CN216659205U

CN216659205U - Heat insulation PC board

Info

Publication number: CN216659205U
Application number: CN202123450455.8U
Authority: CN
Inventors: 陈家国
Original assignee: Wuxi Hilli Plastic Sheet Co ltd
Current assignee: Wuxi Hilli Plastic Sheet Co ltd
Priority date: 2021-12-31
Filing date: 2021-12-31
Publication date: 2022-06-03
Anticipated expiration: 2031-12-31

Abstract

The application discloses thermal-insulated PC board belongs to the field of PC panel, and it is by last first base plate and second base plate of including in proper order under to, first base plate with be provided with the insulating layer between the second base plate, the interval is provided with the heat reflection aluminium foil piece on the insulating layer. This application improves the heat-proof quality of PC board through setting up of insulating layer, and this application makes the PC board have ultraviolet resistance's performance through setting up of ultraviolet reflection stratum, and this application does benefit to further improvement PC board light utilization ratio through being provided with of light guide plate.

Description

Heat insulation PC board

Technical Field

The application relates to the technical field of PC boards, in particular to a heat insulation PC board.

Background

The PC board is a commonly used material in the fields of modern buildings, interior decoration and the like, is prepared by taking polycarbonate as a main component and adopting a co-extrusion technology, and is a high-tech, extremely excellent in comprehensive performance, energy-saving and environment-friendly plastic board.

Among the correlation technique, chinese utility model patent that publication number is CN206416541U discloses a PC endurance plate, including the PC board body, the left side of PC board body is provided with ultraviolet absorption layer, and ultraviolet absorption layer's left side is provided with the antidrip layer, and the left side of antidrip layer is provided with prevents scraping the flower layer, and the right side of PC board body is provided with the puigging, and the right side of puigging is provided with the insulating layer, and the right surface top of insulating layer is provided with discharge electrode.

In view of the above-mentioned related art, the inventor believes that the general residential building has a high demand for temperature control, and the related art has a relatively small amount of insulation on the PC board and a relatively poor insulation performance of the PC board.

SUMMERY OF THE UTILITY MODEL

In order to improve the thermal insulation performance of a PC board, the present application provides a thermal insulation PC board.

The application provides a thermal-insulated PC board adopts following technical scheme:

a heat insulation PC board sequentially comprises a first substrate and a second substrate from top to bottom, wherein a heat insulation layer is arranged between the first substrate and the second substrate, and heat reflection aluminum foil sheets are arranged on the heat insulation layer at intervals.

By adopting the technical scheme, the heat insulation layer is favorable for reducing the efficiency of heat transfer between the first substrate and the second substrate, and the heat reflection aluminum foil can reflect partial heat in the air and improve the heat insulation performance of the PC board.

Preferably, the thermal insulation layer comprises a transparent fiber plate fixedly connected to the first substrate.

Through adopting above-mentioned technical scheme, the setting up of transparent fiber board is favorable to improving the air permeability of PC board on the one hand, and on the other hand is favorable to improving the heat-proof quality of PC board.

Preferably, the side surface of the transparent fiber plate close to the first substrate is arranged in a zigzag manner, and the heat reflection aluminum foils are arranged on the zigzag side surface of the transparent fiber plate at intervals.

Through adopting above-mentioned technical scheme, the structure of cockscomb structure makes transparent fiber board's structural strength bigger, and then improves the intensity of whole PC board, and the structure of cockscomb structure makes transparent fiber board be close to the side area of first base plate bigger to improve transparent fiber board and inhale the sound and adsorb impurity's performance.

Preferably, the heat insulating layer further includes an ultraviolet reflecting layer disposed between the transparent fiber sheet and the second substrate, and the ultraviolet reflecting layer is formed of an ultraviolet reflecting film.

By adopting the technical scheme, the ultraviolet reflecting layer is favorable for reflecting external ultraviolet rays, so that the ultraviolet resistance of the PC board is reduced.

Preferably, a light guide layer is disposed between the heat insulation layer and the second substrate, and the light guide layer is composed of a light guide plate.

Through adopting above-mentioned technical scheme, the setting up of light guide plate makes light evenly distributed, improves the availability factor of light, and then is favorable to improving the light transmissivity of PC board.

Preferably, a plurality of heat insulation cavities are formed in the second substrate at intervals, and heat insulation gel is filled in the heat insulation cavities.

Through adopting above-mentioned technical scheme, thermal-insulated chamber and thermal-insulated gel be provided with and do benefit to the conduction that further reduces heat to improve the heat-proof quality of PC board.

Preferably, an anti-static film is arranged on the side surface of the first substrate far away from the second substrate.

Through adopting above-mentioned technical scheme, prevent being provided with of static film and do benefit to and prevent that the dust from piling up because of static reason at the PC board surface, and then the permeability of guarantee PC board.

Preferably, the periphery of the first substrate is provided with a mounting frame in a surrounding manner, and the inner side wall of the mounting frame is fixedly connected with the outer side walls of the first substrate and the second substrate.

Through adopting above-mentioned technical scheme, the setting up of installing frame makes things convenient for operating personnel to install the PC board on the one hand, and on the other hand is favorable to strengthening the holistic structural strength of PC board.

In summary, the present application includes at least one of the following beneficial technical effects:

the arrangement of the heat insulation layer is beneficial to reducing the heat transfer efficiency between the first substrate and the second substrate, and the arrangement of the heat reflection aluminum foil can reflect partial heat in the air and improve the heat insulation performance of the PC board;

the arrangement of the heat insulation cavity and the heat insulation gel is beneficial to further reducing the heat conduction, so that the heat insulation performance of the PC board is improved;

the anti-static film is favorable for preventing dust from being accumulated on the surface of the PC board due to static electricity, so that the permeability of the PC board is ensured.

Drawings

FIG. 1 is a schematic view of the internal structure of an insulated PC board according to an embodiment of the present application.

Fig. 2 is a schematic view of the internal structure of the thermal insulation layer according to the embodiment of the present application.

Description of reference numerals:

1. a first substrate; 11. an antistatic film; 2. a thermal insulation layer; 21. a transparent fiber sheet; 22. an ultraviolet reflecting layer; 23. a heat reflective aluminum foil sheet; 3. a second substrate; 31. a thermally insulating cavity; 32. heat-insulating gel; 4. a light guide layer; 5. and (5) installing the frame.

Detailed Description

The present application is described in further detail below with reference to figures 1-2.

The embodiment of the application discloses thermal-insulated PC board. Referring to fig. 1, the heat insulation PC board includes a first substrate 1, a heat insulation layer 2, and a second substrate 3 in this order from top to bottom.

Referring to fig. 1 and 2, the first substrate 1 is horizontally disposed, an anti-static film 11 is disposed on a side surface of the first substrate 1 away from the second substrate 3, and the anti-static film 11 is fixedly connected to the first substrate 1. The anti-static film 11 can prevent the PC board from being electrostatically charged on the side of the first substrate 1 away from the second substrate 3 during use, thereby preventing dust and impurities in the air from being accumulated on the surface of the second substrate 3 due to static electricity. Dust on the first base plate 1 is piled up more and is influenced the permeability of PC board and the light transmittance of PC board easily, and the setting of antistatic film 11 does benefit to the permeability of guaranteeing the PC board.

Referring to fig. 1 and 2, the heat insulation layer 2 includes a transparent fiber plate 21 and an ultraviolet reflection layer 22, the side surface of the transparent fiber plate 21 close to the first substrate 1 is arranged in a zigzag manner, and the side surfaces of the transparent fiber plate 21 and the first substrate 1 close to each other are attached and fixedly connected. A plurality of heat reflection aluminum foils 23 are arranged between the transparent fiber plate 21 and the first substrate 1, the heat reflection aluminum foils 23 are fixedly connected to the inclined surface of the sawtooth surface of the transparent fiber plate 21, and the plurality of heat reflection aluminum foils 23 are arranged at intervals along the length direction of the sawtooth-shaped side surface of the transparent fiber plate 21. The transparent fiber board 21 has good heat insulation performance and air permeability, and the transparent fiber board 21 can absorb noise and adsorb impurities in air, so that the arrangement of the transparent fiber board 21 can improve the heat insulation performance and the air permeability of the PC board on one hand, and the transparent fiber board 21 can enable the PC board to have certain sound absorption performance and purification and adsorption performance on the other hand. The arrangement of the serrated surface of the transparent fiber plate 21 is favorable for improving the overall structural strength of the PC board, and the arrangement of the heat reflection aluminum foil 23 is favorable for preventing heat from being transferred from the first substrate 1 to the second substrate 3, so that the heat insulation performance of the PC board is further improved.

Referring to fig. 1 and 2, the ultraviolet reflecting layer 22 is formed of an ultraviolet reflecting film, and the side of the ultraviolet reflecting film away from the second substrate 3 is fixedly connected to the transparent fiber plate 21. The ultraviolet film is beneficial to improving the ultraviolet resistance of the PC board.

Referring to fig. 1 and 2, a light guide layer 4 is disposed between the heat insulation layer 2 and the second substrate 3, one side of the light guide layer 4 is fixedly connected to the ultraviolet reflection layer 22, the other side of the light guide layer 4 is fixedly connected to the second substrate 3, and the light guide layer 4 is composed of a light guide plate. The light guide plate has ultrahigh light utilization rate, and when external light sequentially passes through the first substrate 1 and the heat insulation layer 2 and is transmitted into the light guide plate, the light guide plate uniformly emits light, so that the daylighting performance of the PC board is improved, and the use efficiency of the PC board for the light is further enhanced.

Referring to fig. 1 and 2, a plurality of thermal insulation cavities 31 are formed in the second substrate 3, the cross section of each thermal insulation cavity 31 is rectangular, the thermal insulation cavities 31 are arranged at intervals along the length direction of the second substrate 3, and thermal insulation gel 32 is filled in each thermal insulation cavity 31. The arrangement of the heat insulation cavity 31 facilitates the filling of the heat insulation gel 32 for operators, and the cooperation of the heat insulation cavity 31 and the heat insulation gel 32 is beneficial to further improving the heat insulation effect of the PC board.

Referring to fig. 1 and 2, a mounting frame 5 is disposed around the first substrate 1, the mounting frame 5 surrounds the first substrate 1, and an inner sidewall of the mounting frame 5 is fixedly connected to outer sidewalls of the first substrate 1, the heat insulation layer 2 and the second substrate 3. The setting of installing frame 5 makes things convenient for operating personnel to install the PC board on the one hand, and the setting of installing frame 5 on the other hand is favorable to strengthening the overall structure intensity of PC board.

The implementation principle of this application embodiment thermal-insulated PC board does: the transparent fiber board 21 is arranged to reduce the efficiency of heat transfer between the first substrate 1 and the second substrate 3, and the heat reflective aluminum foil 23 is arranged to reflect part of heat in the air, so as to improve the heat insulation performance of the PC board. The provision of the insulating cavity 31 and the insulating gel 32 is advantageous to further reduce the conduction of heat, thereby improving the insulating properties of the PC board. The light guide plate is arranged to enable light to be uniformly distributed, and the using efficiency of the light is improved.

The above embodiments are preferred embodiments of the present application, and the protection scope of the present application is not limited by the above embodiments, so: all equivalent changes made according to the structure, shape and principle of the present application shall be covered by the protection scope of the present application.

Claims

1. A thermal-insulated PC board, by last first base plate (1) and second base plate (3) of including in proper order down, its characterized in that: a heat insulation layer (2) is arranged between the first substrate (1) and the second substrate (3), and heat reflection aluminum foils (23) are arranged on the heat insulation layer (2) at intervals.

2. An insulated PC board according to claim 1, wherein: the heat insulation layer (2) comprises a transparent fiber plate (21) fixedly connected to the first substrate (1).

3. An insulated PC board according to claim 2, wherein: the side face, close to the first substrate (1), of the transparent fiber plate (21) is arranged in a sawtooth shape, and the heat reflection aluminum foils (23) are arranged on the sawtooth-shaped side face of the transparent fiber plate (21) at intervals.

4. An insulated PC board according to claim 2, wherein: the heat insulation layer (2) further comprises an ultraviolet reflection layer (22) arranged between the transparent fiber plate (21) and the second substrate (3), and the ultraviolet reflection layer (22) is composed of an ultraviolet reflection film.

5. An insulated PC board according to claim 1, wherein: a light guide layer (4) is arranged between the heat insulation layer (2) and the second substrate (3), and the light guide layer (4) is composed of a light guide plate.

6. An insulated PC board according to claim 1, wherein: a plurality of heat insulation cavities (31) are formed in the second substrate (3) at intervals, and heat insulation gel (32) is filled in the heat insulation cavities (31).

7. An insulated PC board according to claim 1, wherein: and an anti-static film (11) is arranged on the side surface of the first substrate (1) far away from the second substrate (3).

8. An insulated PC board according to claim 1, characterised in that: the mounting frame (5) is arranged around the first substrate (1), and the inner side wall of the mounting frame (5) is fixedly connected with the outer side walls of the first substrate (1) and the second substrate (3).