CN216671053U - Display module assembly and display device - Google Patents
Display module assembly and display device Download PDFInfo
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- CN216671053U CN216671053U CN202123258259.0U CN202123258259U CN216671053U CN 216671053 U CN216671053 U CN 216671053U CN 202123258259 U CN202123258259 U CN 202123258259U CN 216671053 U CN216671053 U CN 216671053U
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Abstract
The utility model provides a display module and a display device. The display module assembly includes: the packaging substrate is provided with a display area and a non-display area surrounding the display area; a driving chip is arranged on the non-display area; the first packaging layer is positioned on the non-display area and at least wraps the driving chip; the second packaging layer is positioned on the non-display area and covers the first packaging layer; wherein the first encapsulation layer has a hardness less than the hardness of the second encapsulation layer. The display module can effectively solve the problem that the display of the display module is lack of rows and columns.
Description
Technical Field
The utility model relates to the technical field of display module packaging, in particular to a display module and a display device.
Background
In the prior art, for the purpose of performing anti-corrosion protection on a circuit part of a non-display area, glue pouring, packaging and protection need to be performed on the non-display area of a display module. Meanwhile, for the purpose of hiding the circuit layout, it is required to cure with a colored epoxy resin encapsulant, such as a black epoxy resin. On one hand, compared with the display module which uses the transparent packaging layer and is cured by using the colored epoxy resin sealing adhesive, the circuit layout can not be directly seen from the outside of the display module; on the other hand, if an attempt is made to forcibly remove the encapsulation layer to directly observe the circuit layout, the device or circuit in the circuit layout is damaged along with the removed encapsulation layer when the encapsulation layer is removed, and the original circuit layout cannot be observed, so that the purpose of hiding the circuit layout is achieved. However, such a packaging method affects the display effect, and a display is lack of rows and columns.
SUMMERY OF THE UTILITY MODEL
Therefore, the utility model provides a display module and a display device, which are used for solving the problem that the display of the display module is lack of rows and columns.
The utility model provides a display module, comprising: the packaging substrate is provided with a display area and a non-display area surrounding the display area; a driving chip is arranged on the non-display area; the first packaging layer is positioned on the non-display area and at least wraps the driving chip; the second packaging layer is positioned on the non-display area and covers the first packaging layer; wherein the first encapsulation layer has a hardness less than the hardness of the second encapsulation layer.
Optionally, the first encapsulation layer is in direct contact with the second encapsulation layer.
Optionally, the non-display area includes a bonding area and a non-bonding area, the bonding area is provided with a driver chip, and the second package layer is disposed on the bonding area and the non-bonding area.
Optionally, a plurality of display pixels are arranged on the display area; the driving chip is electrically connected with the display pixels through the connecting wires.
Optionally, the first encapsulation layer completely covers the bonding region and exposes the non-bonding region.
Optionally, the second encapsulation layer encapsulates all the connection lines on the non-display area.
Optionally, the first encapsulation layer comprises a silicone rubber layer.
Optionally, the second encapsulation layer includes an epoxy layer.
Optionally, the epoxy layer comprises a colored epoxy layer.
The utility model also provides a display device which comprises the display module provided by the utility model.
The technical scheme of the utility model has the following advantages:
according to the display module provided by the utility model, the first packaging layer is positioned on the non-display area and at least covers the driving chip, the second packaging layer is positioned on the non-display area and covers the first packaging layer, and the hardness of the second packaging layer is smaller than that of the first packaging layer. The protection to the circuit on the non-display area can be realized by the second packaging layer, and the drive chip is wrapped by the first packaging layer, so that the protection effects such as water and oxygen isolation are realized on the drive chip. Meanwhile, the hardness of the first packaging layer is relatively low, so that the deformation of the pins or the connecting lines caused by extruding the pins and the connecting lines of the driving chip in the forming process can be avoided, and the phenomenon of missing rows and columns of the display effect of the display module is avoided.
Furthermore, the display module provided by the utility model can realize the protection of the circuit on the non-display area by the second packaging layer by setting the second packaging layer to be in a colored setting, and realize the visual shielding of the circuit layout of the non-display area by setting the second packaging layer to be in a colored layer.
The display device provided by the utility model comprises the display module provided by the utility model, wherein a first packaging layer is positioned on the non-display area and at least covers the driving chip, a second packaging layer is positioned on the non-display area and covers the first packaging layer, and the hardness of the second packaging layer is smaller than that of the first packaging layer. Can be by first packaging layer cladding driver chip, realize keeping apart protection effect such as oxygen of waterlogging caused by water to driver chip, simultaneously because first packaging layer hardness is lower relatively, therefore can avoid causing pin or connecting wire to warp because of extrusion driver chip's pin and connecting wire in the forming process, and then avoid display module's display effect to appear lacking the row phenomenon of lacking.
Furthermore, the display device provided by the utility model can realize the protection of the circuit in the non-display area by the second packaging layer through the arrangement that the second packaging layer in the display module is set to be the colored layer, and realize the circuit layout shielding of the non-display area by setting the second packaging layer to be the colored layer;
drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, and it is obvious that the drawings in the following description are some embodiments of the present invention, and other drawings can be obtained by those skilled in the art without creative efforts.
FIG. 1 is a top view of a display module;
FIG. 2 is a top view of the display module of FIG. 1 with the encapsulation layer removed;
FIG. 3 is a schematic structural view of the display module of FIGS. 1 and 2 at the C-C section line;
FIG. 4 is a top view of a display module according to an embodiment of the utility model;
FIG. 5 is a top view of the display module of FIG. 4 with the first and second encapsulating layers removed;
fig. 6 is a schematic structural view of the display module of fig. 4 and 5 at the C-C section line.
Detailed Description
Referring to fig. 1 to 3, a display module 100 includes: the package substrate 110 has a display area a (the display area a has a structure that is not related to the present embodiment and therefore display is omitted) and a non-display area B surrounding the display area a. The non-display area is provided with a driving chip 120. The display module 100 further includes a package layer 130, wherein the package layer 130 is disposed on the non-display region of the package substrate 110 and covers the driving chip 120. Besides providing water and oxygen insulation and physical buffering for the driver chip 120 and other electronic components and circuits (other electronic components and circuits are omitted from the display) on the package substrate 110, the package layer 130 is usually configured as a colored epoxy layer, such as a black epoxy layer, in order to protect the circuit design on the package substrate 110, i.e., the arrangement position and routing manner of each electronic component. On one hand, the color can shield the circuit layout on the package substrate 110 in visual appearance, and on the other hand, if an attempt is made to forcibly remove the package layer 130 to directly observe the circuit layout, the package layer 130 will damage the electronic elements and the wires due to the adhesive strength of the package layer 130 to the electronic elements and the wires, and the original circuit layout cannot be observed, so that the hiding effect of the circuit layout is realized. However, such packaging means can cause the product to show the problem of missing rows and columns. The inventor researches and discovers that the phenomenon that the display effect of the display module is lack of rows and columns is caused by the fact that the epoxy resin is high in hardness and easily extrudes the pins and the connecting lines of the driving chip in the curing process, and therefore part of the pins of the chip are broken or unsoldered or part of the connecting lines are deviated or broken after the curing is finished.
Therefore, the utility model provides a display module and a display device, which are used for solving the problem of row and column missing caused by the package of the circuit layout for hiding a non-display area.
The technical solutions of the present invention will be described clearly and completely with reference to the accompanying drawings, and it should be understood that the described embodiments are some, but not all embodiments of the present invention. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
In the description of the present invention, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc., indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and simplicity of description, but do not indicate or imply that the device or element being referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus, should not be construed as limiting the present invention. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.
In the description of the present invention, it should be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, e.g., as meaning either a fixed connection, a removable connection, or an integral connection; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meanings of the above terms in the present invention can be understood in specific cases to those skilled in the art.
In addition, the technical features involved in the different embodiments of the present invention described below may be combined with each other as long as they do not conflict with each other.
Example 1
Referring to fig. 4-6, the present embodiment provides a display module 200, including:
a package substrate 210; the package substrate 210 has a display area a and a non-display area B surrounding the display area a; the non-display area B is provided with a driving chip 220;
a first encapsulation layer 240; the first packaging layer 240 is located on the non-display region B and at least covers the driving chip;
and a second encapsulation layer 230, wherein the second encapsulation layer 230 is located on the non-display region B and covers the second encapsulation layer 230.
Wherein the first encapsulation layer 240 has a hardness less than the hardness of the second encapsulation layer 230.
The display module that this embodiment provided, can realize the protection to the circuit on the non-display area B by second packaging layer 230, by first packaging layer 240 cladding driver chip 220, realize the protection effect such as isolated water oxygen to driver chip 220, simultaneously because first packaging layer 240 hardness is relatively lower, can regard as the buffering packaging layer by first packaging layer 240, therefore can avoid causing pin or connecting wire to warp because of the pin and the connecting wire of extrusion driver chip 220 in forming process, and then avoid display module's display effect to appear lacking the row and lack the phenomenon.
Further, the hardness of the first encapsulation layer 240 is within a range from 20 degrees shore hardness to 60 degrees shore hardness. If the hardness of the first encapsulation layer 240 is less than 20 degrees, the first encapsulation layer 240 is difficult to mold or has high flowability, and the first encapsulation layer 240 is unstable, so that the protection effect on the driving chip 220 is poor; if the hardness of the first package layer 240 is greater than 60 degrees, the pins or the connection lines of the driving chip 220 are easily extruded to deform during the molding process. The hardness of the first encapsulation layer 240 is within a range of 20 to 60 shore, which can effectively avoid the display of missing rows and columns and achieve a better protection effect on the driving chip 220.
Further, the hardness of the second encapsulation layer 230 is greater than 80 degrees shore. If the hardness of the second packaging layer 230 is less than 80 degrees, it is difficult to deform or peel the electronic components and circuits in the circuit layout in the non-binding region B2 sufficiently with the removal of the second packaging layer 230 when the second packaging layer 230 is removed, the degree of deformation of the original circuit layout is insufficient, and it is difficult to meet the requirement of hiding the circuit layout when the second packaging layer 230 is removed. Therefore, the hardness of the second packaging layer 230 is greater than 80 degrees, which can well satisfy the requirement of hiding the circuit layout when the second packaging layer 230 is removed.
Further, in the present embodiment, the second encapsulation layer 230 includes an epoxy resin layer, such as a colored epoxy resin layer, which is, for example, a black epoxy resin layer. The first encapsulation layer 240 includes a silicone rubber layer.
The display module 200 provided in this embodiment can realize the protection of the circuit on the non-display area B by the second encapsulation layer 230, and at the same time, the second encapsulation layer 230 is set as a colored epoxy layer, and the second encapsulation layer 230 is used as a shielding encapsulation layer, so as to realize the shielding of the circuit layout on the non-display area B.
Further, in the present embodiment, the second encapsulation layer 230 may be in direct contact with the first encapsulation layer 240. In other embodiments, additional layers may be added between the second encapsulation layer 230 and the first encapsulation layer 240 to perform additional functions.
Further, in the present embodiment, the display area a has a plurality of display pixels; the driving chip 220 is electrically connected to each display pixel through a plurality of connecting wires.
Further, the non-display area B includes a binding area B1 and a non-binding area B2, and the driver chip 220 is disposed on the binding area B1. The second encapsulation layer 230 is disposed on the binding region B1 and the non-binding region B2.
Further, the first encapsulation layer 240 completely covers the bonding region B1 and exposes the non-bonding region B2. The first encapsulation layer 240 may be as small as possible so that the projection area of the first encapsulation layer 240 on the encapsulation substrate is as small as possible, so that the first encapsulation layer 240 may cover as few circuits as possible in the unbonded area B2.
In other embodiments, the first encapsulation layer 240 further encapsulates all the connection lines on the non-display region B. Therefore, the risk of displaying missing rows and missing columns due to deformation caused by extrusion of the connecting wires during molding of the second package layer 230 can be further reduced.
Example 2
The present embodiment provides a display device, including the display module provided in embodiment 1.
The display device provided by the embodiment of the utility model comprises the display module provided by the utility model, wherein the first packaging layer is positioned on the non-display area and at least covers the driving chip, the second packaging layer is positioned on the non-display area and covers the first packaging layer, and the hardness of the second packaging layer is smaller than that of the first packaging layer. Can be by first packaging layer cladding driver chip, realize keeping apart protection effect such as oxygen of waterlogging caused by water to driver chip, simultaneously because first packaging layer hardness is lower relatively, therefore can avoid causing pin or connecting wire to warp because of extrusion driver chip's pin and connecting wire in the forming process, and then avoid display module's display effect to appear lacking the row phenomenon of lacking.
Further, the display device provided by the embodiment can realize the protection of the circuit in the non-display area by the second packaging layer, and simultaneously realize the visual shielding of the circuit layout in the non-display area by setting the second packaging layer as a colored layer.
The present invention has been described above by way of examples, and it is believed that one skilled in the art can appreciate the present invention by way of the above examples. It should be understood that the above examples are only for clarity of illustration and are not intended to limit the embodiments. Other variations and modifications will be apparent to persons skilled in the art in light of the above description. And are neither required nor exhaustive of all embodiments. And obvious variations or modifications therefrom are within the scope of the utility model.
Claims (10)
1. A display module, comprising:
the display device comprises a packaging substrate, a display unit and a display unit, wherein the packaging substrate is provided with a display area and a non-display area surrounding the display area; a driving chip is arranged on the non-display area;
the first packaging layer is positioned on the non-display area and at least wraps the driving chip;
a second encapsulation layer on the non-display area and covering the first encapsulation layer;
the hardness of the first encapsulation layer is less than the hardness of the second encapsulation layer.
2. The display module of claim 1,
the first encapsulation layer is in direct contact with the second encapsulation layer.
3. The display module of claim 1, wherein the non-display area comprises a bonding area and a non-bonding area, the driver chip is disposed on the bonding area, and the second package layer is disposed on the bonding area and the non-bonding area.
4. The display module of claim 3, wherein the display area has a plurality of display pixels disposed thereon; the driving chip is electrically connected with the display pixels through a connecting wire.
5. The display module of claim 3, wherein the first encapsulation layer completely covers the bonding region and exposes the non-bonding region.
6. The display module of claim 4,
the second packaging layer covers the part of all the connecting lines on the non-display area.
7. The display module of claim 1,
the first encapsulation layer includes a silicone rubber layer.
8. The display module of claim 1,
the second encapsulation layer includes an epoxy layer.
9. The display module of claim 8, wherein the epoxy layer comprises a colored epoxy layer.
10. A display device, comprising:
a display module according to any one of claims 1-9.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202123258259.0U CN216671053U (en) | 2021-12-22 | 2021-12-22 | Display module assembly and display device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202123258259.0U CN216671053U (en) | 2021-12-22 | 2021-12-22 | Display module assembly and display device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN216671053U true CN216671053U (en) | 2022-06-03 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202123258259.0U Active CN216671053U (en) | 2021-12-22 | 2021-12-22 | Display module assembly and display device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN216671053U (en) |
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2021
- 2021-12-22 CN CN202123258259.0U patent/CN216671053U/en active Active
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