-direction linear motor stator disposed between the two Y-direction guide rails and fixed to the Y-direction base plate, a Y-direction linear motor mover movably disposed on the Y-direction linear motor stator, a Y-direction mover fixing block disposed on the Y-direction linear motor mover, and a Y-direction supporting plate disposed above and fixedly connected to the Y-direction mover fixing block.

11. The apparatus for batch transferring and welding of chips as claimed in claim 10, wherein the X-direction transferring mechanism comprises two X-direction guide rails disposed on the Y-direction support plate in parallel with each other, an X-direction slider disposed on each of the X-direction guide rails, an X-direction linear motor stator disposed between the two X-direction guide rails and fixed on the Y-direction support plate, an X-direction linear motor mover movably disposed on the X-direction linear motor stator, an X-direction mover fixing block disposed on the X-direction linear motor mover, and an X-direction support housing disposed above and fixedly connected to the X-direction mover fixing block, the X-direction support housing being connected to the X-direction slider.

12. The device for batch transferring and welding of chips as claimed in claim 11, wherein the Z-direction elevating mechanism comprises a Z-direction base fixedly arranged in the X-direction support housing, two sets of horizontal cross roller slide rails arranged on the upper surface of the Z-direction base in the horizontal direction, horizontal slide tables arranged on the two sets of horizontal cross roller slide rails and provided with support slopes, and a Z-direction slide table movably arranged on the horizontal slide tables and provided with Z-direction slopes attached to the support slopes; the horizontal power assembly is arranged on the Z-direction base and connected with the horizontal sliding table and used for driving the horizontal sliding table to do reciprocating linear motion on the Z-direction base; the Z-direction auxiliary sliding table is arranged on the upper surface of one end part of the Z-direction base; one end of the Z-direction sliding table is movably connected with a Z-direction guide rail in one side surface of the Z-direction auxiliary sliding table through two groups of Z-direction crossed roller slide rails; when the horizontal sliding table does reciprocating linear motion on the Z-direction base, the Z-direction sliding table is lifted relative to the Z-direction auxiliary sliding table.

13. The apparatus according to claim 12, wherein the horizontal power assembly comprises a horizontal motor mounted on an outer side surface of the Z-direction sub-slide, a horizontal coupling disposed in the Z-direction sub-slide and connected to an output shaft of the horizontal motor, a horizontal bearing seat mounted on the Z-direction sub-slide, and a horizontal screw rod having one end passing through the horizontal bearing seat and connected to the horizontal coupling; the other end of the horizontal screw rod is movably connected with the horizontal sliding table.

14. The apparatus of claim 12, wherein a set of diagonal roller tracks is disposed on each side of the support ramp, and the Z-ramp is connected to the diagonal roller tracks.

15. The device for batch transferring and welding of chips as claimed in claim 12, wherein said R-direction rotating mechanism comprises, from bottom to top, an R-direction bottom plate, an R-direction base, a DD motor, an R-direction rotating base and an adsorption plate, which are sequentially arranged on a Z-direction sliding table; the DD motor is arranged on the R direction base, the R direction rotating base is connected with an output shaft of the DD motor, and the adsorption plate is arranged on the upper surface of the R direction rotating base.

16. The apparatus for batch transferring and soldering of chips as claimed in claim 12, wherein a head base B is provided at one side of the X-direction support case, and an optical head B is provided at a lower surface of the head base B; one side surface of the Y-direction supporting plate is provided with a reading head seat C, the lower surface of the reading head seat C is provided with an optical reading head C, and the inner side of the optical reading head C is provided with a grating ruler connected with the optical reading head C.

17. The apparatus according to claim 2, wherein the chip carrier transfer module comprises a linear module, a driving motor disposed at one end of the linear module, a slide cylinder disposed on the linear module and linearly movable thereon, a Z-direction sub-slider disposed on the slide cylinder and movable up and down relative thereto, a chip carrier pick-up plate disposed on a bottom surface of the Z-direction sub-slider, and a connecting plate disposed on a rear surface of the linear module and fixedly connected to the laser module.

18. The apparatus for batch transferring and welding of chips as claimed in claim 2, wherein the printed board feeding module comprises a square supporting tube fixed on the base, a magnetic couple type rodless cylinder fixed on the upper surface of the square supporting tube, a cylinder connecting plate fixed on the upper surface of one end of the magnetic couple type rodless cylinder, a three-axis cylinder with a guide rail fixed on the outer surface of the cylinder connecting plate, and a printed board transfer plate arranged at one end of the three-axis cylinder with a guide rail and used for placing the printed board.

19. The device for batch transferring and welding of chips as claimed in claim 2, wherein the CCD module is disposed on the laser module and above the printed board carrier transfer module and the chip carrier transfer module; the CCD horizontal moving assembly is arranged on the laser module and located on one side of the laser, the CCD vertical moving assembly is arranged on the CCD horizontal moving assembly, and the camera assembly is arranged on the CCD vertical moving assembly.

20. The device for batch transferring and welding of chips as claimed in claim 19, wherein the CCD horizontal moving assembly comprises a horizontal mounting plate fixedly mounted on the laser module, an actuator disposed on the upper surface of the horizontal mounting plate, a CCD horizontal screw rod disposed in the actuator, a CCD horizontal slider movably disposed on the CCD horizontal screw rod, a CCD horizontal coupling disposed in an end portion of the actuator and connected to one end of the CCD horizontal screw rod, and a CCD horizontal driving motor disposed at one end of the actuator and connected to the CCD horizontal coupling; the CCD sliding table base is arranged on the upper surface of the CCD horizontal sliding block, the sliding table base is arranged on the CCD sliding table base, and the flange mounting plate is arranged on the upper surface of the sliding table base.

21. The device for batch transferring and welding of chips as claimed in claim 20, wherein said CCD vertical moving assembly comprises a CCD vertical driving motor fixedly mounted on the flange mounting plate, a vertical guide rail and a vertical slider connected to an output shaft of the CCD vertical driving motor and located outside the slide table base; the output shaft of the CCD vertical driving motor extends downwards into the sliding table seat.

22. The apparatus according to claim 21, wherein the camera module comprises a camera holder fixed to an outer surface of the vertical slider, a light source holder disposed on the camera holder, a lens having an upper end fixedly connected to the lens holder, a camera disposed at an upper end of the lens, a first light source and a second light source disposed on the light source holder and below the lens, and a wire management plate disposed at an upper end of the camera holder.

23. The apparatus for batch transferring and bonding chips as claimed in claim 22, wherein a read head base D is provided at one side of said CCD slide base, a read head base E fixedly connected to said read head base D is provided at said read head base D, and an optical read head D fixedly connected to said read head base E is provided at a lower surface of said read head base E.