CN216680141U

CN216680141U - Die casting die is used in processing of semiconductor heating plate with rapid cooling structure

Info

Publication number: CN216680141U
Application number: CN202123091498.1U
Authority: CN
Inventors: 肖学才
Original assignee: Zhejiang Longjilier Semiconductor Technology Co ltd
Current assignee: Zhejiang Longjilier Semiconductor Technology Co ltd
Priority date: 2021-12-10
Filing date: 2021-12-10
Publication date: 2022-06-07
Anticipated expiration: 2031-12-10

Abstract

The utility model discloses a die-casting die with a rapid cooling structure for processing a semiconductor heating plate. According to the die-casting device, the insert block is pulled out of the placing groove, the heat dissipation box is placed in the placing groove after the insert block is pulled out, the heat dissipation box slides on the surface of the sliding rail, the heat dissipation box is pushed inwards, the stop block is pushed to move downwards through the chamfer, the push plate and the stop block are driven to move upwards through the elastic force of the spring after the heat dissipation box moves to the end, the stop block limits the heat dissipation box, the insert block is plugged into the placing groove, and the heat dissipation fan is started to cool the die, so that the rapid cooling advantage is achieved, the problem that a user needs to take out the part after the part is cooled is solved, the processing time of the part is greatly prolonged, and the usability of the die-casting die is reduced.

Description

Die casting die is used in processing of semiconductor heating plate with rapid cooling structure

Technical Field

The utility model relates to the technical field of part die casting, in particular to a die casting die with a rapid cooling structure for processing a semiconductor heating plate.

Background

Need use die casting die when producing the heating plate, but current part often still can have the waste heat after the die-casting finishes, this just leads to the user to wait to take out the part after the part cooling finishes, very big increase the process time of part, reduced die casting die's performance.

SUMMERY OF THE UTILITY MODEL

In order to solve the problems in the background art, the utility model aims to provide a die-casting die with a rapid cooling structure for processing a semiconductor heating plate, which has the advantage of rapid cooling and solves the problems that a user needs to take out a part after the part is cooled down because the existing part often has waste heat after die-casting is finished, the processing time of the part is greatly increased, and the use performance of the die-casting die is reduced.

In order to achieve the purpose, the utility model provides the following technical scheme: the utility model provides a die casting die is used in processing of semiconductor heating plate with rapid cooling structure, includes the mould, the standing groove has been seted up to the inside of mould, the equal fixedly connected with slide rail in both sides of standing groove inner wall bottom, the sliding surface of slide rail is connected with the heat dissipation box, the heat dissipation fan is passed through gag lever post fixedly connected with in the inside of heat dissipation box, the driving groove has been seted up to the inside of slide rail, the inside sliding connection of driving groove has the push pedal, the outside of push pedal extends to the outside of slide rail, the top fixedly connected with dog of push pedal, the inboard of dog contacts with the outside of heat dissipation box, the both sides of mould all are provided with the inserted block, the inboard of inserted block extend to the inside of standing groove and contact with the inner wall of standing groove.

Preferably, two guide rods are transversely and fixedly connected inside the transmission groove, and the guide rods penetrate through the push plate and are in sliding connection with the push plate.

Preferably, the surface of the guide rod is sleeved with a spring, the top of the spring is fixedly connected to the bottom of the push plate, and the bottom of the spring is fixedly connected to the bottom of the inner wall of the transmission groove.

Preferably, the front surface of the mold is provided with an air outlet, and the air outlet is communicated with the placing groove.

Preferably, the outer side of the stop block is provided with a chamfer, and the chamfer is matched with the heat dissipation box for use.

Preferably, the outer side of the sliding rail is provided with an opening, the width of the opening is larger than that of the push plate, and the opening is matched with the push plate for use.

Compared with the prior art, the utility model has the following beneficial effects:

1. according to the die-casting device, the insert block is pulled out of the placing groove, the heat dissipation box is placed in the placing groove after the insert block is pulled out, the heat dissipation box slides on the surface of the sliding rail, the heat dissipation box is pushed inwards, the stop block is pushed to move downwards through the chamfer, the push plate and the stop block are driven to move upwards through the elastic force of the spring after the heat dissipation box moves to the end, the stop block limits the heat dissipation box, the insert block is plugged into the placing groove, and the heat dissipation fan is started to cool the die, so that the rapid cooling advantage is achieved, the problem that a user needs to take out the part after the part is cooled is solved, the processing time of the part is greatly prolonged, and the usability of the die-casting die is reduced.

2. The guide rod is arranged, so that the push plate can be guided, and the phenomenon that the push plate is inclined is prevented.

3. The spring is arranged, so that the push plate can automatically move upwards, and the service performance of the push plate is improved.

4. According to the utility model, the air outlet is arranged, so that the air generated by the heat dissipation fan can be discharged, and the stability of the heat dissipation fan is improved.

5. According to the utility model, the chamfer is arranged, so that the stop block can automatically descend when the heat dissipation box is pushed, and the service performance of the stop block is improved.

6. The push plate can completely penetrate through the sliding rail to guide by arranging the opening, so that the phenomenon that the push plate is blocked due to the fact that the opening is too small is prevented.

Drawings

FIG. 1 is a schematic structural view of the present invention;

FIG. 2 is a cross-sectional view of the structure of the present invention;

FIG. 3 is an enlarged view taken at A of FIG. 2 according to the present invention;

fig. 4 is a perspective view of a portion of the present invention.

In the figure: 1. a mold; 2. a placement groove; 3. a slide rail; 4. a heat dissipation box; 5. a heat dissipation fan; 6. a transmission groove; 7. pushing the plate; 8. a stopper; 9. inserting a block; 10. a guide bar; 11. a spring; 12. a tuyere; 13. chamfering; 14. and (4) opening.

Detailed Description

The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.

As shown in fig. 1 to 4, the die casting mold for processing a semiconductor heating plate with a rapid cooling structure provided by the utility model comprises a mold 1, a placing groove 2 is formed inside the mold 1, slide rails 3 are fixedly connected to both sides of the bottom of the inner wall of the placing groove 2, a heat dissipation box 4 is slidably connected to the surface of each slide rail 3, a heat dissipation fan 5 is fixedly connected to the inside of each heat dissipation box 4 through a limiting rod, a transmission groove 6 is formed inside each slide rail 3, a push plate 7 is slidably connected to the inside of each transmission groove 6, the outer side of each push plate 7 extends to the outside of each slide rail 3, a stop block 8 is fixedly connected to the top of each push plate 7, the inner side of each stop block 8 is in contact with the outer side of each heat dissipation box 4, insertion blocks 9 are arranged on both sides of the mold 1, and the inner sides of the insertion blocks 9 extend to the inside of the placing groove 2 and are in contact with the inner wall of the placing groove 2.

Referring to fig. 3, two guide rods 10 are fixedly connected to the inside of the transmission groove 6 in the transverse direction, and the guide rods 10 penetrate through the push plate 7 and are slidably connected with the push plate 7.

As a technical optimization scheme of the utility model, the guide rod 10 is arranged, so that the push plate 7 can be guided, and the phenomenon that the push plate 7 is inclined is prevented.

Referring to fig. 3, the surface of the guide rod 10 is sleeved with a spring 11, the top of the spring 11 is fixedly connected to the bottom of the push plate 7, and the bottom of the spring 11 is fixedly connected to the bottom of the inner wall of the transmission groove 6.

As a technical optimization scheme of the utility model, the spring 11 is arranged, so that the push plate 7 can automatically move upwards, and the service performance of the push plate 7 is improved.

Referring to fig. 1, the front surface of the mold 1 is provided with an air outlet 12, and the air outlet 12 is communicated with the placing groove 2.

As a technical optimization scheme of the present invention, the air outlet 12 is provided to discharge the air generated by the heat dissipation fan 5, thereby improving the stability of the heat dissipation fan 5.

Referring to fig. 3, a chamfer 13 is formed on the outer side of the stopper 8, and the chamfer 13 is used in cooperation with the heat dissipation box 4.

As a technical optimization scheme of the utility model, the stop block 8 can automatically descend when the heat dissipation box 4 is pushed by arranging the chamfer 13, so that the service performance of the stop block 8 is improved.

Referring to fig. 3, an opening 14 is formed on the outer side of the slide rail 3, the width of the opening 14 is greater than that of the push plate 7, and the opening 14 is matched with the push plate 7 for use.

As a technical optimization scheme of the utility model, the opening 14 is arranged, so that the push plate 7 can completely penetrate through the slide rail 3 for guiding, and the phenomenon that the push plate 7 is blocked due to the excessively small opening 14 is prevented.

The working principle and the using process of the utility model are as follows: during the use, at first extract inserted block 9 from the inside of standing groove 2, extract the inside of putting into standing groove 2 with heat dissipation box 4 after finishing and make heat dissipation box 4 slide on the surface of slide rail 3, then inwards promote heat dissipation box 4, make heat dissipation box 4 promote dog 8 downstream through chamfer 13, elasticity through spring 11 after heat dissipation box 4 removes the end drives push pedal 7 and dog 8 rebound, make dog 8 carry on spacingly to heat dissipation box 4, at last insert block 9 is plugged in standing groove 2 and start heat dissipation fan 5 and cool down mould 1, thereby the advantage of rapid cooling has been possessed.

In summary, the following steps: the die-casting die with the rapid cooling structure for processing the semiconductor heating disc is characterized in that the insert block 9 is pulled out from the inside of the placing groove 2, the heat dissipation box 4 is placed in the placing groove 2 after the insert block is pulled out, the heat dissipation box 4 slides on the surface of the slide rail 3, then the heat dissipation box 4 is pushed inwards, the heat dissipation box 4 pushes the stop block 8 to move downwards through the chamfer 13, the push plate 7 and the stop block 8 are driven to move upwards through the elasticity of the spring 11 after the heat dissipation box 4 moves to the end, the stop block 8 limits the heat dissipation box 4, finally the insert block 9 is plugged into the placing groove 2 and the heat dissipation fan 5 is started to cool the die 1, so that the die-casting die has the advantage of rapid cooling, the problem that the existing parts always have waste heat after die-casting is finished is solved, a user can take out the parts after the parts are cooled, and the processing time of the parts is greatly increased, the problem of die casting die service performance has been reduced.

It is noted that, herein, relational terms such as first and second, and the like may be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus.

Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the utility model, the scope of which is defined in the appended claims and their equivalents.

Claims

1. The utility model provides a die casting die is used in processing of semiconductor heating plate with rapid cooling structure, includes mould (1), its characterized in that: a placing groove (2) is arranged in the die (1), two sides of the bottom of the inner wall of the placing groove (2) are fixedly connected with sliding rails (3), the surface of the slide rail (3) is connected with a heat radiation box (4) in a sliding way, the interior of the heat radiation box (4) is fixedly connected with a heat radiation fan (5) through a limiting rod, a transmission groove (6) is arranged inside the sliding rail (3), a push plate (7) is connected inside the transmission groove (6) in a sliding manner, the outer side of the push plate (7) extends to the outer part of the slide rail (3), the top of the push plate (7) is fixedly connected with a stop block (8), the inner side of the stop block (8) is contacted with the outer side of the heat dissipation box (4), the two sides of the die (1) are both provided with an insertion block (9), the inner side of the insertion block (9) extends to the inner part of the placing groove (2) and is contacted with the inner wall of the placing groove (2).

2. The die-casting die with the rapid cooling structure for processing the semiconductor heating plate, as claimed in claim 1, is characterized in that: two guide rods (10) are transversely and fixedly connected inside the transmission groove (6), and the guide rods (10) penetrate through the push plate (7) and are in sliding connection with the push plate (7).

3. The die-casting die with the rapid cooling structure for processing the semiconductor heating plate as claimed in claim 2, wherein: the surface of the guide rod (10) is sleeved with a spring (11), the top of the spring (11) is fixedly connected to the bottom of the push plate (7), and the bottom of the spring (11) is fixedly connected to the bottom of the inner wall of the transmission groove (6).

4. The die-casting die with the rapid cooling structure for processing the semiconductor heating plate, as claimed in claim 1, is characterized in that: an air outlet (12) is formed in the front face of the die (1), and the air outlet (12) is communicated with the placing groove (2).

5. The die-casting die with the rapid cooling structure for processing the semiconductor heating plate, as claimed in claim 1, is characterized in that: a chamfer (13) is formed in the outer side of the stop block (8), and the chamfer (13) is matched with the heat dissipation box (4) for use.

6. The die-casting die with the rapid cooling structure for processing the semiconductor heating plate, as claimed in claim 1, is characterized in that: an opening (14) is formed in the outer side of the sliding rail (3), the width of the opening (14) is larger than that of the push plate (7), and the opening (14) is matched with the push plate (7) for use.