CN216669928U - Constant temperature air chamber and gas monitor - Google Patents

Abstract

The utility model provides a constant-temperature gas chamber and a gas monitor. The constant temperature air chamber includes: the gas chamber body, and the detection module and the temperature regulation module which are arranged on two opposite sides of the gas chamber body; the air chamber body is provided with an air flow channel and a plurality of first detection grooves communicated with the air flow channel, the bottom of each first detection groove is provided with a detection hole communicated with the air flow channel and a first sealing groove wound on the detection hole, and a first sealing element is arranged in each first sealing groove; the detection module comprises a circuit board and a plurality of first gas sensors arranged on the circuit board, the first gas sensors are contained in corresponding first detection grooves, the end faces of the first gas sensors abut against the first sealing elements, and the end face detection mode is formed by the detection holes and the end faces of the first gas sensors. Can seal airflow channel after detecting the module installation, can guarantee that gas sensor's sense terminal can contact and wait to detect gaseous, can prevent again that gaseous from revealing.

Description

Constant temperature air chamber and gas monitor

Technical Field

The utility model belongs to the technical field of gas detection, and particularly relates to a constant-temperature gas chamber and a gas monitor.

Background

When the gas monitor detects the components of environment or sample gas, the gas to be detected needs to be guided into the gas chamber, the gas chamber is provided with a plurality of detection chambers, different gas sensors are arranged in the detection chambers, the gas sensors are respectively used for detecting the gas components possibly contained, and the detection result is transmitted to the control circuit of the gas monitor. During the process of installing the gas sensor into the detection chamber for detection, the inventor finds that there is a possibility that the gas to be detected escapes from the detection chamber, and at the same time, the outside air may intrude into the detection chamber to interfere with the detection result.

SUMMERY OF THE UTILITY MODEL

The utility model provides a constant-temperature gas chamber and a gas monitor, and aims to solve the problem that in the prior art, when the gas monitor directly collects and detects gas in an outdoor environment, a gas sensor can be influenced by the ambient temperature and cannot work normally, so that the detection result is influenced.

In order to realize the purpose, the utility model adopts the technical scheme that:

in a first aspect, the present invention provides a thermostatic gas cell comprising: the device comprises a gas chamber body, a detection module and a temperature adjusting module, wherein the detection module and the temperature adjusting module are arranged on two opposite sides of the gas chamber body; the gas chamber body is provided with an airflow channel and a plurality of first detection grooves communicated with the airflow channel, the bottom of each first detection groove is provided with a detection hole communicated with the airflow channel and a first sealing groove wound on the detection hole, and a first sealing element is arranged in each first sealing groove; the detection module comprises a circuit board and a plurality of first gas sensors arranged on the circuit board, the first gas sensors are contained in the corresponding first detection grooves, the end faces of the first gas sensors abut against the first sealing elements, and the detection holes and the end faces of the first gas sensors form an end face detection mode; and/or the air chamber body is provided with an air flow channel and a plurality of second detection grooves communicated with the air flow channel, the end surface of each second detection groove is provided with a second sealing groove wound on the second detection groove, and a second sealing element is arranged in each second sealing groove; the detection module comprises a circuit board and a plurality of second gas sensors arranged on the circuit board, the second gas sensors are contained in the corresponding second detection grooves, the circuit board abuts against the second sealing element, and the peripheral surfaces of the second detection grooves and the second gas sensors form a peripheral surface detection mode.

In a possible implementation manner, the plurality of first detection slots and/or the plurality of second detection slots are arranged in two rows, which are respectively defined as a first row of slots and a second row of slots, and the airflow channel includes: the first air channel is communicated with the first exhaust groove and forms an air inlet of the air chamber body; the second air passage is communicated with the second row of grooves and forms an air outlet of the air chamber body; the serial air passage is communicated between the first air passage and the second air passage; the process pore canal is communicated with the serial connection air passage and is positioned on the same straight line; and the third sealing element is arranged on the process pore passage in a sealing manner.

In a possible implementation manner, the gas chamber body is provided with a temperature measuring hole, and the constant temperature gas chamber further comprises a temperature sensor arranged in the temperature measuring hole.

In one possible implementation, the temperature adjustment module includes: the semiconductor refrigeration pieces are provided with two working surfaces, and one working surface is attached to the surface of one side, away from the detection module, of the gas chamber body; the heat exchange plate is attached to the working surface of the semiconductor refrigeration sheet, which is far away from the air chamber body; and the heat exchange fan is arranged on one side of the heat exchange plate, which is far away from the semiconductor refrigeration sheet.

In a possible implementation manner, the same working surface of each of the plurality of semiconductor chilling plates is attached to the surface of the air chamber, and the plurality of semiconductor chilling plates are electrically connected in parallel.

In a possible implementation manner, the temperature adjustment module further comprises a heat insulation plate arranged between the heat exchange plate and the air chamber body, and the heat insulation plate is provided with an avoiding groove for the semiconductor refrigerating sheet to penetrate through.

In a possible implementation manner, the heat exchange plate is provided with a plurality of fins on one side far away from the semiconductor refrigeration piece, and the heat exchange fan is arranged on one side far away from the semiconductor refrigeration piece.

In a possible implementation manner, a heat-conducting silica gel layer is arranged between the air chamber body and the semiconductor refrigeration sheet and between the semiconductor refrigeration sheet and the heat exchange plate.

In a possible implementation manner, the constant-temperature air chamber further comprises a heat preservation shell connected with the temperature adjusting module, and the heat preservation shell and the temperature adjusting module jointly enclose a containing cavity for containing the air chamber body.

Compared with the prior art, the constant-temperature air chamber provided by the utility model has the advantages that the detection hole communicated with the air flow channel is formed in the bottom of the first detection groove, the detection hole and the end face of the first gas sensor form an end face detection mode, when gas detection is carried out, gas to be detected is contacted with the detection end face of the first gas sensor through the detection hole, the first sealing element is arranged in the first sealing groove, the air flow channel can be sealed after the detection module is installed, the detection end face of the first gas sensor can be ensured to be contacted with the gas to be detected, and gas leakage can be prevented.

According to the gas detection device, the second sealing groove is formed in the groove end face of the second detection groove, the peripheral face of the second detection groove and the peripheral face of the second gas sensor form a peripheral face detection mode, when gas detection is carried out, gas to be detected enters the second detection groove and contacts with the detection peripheral face of the second gas sensor, the second sealing element is arranged in the second sealing groove, the second detection groove can be sealed after the detection module is installed, and therefore the gas to be detected can be ensured to contact with the detection peripheral face of the second gas sensor, and gas leakage can be prevented.

According to the utility model, the temperature of the air chamber body can be kept in a constant range by arranging the temperature adjusting module, the influence of temperature change on a detection result is reduced, and the detection accuracy is improved.

In a second aspect, the present invention provides a gas monitor comprising: a chassis; the constant-temperature air chamber is arranged in the case; the air inlet pipe is arranged on the case; the air pump is arranged in the case and is communicated between the air inlet pipe and the airflow channel; and the main controller is arranged in the case and is electrically connected with the air pump, the circuit board and the temperature adjusting module.

In one possible implementation, the gas monitor further includes: the particle sampling module is arranged on the case and is electrically connected with the main controller; and the temperature and humidity module is arranged on the case and is electrically connected with the main controller.

The gas monitor provided by the utility model has the same technical effect as a constant-temperature gas chamber, and is not described again.

Drawings

FIG. 1 is a perspective view of a constant temperature gas chamber according to an embodiment of the present invention;

FIG. 2 is a schematic view of the internal structure of a constant temperature chamber according to an embodiment of the present invention;

FIG. 3 is an exploded view of an assembly of a thermostatic gas cell in accordance with an embodiment of the present invention;

FIG. 4 is a perspective view of a gas cell in an embodiment of the present invention;

FIG. 5 is a perspective cross-sectional view of a plenum body in an embodiment of the present invention;

FIG. 6 is a cross-sectional view of another angle of the gas cell in an embodiment of the present invention;

FIG. 7 is a schematic diagram of a gas monitor according to an embodiment of the present invention;

FIG. 8 is a perspective cross-sectional view of a spoiler in accordance with an embodiment of the present invention;

FIG. 9 is a schematic view of the mounting of the baffle and the chamber body according to an embodiment of the present invention;

FIG. 10 is a schematic diagram of a drying assembly according to an embodiment of the present invention;

fig. 11 is a perspective sectional view of a gland in an embodiment of the present invention.

Description of reference numerals:

1. constant temperature air chamber

10. Air chamber body 11, first detection groove 12, airflow channel

121. A first air passage 122, a second air passage 123 and a series air passage

124. Air inlet 125, air outlet 13 and detection hole

14. First seal groove 15, second detection groove 16, second seal groove

17. Temperature measuring hole 18, third sealing element 20 and first sealing element

30. Detection module 31, first gas sensor 32, second gas sensor

33. Circuit board 40, temperature regulation module 41 and semiconductor refrigeration piece

42. Heat exchange plate 421, fin 43, heat exchange fan

44. Heat insulation plate 50, second sealing element 60 and heat insulation shell

70. Spoiler 71, housing 72, spoiler

80. Drying component 81, shell 811 and inner pipe

812. First air hole 813, first air pipe 82 and sealing gland

821. Pressing plate 822, second air hole 823 and connecting strip

824. Sealing cover 825, second air pipe 826 and rubber pad

83. Drying agent 2, gas monitor 91 and case

92. Intake pipe 93, air pump 94, particulate matter sampling module

95. Temperature and humidity module

Detailed Description

In order to make the technical problems, technical solutions and advantageous effects of the present invention more clearly understood, the present invention is further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the utility model and are not intended to limit the utility model.

It will be understood that when an element is referred to as being "secured to," "secured to," or "secured to" another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present. When an element is referred to as being "disposed on," "disposed on" another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "in communication" it can be directly in communication with the other element via a passageway, or indirectly in communication with the other element via other elements, lines, valves, etc. "plurality" means two or more. "at least one" refers to one or more quantities. "a number" means one or more than one.

Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs.

Referring to fig. 1 to 11, a constant temperature gas chamber 1 and a gas monitor 2 according to an embodiment of the present invention will be described.

In a first aspect, referring to fig. 1, fig. 3 and fig. 5, an embodiment of the present invention provides a constant temperature gas chamber 1, including: the device comprises a gas chamber body 10, a detection module 30 and a temperature adjusting module 40, wherein the detection module 30 and the temperature adjusting module 40 are arranged on two opposite sides of the gas chamber body 10; the gas chamber 10 is provided with an airflow channel 12 and a plurality of first detection grooves 11 communicated with the airflow channel 12, the bottom of each first detection groove 11 is provided with a detection hole 13 communicated with the airflow channel 12 and a first sealing groove 14 wound around the detection hole 13, and a first sealing element 20 is arranged in each first sealing groove 14; the detection module 30 comprises a circuit board 33 and a plurality of first gas sensors 31 arranged on the circuit board 33, the first gas sensors 31 are accommodated in the corresponding first detection grooves 11, the end surfaces of the first gas sensors 31 abut against the first sealing element 20, and the end surface detection mode is formed by the detection holes 13 and the end surfaces of the first gas sensors 31;

and/or, the air chamber body 10 is provided with an air flow channel 12 and a plurality of second detection grooves 15 communicated with the air flow channel 12, the groove end surface of the second detection groove 15 is provided with a second sealing groove 16 wound around the second detection groove 15, and a second sealing element 50 is arranged in the second sealing groove 16; the detection module 30 includes a circuit board 33 and a plurality of second gas sensors 32 disposed on the circuit board 33, the second gas sensors 32 are accommodated in the corresponding second detection grooves 15, the circuit board 33 abuts against the second sealing element 50, and peripheral surfaces of the second detection grooves 15 and the second gas sensors 32 form a peripheral surface detection mode.

In the embodiment of the present invention, the temperature of the gas chamber 10 can be maintained within a constant range by providing the temperature adjustment module 40. When the environmental temperature is low, the temperature adjusting module 40 can work through elements capable of generating heat, such as an electric heating rod, a resistance wire, a semiconductor board and the like, and heat the gas chamber 10 by utilizing the heat conduction principle; when the ambient temperature is higher, the temperature adjusting module 40 can cool the air chamber body 10 through circulating cooling water, a semiconductor board, a water cooling fan, an ice box and the like, so that the influence of temperature change on a detection result is reduced, and the detection accuracy is improved. In order to facilitate heat transfer, the chamber body 10 may be made of a material with excellent thermal conductivity, such as aluminum alloy, stainless steel, etc.

According to the embodiment of the utility model, the bottom of the first detection groove 11 is provided with the detection hole 13 communicated with the gas flow channel 12, the detection hole 13 and the end face of the first gas sensor 31 form an end face detection mode, when gas detection is carried out, gas to be detected is contacted with the detection end face of the first gas sensor 31 through the detection hole 13, the first sealing element 20 is arranged in the first sealing groove 14, and the gas flow channel 12 can be sealed after the detection module 30 is installed, so that the detection end face of the first gas sensor 31 can be ensured to be contacted with the gas to be detected, and gas leakage can be prevented.

And/or in the embodiment of the utility model, the second sealing groove 16 is formed in the groove end surface of the second detection groove 15, the circumferential surfaces of the second detection groove 15 and the second gas sensor 32 form a circumferential surface detection mode, when gas detection is performed, gas to be detected enters the second detection groove 15 and contacts with the detection circumferential surface of the second gas sensor 32, the second sealing element 50 is arranged in the second sealing groove 16, and the detection module 30 can seal the second detection groove 15 after being installed, so that the detection circumferential surface of the second gas sensor 32 can be ensured to contact with the gas to be detected, and gas leakage can be prevented.

It should be noted that the gas chamber body 10 according to the embodiment of the present invention can satisfy both the end surface detection mode and the peripheral surface detection mode, and the number and the positions of the first detection grooves and the second detection grooves can be selectively set according to actual situations when in use.

After the detection module 30 is installed, the first gas sensor 31 is located in the first detection groove 11, and a detection end of the first gas sensor 31 is an end surface facing the detection hole 13. After the installation, the detection end of the first gas sensor 31 is located at the detection hole 13, and can contact and detect the gas flowing through the gas flow channel 12. The detection position of the second gas sensor 32 is the outer peripheral surface of the sensor, and in order to make the outer peripheral surface of the second gas sensor 32 contact the gas in the gas flow channel 12 and ensure the sealing of the second detection groove 15, the gas chamber 10 is provided with a second sealing groove 16, and the circuit board 33 is pressed against the second sealing element 50. The circuit board 33 of the first gas sensor 31 and the circuit board 33 of the second gas sensor 32 may be mounted on the gas chamber body 10 by fasteners such as screws or snaps.

The first gas sensor 31 and the second gas sensor 32 are used for detecting gas components such as carbon dioxide, sulfur dioxide, ozone, nitrogen oxide, hydrocarbon, hydrogen sulfide, and the like in the detection chamber.

Specifically, the first gas sensor 31 and the second gas sensor 32 in the embodiment of the present invention may be PID sensors, which are different in detection position. During installation, the plugs of the first gas sensor 31 and the second gas sensor 32 are matched with the corresponding sockets on the circuit board 33 to realize assembly. The assembled detection module 30 is then mounted on the gas chamber body 10 by screws, snap-fit connectors, etc., so that the first gas sensor 31 is located in the first detection groove 11, and the second gas sensor 32 is located in the second detection groove 15.

Of course, the first gas sensor 31 and the second gas sensor 32 may employ other types of gas detection sensors existing on the market; the second sealing element 50 may be a single-material component such as an O-ring, a fluoro-gel gasket, a silicone gasket, or an assembly formed by multiple materials, similar to the first sealing element 20, which is not limited in this embodiment.

Referring to fig. 4 and 6, in some possible embodiments, the plurality of first detection slots 11 and/or the plurality of second detection slots 15 are arranged in two rows, which are respectively defined as a first row of slots and a second row of slots, and the airflow channel 12 includes: a first gas passage 121 communicating with the first exhaust groove and forming a gas inlet 124 of the chamber body 10; a second air passage 122 communicating with the second row groove and forming an air outlet 125 of the chamber body 10; the serial air passage 123 is communicated between the first air passage 121 and the second air passage 122; the process pore canal is communicated with the serial air passage 123 and is positioned on the same straight line; and a third sealing element 18, which is sealed to the process tunnel.

In this embodiment, the air flow channel 12 is suitable for the first detection groove 11 and the second detection groove 15 to form two rows, the positions of the first air passage 121 and the second air passage 122 correspond to one row, and the air passage 123 is connected in series to communicate the first air passage 121 and the second air passage 122, so as to ensure that the air passages are unobstructed. Specifically, in order to facilitate the processing of the air chamber body 10, and simultaneously reduce the probability of the generation of processing defects, and ensure the smoothness and the sealing of the air flow passage 12, in this embodiment, the first air passage 121, the second air passage 122, and the serial air passage 123 are all processed by a drilling process, and a process hole is a passage formed by a path when the drill enters.

Of course, the airflow channel 12 can be processed by a casting process in addition to drilling, and a process hole is not required to be arranged during the casting process.

To prevent gas leakage, the present embodiment provides a third sealing element 18 at the process tunnel. The third sealing element 18 may be a screw plug in threaded fit with the process channel, or a rubber plug in threaded fit with the process channel, and the like, and the sealing is realized by using the elasticity and the deformability of rubber. To further improve the sealing effect, the third sealing element 18 can be mounted with a sealing compound on the joining surface.

Referring to fig. 4, in some possible embodiments, the gas chamber body 10 is provided with a temperature measuring hole 17, and the constant temperature gas chamber 1 further includes a temperature sensor provided in the temperature measuring hole 17.

In this embodiment, the temperature measuring end of the temperature sensor is arranged in the temperature measuring hole 17, so that the temperature of the air chamber body 10 can be conveniently detected, and the temperature sensor and the temperature adjusting module act together to enable the air chamber body to be in a constant temperature range. In actual use, the positions and the number of the temperature measuring holes 17 and the temperature sensors may be set as needed, and the temperature measuring holes 17 may be communicated with the airflow passage 12 or may not be communicated with the airflow passage 12.

In addition, when satisfying spatial layout, temperature sensor can directly set up in technology pore department, can realize concatenating the sealed of air flue 123, has still saved the process of processing temperature measurement hole 17, has practiced thrift processing cost and time.

Referring to fig. 2 and 3, in some possible embodiments, the temperature adjustment module 40 includes: the semiconductor refrigeration pieces 41 are provided with two working surfaces, and one of the working surfaces is attached to the surface of one side, far away from the detection module 30, of the air chamber body 10; the heat exchange plate 42 is attached to the working surface, far away from the air chamber body 10, of the semiconductor chilling plate 41; and a heat exchange fan 43 disposed on a side of the heat exchange plate 42 away from the semiconductor chilling plate 41.

In the embodiment, the temperature adjusting module 40 works through the semiconductor refrigerating sheet 41, and after the semiconductor refrigerating sheet 41 is electrified, one working surface refrigerates and the other working surface heats, so that refrigerating and heating requirements can be met, two sets of independent refrigerating and heating components do not need to be arranged independently, and the number of parts is reduced.

In the embodiment, the heat exchange plate 42 is arranged, so that heat on the other surface of the semiconductor cooling plate 41 can be taken away when the semiconductor cooling plate 41 works, and the cooling/heating effect of the semiconductor cooling plate 41 is improved. Through setting up heat transfer fan 43, can take away the heat of heat transfer board 42 fast for the heat transfer speed of heat transfer board 42 and surrounding environment, improve the refrigeration/heating effect of semiconductor refrigeration piece 41. Specifically, the heat exchange plate 42 may be made of aluminum alloy, copper alloy, stainless steel, or the like, which has good heat conductivity.

In order to make the constant temperature air chamber 1 have the cooling and heating functions, the semiconductor cooling plate 41 has a plurality of setting modes, for example:

the first method is as follows: the plurality of semiconductor refrigerating sheets 41 are attached to the surface of the air chamber body 10 on the same working surface (refrigerating or heating working surface), the plurality of semiconductor refrigerating sheets 41 are connected in parallel and work simultaneously, the working surface in contact with the air chamber body 10 is refrigerated after being electrified, and the working surface in contact with the air chamber body 10 is heated when reverse current is introduced, so that the refrigerating and heating requirements can be met;

the second method comprises the following steps: the refrigerating working surface of one semiconductor refrigerating sheet 41 is in contact with the surface of the air chamber body 10, the heating working surface of the other semiconductor refrigerating sheet 41 is in contact with the surface of the air chamber body 10, and the two semiconductor refrigerating sheets 41 do not work simultaneously when the mode is adopted.

Referring to fig. 2 and 3, in some possible embodiments, the same working surface of the plurality of semiconductor chilling plates 41 is attached to the surface of the gas chamber 10, and the plurality of semiconductor chilling plates 41 are electrically connected in parallel. In the embodiment, the semiconductor chilling plates 41 are arranged in the first mode, the two semiconductor chilling plates 41 are connected in parallel and work simultaneously, the refrigerating/heating area is large, the speed is high, and the temperature adjusting effect is good.

Referring to fig. 2 and 3, in some possible embodiments, the temperature adjustment module 40 further includes a heat insulation plate 44 disposed between the heat exchange plate 42 and the air chamber 10, and the heat insulation plate 44 is provided with an avoiding groove for the semiconductor cooling plate 41 to pass through.

In the present embodiment, the heat insulation plate 44 is arranged to insulate the heat exchange between the air chamber 10 and the heat exchange plate 42, so as to prevent the heat/cold of the air chamber 10 from being transferred to the heat exchange plate 42, and to provide a heat insulation effect for the air chamber 10. The insulation board is provided with avoiding grooves at corresponding positions of the semiconductor refrigerating pieces 41, and the normal work of the semiconductor refrigerating pieces 41 cannot be influenced. Specifically, the insulation board 44 may be made of a single material (such as insulation cotton) with thermal insulation performance, or may be a composite structure formed by multiple layers of thermal insulation materials.

Referring to fig. 2 and 3, in some possible embodiments, the heat exchange plate 42 is provided with a plurality of fins 421 on a side away from the semiconductor chilling plate 41, and the heat exchange fan 43 is provided on a side of the fins 421 away from the semiconductor chilling plate 41.

This embodiment sets up a plurality of fins 421 through keeping away from one side of semiconductor refrigeration piece 41 at heat transfer plate 42, and a plurality of fins 421 are arranged at certain distance intervals and are set up on heat transfer plate 42, help accelerating heat exchange speed, improve semiconductor refrigeration piece 41's result of use. The fins 421 may be made of aluminum alloy, copper alloy, stainless steel, etc. with good heat conductivity, and the fins 421 and the heat exchange plate 42 may be fixed by welding, inserting, etc.

Referring to fig. 2 and 3, in some possible embodiments, a heat conductive silicone layer is disposed between the gas chamber 10 and the semiconductor chilling plate 41, and between the semiconductor chilling plate 41 and the heat exchange plate 42. This embodiment can accelerate the inside heat exchange of temperature regulation module 40 through setting up the heat conduction silica gel layer, improves the heat transfer effect to improve the result of use of semiconductor refrigeration piece 41.

It should be noted that the heat-conducting silicone layer may be a heat-conducting adhesive coated when the semiconductor refrigeration sheet 41 is mounted, or may be a silicone pad having a heat-conducting function.

Referring to fig. 1 and 3, in some possible embodiments, the constant temperature air chamber 1 further includes a thermal insulation shell 60 connected to the temperature adjustment module 40, and the thermal insulation shell 60 and the temperature adjustment module 40 together enclose a receiving cavity for receiving the air chamber body 10.

In this embodiment, the heat insulation shell 60 covers the air chamber body 10 and encloses with the heat insulation plate 44 to form a containing cavity, so that heat loss of the air chamber body 10 can be avoided, and the heat insulation effect on the air chamber body 10 can be achieved. The heat-insulating shell 60 may be made of heat-insulating cotton, foam board, or the like. In order to facilitate the detachment and installation, the heat preservation shell 60 can be fixed by screws, buckles, straps and other connecting pieces.

In practical use, the gas entering the gas flow channel 12 may have a problem of uneven mixing, and uneven gas distribution may cause insufficient contact between the gas and the detection ends of the first gas sensor 31 and the second gas sensor 32, which affects the accuracy of the detection result. To this end, referring to fig. 8 and 9, in some possible embodiments, the thermostatic air chamber 1 further includes a plurality of flow disturbing members 70 disposed in the air flow channel 12, each of the flow disturbing members 70 includes a housing 71 and a plurality of flow disturbing plates 72 disposed in the housing 71, the housing 71 has a flow hole communicating with the air flow channel 12, the plurality of flow disturbing plates 72 are obliquely disposed in the flow hole around an inner wall of the flow hole, and the flow disturbing plates 72 can make the distribution of the air flowing through the flow hole more uniform, thereby improving the detection accuracy.

Referring to fig. 9, in the present embodiment, the spoiler 70 may be installed at a corresponding position of the airflow channel 12 by a screw connection, a snap connection, an adhesive, and the like, and when the screw connection is adopted, the housing 71 is in screw fit with the airflow channel 12. A plurality of baffle members 70 may be provided at different locations in the airflow passage 12, as desired.

When the gas to be detected contains moisture, after the gas to be detected enters the constant-temperature gas chamber 1, water drops may condense on the gas chamber 10, the first gas sensor 31 and the second gas sensor 32, which affects the accuracy of the detection result. To this end, referring to fig. 10 and 11, in some possible embodiments, the thermostatic gas cell 1 further includes a drying component 80 communicated with the gas inlet 124, and the drying component 80 can absorb moisture in the gas to be detected, so as to dry the gas entering the gas cell body 10, thereby ensuring the accuracy of the detection result.

The drying assembly 80 includes: a housing 81, and a gland 82 fitted to the housing 81; a first air pipe 813 is arranged on the shell 81, an inner pipe 811 is arranged inside the shell 81, the inner pipe 811 divides the inner cavity of the shell 81 into a first cavity communicated with the first air pipe 813 and a second cavity surrounding the first cavity, and a plurality of first air holes 812 communicated with the second cavity are arranged on the wall of the inner pipe 811; the seal gland 82 includes: the pressure plate 821, the connecting strip 823 and the sealing cover 824, the pressure plate 821 is abutted to one end of the inner pipe 811 far away from the first air pipe 813 and is in sealing fit with the inner wall of the shell 81, and the pressure plate 821 is provided with a plurality of second air holes 822 at positions corresponding to the second cavity; a plurality of connecting bars 823 are connected between the pressing plate 821 and the sealing cover 824, so that a gas chamber is formed between the pressing plate 821 and the sealing cover 824, a second gas pipe 825 communicated with the gas chamber is arranged on the sealing cover 824, and the sealing cover 824 is in sealing fit with the housing 81.

In order to prevent gas leakage, in this embodiment, sealing rings are disposed on the matching surfaces of the pressure plate 821 and the inner wall of the housing 81, and the pressure plate 821 and the inner tube 811, and the sealing cover 824 and the housing 81 may be detachably connected in a connection manner such as a threaded connection or a snap connection. The sealing cap 824 is detachably connected to the housing 81 to facilitate periodic replacement of the desiccant 83 in the second chamber.

In the embodiment, the desiccant 83 is a granular desiccant 83, and after the gland 82 is installed, the pressure plate 821 can compress the desiccant 83 in the second cavity to reduce the gap between the desiccants 83, so that the gas can be in contact with the desiccant 83 more fully. To prevent the desiccant 83 from being crushed, the pressure plate 821 in this embodiment is provided with a rubber pad 826 at an end adjacent to the second cavity.

As shown in fig. 10, when in use, the second cavity is filled with a drying agent 83, the drying agent 83 may be anhydrous calcium chloride, anhydrous copper sulfate, etc., arrows indicate the flowing direction of gas, the gas to be detected enters the first cavity from the first air tube 813, enters the second cavity through the first air hole 812 on the inner tube 811, the drying agent 83 in the second cavity can absorb moisture, the dried gas enters the gas cavity through the second air hole 822 and then flows out from the second air tube 825, and the second air tube 825 is communicated with the air inlet 124 of the gas cavity 10.

In a second aspect, referring to fig. 7, an embodiment of the utility model further provides a gas monitor 2, including: a chassis 91; the constant-temperature air chamber 1 of any one of the embodiments is arranged in the case 91; an air inlet pipe 92 provided on the cabinet 91; the air pump 93 is arranged in the case 91 and communicated between the air inlet pipe 92 and the air flow passage 12; and the main controller is arranged in the case 91 and is electrically connected with the air pump 93, the circuit board 33 and the temperature adjusting module 40.

The gas monitor 2 provided by the embodiment of the utility model can detect greenhouse gases such as carbon dioxide, sulfur dioxide, oxynitride and other components, when the gas monitor works, the gas to be detected is sucked by the gas pump 93 through the gas inlet pipe 92 and is conveyed to the gas inlet 124 of the gas chamber 10, and the gas inlet 124 and the gas outlet 125 are both provided with gas connectors. The air inlet pipe 92, the air pump 93 and the air joint are communicated through an air hose. The main controller is used for controlling the operations of the air pump 93, the detection module 30, the temperature adjustment module 40 and other components.

Referring to fig. 7, in some possible embodiments, gas monitor 2 further includes: the particulate matter sampling module 94 is arranged on the case 91 and is electrically connected with the main controller; and a temperature and humidity module 95 disposed on the case 91 and electrically connected to the main controller.

Particulate matter content in the air can be detected to particulate matter sampling module 94 in this embodiment to carry the testing result to the controller through the signal transmission, humiture module 95 can detect the humiture in the surrounding environment, and carry the testing result to the controller through the signal transmission. Through setting up particulate matter sampling module 94 and humiture module 95 for gas monitor 2 can be applicable to more application scenes, has improved gas monitor 2's commonality.

It is to be understood that, in the foregoing embodiments, various parts may be freely combined or deleted to form different combination embodiments, and details of each combination embodiment are not described herein again, and after this description, it can be considered that each combination embodiment has been described in the present specification, and can support different combination embodiments.

The present invention is not limited to the above preferred embodiments, and any modifications, equivalent substitutions and improvements made within the spirit and principle of the present invention should be included in the protection scope of the present invention.

Claims (10)

1. Constant temperature air chamber, its characterized in that includes: the device comprises a gas chamber body, a detection module and a temperature adjusting module, wherein the detection module and the temperature adjusting module are arranged on two opposite sides of the gas chamber body;

the gas chamber body is provided with an airflow channel and a plurality of first detection grooves communicated with the airflow channel, the bottom of each first detection groove is provided with a detection hole communicated with the airflow channel and a first sealing groove wound on the detection hole, and a first sealing element is arranged in each first sealing groove;

the detection module comprises a circuit board and a plurality of first gas sensors arranged on the circuit board, the first gas sensors are contained in the corresponding first detection grooves, the end faces of the first gas sensors abut against the first sealing elements, and the detection holes and the end faces of the first gas sensors form an end face detection mode;

and/or the presence of a gas in the gas,

the air chamber body is provided with an air flow channel and a plurality of second detection grooves communicated with the air flow channel, the end face of each second detection groove is provided with a second sealing groove wound on the second detection groove, and a second sealing element is arranged in each second sealing groove;

the detection module comprises a circuit board and a plurality of second gas sensors arranged on the circuit board, the second gas sensors are contained in the corresponding second detection grooves, the circuit board abuts against the second sealing element, and the second detection grooves and the peripheral surfaces of the second gas sensors form a peripheral surface detection mode.

2. The thermostatic gas cell according to claim 1, wherein the first and/or second plurality of detection cells are arranged in two rows, respectively defined as a first row of cells and a second row of cells, the air flow path comprising:

the first air channel is communicated with the first exhaust groove and forms an air inlet of the air chamber body;

the second air passage is communicated with the second row of grooves and forms an air outlet of the air chamber body;

the serial air passage is communicated between the first air passage and the second air passage;

the process pore canal is communicated with the serial connection air passage and is positioned on the same straight line; and

and the third sealing element is arranged on the process pore passage in a sealing manner.

3. The constant-temperature air chamber as claimed in claim 1, wherein a temperature measuring hole is formed on the air chamber body, and the constant-temperature air chamber further comprises a temperature sensor arranged in the temperature measuring hole.

4. The thermostatic gas cell of claim 1, wherein the temperature adjustment module comprises:

the semiconductor refrigeration pieces are provided with two working surfaces, and one working surface is attached to the surface of one side, away from the detection module, of the gas chamber body;

the heat exchange plate is attached to the working surface of the semiconductor refrigeration sheet, which is far away from the air chamber body; and

and the heat exchange fan is arranged on one side of the heat exchange plate far away from the semiconductor refrigerating sheet.

5. The constant-temperature air chamber as claimed in claim 4, wherein the same working surface of each of the plurality of semiconductor chilling plates is attached to the surface of the air chamber, and the plurality of semiconductor chilling plates are electrically connected in parallel.

6. The constant-temperature air chamber as claimed in claim 4, wherein the temperature adjustment module further comprises a heat insulation plate disposed between the heat exchange plate and the air chamber body, and the heat insulation plate is provided with an avoiding groove for the semiconductor refrigeration sheet to penetrate through.

7. The constant-temperature air chamber as claimed in claim 4, wherein the heat exchange plate is provided with a plurality of fins on a side away from the semiconductor chilling plates, and the heat exchange fan is provided on a side of the fins away from the semiconductor chilling plates.

8. The constant-temperature air chamber as claimed in claim 4, wherein heat-conducting silica gel layers are arranged between the air chamber body and the semiconductor refrigerating sheet and between the semiconductor refrigerating sheet and the heat exchange plate.

9. The constant-temperature air chamber as claimed in claim 1, further comprising a heat-insulating shell connected with the temperature adjusting module, wherein the heat-insulating shell and the temperature adjusting module jointly enclose a containing cavity for containing the air chamber body.

10. Gas monitor, its characterized in that includes:

a chassis;

the constant-temperature air chamber as claimed in any one of claims 1 to 9, which is provided in the case;

the air inlet pipe is arranged on the case;

the air pump is arranged in the case and is communicated between the air inlet pipe and the airflow channel; and

and the main controller is arranged in the case and is electrically connected with the air pump, the circuit board and the temperature adjusting module.

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