CN216655700U - Clamping device for etching or cleaning circuit board - Google Patents
Clamping device for etching or cleaning circuit board Download PDFInfo
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- CN216655700U CN216655700U CN202123298247.0U CN202123298247U CN216655700U CN 216655700 U CN216655700 U CN 216655700U CN 202123298247 U CN202123298247 U CN 202123298247U CN 216655700 U CN216655700 U CN 216655700U
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- circuit board
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Abstract
The clamping device for etching or cleaning the circuit board comprises a first clamping plate and a second clamping plate which are rotatably connected with each other, and further comprises a clamping piece and an auxiliary piece, wherein a positioning area is arranged between the clamping piece and the second clamping plate, and when the auxiliary piece is positioned at a first position, the auxiliary piece and the positioning area are oppositely arranged in a spaced mode; when the auxiliary piece rotates to the second position, at least one part of the auxiliary piece is inserted into the positioning area and clamped between the clamping piece and the second clamping plate. When the clamping device clamps a circuit board with thicker thickness and the auxiliary piece is positioned at the first position, the clamping piece is rotated, so that the circuit board can be reliably clamped by the first clamping plate and the second clamping plate; when the clamping device clamps the circuit board with a thin thickness, the auxiliary part rotates to the second position, so that the first clamping plate and the second clamping plate reliably clamp the circuit board, therefore, the clamping device can clamp the circuit boards with different thicknesses, the universality of the clamping device is realized, and the large-scale production of the circuit board is facilitated.
Description
Technical Field
The utility model relates to the technical field of circuit boards, in particular to a clamping device for etching or cleaning a circuit board.
Background
At present, in the manufacture of circuit boards such as PCBs, FPCs, etc., plasma etching or cleaning is often required, and when etching or cleaning is performed, the circuit board needs to be fixed to perform the process. In the prior art, the circuit boards are positioned on the clamping devices, however, different circuit boards are different in thickness, the thickness clamping size cannot be adjusted by the existing clamping devices, each clamping device can only clamp a circuit board with a single thickness, and the circuit boards with different thicknesses need to be clamped by different clamping devices, so that the clamping devices cannot be generalized, and the large-scale production of the circuit boards is inconvenient.
SUMMERY OF THE UTILITY MODEL
In order to overcome the defects of the prior art, the utility model aims to provide a clamping device for etching or cleaning circuit boards, which is convenient for large-scale production of the circuit boards.
In order to achieve the above object, the present invention provides a clamping device for etching or cleaning a circuit board, comprising a first clamping plate and a second clamping plate rotatably connected to each other, the clamping device further comprising a clamping member and an auxiliary member, the clamping member being rotatably connected to the first clamping plate, the auxiliary member being rotatably connected to the second clamping plate; a positioning area is arranged between the clamping piece and the second clamping plate, and when the auxiliary piece is positioned at the first position, the auxiliary piece and the positioning area are oppositely arranged in a spaced mode; when the auxiliary piece rotates to the second position, at least one part of the auxiliary piece is inserted into the positioning area and clamped between the clamping piece and the second clamping plate.
According to the scheme, when the clamping device clamps the circuit board with thicker thickness, the auxiliary piece is positioned at the first position, the auxiliary piece and the positioning area are arranged oppositely in a spaced mode, the auxiliary piece is not positioned in the positioning area, and the clamping piece is rotated to apply force to the first clamping plate and the second clamping plate, so that the circuit board is reliably clamped by the first clamping plate and the second clamping plate; when the clamping device clamps the circuit board with a thin thickness, the auxiliary piece rotates to the second position, at least one part of the auxiliary piece is inserted into the positioning area and clamped between the clamping piece and the second clamping plate, the clamping piece applies force to the auxiliary piece and the first clamping plate, and the auxiliary piece applies force to the second clamping plate, so that the first clamping plate and the second clamping plate reliably clamp the circuit board.
Preferably, the clamping member comprises a first portion, a second portion and a connecting portion, the connecting portion connects the first portion and the second portion, the first portion is rotatably connected to the first clamping plate, and the positioning portion is located between the second portion and the second clamping plate.
Furthermore, the first part and the second part are arranged in parallel.
Further, the connecting portion is perpendicular to the first portion and the second portion respectively.
Further, the first rotating shaft member of the clamping device passes through the first portion and is inserted into the first clamping plate.
Further, the second rotating shaft member of the clamping device passes through the auxiliary member and is inserted into the second clamping plate.
Preferably, the first clamping plate is provided with a positioning protrusion, and the positioning protrusion extends from the first clamping surface of the first clamping plate to the second clamping plate.
Furthermore, the second clamping plate is provided with a positioning groove which is concave to the inner side of the second clamping plate relative to the second clamping surface of the second clamping plate.
Furthermore, the height difference between the top surface of the positioning protrusion and the first clamping surface is smaller than the height difference between the bottom surface of the positioning groove and the second clamping surface.
Preferably, the first clamping plate is provided with a positioning groove which is concave to the inner side of the first clamping plate relative to the first clamping surface of the first clamping plate; the second clamping plate is provided with a positioning protrusion, and the positioning protrusion extends from the second clamping surface of the second clamping plate to the second clamping plate; the height difference between the top surface of the positioning protrusion and the first clamping surface is smaller than the height difference between the bottom surface of the positioning groove and the second clamping surface.
Compared with the prior art, the utility model has the beneficial effects that:
when the clamping device clamps a circuit board with thicker thickness, the auxiliary piece is positioned at the first position, the auxiliary piece and the positioning area are oppositely arranged in a spaced mode, the auxiliary piece is not positioned in the positioning area, and the clamping piece is rotated to apply force to the first clamping plate and the second clamping plate, so that the circuit board is reliably clamped by the first clamping plate and the second clamping plate; when the clamping device clamps the circuit board with the small thickness, the auxiliary piece rotates to the second position, at least one part of the auxiliary piece is inserted into the positioning area and clamped by the clamping piece and the second clamping plate, the clamping piece applies force to the auxiliary piece and the first clamping plate, and the auxiliary piece applies force to the second clamping plate, so that the first clamping plate and the second clamping plate reliably clamp the circuit board, therefore, the clamping device can clamp the circuit boards with different thicknesses, the universality of the clamping device is realized, and the large-scale production of the circuit board is facilitated.
The utility model is described in further detail below with reference to the drawings and the detailed description.
Drawings
The utility model is further illustrated by means of the attached drawings, but the embodiments in the drawings do not constitute any limitation to the utility model, and for a person skilled in the art, other drawings can be derived on the basis of the following drawings without inventive effort.
Fig. 1 is a structural diagram of a first embodiment of a clamping device for etching or cleaning a circuit board according to the utility model.
Fig. 2 is an enlarged view of a portion of the structure shown in fig. 1 at a.
Fig. 3 is an enlarged view of a first clamping plate of a first embodiment of a clamping device for etching or cleaning a circuit board according to the utility model.
Fig. 4 is an enlarged view of a portion of the structure shown in fig. 3 at B.
Fig. 5 is an enlarged view of a second clamping plate of the first embodiment of the clamping device for etching or cleaning the circuit board.
Fig. 6 is an enlarged view of a portion of the structure shown in fig. 5 at C.
The reference numbers illustrate: a holding device 100; a first splint 1; a second splint 2; a holder 3; an auxiliary member 4; a positioning area 5; a first portion 6; a second portion 7; a connecting portion 8; a positioning protrusion 9; a first clamping surface 10; a positioning groove 11; a second clamping surface 12.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention more apparent, the present invention is described in further detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the utility model and are not intended to limit the utility model.
First embodiment
Referring to fig. 1 and 2, the clamping device 100 for etching or cleaning a circuit board provided in this embodiment includes a first clamping plate 1 and a second clamping plate 2 rotatably connected to each other, wherein the first clamping plate 1 is hinged to the second clamping plate 2.
The clamping device 100 further comprises a clamping member 3 and an auxiliary member 4, the clamping member 3 is rotatably connected to the first clamping plate 1, the auxiliary member 4 is rotatably connected to the second clamping plate 2, and a positioning area 5 is arranged between the clamping member 3 and the second clamping plate 2.
The clamping piece 3 comprises a first portion 6, a second portion 7 and a connecting portion 8, the connecting portion 8 connects the first portion 6 and the second portion 7, the first portion 6 is rotatably connected to the first clamping plate 1, and the positioning area 5 is located between the second portion 7 and the second clamping plate 2.
The first portion 6 and the second portion 7 are arranged parallel to each other.
The connecting portion 8 is perpendicular to the first portion 6 and the second portion 7, respectively.
The first rotating shaft member of the clamping device passes through the first portion 6 and is inserted into the first clamping plate 1, and the first rotating shaft member can be selected from a positioning pin.
The second rotating shaft member of the clamping device passes through the auxiliary member 4 and is inserted into the second clamping plate 2, and the second rotating shaft member can be selected from a positioning pin.
Referring to fig. 1, 3 and 4, the first clamping plate 1 is provided with a positioning protrusion 9, and the positioning protrusion 9 extends from the first clamping surface 10 of the first clamping plate 1 to the second clamping plate 2.
Referring to fig. 1, 5 and 6, the second clamping plate 2 is provided with a positioning groove 11, and the positioning groove 11 is recessed towards the inner side of the second clamping plate 2 relative to the second clamping surface 12 of the second clamping plate 2.
The height difference H1 between the top surface of the positioning protrusion 9 and the first clamping surface 10 is 0.4-0.6 mm less than the height difference H2 between the bottom surface of the positioning groove 11 and the second clamping surface 12. In the present embodiment, the height difference H1 is 0.5mm less than the height difference H2.
When the auxiliary part 4 is positioned at the first position, the auxiliary part 4 and the positioning area 5 are arranged oppositely in a spaced mode; when the auxiliary member 4 is rotated to the second position, at least a portion of the auxiliary member 4 is inserted into the positioning area 5 and clamped between the clamping member 3 and the second clamping plate 2.
Referring to fig. 1 to 6, when the clamping device 100 clamps a circuit board with a relatively thick thickness, when the auxiliary member 4 is located at the first position, the auxiliary member 4 and the positioning area 5 are arranged opposite to each other in a spaced manner, the auxiliary member 4 is not located in the positioning area 5, and the clamping member 3 is rotated to apply a force to the first clamping plate 1 and the second clamping plate 2, so that the first clamping plate 1 and the second clamping plate 2 reliably clamp the circuit board; when the clamping device 100 clamps the circuit board with a relatively thin thickness, the auxiliary member 4 rotates to the second position, at least a part of the auxiliary member 4 is inserted into the positioning area 5 and clamped between the clamping member 3 and the second clamping plate 2, the clamping member 3 applies force to the auxiliary member 4 and the first clamping plate 1, and the auxiliary member 4 applies force to the second clamping plate 2, so that the circuit board can be reliably clamped by the first clamping plate 1 and the second clamping plate 2, therefore, the clamping device can clamp circuit boards with different thicknesses, the universality of the clamping device is realized, and the large-scale production of the circuit board is facilitated.
The height difference H1 between the top surface of the positioning protrusion 9 and the first clamping surface 10 is 0.4-0.6 mm less than the height difference H2 between the bottom surface of the positioning slot 11 and the second clamping surface 12, so that dimensional pressurization is formed between the first clamping plate 1 and the second clamping plate 2, the circuit board is further clamped, and the clamping reliability of the clamping device 100 is enhanced.
Second embodiment
The first clamping plate 1 is provided with a positioning groove which is concave to the inner side of the first clamping plate 1 relative to the first clamping surface of the first clamping plate 1; the second clamping plate 2 is provided with a positioning protrusion, and the positioning protrusion extends from the second clamping surface of the second clamping plate 2 to the second clamping plate 2; the height difference between the top surface of the positioning protrusion and the first clamping surface is 0.4-0.6 mm less than that between the bottom surface of the positioning groove and the second clamping surface.
The rest of the structure is the same as the first embodiment, and is not described herein again.
In the present invention, unless otherwise explicitly stated or limited, the terms "connected" and "positioned" are to be understood broadly, and may be, for example, fixedly connected, clamped in place, detachably connected, or integrated; either directly or indirectly through intervening media, either internally or in any other relationship. The specific meanings of the above terms in the present invention can be understood by those skilled in the art according to specific situations.
The above embodiments are only preferred embodiments of the present invention, and the protection scope of the present invention is not limited thereby, and any insubstantial changes and substitutions made by those skilled in the art based on the present invention are within the protection scope of the present invention.
Finally, it should be emphasized that the present invention is not limited to the above-described embodiments, but only the preferred embodiments of the utility model have been described above, and the present invention is not limited to the above-described embodiments, and any modifications, equivalent substitutions, improvements, etc. within the spirit and principle of the present invention should be included in the protection scope of the present invention.
Claims (10)
1. A clamping device for circuit board etching or washing, includes mutual rotatable coupling's first splint and second splint, its characterized in that:
the clamping device further comprises a clamping piece and an auxiliary piece, the clamping piece is rotatably connected to the first clamping plate, and the auxiliary piece is rotatably connected to the second clamping plate;
a positioning area is arranged between the clamping piece and the second clamping plate, and when the auxiliary piece is positioned at the first position, the auxiliary piece and the positioning area are arranged oppositely in a spaced mode;
when the auxiliary piece rotates to the second position, at least one part of the auxiliary piece is inserted into the positioning area and clamped between the clamping piece and the second clamping plate.
2. A clamping device for circuit board etching or cleaning according to claim 1, wherein:
the clamping piece comprises a first portion, a second portion and a connecting portion, the connecting portion is connected with the first portion and the second portion, the first portion is rotatably connected with the first clamping plate, and the positioning area is located between the second portion and the second clamping plate.
3. A clamping device for circuit board etching or cleaning according to claim 2, wherein:
the first portion and the second portion are arranged in parallel.
4. A clamping device for circuit board etching or cleaning according to claim 3, wherein:
the connecting portions are perpendicular to the first portion and the second portion, respectively.
5. A clamping device for circuit board etching or cleaning according to claim 4, characterized in that:
the first rotating shaft piece of the clamping device penetrates through the first part and is inserted into the first clamping plate.
6. A clamping device for circuit board etching or cleaning according to claim 5, characterized in that:
and a second rotating shaft piece of the clamping device penetrates through the auxiliary piece and is inserted into the second clamping plate.
7. A holding device for circuit board etching or cleaning according to any one of claims 1 to 6, wherein:
first splint are equipped with the location protrudingly, the location is protruding from the first clamping face of first splint toward the second splint extend.
8. A clamping device for circuit board etching or cleaning according to claim 7, wherein:
the second splint is provided with a positioning groove which is concave to the inner side of the second splint relative to the second clamping surface of the second splint.
9. A clamping device for circuit board etching or cleaning according to claim 8, wherein:
the height difference between the top surface of the positioning protrusion and the first clamping surface is smaller than the height difference between the bottom surface of the positioning groove and the second clamping surface.
10. A holding device for circuit board etching or cleaning according to any one of claims 1 to 6, wherein:
the first clamping plate is provided with a positioning groove which is concave to the inner side of the first clamping plate relative to the first clamping surface of the first clamping plate;
the second clamping plate is provided with a positioning protrusion, and the positioning protrusion extends from a second clamping surface of the second clamping plate to the second clamping plate;
the height difference between the top surface of the positioning protrusion and the first clamping surface is smaller than the height difference between the bottom surface of the positioning groove and the second clamping surface.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202123298247.0U CN216655700U (en) | 2021-12-23 | 2021-12-23 | Clamping device for etching or cleaning circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202123298247.0U CN216655700U (en) | 2021-12-23 | 2021-12-23 | Clamping device for etching or cleaning circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN216655700U true CN216655700U (en) | 2022-06-03 |
Family
ID=81799306
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202123298247.0U Active CN216655700U (en) | 2021-12-23 | 2021-12-23 | Clamping device for etching or cleaning circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN216655700U (en) |
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2021
- 2021-12-23 CN CN202123298247.0U patent/CN216655700U/en active Active
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