CN216650138U

CN216650138U - High-speed array chip mounter

Info

Publication number: CN216650138U
Application number: CN202220111651.8U
Authority: CN
Inventors: 伍远宏; 郭晓卫; 杨钟
Original assignee: Judaxiang Equipment Shenzhen Co ltd
Current assignee: Judaxiang Equipment Shenzhen Co ltd
Priority date: 2022-01-17
Filing date: 2022-01-17
Publication date: 2022-05-31
Anticipated expiration: 2032-01-17

Abstract

The utility model belongs to the technical field of chip mounters and discloses a high-speed array chip mounter which comprises a rack, wherein a chip mounter body is arranged at the top of the rack, a plate conveying frame penetrates through the interior of the chip mounter body, two linear guide rails are symmetrically arranged at the top of the plate conveying frame, a plate supplying table is connected to the tops of the two linear guide rails in a sliding manner, fixed frames are arranged at two ends of the plate supplying table, a screw rod is rotatably connected to the interior of each fixed frame through a bearing, screw sleeves are symmetrically arranged at two ends of the screw rod, and a motor is fixed at one end of the screw rod extending to the exterior of each fixed frame. The accuracy of patch positioning is greatly improved.

Description

High-speed array chip mounter

Technical Field

The utility model belongs to the technical field of chip mounters, and particularly relates to a high-speed array type chip mounter.

Background

The chip mounter is also called a mounter and a surface mounting system, and is configured behind a dispensing machine or a screen printing machine in a production line, the surface mounting system is equipment for accurately placing surface mounting components on a PCB (printed circuit board) pad by moving a mounting head, and in order to achieve high-speed and high-efficiency mounting, 10 or more mounting heads can be mounted on one machine body, so that the chip mounter is called an array chip mounter.

In chinese patent No. CN201310505216.9, a high-speed array chip mounter is disclosed, the device adopts 30 groups of array mounting heads to move synchronously to suck and discharge materials, and complete the high-speed mounting process by using the same technology of taking and discharging, and adopts left and right board feeding, when the machine mounts the circuit board fed in from one side, the staff sends the circuit board on the board table from the other side, so that the staff can be fully utilized, and the production efficiency is improved, but the device still has more defects when in use, for example, the circuit board placed on the board table is not limited and fixed, so that the circuit board is easy to move and displace in the process of transmission and movement, and the position deviation occurs, and the accuracy of the chip mounting positioning is influenced.

SUMMERY OF THE UTILITY MODEL

The utility model aims to provide a high-speed array chip mounter to solve the problem that the accuracy of chip mounting positioning is influenced because circuit boards placed on a board conveying table are not limited and fixed in the background technology.

In order to achieve the purpose, the utility model provides the following technical scheme: the utility model provides a high-speed array chip mounter, which comprises a frame, the chip mounter body is installed at the top of frame, the inside of chip mounter body is run through and is sent the grillage, send the top symmetry of grillage to install two linear guide, two linear guide's the equal sliding connection in top has the confession pallet, the fixed frame is all installed at the both ends that supply the pallet, the inside of fixed frame is rotated through the bearing and is connected with the screw rod, the swivel nut is installed to the both ends symmetry of screw rod, and the screw rod extends to the outside one end of fixed frame and is fixed with the motor, two the lateral wall of swivel nut all articulates there is the dead lever, two the dead lever is kept away from and is articulated to have the connecting plate between the one end of swivel nut, the baffle is installed to the lateral wall of connecting plate, and the baffle is located the top that supplies the pallet.

Preferably, a cavity groove is formed in one side, far away from the connecting plate, of the baffle plate, a spring is fixed inside the cavity groove, and one end, extending to the outside of the cavity groove, of the spring is connected with a clamping plate.

Preferably, the clamping plate is installed on one side, close to the baffle, of the connecting plate, and the clamping groove matched with the clamping plate is formed in the side wall of the baffle.

Preferably, a telescopic cylinder is arranged between the clamping plate and the cavity groove, and the telescopic cylinder is positioned inside the spring.

Preferably, the inner wall of the clamping groove is provided with a rubber pad, and the outer wall of the rubber pad is provided with an anti-slip groove.

Preferably, the bottom of frame is installed the shock pad, the outer wall of motor is provided with the safety cover.

Compared with the prior art, the utility model has the beneficial effects that:

(1) according to the utility model, through the matching of the fixing frame, the screw, the fixing rod, the connecting plate and other structures, the connecting plate can drive the baffles to move, so that the two baffles slowly approach and abut against the circuit board, the circuit board can be limited and fixed, the circuit board is effectively prevented from moving and moving on the board supply table, and the accuracy of positioning the patch is greatly improved.

(2) The utility model can greatly reduce the rigid impact during clamping when the baffle presses the circuit board through the matching of the cavity groove and the spring, thereby preventing the circuit board from deforming and damaging, and simultaneously, through the matching of the clamping plate and the clamping groove, the utility model is convenient for quickly separating the connecting plate and the baffle so as to be convenient for maintenance and replacement, thereby greatly improving the practicability of the device.

Drawings

FIG. 1 is a schematic structural view of the present invention;

FIG. 2 is a schematic view of the internal structure of the fixing frame according to the present invention;

FIG. 3 is an enlarged view of portion A of FIG. 2;

in the figure: 1. a frame; 2. a chip mounter body; 3. a plate conveying frame; 4. a linear guide rail; 5. a fixing frame; 6. a supply table; 7. a baffle plate; 8. a threaded sleeve; 9. a screw; 10. a motor; 11. a telescopic cylinder; 12. a spring; 13. a cavity groove; 14. fixing the rod; 15. a connecting plate; 16. a splint; 17. a card slot; 18. and (4) clamping the board.

Detailed Description

The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be obtained by a person skilled in the art without making any creative effort based on the embodiments in the present invention, belong to the protection scope of the present invention.

Referring to fig. 1-3, the present invention provides the following technical solutions: the utility model provides a high-speed array chip mounter, which comprises a frame 1, chip mounter body 2 is installed at the top of frame 1, chip mounter body 2's inside is run through and is sent grillage 3, send the top symmetry of grillage 3 to install two linear guide 4, the equal sliding connection in top of two linear guide 4 has supply pallet 6, supply pallet 6's both ends all to install fixed frame 5, the inside of fixed frame 5 is rotated through the bearing and is connected with screw rod 9, swivel nut 8 is installed to the both ends symmetry of screw rod 9, and screw rod 9 extends to fixed frame 5 outside one end and is fixed with motor 10, the lateral wall of two swivel nuts 8 all articulates there is dead lever 14, it has connecting plate 15 to articulate between the one end that swivel nut 8 was kept away from to two dead levers 14, baffle 7 is installed to the lateral wall of connecting plate 15, and baffle 7 is located the top that supplies pallet 6.

Specifically, after the circuit board is laid on the supply pallet 6, the motors 10 at two side ends can be started simultaneously, the motors 10 are made to work to drive the screw rods 9 to rotate, then the screw rods 9 drive the screw sleeves 8 to move, the fixing rods 14 drive the connecting plates 15 to move, and then the connecting plates 15 drive the baffle plates 7 to move, so that the two baffle plates 7 are slowly close to and abut against the circuit board, the circuit board can be limited and fixed, the circuit board is effectively prevented from moving and moving on the supply pallet 6, and the accuracy of patch positioning is greatly improved.

Chamber groove 13 has been seted up to one side that baffle 7 kept away from connecting plate 15, and the inside of chamber groove 13 is fixed with spring 12, and spring 12 extends to the outside one end in chamber groove 13 and is connected with splint 16, and connecting plate 15 is close to one side of baffle 7 and installs cardboard 18, and the lateral wall of baffle 7 seted up with cardboard 18 assorted draw-in groove 17.

Specifically, by additionally arranging the cavity groove 13 and the spring 12, under the elastic action of the spring 12, the clamping plate 16 can be firstly in buffer fit with the side edge of the circuit board when the baffle 7 is abutted against the circuit board, so that the hard impact during clamping can be greatly reduced, and the circuit board is prevented from being deformed and damaged;

meanwhile, the clamping plate 18 and the clamping groove 17 are clamped with each other, so that the connecting plate 15 and the baffle 7 can be separated from each other conveniently, maintenance and replacement are facilitated, and the practicability of the device is greatly improved.

A telescopic cylinder 11 is arranged between the clamping plate 16 and the cavity groove 13, the telescopic cylinder 11 is located inside the spring 12, a rubber pad is installed on the inner wall of the clamping groove 17, an anti-slip groove is formed in the outer wall of the rubber pad, a shock absorption pad is installed at the bottom of the rack 1, and a protective cover is arranged on the outer wall of the motor 10.

Specifically, the stability of the clamping plate 16 can be greatly enhanced through the telescopic cylinder 11, the clamping plate 18 can be fastened in the clamping groove 17 through the rubber pad, the shock pad has the shock absorption and energy dissipation effects, and the motor 10 can be protected through the protective cover.

It is noted that, herein, relational terms such as first and second, and the like may be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus.

Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the utility model, the scope of which is defined in the appended claims and their equivalents.

Claims

1. A high-speed array chip mounter is characterized in that: the chip mounter comprises a rack (1), a chip mounter body (2) is installed at the top of the rack (1), a plate feeding frame (3) penetrates through the interior of the chip mounter body (2), two linear guide rails (4) are installed at the top of the plate feeding frame (3), two linear guide rails (4) are connected with a plate feeding table (6) in a sliding mode, fixed frames (5) are installed at the two ends of the plate feeding table (6), a screw rod (9) is connected to the interior of each fixed frame (5) in a rotating mode through a bearing, threaded sleeves (8) are installed at the two ends of the screw rod (9) in a symmetrical mode, a motor (10) is fixed at one end, extending to the exterior of each fixed frame (5), of the two threaded sleeves (8) is hinged to a side wall, and a connecting plate (15) is hinged between one end, far away from each threaded sleeve (8), of the two fixing rods (14), baffle (7) are installed to the lateral wall of connecting plate (15), and baffle (7) are located the top that supplies pallet (6).

2. The high-speed array chip mounter according to claim 1, wherein: chamber groove (13) have been seted up to one side that connecting plate (15) are kept away from in baffle (7), the inside of chamber groove (13) is fixed with spring (12), spring (12) extend to the outside one end in chamber groove (13) and are connected with splint (16).

3. The high-speed array chip mounter according to claim 2, wherein: clamping plates (18) are installed on one sides, close to the baffles (7), of the connecting plates (15), and clamping grooves (17) matched with the clamping plates (18) are formed in the side walls of the baffles (7).

4. The high-speed array chip mounter according to claim 3, wherein: a telescopic cylinder (11) is arranged between the clamping plate (16) and the cavity groove (13), and the telescopic cylinder (11) is located inside the spring (12).

5. The high-speed array chip mounter according to claim 4, wherein: the inner wall of the clamping groove (17) is provided with a rubber pad, and the outer wall of the rubber pad is provided with an anti-slip groove.

6. The high-speed array chip mounter according to claim 5, wherein: the shock pad is installed to the bottom of frame (1), the outer wall of motor (10) is provided with the safety cover.