CN216647023U - Backlight module and display device - Google Patents

Abstract

The embodiment of the application provides a backlight module and a display device, comprising a printed circuit board, a light-emitting device and a light-transmitting protective layer; the light-emitting device is positioned on one side of the printed circuit board and is electrically connected with the printed circuit board; the light-transmitting protective layer is positioned on one side of the light-emitting device, which is far away from the printed circuit board, and comprises a plurality of main bulge structures, and the main bulge structures are arranged in one-to-one correspondence with the light-emitting device and cover the light-emitting device corresponding to the main bulge structures; the outer surface of the main bulge structure is a curved surface structure which is bulged back to the printed circuit board, and the outer surface of the main bulge structure comprises a plurality of sub-bulge structures. In the application, the light-emitting angle of the light-emitting device is enlarged, and the light diffusion effect is improved. Under the condition that the distance between the light emitting devices is kept unchanged, the OD can be reduced, so that the thickness of the backlight module is reduced, and the light and thin degree of a product is improved. Under the condition that OD is not changed, the distance between the light-emitting devices can be increased, so that the number of the light-emitting devices is reduced, and the manufacturing cost of the backlight module is further reduced.

Description

Backlight module and display device

Technical Field

The utility model belongs to the technical field of display, and particularly relates to a backlight module and a display device.

Background

The sub-millimeter light-emitting diode (Mini-LED) display panel has the characteristics of high resolution, high brightness, high contrast and wide color gamut, and is thinner, thinner and more energy-saving. The high-definition comfortable visual experience can be provided for the user.

In the backlight design of the display device, different light-transmitting protective layers are arranged on the Mini-LED, so that the function of effectively protecting the Mini-LED can be achieved, the light path can be changed, and the light diffusion effect of the Mini-LED is improved. However, in the prior art, the light-transmitting protective layer disposed on the Mini-LEDs has a limited effect on light diffusion, and the required light mixing distance is large under the condition that the distance between adjacent Mini-LEDs is constant, which is not favorable for thinning the display device. Under the condition of a certain light mixing distance, the distance between adjacent Mini-LEDs needs to be reduced, so that the number of the Mini-LEDs is increased, and the preparation cost of the display device is increased.

SUMMERY OF THE UTILITY MODEL

In view of the above, the present application provides a backlight module and a display device to solve the above problems.

In a first aspect, an embodiment of the present application provides a backlight module, including a printed circuit board, a light emitting device, and a light transmissive protective layer; the light emitting device is positioned on one side of the printed circuit board and is electrically connected with the printed circuit board; the light-transmitting protective layer is positioned on one side of the light-emitting device far away from the printed circuit board; the light-transmitting protective layer comprises a plurality of main protruding structures, the main protruding structures are arranged in one-to-one correspondence with the light-emitting devices, and the main protruding structures cover the light-emitting devices corresponding to the main protruding structures; the main protruding structure comprises a first surface far away from one side of the light-emitting device, the first surface is a curved surface structure protruding from the light-emitting device, and the first surface comprises a plurality of sub protruding structures.

In one implementation of the first aspect, the plurality of primary projection structures are not connected to each other.

In one implementation manner of the first aspect, the sub-protrusion structure is at least one of a pyramid structure and a cone structure.

In one implementation of the first aspect, the distance between adjacent sub-projection structures is D1; wherein D1 is more than or equal to 0 and less than or equal to 0.5 mm.

In one implementation of the first aspect, the height of the sub-projection structure is D2; wherein D2 is more than or equal to 0.1mm and less than or equal to 0.3 mm.

In one implementation manner of the first aspect, the main protrusion structure includes a first layer of light-transmitting structure and a second layer of light-transmitting structure, the second layer of light-transmitting structure is located on a side of the first layer of light-transmitting structure away from the printed circuit board, and the second layer of light-transmitting structure covers the first layer of light-transmitting structure; the refractive index of the second layer of light-transmitting structure is smaller than that of the first layer of light-transmitting structure.

In one implementation of the first aspect, there is no gap between the light emitting device and the main bump structure.

In one implementation manner of the first aspect, the main protrusion structure is a silicone structure.

In one implementation manner of the first aspect, the backlight module further includes a reflective sheet, the reflective sheet is located between the printed circuit board and the light-transmitting protective layer, the reflective sheet includes an opening, and the light-emitting device is located in the opening.

In one implementation of the first aspect, the main projection structure covers at least an opening of the reflective sheet corresponding thereto.

In an implementation manner of the first aspect, the backlight module further includes a support pillar and an optical film layer stacked on the support pillar, the optical film layer is located on one side of the light-transmitting protection layer close to the light-emitting surface of the backlight module, and the optical film layer is connected with the printed circuit board through the support pillar.

In one implementation of the first aspect, the optical film layer includes at least one of a diffuser plate, a phosphor film, a quantum dot film, and a homo film.

In a second aspect, an embodiment of the present application provides a display device, which includes the backlight module and the display panel provided in the first aspect, where the display panel is located on a side of the backlight module close to a light emitting surface of the display device.

In one implementation manner of the second aspect, the display panel is a liquid crystal display panel.

The application provides a backlight unit and display device has following beneficial effect:

because the plurality of sub-convex structures are arranged on the first surface of the main convex structure far away from the printed circuit board, light rays emitted by the light emitting device are reflected and refracted for multiple times in the sub-convex structures to change a light path, and diffusion at a larger angle is realized, so that the light emitting angle of the light emitting device is enlarged, and the light diffusion effect is improved. Under the condition that the distance between the light-emitting devices is kept unchanged, the OD can be reduced, so that the thickness of the backlight module is reduced, and the light and thin degree of a product is improved. Under the condition that OD is not changed, the distance between the light emitting devices can be increased, so that the number of the light emitting devices is reduced, and the manufacturing cost of the backlight module is further reduced. And because a plurality of main protruding structures are not connected with each other, the using amount of transparent protective layer materials can be reduced, and the manufacturing cost of the backlight module is further reduced.

Drawings

Fig. 1 is a schematic structural diagram of a backlight module in the prior art;

fig. 2 is a schematic partial structure diagram of a backlight module according to an embodiment of the present disclosure;

FIG. 3 is a schematic diagram of light extraction according to the present application;

FIG. 4 is a graph of an illumination profile according to the present application;

fig. 5 is a schematic partial structure diagram of another backlight module according to an embodiment of the present disclosure;

FIG. 6 is an enlarged partial view of the main bump structure of FIG. 5;

FIG. 7 is an enlarged partial schematic view of the main bump structure of FIG. 5;

fig. 8 is a schematic structural diagram of another backlight module according to an embodiment of the present disclosure;

FIG. 9 is a schematic view of a primary projection structure forming mold according to the present application;

fig. 10 is a schematic view of a display device according to an embodiment of the present disclosure.

Detailed Description

The terminology used in the description of the embodiments section of the present application is for the purpose of describing particular embodiments of the present application only and is not intended to be limiting of the present application.

Fig. 1 is a schematic structural diagram of a backlight module in the prior art.

In one conventional solution, as shown in fig. 1, a backlight module 001 'includes a printed circuit board 01', a light emitting device 02 ', a light transmitting protective layer 03', a diffuser plate 04 ', a fluorescent film 05', a quantum dot film 06 ', and a light equalizing film 07'. Wherein the light emitting device 02 'is electrically connected to the printed circuit board 01', and the light-transmitting protective layer 03 'covers the light emitting device 02'.

It can be understood that, the distance between the diffusion plate 04 'and the printed circuit board 01' is an Optical Distance (OD), and the larger the OD is, the more sufficiently the light beams emitted by the different light emitting devices 02 'are mixed, the lighter the light emitting point shadow of the display device using the backlight module 001' is, and the better the visual effect is.

The light-transmitting protective layer 03 ' can not only play a role in effectively protecting the light-emitting device 02 ', but also change a light path and improve the light diffusion effect of the light-emitting device 02 '.

However, in the above prior art, the light-transmitting protective layer 03 'is usually prepared by front molding, and the surface of the light-emitting side is flat, so that the change of the light path is limited, and the effect of expanding the light-emitting angle of the light-emitting device 02' is small. The light diffusion effect of the light emitting device 02' cannot be improved well. Then the height of the OD needs to be increased in case the spacing between adjacent light emitting devices 02' is determined in order to achieve a better visual effect. This results in a display device with a large thickness, which is not suitable for the user's demand for a thinner and lighter product.

If the OD is kept constant, the pitch between the adjacent light emitting devices 02 'needs to be reduced, that is, the light emitting devices 02' need to be arranged more densely. This results in an increase in the number of light emitting devices 02', thereby increasing the manufacturing cost of the backlight assembly and the display device.

The inventors of the present application have intensively studied to provide a solution to solve the problems in the prior art.

Fig. 2 is a schematic partial structure diagram of a backlight module according to an embodiment of the present disclosure, fig. 3 is a schematic light emitting diagram according to the present disclosure, and fig. 4 is a graph illustrating an illuminance distribution according to the present disclosure.

As shown in fig. 2, the embodiment of the present application provides a backlight module 001, which includes a printed circuit board 01, a light emitting device 02, and a light transmissive protective layer 03. The light emitting device 02 is located at one side of the printed circuit board 01, and the light emitting device 02 is electrically connected to the printed circuit board 01. Alternatively, the light emitting device 02 is electrically connected to the printed circuit board 01 by solder paste. The printed circuit board 01 can control the light emitting device 02 to emit light and even control the brightness thereof.

In addition, the light emitting devices 02 may be distributed on the printed circuit board 01 in an array, and the backlight module 001 may implement local dimming.

The light-transmitting protective layer 03 is located on one side, away from the printed circuit board 01, of the light-emitting device 02, the light-transmitting protective layer 03 comprises a plurality of main protruding structures 31, the main protruding structures 31 correspond to the light-emitting devices 02 one to one, and the main protruding structures 31 cover the light-emitting devices 02 corresponding to the backlight module 001 in the thickness direction.

It should be noted that, as shown in fig. 2, the main bump structure 31 wraps the light emitting device 02 corresponding to the main bump structure, that is, the light emitting device 02 is in contact with the main bump structure 31 except for one side fixed on the printed circuit board 01. Thereby avoiding the influence of the water vapor on the light emitting device 02 and further improving the reliability of the light emitting device 02.

The main protruding structure 31 includes a first surface 31A far from the light emitting device 02 side, and the first surface 31A is a curved surface structure protruding away from the light emitting device 02. Also, the first surface 31A includes a plurality of sub-protrusion structures 311. It should be noted that when light emitted from the light-emitting device 02 passes through the sub-bump structure 311, the sub-bump structure 311 expands the exit angle of the light.

Optionally, the refractive index of the primary projection structure 31 is 1.4-1.6.

In the embodiment of the present application, it can be understood that the primary projection structure 31 has a function of diffusing light and collimating a light path, as shown in fig. 3. As illustrated in fig. 3, a part of the light ray X1 emitted from the light emitting device 02 is emitted to the surface of the main protrusion structure 31 at a large angle, and then the light ray X1 is converged into the light mixing region to perform sufficient light mixing. With reference to fig. 3, due to the sub-protrusion structure 311, the light X1 emitted by the light emitting device 02 at the same angle enters the sub-protrusion structure 311, and the light is reflected and refracted many times in the sub-protrusion structure 311 and then exits at a large angle. It is understood that the same light ray X1 emitted after being reflected and refracted by the sub-bump structure 311 has a larger angle than that emitted without the sub-bump structure 311. That is, due to the arrangement of the sub-bump structure 311, the light emitting angle of the light emitting device 02 is further expanded. In the light effect simulation experiment performed by the inventor, as shown in fig. 4, the illumination value of the backlight module 001 provided with the sub-protrusion structure 311 is larger at each viewing angle. That is, the arrangement of the sub-bump structure 311 further enhances the light emitting effect of the light emitting device 02.

It is understood that, under the same visual effect, if the spacing between the adjacent light emitting devices 02 is not changed, the larger the angle at which the light emitted from the light emitting devices 02 is spread, the smaller the OD. If the OD remains constant, the greater the angle at which light emitted by the light emitting devices 02 is spread, the greater the spacing between adjacent light emitting devices 02.

In the embodiment of the present application, the first surface 31A of the main protrusion structure 31 includes the sub-protrusion structure 311, so that the diffusion angle of the light emitted by the light emitting device 02 is increased, and the light diffusion effect is improved. Under the condition that the distance between the light emitting devices 02 is kept unchanged, the OD is reduced, so that the thickness of the backlight module 001 is reduced, and the light and thin degree of a product is improved. Or, under the condition that the OD is not changed, the distance between the light emitting devices 02 is increased, so that the number of the light emitting devices 02 is reduced, and the manufacturing cost and the power consumption of the backlight module 001 are reduced.

Fig. 5 is a schematic partial structure diagram of another backlight module according to an embodiment of the present disclosure.

As shown in fig. 5, in one embodiment of the present application, the plurality of primary projection structures 31 are not connected to each other. That is, the plurality of main protrusion structures 31 are distributed in a dot shape.

In the embodiment of the present application, the plurality of main protrusion structures 31 are not connected to each other, and in the process of manufacturing the main protrusion structures 31, the structural members in the shape of the main protrusion structures 31 may be formed first, then the main protrusion structures 31 are manufactured in batches, and then the main protrusion structures 31 are bonded to the printed circuit board 01. The material consumption of the light-transmitting protective layer 03 can be reduced, and the material cost of the backlight module 001 is further reduced.

And since the main bump structures 31 are not connected to each other, the area of the printed circuit board 01 occupied by the light-transmitting protective layer 03 is reduced. The probability of generating stains on the surface of the printed circuit board 01 in the preparation process of the light-transmitting protective layer 03 is reduced. Even if the surface of the printed circuit board 01 is dirty, the main protrusion structures 31 are distributed in a dotted manner, so that the replacement of a single main protrusion structure 31 is convenient, and the cost is low. Thereby reducing the difficulty of dirt cleaning and avoiding the occurrence of product scrapping.

Optionally, the main protrusion structure 31 is a silica gel structure, the light transmittance is not less than 95%, and the light diffusion effect is improved while the brightness of the light emitting device 02 is favorably ensured.

In an embodiment of the present application, please refer to fig. 5, there is no gap between the light emitting device 02 and the main protrusion structure 31, which is beneficial to directly diffuse the light emitted from the light emitting device 02 in the main protrusion structure 31, so as to enlarge the emergent angle of the light. Meanwhile, the light-emitting device 02 can be protected from being damaged by water vapor, and the service life of the light-emitting device 02 is prolonged.

Fig. 6 is a partially enlarged view of the main bump structure shown in fig. 5.

In one embodiment of the present application, as shown in FIG. 6, the distance between the adjacent sub-protrusion structures 311 is D1, wherein D1 is 0 mm or less and 0.5mm or less. That is, the sub-protrusion structures 311 may be arranged continuously or dispersedly.

Optionally, the sub-protrusion structures 311 are continuously arranged on the first surface 31A of the main protrusion structure 31, which is beneficial to increasing the times of reflection and refraction of light in the plurality of sub-protrusion structures 311, so as to improve the diffusion angle of the light.

Optionally, the sub-protrusion structures 311 are dispersedly arranged on the first surface 31A of the main protrusion structure 31, so that the light diffusion angle is improved, the preparation difficulty of the main protrusion structure 31 is reduced, and the process difficulty is reduced.

Optionally, the sub-protrusion structure 311 is at least one of a pyramid structure and a cone structure. Further, the sub-protrusion structure 311 may be at least one of a triangular pyramid, a rectangular pyramid, a pentagonal pyramid, and a cone. When the light that emitting device 02 sent shines into on the first surface 31A of main protruding structure 31, the sub-protruding structure 311 that this application provided is favorable to diffusing light to each direction, increases the diffusion angle of light in each direction to improve the effect of light diffusion.

With continued reference to FIG. 6, in one embodiment of the present application, the height of the sub-protrusion structures 311 is D2, wherein D2 is 0.1mm ≦ D2 ≦ 0.3 mm.

In the embodiment of the present application, the sub-protrusion structures 311 are arranged lower, so that it is ensured that the light emitted by the light emitting device 02 can be emitted at a larger angle through reflection and refraction of the sub-protrusion structures 311, thereby enlarging the diffusion angle of the light emitting line emitted by the light emitting device 02 and effectively improving the backlight uniformity of the backlight module 001. And the situation that the sub-bump structure 311 excessively occupies the light mixing area to influence the light mixing is avoided.

Fig. 7 is a partially enlarged view of the main bump structure shown in fig. 5.

As shown in fig. 7, in an embodiment of the present application, the main protrusion structure 31 includes a first layer of light transmissive structure 312 and a second layer of light transmissive structure 313, the second layer of light transmissive structure 313 is located on a side of the first layer of light transmissive structure 312 away from the printed circuit board 01, and the second layer of light transmissive structure 313 covers the first layer of light transmissive structure 312. That is, light emitted from the light emitting device 02 sequentially passes through the first layer of light transmitting structure 312 and the second layer of light transmitting structure 313 and is then emitted.

The refractive index of the second layer of light-transmitting structures 313 is smaller than that of the first layer of light-transmitting structures 312.

Optionally, the refractive index of the first layer of light-transmitting structure 312 is 1.5 to 1.6, and the refractive index of the second layer of light-transmitting structure 313 is 1.4 to 1.5.

It can be understood that, in the present embodiment, the sub-protrusion structure 311 is located on the surface of the second layer of the light-transmitting structure 313 away from the printed circuit board 01.

In the embodiment of the present application, light emitted from the light emitting device 02 is incident into the second layer light-transmitting structure 313 through the first layer light-transmitting structure 312, and since the refractive index of the second layer light-transmitting structure 313 is smaller than that of the first layer light-transmitting structure 312, the refraction angle of the light in the second layer light-transmitting structure 313 is larger than the incident angle in the first layer light-transmitting structure 312. The position of the light ray X incident into the sub-protrusion structure 311 is lowered, so that the light diffusion angle is larger, the light emitting angle of the light emitting device 02 is further enlarged, and the light diffusion effect is improved. Under the condition that the distance between the light emitting devices 02 is kept unchanged, the OD is reduced, so that the thickness of the backlight module 001 is reduced, and the light and thin degree of a product is improved. Under the condition that OD is not changed, the distance between the light-emitting devices 02 is increased, so that the number of the light-emitting devices 02 is reduced, and the manufacturing cost of the backlight module 001 is reduced.

It should be noted that the main protrusion structure 31 may further include a third layer of light-transmitting structure, the third layer of light-transmitting structure is located on a side of the second layer of light-transmitting structure 313 away from the printed circuit board 01, and the third layer of light-transmitting structure covers the second layer of light-transmitting structure 313, and a refractive index of the third layer of light-transmitting structure is smaller than a refractive index of the second layer of light-transmitting structure 313. It is understood that the sub-bump structures 311 are located on the surface of the third layer of light-transmitting structure away from the printed circuit board 01.

Further, the main protrusion structure 31 may further include a multi-layer light-transmitting structure having at least four layers or more, wherein a refractive index of the light-transmitting structure farther from the printed circuit board 01 is smaller. The position of light incident into the sub-protrusion structure 311 is further reduced, so that the light diffusion angle is larger, the light emitting angle of the light emitting device 02 is further enlarged, and the light diffusion effect is improved. Under the condition that the distance between the light emitting devices 02 is kept unchanged, the OD is reduced, so that the thickness of the backlight module 001 is reduced, and the light and thin degree of a product is improved. Under the condition that the OD is unchanged, the distance between the light emitting devices 02 is increased, so that the number of the light emitting devices 02 is reduced, and the manufacturing cost of the backlight module 001 is reduced.

Fig. 8 is a schematic structural diagram of another backlight module according to an embodiment of the present disclosure.

As shown in fig. 8, in an embodiment of the present application, the backlight module 001 further includes a reflective sheet 04, the reflective sheet 04 is located between the printed circuit board 01 and the light-transmissive protective layer 03, and optionally, the reflective sheet 04 is adhered to the printed circuit board 01 by a back adhesive. The emission sheet 04 includes an opening 41, and the light emitting device 02 is located in the opening 41. It is understood that the light emitting device 02 is electrically connected to the printed circuit board 01 through the opening 41.

In this application, the setting of reflector plate 04 can be with the light reflection of 01 directions of directive printed circuit board to mixing the light region, is favorable to promoting backlight unit 001's luminous luminance to promote visual effect.

Optionally, with reference to fig. 8, along the thickness direction of the backlight module 001, the main protrusion structure 31 at least covers the opening 41 of the reflector 04 corresponding thereto. Since the light emitting device 02 is located in the opening 41 and the main protrusion structure 31 at least covers the openings of the light emitting device 02 and the reflective sheet 04, the main protrusion structure 31 isolates the light emitting device 02 from air, thereby preventing the light emitting device 02 from being damaged by moisture.

Optionally, the reflector plate 04 includes a first portion (not shown in the figure) located below the main protrusion structure 31, and when the light entering the main protrusion structure 31 enters the first portion of the reflector plate 04, the first portion may reflect the light as a light departing from the direction of the printed circuit board 01, so that the light is emitted at a larger angle under the action of the sub-protrusion structure 311, thereby increasing the light emitting brightness of the backlight module 001.

Further, the reflection sheet 04 further includes a second portion (not shown) located between the adjacent main protrusion structures 31, and when the light exiting the main protrusion structures 31 enters the second portion, the second portion can reflect the light as light departing from the direction of the printed circuit board 01, so as to increase the light emitting brightness of the backlight module 001.

In addition, when the reflective sheet 04 includes the second portion located between the adjacent main protruding structures 31, the second portion may be a continuous structure, so as to improve the reflection efficiency of the second portion and ensure the light emitting brightness of the backlight module 001. The second portion may also be a discontinuous structure, so that when the backlight module 001 needs to perform area dimming, light crosstalk between different areas can be avoided.

In an embodiment of the present application, as shown in fig. 8, the backlight module 001 further includes a supporting pillar 05 and an optical film 06 stacked on the supporting pillar, where the optical film 06 is located on a side of the light-transmitting protective layer 03 close to the light-emitting surface of the backlight module 001. The optical film layer 06 is connected with the printed circuit board 01 through the support pillar 05. That is, the optical film layer 06 is fixed on the printed circuit board 01 at a side close to the light emitting surface of the display device by the support pillar 05. It is understood that the optical film layer 06 is not in contact with the light-transmitting protective layer 03.

Optionally, the optical film layer 06 includes at least one of a diffusion plate 61, a fluorescent film 62, a quantum dot film 63, and a light-equalizing film 64.

Specifically, the diffusion plate 61 may be disposed at the bottommost layer of the optical film layer 06, and connected to the supporting posts 05, for further diffusing light.

The fluorescent film 62 emits light under the irradiation of the light source, and when the light source stops emitting light, the fluorescent film 62 stops emitting light, which is beneficial to ensuring the accuracy of the light emission control of the backlight module 001.

The quantum dot film 63 serves to convert light emitted from the light emitting device 02 into white light. For example, the light emitting device 02 in the present application may be a blue light emitting diode having high light emitting efficiency and excellent light emitting intensity, and the quantum dot film 63 may be a blue quantum dot film to convert blue light emitted from the blue light emitting diode into white light. Generally, the quantum dot film 63 is disposed on the light exit surface side of the diffusion plate 61.

The light equalizing film 64 can be used to equalize light and make the light exit into the display panel uniformly. Typically, the homogenizing film 64 is disposed on the topmost layer of the optical film layer 06.

The printed circuit board 01 further includes a substrate 11 and a driver chip 12, and the driver chip 12 is electrically connected to the substrate 11. Alternatively, the driving chip 12 is electrically connected to the substrate 11 by solder paste. Further, the driving chip 12 may be located on the same side or different side of the substrate 11 from the main bump structure 31. Optionally, the substrate 11 has a thickness of 0.6-1.2 mm.

In this application, the control signal control light emitting device 02 that driver chip 12 sent is luminous, and the light that light emitting device 02 sent conducts at first in printing opacity protective layer 03, then the surface of keeping away from printed circuit board 01 one side through printing opacity protective layer 03 jets out, and the light that numerous light emitting device 02 sent realizes mixing before reaching optics rete 06, then enters into display panel through the optics rete 06 of range upon range of setting.

Because the plurality of sub-protrusion structures 311 are arranged on the first surface 31A of the main protrusion structure 31 far away from the printed circuit board 01, light emitted by the light-emitting device 02 changes a light path through multiple reflection and refraction in the sub-protrusion structures 311, and diffusion at a larger angle is realized, so that the light-emitting angle of the light-emitting device 02 is enlarged, and the light diffusion effect is improved. Under the condition that the distance between the adjacent light-emitting devices 02 is kept unchanged, the OD can be reduced, so that the thickness of the backlight module 001 is reduced, and the light and thin degree of a product is improved. Under the condition that the OD is not changed, the distance between the light-emitting devices 02 can be increased, so that the number of the light-emitting devices 02 is reduced, and the manufacturing cost of the backlight module 001 is reduced. And because a plurality of main protruding structures 31 are not connected with each other, the amount of the material of the light-transmitting protective layer 03 can be reduced, and the manufacturing cost of the backlight module 001 is further reduced.

The inventor tests the beneficial effects of the backlight module 001 provided by the application, and the light-emitting device 02 adopts a large-angle light-emitting diode on the market, and when the OD is 9mm, the distance between the light-emitting devices 02 can be increased by 57%, so that the number of the light-emitting devices 02 can be reduced by 60%. When the pitch of the light emitting devices 02 is 23mm, the OD may be reduced by 35%.

Fig. 9 is a schematic view of a main protrusion structure forming mold according to the present application.

In the present application, the main protrusion structure 31 may be prepared by a high precision mold or a nano-imprinting method. In the process of manufacturing the backlight module 001, after the light emitting device 02 is manufactured, a light transmissive material is coated on the light emitting device 02, and then the light transmissive material is directly pressed and molded on the light emitting device 02 by a high precision mold as shown in fig. 9, and after the molding, the excess portions are etched away to form the main protrusion structures 31. Note that, when the light-emitting device 02 is formed by pressing, a nanoimprint method may be used.

Further, a structural member in the shape of the main protrusion structure 31 may be prepared, the main protrusion structure 31 is prepared through a patch printing process, and then the main protrusion structure 31 is fixed above the light emitting device 02.

In the present application, the light emitting device 02 may be a light-emitting diode (LED). And as shown in fig. 8, when the backlight module 001 includes a plurality of LEDs, the plurality of LEDs may be arranged in an array. The LED may be a mini-LED (mini light-emitting diode), which is an LED with a size of hundreds of micrometers, for example, an LED with a size of 50 μm to 200 μm is a mini-LED. The backlight module 001 using the mini-LED as the light emitting device 02 has higher brightness, and can realize regional dimming of more partitions.

Fig. 10 is a schematic view of a display device according to an embodiment of the present disclosure.

As shown in fig. 10, the present embodiment provides a display device 100, which includes the backlight module 001 and the display panel 002, wherein the display panel 002 is disposed on the light-emitting side of the backlight module 001, and the light generated by the backlight module 001 reaches the display panel 002 to provide backlight for the display panel 002. In addition, the display device may further include a back plate 003, a front frame 004 and a middle frame (not shown), wherein the back plate 003 is used for carrying the backlight module 001, and the back plate 003, the front frame 004 and the middle frame are used for encapsulating the display panel 002 and the backlight module 001.

The backlight module 001 includes a printed circuit board 01 and a light emitting device 02, specifically, the light emitting device 02 is electrically connected to the printed circuit board 01 and emits light toward the display panel 002, and the printed circuit board 01 controls the light emitting device 02 to emit light so as to provide backlight for the display panel 002.

In an embodiment of the present application, the display panel 002 can be a liquid crystal display panel, and the backlight module 001 provides the display panel 002 with light required for displaying because the liquid crystal display panel is passive light emitting.

In an embodiment of the present application, the display panel 002 may also be an organic light emitting display panel, although the organic light emitting display panel is active light emitting, in order to improve the color purity of the display device including the organic light emitting display panel, the backlight module 001 provides the display device with light of different colors, and the light emitting devices 02 of the backlight module 001 may correspond to the pixels of the display panel 002 one by one. Specifically, the light emission color of the light emitting device 02 is the same as the light emission color of the corresponding pixel in the display panel 002, thereby improving the color purity of the display device.

According to different application scenarios, as shown in fig. 10, the display device 100 provided in the embodiment of the present application may be a television, and in addition, the display device provided in the embodiment of the present application may also be a computer, a tablet, a mobile phone, and the like. It should be noted that, in different application scenarios, the sizes of the display devices are different, and the viewing distances are different, so the sizes and densities of the light emitting devices 02 in the backlight module 001 are also different.

When the display device provided by the embodiment of the application is a television, the size of the light-emitting device 02 can be relatively large due to the fact that the distance for watching by human eyes is long, and the process is simple; the density of the light emitting device 02 can also be small, reducing power consumption and saving cost.

In the display device 100, the control signal sent by the driving chip 12 controls the light emitting device 02 to emit light, light emitted by the light emitting device 02 is firstly conducted in the light-transmitting protective layer 03, then enters the air through the surface of the light-transmitting protective layer 03 far away from the printed circuit board 01, light emitted by the plurality of light emitting devices 02 is mixed in the air, and then enters the display panel 002 through the optical film layer 06 arranged in a laminated manner.

Because the plurality of sub-convex structures 311 are arranged on the first surface 31A of the main convex structure 31 far away from the printed circuit board 01, light rays emitted by the light-emitting device 02 are reflected and refracted for multiple times in the sub-convex structures 311, so that light path diffusion is realized, the light-emitting angle of the light-emitting device 02 is enlarged, and the light diffusion effect is improved. Under the condition that the distance between the adjacent light-emitting devices 02 is kept unchanged, the OD can be reduced, so that the thickness of the backlight module 001 is reduced, and the light and thin degree of a product is improved. Under the condition that the OD is not changed, the distance between the light-emitting devices 02 can be increased, so that the number of the light-emitting devices 02 is reduced, and the manufacturing cost of the backlight module 001 is reduced. And because a plurality of main protruding structures 31 are not connected with each other, the amount of the material of the light-transmitting protective layer 03 can be reduced, and the manufacturing cost of the backlight module 001 is further reduced.

The above description is only for the purpose of illustrating the preferred embodiments of the present invention and is not to be construed as limiting the utility model, and any modifications, equivalents, improvements and the like made within the spirit and principle of the present invention should be included in the scope of the present invention. Finally, it should be noted that: the above embodiments are only used to illustrate the technical solution of the present invention, and not to limit the same; while the utility model has been described in detail and with reference to the foregoing embodiments, it will be understood by those skilled in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some or all of the technical features may be equivalently replaced; and the modifications or the substitutions do not make the essence of the corresponding technical solutions depart from the scope of the technical solutions of the embodiments of the present invention.

Claims (14)

1. A backlight module is characterized in that the backlight module comprises:

a printed circuit board;

the light-emitting device is positioned on one side of the printed circuit board and is electrically connected with the printed circuit board;

the light-transmitting protective layer is positioned on one side, far away from the printed circuit board, of the light-emitting device; the light-transmitting protective layer comprises a plurality of main protruding structures, the main protruding structures are arranged in one-to-one correspondence with the light-emitting devices, and the main protruding structures cover the light-emitting devices corresponding to the main protruding structures;

the main protruding structure comprises a first surface far away from one side of the light-emitting device, the first surface is a curved surface structure protruding from the light-emitting device, and the first surface comprises a plurality of sub-protruding structures.

2. A backlight module according to claim 1, wherein the main bump structures are not connected to each other.

3. The backlight module according to claim 1, wherein the sub-protrusion structures are at least one of pyramid structures and cone structures.

4. A backlight module according to claim 1, wherein the distance between adjacent sub-protrusion structures is D1, 0 ≦ D1 ≦ 0.5 mm.

5. A backlight module according to claim 1, wherein the height of the sub-protrusion structure is D2, D2 is 0.1mm ≦ D2 ≦ 0.3 mm.

6. The backlight module according to claim 1, wherein the main protrusion structure comprises a first layer of light-transmissive structure and a second layer of light-transmissive structure, the second layer of light-transmissive structure is located on a side of the first layer of light-transmissive structure away from the printed circuit board, and the second layer of light-transmissive structure covers the first layer of light-transmissive structure;

wherein the refractive index of the second layer of light-transmitting structures is less than the refractive index of the first layer of light-transmitting structures.

7. A backlight module according to claim 1, wherein the light emitting devices are substantially free of gaps with the main bump structures.

8. The backlight module as claimed in claim 1, wherein the main protrusion structure is a silicone structure.

9. The backlight module according to claim 1, further comprising a reflective sheet between the printed circuit board and the light transmissive protective layer, the reflective sheet comprising an opening, the light emitting device being located in the opening.

10. A backlight module according to claim 9, wherein the main protrusion structure covers at least the opening of the reflector plate corresponding to the main protrusion structure.

11. The backlight module according to claim 1, further comprising a supporting pillar and a stacked optical film layer, wherein the optical film layer is disposed on a side of the light-transmissive protective layer close to a light-emitting surface of the backlight module; the optical film layer is connected with the printed circuit board through the supporting column.

12. The backlight module according to claim 11, wherein the optical film layer comprises at least one of a diffuser plate, a phosphor film, a quantum dot film, and a light uniformizing film.

13. A display device, comprising the backlight module and the display panel according to any one of claims 1 to 12; the display panel is positioned on one side of the backlight module close to the light emitting surface of the display device.

14. The display device according to claim 13, wherein the display panel is a liquid crystal display panel.

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