CN216648349U - LED chip structure, display module and electronic equipment - Google Patents
LED chip structure, display module and electronic equipment Download PDFInfo
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- CN216648349U CN216648349U CN202123174098.7U CN202123174098U CN216648349U CN 216648349 U CN216648349 U CN 216648349U CN 202123174098 U CN202123174098 U CN 202123174098U CN 216648349 U CN216648349 U CN 216648349U
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Abstract
The utility model relates to the technical field of Micro-LEDs, in particular to an LED chip structure, a display module and electronic equipment. The LED chip structure comprises a color conversion component and a light-emitting component, wherein the light-emitting component is used for emitting any one of three primary colors of colored light; the color conversion assembly is arranged on the light emitting side of the light emitting assembly, is in bonded connection with the light emitting assembly and is used for converting the colored light into the other two of the three primary colors; wherein, the color conversion component and the light-emitting component are separable. According to the LED chip structure in the embodiment, the function of emitting three primary colors can be realized by arranging the color conversion assembly to be matched with the light emitting assembly, and because the color conversion assembly is separable, when the LED chip structure has the problems of uneven color and the like, the color conversion assembly can be directly stripped and replaced with new one for recycling, so that the use cost is reduced.
Description
Technical Field
The utility model relates to the technical field of Micro-LEDs, in particular to an LED chip structure, a display module and electronic equipment.
Background
Quantum dots are semiconductor nanocrystals that can be tuned to emit colored light throughout the visible and infrared spectrum, have unique optical properties different from the corresponding bulk material, and find application in the field of display technology. Two sets of feasible schemes are generally provided for realizing the colorization of the Micro-LED by taking the quantum dots as color conversion materials: firstly, UV Micro-LEDs are used for respectively exciting red, green and blue light to generate light-emitting quantum dots to obtain RGB three-primary-color full-color pixels; and secondly, the blue light Micro-LED is used for respectively exciting red and green photoluminescence quantum dots, and the blue light of the Micro-LED is added to obtain the RGB three primary colors full-color pixel.
However, the light-emitting life of the existing quantum dot material is far shorter than that of a Micro-LED, the problem of purity reduction of a full-color light source after quantum dot color conversion is easy to occur after long-term use, the visual effect of an application end is also poor, only the panel formed by compositing the quantum dot material and the LED can be integrally replaced in the later maintenance process, and the use cost is high.
Therefore, how to solve the problem of high maintenance cost due to the short lifetime of the quantum dot material is an important issue to be solved in the industry.
SUMMERY OF THE UTILITY MODEL
The utility model provides an LED chip structure, a display module and electronic equipment, which are used for solving the problem of higher later maintenance cost caused by lower service life of a quantum dot material.
The utility model provides an LED chip structure, comprising:
the light-emitting component is used for emitting any one of the three primary colors of colored light; and
the color conversion assembly is arranged on the light emitting side of the light emitting assembly, is in bonding connection with the light emitting assembly and is used for converting the color light into the other two of the three primary colors; wherein the color conversion assembly is separable from the light emitting assembly.
According to one embodiment of the utility model, the color conversion assembly comprises a substrate, a pressing plate and an optical layer group, wherein one side of the pressing plate is fixedly connected to the substrate, and the other side of the pressing plate is connected to the light emitting assembly through bonding and is separable from the light emitting assembly; the optical layer is arranged between the substrate and the pressing plate, and the optical layer group comprises a filter layer and a color conversion layer.
According to an embodiment of the present invention, the pressing plate includes a flat plate portion and a lens portion, the lens portion is connected to the flat plate portion, the flat plate portion is fixedly connected to the substrate, the optical layer is disposed between the flat plate portion and the substrate, and the lens portion corresponds to the light emitting element.
According to one embodiment of the present invention, a lens groove is formed on a side of the substrate facing the pressing plate, and the lens portion is accommodated in the lens groove.
According to an embodiment of the present invention, the light emitting assembly includes a lens and a light emitting member, the light emitting member is used for emitting the colored light, the lens is covered on the light emitting member, and at least part of the lens is accommodated in the lens.
According to one embodiment of the utility model, the press plate comprises a glass press plate, or the press plate is formed by curing a UV glue, or the press plate is a glass press plate.
According to one embodiment of the utility model, the LED chip structure comprises a plurality of sets of the light emitting components; the holding tank has been seted up to the base plate, look conversion module still includes the separator, the separator inlays to be located in the holding tank, just the separator is used for separating adjacent two the chromatic light that light-emitting component sent.
According to one embodiment of the utility model, the separator comprises a # -shaped structure, and the material of the separator comprises black photoresist.
According to one embodiment of the present invention, the light emitted by the light emitting component is blue, and the color conversion component is configured to convert the blue light into red light or green light.
The utility model also provides a display module comprising the LED chip structure.
The utility model also provides electronic equipment comprising the LED chip structure or the display module.
The embodiment of the utility model has the following beneficial effects:
according to the LED chip structure in the embodiment, the function of emitting three primary colors can be realized by arranging the color conversion assembly to be matched with the light emitting assembly, and because the color conversion assembly is separable, when the LED chip structure has the problems of uneven color and the like, the color conversion assembly can be directly stripped and replaced with new one for recycling, so that the use cost is reduced.
According to the display module in the above embodiment, by providing the LED chip structure in any one of the above embodiments, when the display module has problems such as uneven color, the color conversion module in the LED chip structure can be directly peeled off and replaced with a new one for recycling, so that the use cost is reduced and the use effect is good.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the drawings without creative efforts.
Wherein:
FIG. 1 is a perspective view of an LED chip structure in an embodiment of the present invention;
FIG. 2 is a schematic cross-sectional view of an LED chip structure in an embodiment of the utility model;
FIG. 3 is an exploded view of an LED chip structure in an embodiment of the utility model;
reference numerals:
10. an LED chip structure;
100. a color conversion component; 110. a substrate; 111. a lens groove; 112. accommodating grooves; 120. pressing a plate; 121. a flat plate portion; 122. a lens section; 130. a separator;
200. a light emitting assembly; 210. a lens body; 220. a light emitting member; 230. the substrate is driven.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention clearer, the technical solutions of the present invention will be clearly and completely described below with reference to the accompanying drawings, and it is obvious that the described embodiments are some, but not all embodiments of the present invention. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Referring to fig. 1, an embodiment of the utility model provides an LED chip structure 10, which includes a color conversion element 100 and a light emitting element 200, where the light emitting element 200 is used for emitting any one of three primary colors of color light; the color conversion assembly 100 is disposed on the light emitting side of the light emitting assembly 200, the color conversion assembly 100 is connected to the light emitting assembly 200, and the color conversion assembly 100 is used for converting the color light into the other two of the three primary colors; the color conversion assembly 100 is detachable from the light emitting assembly 200.
According to the LED chip structure 10 in the above embodiment, the color conversion assembly 100 and the light emitting assembly 200 are arranged to cooperate to realize the function of emitting three primary colors, and since the color conversion assembly 100 is separable, when the LED chip structure 10 has problems such as uneven color, the color conversion assembly 100 can be directly peeled off and replaced with a new one for recycling, so that the use cost is reduced.
In the LED chip structure 10 of the present invention, the light emitting element 220 of the light emitting assembly 200 is preferably a Micro-LED, and the color conversion assembly 100 is preferably a quantum dot material.
In one embodiment, the light emitting device 200 emits blue light, and the color conversion device 100 is used for converting the blue light into red light or green light.
When the LED chip structure 10 of the present embodiment is used, the light emitting device 200 can emit blue light, and is excited by the excitation color conversion device 100 to form red light and green light, so as to form a full-color pixel with three primary colors; in other embodiments, the color light between the light emitting device 200 and the color conversion device 100 can be selected according to actual design requirements, and is not limited herein.
Referring to fig. 1 to 3, the color conversion device 100 includes a substrate 110, a pressing plate 120 and an optical layer set, wherein one side of the pressing plate 120 is fixedly connected to the substrate 110, and the other side of the pressing plate 120 is connected to the light emitting device 200 and is separable from the light emitting device 200; the optical layer is disposed between the substrate 110 and the pressing plate 120, and the optical layer group includes a filter layer and a color conversion layer.
With this arrangement, after the substrate 110 is connected to the pressing plate 120, the pressing plate 120 can fix the optical layer to prevent the optical layer from being separated from the substrate 110 during the process of separating the color conversion assembly 100 from the light emitting assembly 200. It should be noted that, in this embodiment, the connection firmness between the pressing plate 120 and the substrate 110 may be set to be higher than the connection firmness between the pressing plate 120 and the light emitting assembly 200, that is, when the color conversion assembly 100 and the light emitting assembly 200 are separated by a predetermined force, the pressing plate 120 may be separated from the light emitting assembly 200, and the pressing plate 120 may not be separated from the substrate 110, so that the pressing plate 120 may be ensured to fix the optical layer on the substrate 110; for example, the substrate 110 and the pressing plate 120 and the connecting medium between the pressing plate 120 and the light emitting element 200 may be made of different materials, when a preset separation condition is adopted, the pressing plate 120 is separated from the light emitting element 200, and the pressing plate 120 is not separated from the substrate 110, which is not described herein again.
In other embodiments, the pressing plate 120 may be omitted, the substrate 110 is made of a transparent material, and the optical layer is embedded in the substrate 110, so that the optical layer can be prevented from being separated when the color conversion assembly 100 is separated from the light emitting assembly 200 without affecting the color conversion effect of the optical layer, and the color conversion assembly has a simple structure and a good use effect.
Specifically, referring to fig. 2 and 3, the pressing plate 120 includes a flat plate portion 121 and a lens portion 122, the lens portion 122 is connected to the flat plate portion 121, the flat plate portion 121 is fixedly connected to the substrate 110, the optical layer is disposed between the flat plate portion 121 and the substrate 110, and the lens portion 122 corresponds to the light emitting assembly 200.
With this arrangement, when the pressing plate 120 is connected to the substrate 110, the flat plate portion 121 can be used for connecting to the substrate 110, and the lens portion 122 is used for conducting the color light emitted by the light emitting assembly 200; in addition, by arranging the lens portion 122 corresponding to the light emitting assembly 200, the lens portion 122 can also position the pressing plate 120 to ensure that the color light emitted by the light emitting assembly 200 can be smoothly transmitted.
In one embodiment, a lens groove 111 is formed on a side of the substrate 110 facing the platen 120, and the lens portion 122 is accommodated in the lens groove 111.
It is understood that by providing the lens groove 111 corresponding to the lens portion 122, on one hand, the lens groove 111 can cooperate with the lens portion 122 to position the platen 120, and at the same time, the substrate 110 and the platen 120 can have a more compact structure after being combined, i.e., the overall thickness of the color conversion assembly 100 can be reduced. Preferably, the optical layer may be deposited in the lens groove 111, and the outer wall of the lens portion 122 abuts against the optical layer and fixes the optical layer in the lens groove 111, and the other side of the lens portion 122 away from the optical layer contacts and cooperates with the light emitting element 200.
Specifically, referring to fig. 2 and 3, the light emitting assembly 200 includes a lens body 210 and a light emitting element 220, the light emitting element 220 is used for emitting color light, the lens body 210 is covered on the light emitting element 220, and at least a portion of the lens body 210 is accommodated in the lens portion 122.
In this embodiment, the lens 210 is disposed on the light emitting element 220, so that on one hand, the color light emitted by the light emitting element 220 can be refracted and diffused, and meanwhile, the light emitting element 220 can be protected, when the color conversion assembly 100 is separated from the light emitting element 200, the impurities in the external environment can be prevented from damaging the light emitting element 220, in addition, the lens 210 is disposed to be matched with the lens portion 122, the installation and positioning functions between the pressing plate 120 and the light emitting element 200 can be realized, and the color conversion assembly 100 and the light emitting element 200 can have a compact structure after being connected.
In one embodiment, the light emitting element 220 may be a Micro-LED light emitting element, and the light emitting assembly 200 further includes a driving substrate 230, wherein the light emitting element 220 is disposed on the driving substrate 230 and electrically connected to an external driving circuit through the driving substrate 230.
In the embodiment shown in fig. 2 and 3, the cross-sections of the lens groove 111, the lens portion 122 and the lens body 210 are all circular, and the inner diameter of the lens groove 111 is equal to the outer diameter of the lens portion 122, and the inner diameter of the lens portion 122 is equal to the outer diameter of the lens body 210, which can be attached to each other for connection and positioning.
In other embodiments, the cross-sections of the lens grooves 111, the lens portions 122 and the lens body 210 may also be regular polygons such as regular pentagons, regular hexagons, or polygonal structures such as rectangles, so as to achieve uniform transmission of color light, which is not limited herein.
In one embodiment, the platen 120 is formed by curing a UV glue,
it can be understood that, by forming the pressing plate 120 by curing the UV glue, a layer of UV glue film structure (the pressing plate 120) may be spin-coated on the substrate 110 during the processing process to adhere the optical layer structure, and may also be bonded to the light emitting assembly 200 by using the viscosity of the UV glue, and since the heated temperature of the UV glue is 200-250 ℃, when the light emitting element 220 is turned on and generates heat, the pressing plate 120 formed by the UV glue has good stability.
In other embodiments, the platen 120 comprises a glass platen 120.
The glass-made pressure plate 120 not only has good light transmittance, but also has rigidity to secure the optical layer after the pressure plate 120 is connected to the substrate 110, and has good durability.
Referring to fig. 2 and 3, the LED chip structure 10 includes a plurality of sets of light emitting elements 200; the substrate 110 has a receiving groove 112, the color conversion assembly 100 further includes a separating member 130, the separating member 130 is embedded in the receiving groove 112, and the separating member 130 is used for separating the color lights emitted by the two adjacent light emitting assemblies 200.
In the present embodiment, the driving substrates 230 of the plurality of light emitting assemblies 200 are mutually assembled to form the driving substrate 230 of a whole plate, and the plurality of light emitting elements 220 are uniformly distributed on the driving substrate 230; by providing the receiving groove 112 on the substrate 110, the separating member 130 having characteristics of light-tight or low transmittance can be formed in the receiving groove 112, and after the color conversion assembly 100 is combined with the light emitting assembly 200, the separating member 130 can separate the adjacent light emitting members 220, so as to prevent crosstalk between color lights emitted by the adjacent light emitting members 220, and the using effect is good.
In particular, in one embodiment, the separator 130 includes a well-shaped structure.
In the embodiment shown in fig. 3, the partition 130 is formed with a plurality of partition spaces having a rectangular cross section, the plurality of partition spaces are linearly and uniformly distributed along a plane direction, each partition space corresponds to at least one light emitting member 220, and the plurality of light emitting members 220 are linearly and uniformly distributed along a plane of the driving substrate 230, and by partitioning the light emitting members 220 using the partition 130 having a cross shape, the light emitting members 220 can be partitioned while ensuring a compact structure of the partition 130; in other embodiments, the cross-section of the separation space may be triangular, circular, hexagonal, or the like, so as to ensure that the partition 130 has a compact structure, which is not limited herein.
Further, the spacer 130 material includes black photoresist. It can be understood that the light emitting member 220 can be separated by using the black photoresist, and the light emitting member 220 can absorb the excessive light by using the black photoresist, thereby ensuring the illumination effect of the light emitting member 220.
The utility model also provides a display module comprising the LED chip structure 10 in any of the above implementations.
According to the display module in the above embodiment, by providing the LED chip structure 10 in any one of the above embodiments, when the display module has problems such as uneven color, the color conversion assembly 100 in the LED chip structure 10 can be directly peeled off and replaced with a new one for recycling, so that the use cost is reduced and the use effect is good. The utility model also provides electronic equipment which comprises the LED chip structure in any one of the implementations or the display module in any one of the implementations, and a body. The display module is arranged on the body and used for displaying images.
It can be understood that, in the electronic device of the present embodiment, by providing the above-mentioned LED chip structure, in the using process, when the color effect is reduced, only the color conversion assembly 100 can be replaced without replacing the whole LED chip structure 10, so that the use cost can be reduced.
In the description of the embodiments of the present invention, it should be noted that the terms "center", "longitudinal", "lateral", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", and the like indicate orientations or positional relationships based on those shown in the drawings, and are only for convenience in describing the embodiments of the present invention and simplifying the description, but do not indicate or imply that the referred devices or elements must have a specific orientation, be constructed in a specific orientation, and be operated, and thus, should not be construed as limiting the embodiments of the present invention. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.
In the description of the embodiments of the present invention, it should be noted that, unless explicitly stated or limited otherwise, the terms "connected" and "connected" are to be interpreted broadly, and may be, for example, fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; may be directly connected or indirectly connected through an intermediate. Specific meanings of the above terms in the embodiments of the present invention can be understood in specific cases by those of ordinary skill in the art.
In embodiments of the utility model, unless expressly stated or limited otherwise, the first feature "on" or "under" the second feature may be directly contacting the first and second features or indirectly contacting the first and second features through intervening media. Also, a first feature "on," "over," and "above" a second feature may be directly or diagonally above the second feature, or may simply indicate that the first feature is at a higher level than the second feature. A first feature being "under," "below," and "beneath" a second feature may be directly under or obliquely under the first feature, or may simply mean that the first feature is at a lesser elevation than the second feature.
In the description herein, references to the description of the term "one embodiment," "some embodiments," "an example," "a specific example," or "some examples," etc., mean that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of an embodiment of the utility model. In this specification, the schematic representations of the terms used above are not necessarily intended to refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples. Furthermore, various embodiments or examples and features of different embodiments or examples described in this specification can be combined and combined by one skilled in the art without contradiction.
Finally, it should be noted that: the above examples are only intended to illustrate the technical solution of the present invention, but not to limit it; although the present invention has been described in detail with reference to the foregoing embodiments, it will be understood by those of ordinary skill in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some technical features may be equivalently replaced; and such modifications or substitutions do not depart from the spirit and scope of the corresponding technical solutions of the embodiments of the present invention.
Claims (10)
1. An LED chip structure, comprising:
the light-emitting component is used for emitting any one of the three primary colors of colored light; and
the color conversion assembly is arranged on the light emitting side of the light emitting assembly, connected to the light emitting assembly and used for converting the color light into the other two of the three primary colors; wherein the color conversion assembly is separable from the light emitting assembly.
2. The LED chip structure according to claim 1, wherein the color conversion assembly comprises a substrate, a pressing plate and an optical layer set, one side of the pressing plate is fixedly connected to the substrate, and the other side of the pressing plate is connected to the light emitting assembly and is separable from the light emitting assembly; the optical layer is arranged between the substrate and the pressing plate, and the optical layer group comprises a filter layer and a color conversion layer.
3. The LED chip structure of claim 2, wherein the pressing plate comprises a flat plate portion and a lens portion, the lens portion is connected to the flat plate portion, the flat plate portion is fixedly connected to the substrate, the optical layer is disposed between the flat plate portion and the substrate, and the lens portion corresponds to the light emitting component.
4. The LED chip structure of claim 3, wherein a lens groove is formed on a side of the substrate facing the pressing plate, and the lens portion is received in the lens groove.
5. The LED chip structure according to claim 3, wherein the light emitting assembly comprises a lens and a light emitting member, the light emitting member is used for emitting the colored light, the lens covers the light emitting member, and at least part of the lens is accommodated in the lens.
6. The LED chip structure of claim 2, wherein the platen comprises a glass platen or is formed by UV glue curing.
7. The LED chip structure according to claim 2, wherein the LED chip structure comprises a plurality of sets of the light emitting components; the holding tank has been seted up to the base plate, the colour conversion subassembly still includes the separator, the separator inlays to be located in the holding tank, just the separator is used for separating adjacent two the chromatic light that light-emitting component sent.
8. The LED chip structure of claim 7, wherein said spacer comprises a well-shaped structure, and wherein said spacer material comprises black photoresist.
9. A display module comprising the LED chip structure according to any one of claims 1 to 8.
10. An electronic device, comprising the LED chip structure according to any one of claims 1 to 8 or the display module according to claim 9.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202123174098.7U CN216648349U (en) | 2021-12-16 | 2021-12-16 | LED chip structure, display module and electronic equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202123174098.7U CN216648349U (en) | 2021-12-16 | 2021-12-16 | LED chip structure, display module and electronic equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN216648349U true CN216648349U (en) | 2022-05-31 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN202123174098.7U Active CN216648349U (en) | 2021-12-16 | 2021-12-16 | LED chip structure, display module and electronic equipment |
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| CN (1) | CN216648349U (en) |
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- 2021-12-16 CN CN202123174098.7U patent/CN216648349U/en active Active
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