CN216656927U - Spot welding jig for mobile phone motherboard support - Google Patents
Spot welding jig for mobile phone motherboard support Download PDFInfo
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- CN216656927U CN216656927U CN202123155057.3U CN202123155057U CN216656927U CN 216656927 U CN216656927 U CN 216656927U CN 202123155057 U CN202123155057 U CN 202123155057U CN 216656927 U CN216656927 U CN 216656927U
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- bottom die
- pressing plate
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- mobile phone
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Abstract
The utility model discloses a spot welding jig for a mobile phone mainboard support, which comprises a lower end bottom die and an upper end pressing plate, wherein a support placing area is arranged on the upper surface of the lower end bottom die and provided with a support positioning column; a limiting profile groove is formed in the support placing area of the lower end bottom die, and a clearance hole communicated with the limiting profile groove is formed in the lower surface of the lower end bottom die; the lower end bottom die is provided with at least two bottom die mounting holes which are arranged at intervals, and bottom die magnets are respectively embedded in the bottom die mounting holes; the upper end pressing plate is provided with a pressing plate mounting hole corresponding to each bottom die mounting hole of the lower end bottom die respectively, and a pressing plate magnet is embedded in each pressing plate mounting hole respectively; when the lower bottom die and the upper pressure plate are closed, the bottom die magnets are respectively magnetically adsorbed with the corresponding pressure plate magnets. Through the structural design, the mobile phone mainboard support has the advantages of novel structural design and convenience in use, and can effectively improve the spot welding efficiency of the mobile phone mainboard support and the elastic sheet.
Description
Technical Field
The utility model relates to the technical field of mobile phone processing jigs, in particular to a spot welding jig for a mobile phone mainboard support.
Background
In the production and processing process of the mobile phone, the mobile phone motherboard bracket of the mobile phone needs to be welded with the elastic sheet, and the mobile phone motherboard bracket and the elastic sheet are generally welded together in a spot welding manner.
In the prior art, due to the lack of effective jig products, the defects of low spot welding efficiency and low yield exist in actual spot welding operation.
SUMMERY OF THE UTILITY MODEL
The utility model aims to provide a mobile phone mainboard support spot welding jig aiming at the defects of the prior art, which has novel structural design and convenient use and can effectively improve the spot welding efficiency of a mobile phone mainboard support and a spring plate.
In order to achieve the above object, the present invention is achieved by the following technical solutions.
A spot welding jig for a mobile phone mainboard support comprises a lower end bottom die and an upper end pressing plate which are horizontally and transversely arranged, wherein the lower end bottom die is located on the lower end side of the upper end pressing plate, a support placing area is arranged on the upper surface of the lower end bottom die, and a support positioning column which protrudes upwards and extends and corresponds to a through hole of a mainboard support is arranged in the support placing area;
the lower end bottom die is provided with a limiting copying groove in the support placing area, and the lower surface of the lower end bottom die is provided with a clearance hole communicated with the limiting copying groove;
the lower end bottom die is provided with at least two bottom die mounting holes which are arranged at intervals, and bottom die magnets are respectively embedded in the bottom die mounting holes; the bottom die mounting holes of the upper end pressing plate corresponding to the bottom die at the lower end are respectively provided with a pressing plate mounting hole, and a pressing plate magnet is respectively embedded in each pressing plate mounting hole; when the lower bottom die and the upper pressure plate are closed, the bottom die magnets are respectively magnetically adsorbed with the corresponding pressure plate magnets.
The lower end bottom die is provided with four bottom die mounting holes which are distributed in a rectangular shape and are respectively opened downwards, and a bottom die magnet is embedded in each bottom die mounting hole;
the upper end pressing plate is provided with four pressing plate mounting holes which are distributed in a rectangular shape and are respectively provided with an upward opening, and a pressing plate magnet is embedded in each pressing plate mounting hole.
The edge part of the front end and the edge part of the rear end of the lower end bottom die are respectively provided with a positioning groove, and the edge part of the front end and the edge part of the rear end of the upper end pressing plate are respectively provided with a positioning bulge which protrudes downwards;
when the upper end pressing plate and the lower end bottom die are closed, all the positioning bulges of the upper end pressing plate are respectively embedded into the positioning grooves on the corresponding side of the lower end bottom die.
The support positioning column and the lower end bottom die are of an integrated structure.
The lower end bottom die is provided with a positioning column mounting hole with an upward opening corresponding to the support positioning column, and the lower end part of the support positioning column is embedded in the positioning column mounting hole.
Wherein, the lower end opening of the clearance hole is in a flaring shape.
The bottom die comprises a lower end bottom die, an upper end pressing plate and a lower end pressing plate, wherein bottom die notches are respectively formed in the edge part of the left end and the edge part of the right end of the lower end bottom die, and pressing plate notches are respectively formed in the edge part of the left end and the edge part of the right end of the upper end pressing plate;
when the upper end pressing plate and the lower end bottom die are closed, the notches of the bottom dies are respectively aligned with the notches of the pressing plates on the corresponding sides.
The utility model has the beneficial effects that: the utility model relates to a spot welding jig for a mobile phone mainboard support, which comprises a lower end bottom die and an upper end pressing plate which are horizontally and transversely arranged, wherein the lower end bottom die is positioned on the lower end side of the upper end pressing plate; the lower end bottom die is provided with a limiting profiling groove in a support placing area, and the lower surface of the lower end bottom die is provided with a clearance hole communicated with the limiting profiling groove; the lower end bottom die is provided with at least two bottom die mounting holes which are arranged at intervals, and bottom die magnets are respectively embedded in the bottom die mounting holes; the bottom die mounting holes of the upper end pressing plate corresponding to the bottom die at the lower end are respectively provided with a pressing plate mounting hole, and a pressing plate magnet is respectively embedded in each pressing plate mounting hole; when the lower bottom die and the upper pressing plate are closed, each bottom die magnet is respectively magnetically adsorbed with the corresponding pressing plate magnet. Through the structural design, the mobile phone mainboard support has the advantages of novel structural design and convenience in use, and can effectively improve the spot welding efficiency of the mobile phone mainboard support and the elastic sheet.
Drawings
The utility model will be further described with reference to the drawings to which, however, the embodiments shown in the drawings do not constitute any limitation.
FIG. 1 is a schematic structural diagram of the present invention.
Fig. 2 is an exploded view of fig. 1.
FIG. 3 is a schematic view of another embodiment of the present invention.
Fig. 4 is a schematic cross-sectional view of the present invention.
Fig. 1 to 4 include:
1-lower end bottom die 11-support placing area
12-support positioning column 13-limit profile groove
14-clearance hole 15-bottom die mounting hole
16-positioning groove 17-bottom die notch
2-upper end pressing plate 21-pressing plate mounting hole
22-positioning projection 23-pressing plate notch
31-bottom die magnet 32-press plate magnet
4-mobile phone motherboard bracket 5-shrapnel.
Detailed Description
The present invention will be described below with reference to specific embodiments.
As shown in fig. 1 to 4, a spot welding jig for a mobile phone motherboard support includes a lower end bottom die 1 and an upper end pressing plate 2 which are horizontally and transversely arranged, respectively, wherein the lower end bottom die 1 is located at a lower end side of the upper end pressing plate 2, a support placing area 11 is arranged on an upper surface of the lower end bottom die 1, and the support placing area 11 is provided with a support positioning column 12 which protrudes upwards and extends and corresponds to a through hole of the motherboard support.
It should be explained that the bracket positioning column 12 of the present invention can adopt an integrated structure design, and certainly can also adopt a split structure design; for the support positioning column 12 with an integrated structure design, the support positioning column 12 and the lower bottom die 1 are integrated; for the support positioning column 12 with a split structure design, the lower bottom die 1 is provided with a positioning column mounting hole with an upward opening corresponding to the support positioning column 12, and the lower end part of the support positioning column 12 is embedded in the positioning column mounting hole.
Wherein, the lower end bottom die 1 is provided with a limiting profile groove 13 in the support placing area 11, and the lower surface of the lower end bottom die 1 is provided with a clearance hole 14 communicated with the limiting profile groove 13.
Further, the lower bottom die 1 is provided with at least two bottom die mounting holes 15 which are arranged at intervals, and bottom die magnets 31 are respectively embedded in the bottom die mounting holes 15; the upper end pressing plate 2 is provided with pressing plate mounting holes 21 corresponding to the bottom die mounting holes 15 of the lower end bottom die 1 respectively, and pressing plate magnets 32 are embedded in the pressing plate mounting holes 21 respectively; when the lower bottom mold 1 and the upper platen 2 are closed, each bottom mold magnet 31 is magnetically attracted to the corresponding platen magnet 32.
Preferably, as shown in fig. 1 to 3, the lower bottom mold 1 is provided with four bottom mold mounting holes 15 which are distributed in a rectangular shape and open downwards, and a bottom mold magnet 31 is embedded in each bottom mold mounting hole 15; the upper end pressing plate 2 is provided with four pressing plate mounting holes 21 which are distributed in a rectangular shape and are respectively provided with an upward opening, and a pressing plate magnet 32 is respectively embedded in each pressing plate mounting hole 21.
In the using process of the utility model, the elastic sheet 5 is firstly placed into the limit profile groove 13 of the lower end bottom die 1, the limit profile groove 13 adopts a profile design, and the shape of the limit profile groove 13 is consistent with that of the elastic sheet 5, namely the limit profile groove 13 can accurately position the elastic sheet 5; after the elastic sheet 5 is positioned and placed, the mobile phone mainboard support 4 is placed in the support placing area 11 of the lower end bottom die 1, and the lower end bottom die 1 positions the mobile phone mainboard support 4 through the support positioning column 12; after the elastic sheet 5 and the mobile phone motherboard support 4 are positioned and placed completely, the upper end pressing plate 2 covers the lower end bottom die 1, and the mobile phone motherboard support 4 and the elastic sheet 5 are tightly pressed and fixed between the upper end pressing plate 2 and the lower end bottom die 1 through the magnetic adsorption effect of the bottom die magnet 31 and the pressing plate magnet 32; during spot welding, the worker turns the whole jig provided with the elastic sheet 5 and the mobile phone motherboard support 4 and puts the jig into a spot welding machine, and a spot welding head of an electric welding machine is inserted into the clearance hole 14 of the lower end bottom die 1 so as to perform spot welding operation on the elastic sheet 5 and the mobile phone motherboard support 4.
It should be emphasized that, in the process of using the utility model to perform spot welding operation on the mobile phone motherboard bracket 4 and the elastic sheet 5, the utility model can be beneficial to improving the problem that the tiny elastic sheet 5 cannot be positioned, and is beneficial to improving the deviation phenomenon of manual adjustment of the elastic sheet 5; during spot welding, mobile phone motherboard support 4, shell fragment are compressed tightly fixedly, and this is favorable to improving spot welding rosin joint phenomenon and takes place, and then is favorable to improving the postweld quality yield, reduces quality testing personnel and pays out man-hour to it is extravagant to reduce material cost.
According to the above situation, through the above structural design, the mobile phone mainboard support has the advantages of novel structural design and convenience in use, and can effectively improve the spot welding efficiency of the mobile phone mainboard support 4 and the elastic sheet 5.
As a preferred embodiment, as shown in fig. 1 to 3, in order to improve the accuracy of the closing of the lower bottom die 1 and the upper platen 2, the present invention adopts the following positioning structure design: the edge part of the front end and the edge part of the rear end of the lower end bottom die 1 are respectively provided with a positioning groove 16, and the edge part of the front end and the edge part of the rear end of the upper end pressing plate 2 are respectively provided with a positioning bulge 22 which protrudes downwards; when the upper end pressing plate 2 and the lower end bottom die 1 are closed, the positioning protrusions 22 of the upper end pressing plate 2 are respectively embedded into the positioning grooves 16 on the corresponding side of the lower end bottom die 1.
As a preferred embodiment, as shown in fig. 3 and 4, the lower end opening of the clearance hole 14 is in a flaring shape; the flared clearance hole 14 has a good clearance space so that the spot welding head can be conveniently and effectively aligned with the clearance hole 14.
As shown in fig. 1 to 4, in a preferred embodiment, a bottom mold notch 17 is formed in each of the left and right edge portions of the lower bottom mold 1, and a platen notch 23 is formed in each of the left and right edge portions of the upper platen 2. When the upper press plate 2 and the lower bottom mold 1 are closed, each bottom mold notch 17 is aligned with the corresponding side press plate notch 23.
In the using process of the utility model, when the lower bottom die 1 and the upper end pressing plate 2 need to be separated, a worker can hold the position of the bottom die notch 17 of the lower bottom die 1 with one hand and hold the position of the pressing plate notch 23 of the upper end pressing plate 2 with the other hand; by arranging the bottom die notch 17 and the pressing plate notch 23, the bottom die can be operated conveniently by workers, and the lower end bottom die 1 and the upper end pressing plate 2 can be separated conveniently.
The above description is only a preferred embodiment of the present invention, and for those skilled in the art, the present invention should not be limited by the description of the present invention, which should be interpreted as a limitation.
Claims (7)
1. The utility model provides a mobile phone motherboard support spot welding tool which characterized in that: the support structure comprises a lower end bottom die (1) and an upper end pressing plate (2) which are horizontally and transversely arranged, wherein the lower end bottom die (1) is positioned on the lower end side of the upper end pressing plate (2), a support placing area (11) is arranged on the upper surface of the lower end bottom die (1), and a support positioning column (12) which protrudes upwards and extends and corresponds to a through hole of a main board support is arranged in the support placing area (11);
a limiting profile groove (13) is formed in the support placing area (11) of the lower end bottom die (1), and a clearance hole (14) communicated with the limiting profile groove (13) is formed in the lower surface of the lower end bottom die (1);
the lower end bottom die (1) is provided with at least two bottom die mounting holes (15) which are arranged at intervals, and bottom die magnets (31) are respectively embedded in the bottom die mounting holes (15); the upper end pressing plate (2) is provided with pressing plate mounting holes (21) corresponding to the bottom die mounting holes (15) of the lower end bottom die (1), and pressing plate magnets (32) are embedded in the pressing plate mounting holes (21) respectively; when the lower bottom die (1) and the upper end pressing plate (2) are closed, each bottom die magnet (31) is respectively and magnetically attracted with the corresponding pressing plate magnet (32).
2. The spot welding jig for the mobile phone motherboard bracket according to claim 1, characterized in that: the lower end bottom die (1) is provided with four bottom die mounting holes (15) which are distributed in a rectangular shape and are respectively opened downwards, and a bottom die magnet (31) is embedded in each bottom die mounting hole (15);
the upper end pressing plate (2) is provided with four pressing plate mounting holes (21) which are distributed in a rectangular shape and are respectively provided with an upward opening, and a pressing plate magnet (32) is embedded in each pressing plate mounting hole (21).
3. The spot welding jig for the mobile phone motherboard bracket according to claim 1, characterized in that: positioning grooves (16) are respectively formed in the edge part of the front end and the edge part of the rear end of the lower end bottom die (1), and downward convex positioning bulges (22) are respectively formed in the edge part of the front end and the edge part of the rear end of the upper end pressing plate (2);
when the upper end pressing plate (2) and the lower end bottom die (1) are closed, the positioning bulges (22) of the upper end pressing plate (2) are respectively embedded into the positioning grooves (16) on the corresponding side of the lower end bottom die (1).
4. The spot welding jig for the mobile phone main board bracket according to claim 1, characterized in that: the support positioning column (12) and the lower end bottom die (1) are of an integrated structure.
5. The spot welding jig for the mobile phone motherboard bracket according to claim 1, characterized in that: the lower end bottom die (1) is provided with a positioning column mounting hole with an upward opening corresponding to the support positioning column (12), and the lower end part of the support positioning column (12) is embedded in the positioning column mounting hole.
6. The spot welding jig for the mobile phone motherboard bracket according to claim 1, characterized in that: the lower end opening of the clearance hole (14) is in a flaring shape.
7. The spot welding jig for the mobile phone motherboard bracket according to claim 1, characterized in that: a bottom die notch (17) is formed in the edge portion of the left end and the edge portion of the right end of the lower bottom die (1), and a pressing plate notch (23) is formed in the edge portion of the left end and the edge portion of the right end of the upper pressing plate (2);
when the upper end pressing plate (2) and the lower end bottom die (1) are closed, each bottom die notch (17) is respectively aligned with the corresponding side pressing plate notch (23).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202123155057.3U CN216656927U (en) | 2021-12-16 | 2021-12-16 | Spot welding jig for mobile phone motherboard support |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202123155057.3U CN216656927U (en) | 2021-12-16 | 2021-12-16 | Spot welding jig for mobile phone motherboard support |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN216656927U true CN216656927U (en) | 2022-06-03 |
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ID=81794775
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202123155057.3U Active CN216656927U (en) | 2021-12-16 | 2021-12-16 | Spot welding jig for mobile phone motherboard support |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN216656927U (en) |
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2021
- 2021-12-16 CN CN202123155057.3U patent/CN216656927U/en active Active
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