CN216656927U - Spot welding jig for mobile phone motherboard support - Google Patents

Abstract

The utility model discloses a spot welding fixture for a mobile phone mainboard bracket, comprising a bottom mold at a lower end, a pressing plate at an upper end, a bracket placement area on the upper surface of the lower end mold, and a bracket positioning column in the bracket placement area; The lower surface of the bottom mold is provided with an escape hole that communicates with the limit copying groove; the bottom mold of the lower end is provided with at least two bottom mold mounting holes arranged at intervals, and each bottom mold mounting hole is respectively embedded in the bottom mold There are bottom mold magnets; each bottom mold mounting hole of the upper end pressing plate corresponding to the lower bottom bottom mold is respectively provided with a pressing plate mounting hole, and each pressing plate mounting hole is respectively embedded with a pressing plate magnet; when the lower bottom bottom mold and the upper end pressing plate are closed, each bottom mold magnet They are magnetically attached to the corresponding platen magnets, respectively. Through the above-mentioned structural design, the utility model has the advantages of novel structural design and convenient use, and can effectively improve the spot welding efficiency between the mobile phone mainboard bracket and the elastic sheet.

Description

A mobile phone motherboard bracket spot welding fixture

technical field

The utility model relates to the technical field of mobile phone processing jigs, in particular to a spot welding jig for a mainboard bracket of a mobile phone.

Background technique

In the process of mobile phone production and processing, the mobile phone motherboard bracket of the mobile phone needs to be welded with shrapnel, and the mobile phone motherboard bracket and the shrapnel are generally welded together by spot welding.

In the prior art, due to the lack of effective jig products, the actual spot welding operation has the defects of low spot welding efficiency and low yield rate.

Utility model content

The purpose of the utility model is to provide a mobile phone motherboard bracket spot welding fixture for the deficiencies of the prior art. The mobile phone motherboard bracket spot welding fixture has a novel structure in design, is convenient to use, and can effectively improve the distance between the mobile phone motherboard bracket and the spring. Spot welding efficiency.

In order to achieve the above-mentioned purpose, the utility model is realized through the following technical solutions.

A mobile phone motherboard bracket spot welding fixture, comprising a lower end bottom mold and an upper end pressure plate respectively arranged horizontally and horizontally, the lower end bottom mold is located on the lower end side of the upper end pressure plate, the upper surface of the lower end bottom mold is provided with a bracket placement area, and the bracket placement area A bracket positioning column is provided which protrudes upward and corresponds to the through hole of the motherboard bracket;

The bottom mold of the lower end is provided with a limit profiling groove in the bracket placement area, and the lower surface of the bottom mold of the lower end is provided with an escape hole communicating with the limit profiling groove;

The bottom bottom mold is provided with at least two bottom mold mounting holes arranged at intervals, and bottom mold magnets are embedded in each bottom mold mounting hole respectively; the bottom mold mounting holes corresponding to the lower bottom bottom mold are respectively provided with press plate mounting holes. The pressing plate mounting holes are respectively embedded with pressing plate magnets; when the lower bottom mold and the upper pressing plate are closed, the bottom mold magnets are respectively magnetically attracted to the corresponding pressing plate magnets.

Wherein, the bottom bottom mold at the lower end is provided with four bottom mold mounting holes which are distributed in a rectangular shape and open downward respectively, and a bottom mold magnet is embedded in each bottom mold mounting hole respectively;

The upper pressure plate is provided with four pressure plate mounting holes which are distributed in a rectangular shape and open upward respectively, and a pressure plate magnet is embedded in each of the pressure plate mounting holes.

Wherein, the front edge part and the rear edge part of the lower end bottom mold are respectively provided with positioning grooves, and the front edge part and the rear edge part of the upper end pressing plate are respectively provided with downwardly protruding positioning protrusions;

When the upper end pressing plate and the lower end bottom mold are closed, the positioning protrusions of the upper end pressing plate are respectively embedded into the positioning grooves on the corresponding sides of the lower end bottom mold.

Wherein, the bracket positioning column and the lower bottom mold are integral structure.

Wherein, the bottom mold of the lower end is provided with a positioning column installation hole that opens upward corresponding to the bracket positioning column, and the lower end of the bracket positioning column is embedded in the positioning column installation hole.

Wherein, the lower end opening of the hollow hole is in a flared shape.

Wherein, the left end edge portion and the right end edge portion of the lower end bottom mold are respectively provided with bottom mold gaps, and the left end edge portion and the right end edge portion of the upper end pressing plate are respectively provided with pressing plate gaps;

When the upper end pressing plate and the lower end bottom mold are closed, the notches of each bottom mold are respectively aligned with the notches of the pressing plate on the corresponding side.

The beneficial effects of the utility model are as follows: the mobile phone motherboard bracket spot welding fixture described in the utility model comprises a lower end bottom die and an upper end pressing plate respectively arranged horizontally and horizontally, and the lower end bottom die is located on the lower end side of the upper end pressing plate, The upper surface of the lower end bottom mold is provided with a bracket placement area, and the bracket placement area is provided with a bracket positioning column that protrudes upward and corresponds to the through hole of the motherboard bracket; The lower surface of the lower end bottom mold is provided with an escape hole communicating with the limit copying groove; the lower end bottom mold is provided with at least two bottom mold mounting holes arranged at intervals, and bottom mold magnets are respectively embedded in each bottom mold mounting hole; Each bottom mold mounting hole of the upper end plate corresponding to the lower end bottom mold is respectively provided with a platen mounting hole, and a platen magnet is embedded in each platen mounting hole; Magnetic adsorption. Through the above-mentioned structural design, the utility model has the advantages of novel structural design and convenient use, and can effectively improve the spot welding efficiency between the mobile phone mainboard bracket and the elastic sheet.

Description of drawings

The present utility model will be further described below with reference to the accompanying drawings, but the embodiments in the accompanying drawings do not constitute any limitation to the present utility model.

Figure 1 is a schematic structural diagram of the utility model.

FIG. 2 is an exploded schematic view of FIG. 1 .

3 is a schematic structural diagram of the present invention from another perspective.

4 is a schematic cross-sectional view of the utility model.

Included in Figures 1 to 4 are:

1——Lower end mold 11——Bracket placement area

12——Bracket positioning column 13——Limited profile groove

14——Escape hole 15——Bottom mold mounting hole

16 - Positioning groove 17 - Bottom die gap

2——The upper pressure plate 21——The mounting hole of the pressure plate

22——Positioning protrusion 23——Notch of pressure plate

31 - Bottom mold magnet 32 - Platen magnet

4 - Mobile phone motherboard bracket 5 - Shrapnel.

Detailed ways

The present invention will be described below with reference to specific embodiments.

As shown in Figures 1 to 4, a mobile phone motherboard bracket spot welding fixture includes a lower end bottom mold 1 and an upper end pressure plate 2 arranged horizontally and horizontally, respectively. The upper surface of the bottom mold 1 is provided with a bracket placement area 11 , and the bracket placement area 11 is provided with bracket positioning posts 12 that protrude upward and correspond to the through holes of the motherboard bracket.

It should be explained that the bracket positioning column 12 of the present invention can be designed with an integrated structure, and of course can also be designed with a split structure; for the bracket positioning column 12 with an integrated structure design, the bracket positioning column 12 and the lower end bottom mold 1. One-piece structure; for the bracket positioning column 12 of the split structure design, the lower end mold 1 corresponding to the bracket positioning column 12 is provided with a positioning column installation hole that opens upward, and the lower end of the bracket positioning column 12 is embedded in the positioning column. in the mounting hole.

Wherein, the lower end bottom mold 1 defines a position-limiting profiling groove 13 in the bracket placement area 11 , and the lower surface of the lower end bottom mold 1 defines an escape hole 14 that communicates with the position-limiting profiling groove 13 .

Further, the bottom bottom mold 1 is provided with at least two bottom mold mounting holes 15 arranged at intervals, and bottom mold magnets 31 are respectively embedded in each bottom mold mounting hole 15; The holes 15 are respectively provided with pressure plate mounting holes 21, and pressure plate magnets 32 are respectively embedded in each pressure plate mounting hole 21; when the lower bottom mold 1 and the upper pressure plate 2 are closed, each bottom mold magnet 31 is magnetically attracted to the corresponding pressure plate magnet 32 respectively. .

Preferably, as shown in FIG. 1 to FIG. 3 , the bottom bottom mold 1 is provided with four bottom mold mounting holes 15 distributed in a rectangular shape and opening downward respectively, and a bottom mold magnet 31 is embedded in each bottom mold mounting hole 15 respectively. The upper pressure plate 2 is provided with four pressure plate mounting holes 21 which are distributed in a rectangular shape and open upward respectively, and a pressure plate magnet 32 is embedded in each pressure plate mounting hole 21 respectively.

In the process of using the utility model, first put the elastic piece 5 into the limit copying groove 13 of the bottom mold 1, the limit copying groove 13 adopts the copying design, and the shape of the limit copying groove 13 is the same as that of the elastic piece. The shape of 5 is the same, that is, the limit profiling groove 13 can accurately position the elastic piece 5; after the positioning and placement of the elastic piece 5 is completed, place the mobile phone motherboard bracket 4 in the bracket placement area 11 of the lower end bottom mold 1, and the lower end bottom mold 1 The mobile phone mainboard bracket 4 is positioned by the bracket positioning column 12; after the shrapnel 5 and the mobile phone mainboard bracket 4 have been positioned and placed, the upper end pressing plate 2 is covered on the lower end bottom mold 1, and the magnetic force of the bottom mold magnet 31 and the pressing plate magnet 32 is passed. Adsorption, the mobile phone motherboard bracket 4 and the shrapnel 5 are pressed and fixed between the upper pressure plate 2 and the lower bottom mold 1; during spot welding, the staff will turn the jig with the shrapnel 5 and the phone motherboard bracket 4 over the whole and put it into spot welding The spot welding head of the electric welding machine is inserted into the avoidance hole 14 of the bottom mold 1 at the lower end to perform spot welding operation on the elastic sheet 5 and the mobile phone motherboard bracket 4 .

It should be emphasized that, in the process of using the present utility model to perform spot welding of the mobile phone mainboard bracket 4 and the shrapnel 5, the present utility model can help to improve the problem that the tiny shrapnel 5 cannot be positioned, and also help to improve the deviation caused by manual adjustment of the shrapnel 5. During spot welding, the mobile phone mainboard bracket 4 and the shrapnel are pressed and fixed, which is conducive to improving the occurrence of spot welding virtual welding, which in turn is conducive to improving the quality yield after welding, reducing the time spent on quality inspectors and staff, and reducing material costs. waste.

From the above situation, it can be seen that through the above structural design, the utility model has the advantages of novel structural design and convenient use, and can effectively improve the spot welding efficiency of the mobile phone motherboard bracket 4 and the elastic sheet 5 .

As a preferred embodiment, as shown in FIGS. 1 to 3 , in order to improve the accuracy when the lower end bottom mold 1 and the upper end pressing plate 2 are closed, the present invention adopts the following positioning structure design, specifically: the front end of the lower end bottom mold 1 The edge part and the rear edge part are respectively provided with positioning grooves 16, and the front edge part and the rear edge part of the upper end pressing plate 2 are respectively provided with positioning protrusions 22 that protrude downward; when the upper end pressing plate 2 and the lower end bottom mold 1 are closed , each positioning protrusion 22 of the upper end pressing plate 2 is respectively embedded into the positioning groove 16 on the corresponding side of the lower end bottom mold 1 .

As a preferred embodiment, as shown in FIG. 3 and FIG. 4 , the opening of the lower end of the hollow hole 14 is in a flared shape; Effectively align the escape holes 14 .

As a preferred embodiment, as shown in FIG. 1 to FIG. 4 , the bottom mold notch 17 is respectively opened on the left edge part and the right edge part of the lower end bottom mold 1 , and the left edge part and the right end edge part of the upper end pressing plate 2 are respectively provided with pressing plates Notch 23. When the upper end pressing plate 2 and the lower end bottom mold 1 are closed, each bottom mold notch 17 is aligned with the corresponding side pressing plate notches 23 respectively.

During the use of the utility model, when it is necessary to separate the lower end bottom mold 1 from the upper end pressing plate 2, the staff can hold the position of the bottom mold notch 17 of the lower end bottom mold 1 with one hand, and hold the upper end pressing plate 2 with the other hand. By setting the bottom mold gap 17 and the pressing plate gap 23, the utility model can achieve the purpose of facilitating the operation of the staff, and facilitate the separation of the lower end bottom mold 1 and the upper end pressing plate 2.

The above content is only a preferred embodiment of the present invention. For those of ordinary skill in the art, according to the idea of the present invention, there will be changes in the specific implementation and application scope. The content of this description should not be interpreted as Limitations of the present invention.

Claims (7)

1. A mobile phone motherboard bracket spot welding fixture, characterized in that it comprises a lower end bottom mold (1) and an upper end pressure plate (2) arranged horizontally and horizontally, and the lower end bottom mold (1) is located at the upper end of the upper end pressure plate (2). On the lower end side, the upper surface of the lower end bottom mold (1) is provided with a bracket placement area (11), and the bracket placement area (11) is provided with a bracket positioning column (12) that protrudes upward and corresponds to the through hole of the motherboard bracket ; The lower end bottom mold (1) is provided with a limit profiling groove (13) in the bracket placement area (11), and the lower surface of the lower end bottom mold (1) is provided with an escape hole (14) that communicates with the limit profiling groove (13). ); The bottom bottom mold (1) at the lower end is provided with at least two bottom mold mounting holes (15) arranged at intervals, and bottom mold magnets (31) are respectively embedded in the bottom mold mounting holes (15); the upper end pressing plate (2) corresponds to the bottom bottom mold Each bottom die mounting hole (15) of the die (1) is respectively provided with a pressure plate mounting hole (21), and each pressure plate mounting hole (21) is respectively embedded with a pressure plate magnet (32); When the pressing plate (2) is closed, each bottom mold magnet (31) is magnetically attracted to the corresponding pressing plate magnet (32). 2. A mobile phone motherboard bracket spot welding jig according to claim 1, characterized in that: the bottom bottom mold (1) is provided with four bottom mold mounting holes (15) which are distributed in a rectangular shape and open downward respectively. ), each bottom mold mounting hole (15) is respectively embedded with a bottom mold magnet (31); The upper pressure plate (2) is provided with four pressure plate mounting holes (21) distributed in a rectangular shape and opening upward respectively, and a pressure plate magnet (32) is embedded in each pressure plate mounting hole (21). 3. A mobile phone motherboard bracket spot welding fixture according to claim 1, characterized in that: the front edge portion and the rear edge portion of the lower bottom mold (1) are respectively provided with positioning grooves (16), The front end edge portion and the rear end edge portion of the upper end pressing plate (2) are respectively provided with downwardly protruding positioning protrusions (22); When the upper end pressing plate (2) and the lower end bottom mold (1) are closed, the positioning protrusions (22) of the upper end pressing plate (2) are respectively embedded into the positioning grooves (16) on the corresponding sides of the lower end bottom mold (1). 4. A mobile phone motherboard bracket spot welding jig according to claim 1, characterized in that: the bracket positioning column (12) and the lower bottom mold (1) are integrally constructed. 5. A mobile phone motherboard bracket spot welding jig according to claim 1, characterized in that: the lower bottom mold (1) is provided with a positioning column mounting hole that opens upwards corresponding to the bracket positioning column (12). , the lower end of the bracket positioning column (12) is embedded in the positioning column mounting hole. 6 . The spot welding jig for a mainboard bracket of a mobile phone according to claim 1 , characterized in that: the lower end opening of the hollow hole ( 14 ) is in a flared shape. 7 . 7. A mobile phone motherboard bracket spot welding jig according to claim 1, characterized in that: the left end edge portion and the right end edge portion of the lower end bottom mold (1) are respectively provided with bottom mold gaps (17), so The left end edge portion and the right end edge portion of the upper end pressing plate (2) are respectively provided with pressing plate notches (23); When the upper end pressing plate (2) and the lower end bottom mold (1) are closed, each bottom mold notch (17) is aligned with the corresponding side pressing plate notch (23).

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