CN216655151U - Siphon module gumming device - Google Patents

Abstract

The utility model relates to the field of workpiece gluing, and discloses a siphon module glue dipping device, which comprises: mounting disc and mount pad, mounting disc fixed connection on the mount pad, the open-top of mounting disc is equipped with the baffle in the mounting disc, and the baffle separates the mounting disc for first recess and second recess. The utility model has the beneficial effects that: the baffle is used for accepting the lid, and first recess and second recess are used for holding glue respectively and hold the lid, directly put the lid and can accomplish the rubber coating on the rubber coating device, and the packaging efficiency is high, and even no breakpoint is paintd to glue, reduction in production cost when guaranteeing product quality.

Description

Siphon module gumming device

Technical Field

The utility model relates to the field of workpiece gluing, in particular to a siphon module glue dipping device.

Background

In a building drainage system, a floor drain is a very common drainage device, a floor drain assembly usually needs to adopt a siphon effect to introduce water into a drain pipe so as to achieve the purpose of improving the drainage effect, and therefore the floor drain assembly usually can be provided with a siphon module.

As shown in fig. 1 and 2, the siphon module is generally assembled by a base 1 and a cover 2, which are adhered together by glue, and the cover is provided with a socket 21 and a cylinder 22, at present, the glue is generally applied by hand at the socket 21 of the cover 2 or the socket 11 of the base 1, and then sleeved together and kept for a while until the glue is solidified so as to be adhered together to form a whole. However, this way of applying glue to the hands has the following drawbacks: 1. the assembly efficiency is low and the production cost is high; 2. the coating is not uniform, and the glue is easy to break to cause water leakage; 3. the glue is easy to be attached to the outer surface, which affects the appearance and causes customer complaints. Therefore, a glue applying device of a siphon module is needed to solve the above problems.

SUMMERY OF THE UTILITY MODEL

The utility model provides a siphon module gumming device, it can paint glue for the lid of siphon module high efficiency to the rubber coating is effectual, improves product competitiveness.

The purpose of the application is realized by the following technical scheme:

a siphon module gumming apparatus, comprising: mounting disc and mount pad, mounting disc fixed connection in on the mount pad, the top of mounting disc has the holding chamber, be equipped with the baffle that is used for accepting the lid of siphon module in the holding chamber, the baffle will the holding chamber is separated for first recess and second recess, first recess is used for holding glue, the second recess is used for the lid bottom of holding siphon module.

In some embodiments of the present application, a through hole is formed in a bottom surface of the second groove, and the through hole is used for the cylinder of the cover to pass through and to be positioned in cooperation with the cover.

In some embodiments of the present application, the baffle is shaped to conform to the peripheral contour of the lid of the siphon module.

In some embodiments of the present application, a marking line for indicating the height of the glue level is disposed on the outer circumferential surface of the partition.

In some embodiments of the present application, the designation line is located more than half of the height of the partition.

In some embodiments of the present application, the mounting base includes two support legs, the support legs are fixedly connected to the opposite side walls of the mounting plate by bolts.

In some embodiments of this application, the supporting legs includes riser and diaphragm, the riser with diaphragm angulation fixed connection, the riser pass through bolt fixed connection in on the relative lateral wall of mounting disc, the diaphragm is located the bottom of riser.

In some embodiments of the present application, the riser with diaphragm integrated into one piece, just the riser with the hookup location of diaphragm forms the fillet.

In some embodiments of the present application, the top of the mounting plate is higher than the top of the spacer plate.

In some embodiments of the present application, the mounting plate has a square structure when viewed from the top of the gumming apparatus.

The utility model provides a siphon module gumming device, mount pad cooperation mounting disc makes the application device can fix and lays on various planes, the second recess holds the inboard structure of lid, the lid that makes the siphon module can overlap joint on the baffle, the socket of lid stretches into in the first recess, thereby glue is stained with at the internal and external surface of socket, glue evenly coats on the socket, no breakpoint, effectively solve leaking and the excessive problem that glue is inhomogeneous to lead to, and only need with the lid place on the mounting disc can, the operation is simple and convenient, high assembly efficiency, and low in production cost.

Drawings

FIG. 1 is a schematic view of the installation structure of the siphon module according to the present embodiment;

FIG. 2 is an exploded view of the siphon module of the present solution;

FIG. 3 is a schematic structural view of the glue spreading device of the present embodiment;

FIG. 4 is a schematic structural diagram of the siphon module of the present embodiment when the cover is lapped on the partition of the glue applicator;

fig. 5 is a vertical sectional view of fig. 4.

In the figure, 1, a base; 11. a socket; 2. a cover; 21. a socket; 22. a barrel; 3. mounting a disc; 31. an accommodating cavity; 32. a partition plate; 33. a first groove; 34. a second groove; 35. a through hole; 36. marking a line; 4. a mounting seat; 41. supporting legs; 42. a vertical plate; 43. a transverse plate.

Detailed Description

The following detailed description of embodiments of the present invention is provided in connection with the accompanying drawings and examples. The following examples are intended to illustrate the utility model but are not intended to limit the scope of the utility model.

In the description of the present application, it should be understood that the terms "upper", "lower", "left", "right", "front", "rear", "inner", "outer", "top", "bottom", "circumferential", "center", and the like used herein indicate orientations or positional relationships based on those shown in the drawings, and are only for convenience in describing the present invention and simplifying the description, but do not indicate or imply that the device or element being referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus, should not be construed as limiting the present invention. Furthermore, the terms "first" and "second" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.

As shown in fig. 3 to 5, an embodiment of the present application provides a siphon module glue dipping apparatus, including: the method comprises the following steps: mounting disc 3 and mount pad 4, mounting disc 3 fixed connection in on the mount pad 4, the top of mounting disc 3 has holding chamber 31, be equipped with the baffle 32 that is used for accepting lid 2 of siphon module in the holding chamber 31, baffle 32 will holding chamber 31 separates for first recess 33 and second recess 34, first recess 33 is used for holding glue, second recess 34 is used for holding lid 2 bottom of siphon module.

Based on above-mentioned technical scheme, mount pad 4 cooperation mounting disc 3 makes the painting device can fix and lay on various planes, and the bottom surface of mount pad 4 is preferably parallel with mounting disc 3 for mounting disc 3 keeps the level when mount pad 4 places on general plane. Second recess 34 holds the inboard structure of lid 2, make lid 2 of siphon module can the overlap joint on baffle 32, can not take place to interfere with mounting disc 3, at this moment, socket 21 on the border of lid 2 just can stretch into inside first recess 33, first recess 33 is used for holding glue, thereby make the interior external surface of socket 21 be stained with glue, glue can coat uniformly on socket 21 and do not have the breakpoint, effectively solve the inhomogeneous leaking and excessive problem that leads to of glue, and only need with lid 2 place on mounting disc 3 can, the operation is simple and convenient, the packaging efficiency is high, and the production cost is reduced.

In some embodiments of the present application, as shown in fig. 3 to 5, a through hole 35 is opened on a bottom surface of the second groove 34 for the cylinder 22 of the cover 2 to pass through and to be positioned in cooperation with the cover 2. Because the cover 2 of the siphon module is provided with the cylinder 22 extending downwards, the corresponding position on the bottom surface of the second groove 34 can be provided with the through hole 35 for the cylinder 22 to pass through, and the shape of the through hole 35 is matched with that of the cylinder 22, so that the positioning function is realized, and the cover 2 can be lapped on the partition plate 32.

In some embodiments of the present application, the partition 32 is shaped to conform to the peripheral contour of the lid 2 of the siphon module, as shown in figure 3. The shape of the cover 2 of the siphon module is similar to that of a long hole, so that the partition plate 32 can be arranged in the shape of the long hole to better play a role in overlapping, and the phenomenon that the cover 2 is uneven after being placed in place due to unmatched shapes, so that the gluing quality is influenced is avoided.

In some embodiments of the present application, as shown in fig. 3, the outer periphery of the partition 32 is provided with a marking line 36 for indicating the level of glue. After the cover 2 is lapped on the partition plate 32, the inserting opening 21 of the cover 2 is in a suspended state, if the added glue is too little, the inserting opening 21 cannot be submerged below the liquid level of the glue, the glue cannot be coated, therefore, a liquid level height marking line 36 of the glue needs to be arranged, the liquid level of the added glue needs to be higher than the marking line 36, and the fact that the inserting opening 21 can be coated with the glue is guaranteed.

Specifically, as shown in FIG. 3, the indicator line 36 is located more than half the height of the partition 32. In order to ensure the gluing quality, the glue is applied to at least half or more of the total height of the insertion opening 21 of the cover 2 to ensure that the cover 2 is firmly adhered to the base 1, and therefore the height of the indication line 36 is higher than half of the height of the partition 32 to ensure the gluing quality.

In some embodiments of the present application, as shown in fig. 3 to 5, the mounting base 4 includes two supporting legs 41, and the supporting legs 41 are fixedly connected to the opposite side walls of the mounting plate 3 through bolts. The mounting disc 3 is elevated through the two supporting legs 41, the cover 2 can be lapped on the partition plate 32, the two supporting legs 41 can place the mounting disc 3 stably, the bolt is fixedly connected reliably, the operation is convenient, and meanwhile, different mounting seats 4 can be replaced by detachable functions of the mounting disc, so that the mounting disc is suitable for different use conditions.

Specifically, as shown in fig. 3 to 5, the supporting foot 41 includes a vertical plate 42 and a horizontal plate 43, the vertical plate 42 and the horizontal plate 43 are fixedly connected at an angle, the vertical plate 42 is fixedly connected to the opposite side walls of the mounting plate 3 by bolts, and the horizontal plate 43 is disposed at the bottom of the vertical plate 42. The vertical plate 42 and the transverse plate 43 are preferably connected at 90 degrees, and the vertical plate 42 is fixedly arranged on the opposite side wall of the mounting disc 3 to play a role in lifting the mounting disc 3 and avoid interference; the horizontal plate 43 is arranged at the bottom of the vertical plate 42 and can be conveniently and stably placed on the platform.

More specifically, as shown in fig. 3-5, the vertical plate 42 and the transverse plate 43 are integrally formed, and the connecting position of the vertical plate 42 and the transverse plate 43 forms a round corner. Riser 42 and diaphragm 43 integrated into one piece, the preparation is convenient simple, and sharp limit and burr can be got rid of to the two hookup location radius angle, improves the security, and the shaping is also easier simultaneously.

In some embodiments of the present application, as shown in fig. 5, the top of the mounting plate 3 is higher than the top of the partition plate 32. Since the first recess 33 is required to accommodate glue, if the height of the mounting plate 3 is lower than the height of the partition 32, the glue level can only reach the height of the lower mounting plate 3, and if the partition 32 is required to receive the cover 2, the insertion opening 21 at the outer edge of the cover 2 is likely not to contact the glue level, so that the glue cannot be applied, and therefore, the height of the mounting plate 3 is required to be greater than the height of the partition 32.

In some embodiments of the present application, as shown in fig. 3 and 4, the mounting plate 3 has a square structure when viewed from the top of the gumming apparatus. The square-structured mounting plate 3 is easier to mold, and more molding modes can be selected, so that the shape of the mounting plate 3 is more suitable.

The working process of the scheme is as follows: firstly, the gluing device is placed on a plane, the mounting plate 3 is horizontally arranged, glue is poured into the first groove 33 and is required to be higher than the indication line 36, then the cover 2 is taken off from the siphon module, the cylinder 22 is aligned with the through hole 35 on the bottom surface of the second groove 34, the cover 2 is lapped on the partition plate 32, the inserting opening 21 on the outer edge of the cover 2 is immersed below the glue level in the first groove 33, then the cover 2 is taken out, the inserting opening 21 of the cover 2 is aligned with the socket 11 of the base 1, the glue is flattened and positioned for a period of time by hands or a punch, and the glue is solidified, and the assembly is completed.

In conclusion, the siphon module gumming device of this application, mount pad 4 cooperation mounting disc 3 makes the application device can fix and lay on various planes, second recess 34 holds the inboard structure of lid 2, make the lid 2 of siphon module can the overlap joint on baffle 32, the socket 21 of lid 2 stretches into in first recess 33, thereby glue is stained with on the internal and external surface at socket 21, glue evenly coats on socket 21, no breakpoint, effectively solve the inhomogeneous water and the excessive problem of leaking that leads to of glue, and only need with lid 2 place on mounting disc 3 can, and easy operation is convenient, high assembly efficiency, and low in production cost.

The foregoing is only a preferred embodiment of the present application, and it should be noted that, for those skilled in the art, several modifications and substitutions can be made without departing from the technical principle of the present application, and these modifications and substitutions should also be regarded as the protection scope of the present application.

Claims (10)

1. A siphon module gumming device which is characterized by comprising: mounting disc and mount pad, mounting disc fixed connection in on the mount pad, the top of mounting disc has the holding chamber, be equipped with the baffle that is used for accepting the lid of siphon module in the holding chamber, the baffle will the holding chamber is separated for first recess and second recess, first recess is used for holding glue, the second recess is used for the lid bottom of holding siphon module.

2. The siphon module gumming device of claim 1, wherein a through hole for the cylinder of the cover to pass through and to be matched with and positioned on the bottom surface of the second groove is opened.

3. A siphon module dip apparatus according to claim 1, characterised in that the shape of the partition is adapted to the peripheral profile of the lid of the siphon module.

4. The siphon module dipping device according to claim 1, wherein the outer peripheral surface of the partition is provided with a marking line for indicating the height of the glue level.

5. The siphon module dipping device of claim 4, wherein the indication line is located at more than half of the height of the partition.

6. The siphon module dipping device of claim 1, wherein the mounting base comprises two support legs, and the support legs are fixedly connected to the opposite side walls of the mounting plate through bolts.

7. The siphon module gumming device of claim 6, wherein the supporting legs comprise a vertical plate and a transverse plate, the vertical plate and the transverse plate are fixedly connected at an angle, the vertical plate is fixedly connected to the opposite side walls of the mounting plate through bolts, and the transverse plate is arranged at the bottom of the vertical plate.

8. The siphon module gumming device of claim 7, wherein the vertical plate and the transverse plate are integrally formed, and the connecting position of the vertical plate and the transverse plate forms a round angle.

9. The siphon module dipping device of claim 1, wherein the top of the mounting plate is higher than the top of the partition.

10. The siphon module dipping device of claim 1, wherein the mounting plate has a square structure as viewed from the top of the dipping device.

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