CN216626206U - Chip supporting structure and electronic equipment - Google Patents

Abstract

The utility model discloses a chip supporting structure, which comprises at least two chips with different thicknesses, a circuit board, a shielding case and a shell, wherein the circuit board is arranged on the circuit board; a containing groove is formed in one side of the shell, the shielding cover is fixed to the bottom of the containing groove, the circuit board covers the containing groove and is fixedly connected with the shell, and the chip is arranged on the circuit board and contained in the containing groove; the shielding cover is further provided with a plurality of supporting parts for supporting the chip on one side close to the circuit board through stamping, the bottom of the containing groove is also protruded to form a plurality of supporting protrusions corresponding to the chip, and the supporting parts are provided with supporting grooves matched with the supporting protrusions on one side far away from the circuit board. The utility model also discloses electronic equipment comprising the chip supporting structure. Compared with the prior art, beneficial effect lies in: through set up the support protruding on the casing and set up the supporting part on the shield cover and come the chip on the support circuit board, the inside space utilization of improvement casing that can be better, and then do benefit to electronic equipment's frivolous design.

Description

Chip supporting structure and electronic equipment

[ technical field ] A method for producing a semiconductor device

The utility model relates to the technical field of electronic equipment, in particular to a chip supporting structure and electronic equipment.

[ background of the utility model ]

The chip is an important component in the mobile phone, and the stability of the chip plays a critical role in the performance of the mobile phone, so that it is very important to provide a reliable operating environment for the chip. At present, a plurality of mobile phone structures for protecting chips are available, and in most cases, the current mobile phone structure can provide a reliable environment for the mobile phone chip, but in an extreme environment, for example, in a reliability test for simulating that the mobile phone is pressed, the chip still easily generates a phenomenon of function failure, that is, under the condition that the mobile phone is pressed, the chip may be damaged internally due to external force, and further the chip function fails.

Therefore, in the prior art, a shielding case is generally welded on the periphery of the chip, the chip is sealed in the shielding case, the shielding case and the chip keep a sufficient safety distance (generally not less than 0.2mm), and meanwhile, a safety distance of not less than 0.15mm is ensured between the shielding case and the mobile phone shell.

However, in the prior art, there are a plurality of important chips in the mobile phone, and the height dimensions (i.e. chip thicknesses) of these chips are different, but the height of the shielding can is only limited by the highest chip in the mobile phone, and in addition, the safety distance between the shielding can and the mobile phone casing results in the overall thickness of the mobile phone being thickened, which is not favorable for the light and thin design of the mobile phone.

[ Utility model ] content

The utility model aims to provide a chip supporting structure which is used for fixing a plurality of chips with different thicknesses and aims to reduce the overall thickness of the chip supporting structure.

In order to achieve the above object, the present invention provides a chip supporting structure for supporting at least two chips with different thicknesses, including a circuit board, a shielding case and a housing; an accommodating groove is formed in one side of the shell, the shielding cover is fixed to the bottom of the accommodating groove, the circuit board covers the accommodating groove and is fixedly connected with the shell, and the chip is arranged on the circuit board and is accommodated in the accommodating groove; the shielding cover is further provided with a plurality of supporting parts which are formed on one side close to the circuit board through stamping and used for supporting the chips one by one, the bottom of the containing groove is provided with a plurality of supporting bulges corresponding to the chips one by one, and each supporting part is provided with a supporting groove matched with one supporting bulge on one side far away from the circuit board.

As an improvement of the chip supporting structure of the present invention, an elastic pad for pressing the chip is attached to the supporting portion.

As an improvement of the chip supporting structure, the elastic gasket is a Mylar film with a regular shape.

As an improvement of the chip supporting structure of the utility model, the shielding case includes a bottom plate and at least one side plate extending from an edge of the bottom plate, the supporting portions are disposed on the bottom plate at intervals, and the side plate abuts against an inner wall of the accommodating groove.

As an improvement of the chip support structure of the utility model, the side plate is further fixedly connected with a limiting ring, and the limiting ring is further abutted between the circuit board and the bottom plate.

As an improvement of the chip supporting structure of the present invention, the limiting ring includes a lower abutting portion abutting against the bottom plate, an upper abutting portion abutting against the circuit board, and a connecting portion connected between the lower abutting portion and the upper abutting portion and fixedly connected to the inner side of the side plate.

As an improvement of the chip support structure of the present invention, the lower abutting portion has an annular plate shape and a through hole for the support portion to pass through is formed in a middle portion thereof.

As an improvement of the chip supporting structure of the utility model, the side plate is provided with a plurality of first fixing holes, and the connecting part is provided with second fixing holes corresponding to the first fixing holes one by one.

The utility model also provides electronic equipment comprising the chip supporting structure.

Compared with the prior art, the chip supporting structure has the beneficial effects that: through set up the support protruding on the casing and set up the supporting part on the shield cover and support the chip on the circuit board for the casing can wholly consider to carry out the fixed problem of support simultaneously to the chip of a plurality of different thickness when the design, and the inner space utilization of improvement casing that can be better, and then does benefit to electronic equipment's frivolous design.

In order to make the aforementioned and other objects, features and advantages of the utility model comprehensible, preferred embodiments accompanied with figures are described in detail below.

[ description of the drawings ]

In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings needed to be used in the embodiments will be briefly described below, it should be understood that the following drawings only illustrate some embodiments of the present invention and therefore should not be considered as limiting the scope, and for those skilled in the art, other related drawings can be obtained according to the drawings without inventive efforts.

Fig. 1 is an exploded perspective view of a chip support structure provided in the present invention.

Fig. 2 is a perspective cross-sectional view of the chip support structure shown in fig. 1.

Fig. 3 is an enlarged view of the area a shown in fig. 2.

[ detailed description ] embodiments

In order to make the objects, technical solutions and advantageous effects of the present invention more clearly apparent, the present invention is further described in detail below with reference to the accompanying drawings and the detailed description. It should be understood that the detailed description and specific examples, while indicating the preferred embodiment of the utility model, are intended for purposes of illustration only and are not intended to limit the scope of the utility model.

Referring to fig. 1 to 3, the present invention provides a chip supporting structure 100 and an electronic device including the chip supporting structure 100, which are used for fixing a plurality of chips 10 with different thicknesses in the electronic device, and aims to reduce the overall thickness of the chip supporting structure.

In an embodiment of the present invention, the chip support structure 100 includes a circuit board 20, a shield can 30, and a housing 40. The housing 40 has a receiving slot 401 formed at one side thereof, the shielding cover 30 is fixed at the bottom of the receiving slot 401, the circuit board 20 covers the receiving slot 401 and is fixedly connected to the housing 40, and the chip 10 is mounted on the circuit board 20 and received in the receiving slot 401. The shielding cover 30 further forms a plurality of supporting portions 301 corresponding to the chips 10 one by stamping on a side close to the circuit board 20 for supporting the chips 10, the bottom of the receiving slot 401 has a plurality of supporting protrusions 402 corresponding to the chips 10 one by one, and each supporting portion 301 forms a supporting slot (not shown) matching with one supporting protrusion 402 on a side far away from the circuit board 20, that is, the shape of the portion of the shielding cover 30 for supporting the chips 10 is the same as the shape of the bottom of the receiving slot 401.

In this embodiment, the supporting protrusion 402 is disposed on the housing 40 and the supporting portion 301 is disposed on the shielding case 30 to support the chip 10 on the circuit board 20, so that the housing 40 can integrally support and fix a plurality of chips 10 with different thicknesses when being designed, which is also convenient for reducing the thickness of the housing 40, and the shielding case 30 is also provided with the supporting portion 301 which is matched with the shape of the housing 40 and used for supporting the chip 10, so as to better improve the internal space utilization of the housing 40, and further facilitate the light and thin design of the electronic device.

Further, in one embodiment, an elastic pad 50 for pressing the chip 10 is attached to the supporting portion 301, and the elastic pad 50 acts as a buffer for the chip 10, so that when the electronic device is pressed, the elastic pad 50 can absorb the pressure acting on the chip 10, thereby preventing the chip 10 from being damaged by the pressure.

In this embodiment, the elastic pad 50 is a mylar sheet having a regular shape, the mylar sheet is a thin film formed by heating dimethyl terephthalate and ethylene glycol with the aid of a relevant catalyst, performing transesterification and vacuum polycondensation, and biaxially stretching, and the mylar sheet has the characteristics of stable size, flatness, excellent tear strength and the like, is heat-resistant, cold-resistant, moisture-resistant, water-resistant, and chemical-resistant, has super-strong insulating properties, and excellent electrical, mechanical, heat-resistant, and chemical-resistant properties, and therefore the elastic pad 50 can also play an insulating protection role for the chip 10.

Here, the shape of the elastic pad 50 is consistent with the end surface of the chip 10 at the end far from the circuit board 20, and the area of the elastic pad 50 is larger than the end surface of the chip 10 at the end far from the circuit board 20, so as to ensure complete isolation between the chip 10 and the shielding case 30.

Further, in an embodiment, the shielding cover 30 includes a bottom plate 31 and at least one side plate 32 extending from an edge of the bottom plate 31, the supporting portions 301 are disposed on the bottom plate 31 at intervals, and the bottom plate 31 and the side plate 32 respectively abut against a bottom of the receiving slot 401 and an inner wall of the receiving slot 401, so that the shielding cover 30 can be stably embedded in the receiving slot 401 of the housing 40.

In the present embodiment, the side plate 32 is further fixed with a limiting ring 33, and the limiting ring 33 is further abutted between the circuit board 20 and the bottom plate 31, that is, the limiting ring 33 is used for supporting the circuit board 20 and pressing the shielding cover 30 at the bottom of the accommodating groove 401, so that the shielding cover 30 is more firmly fixed, and the housing 40 is not required to be provided with a fastening member such as a screw, which is beneficial to the light and thin design of the electronic device.

Here, the limit ring 33 may include a lower abutting portion 331 abutting against the bottom plate 31, an upper abutting portion 332 abutting against the circuit board 20, and a connecting portion 333 connected between the lower abutting portion 331 and the upper abutting portion 332 and fixedly connected to the inner side of the side plate 32, wherein the height of the connecting portion 333 is greater than the height of the side plate 32, so that the upper abutting portion 332 is disposed directly above the side plate 32 and spaced from the side plate 32, and the width of the upper abutting portion 332 may completely cover one end of the side plate 32 away from the bottom plate 31, and the lower abutting portion 331 is in a ring plate shape and has a through hole formed in the middle thereof through which the supporting portion 301 passes, and in order to improve the force receiving effect, the width of the lower abutting portion 331 is greater than the width of the upper abutting portion 332, and preferably, the width of the lower abutting portion 331 is greater than twice or more than the width of the upper abutting portion 332.

In this embodiment, the side plate 32 is further provided with a plurality of first fixing holes 321, the connecting portion 333 is further provided with second fixing holes 334 corresponding to the first fixing holes 321 one by one, the first fixing holes 321 and the second fixing holes 334 can be used as welding holes to weld the side plate 32 and the connecting portion 333 together, and the first fixing holes 321 and the second fixing holes 334 can also be used as dispensing holes to bond the side plate 32 and the connecting portion 333 together, so that the stability of the supporting structure can be further improved.

When the chip support structure 100 provided by the present invention is assembled,

first, the chip 10 is mounted on the circuit board 20 by means of a patch.

Next, the retainer ring 33 and the shield case 30 are fixed together and then are collectively fitted into the housing groove 401 of the housing 40.

Then, the elastic spacer 50 is attached to the support portion 301 of the shield case 30.

Finally, the circuit board 20 with the chip 10 is fixed to the housing 40, and then the assembly is completed.

In summary, in the chip supporting structure 100 provided by the present invention, the supporting protrusions 402 are disposed on the housing 40 and the supporting portions 301 are disposed on the shielding cover 30 to support the chip 10 on the circuit board 20, so that the problem of supporting and fixing a plurality of chips 10 with different thicknesses can be considered integrally when the housing 40 is designed, the utilization rate of the internal space of the housing 40 can be improved better, and the light and thin design of the electronic device is facilitated.

The utility model is not limited solely to that described in the specification and embodiments, and additional advantages and modifications will readily occur to those skilled in the art, so that the utility model is not limited to the specific details, representative apparatus, and illustrative examples shown and described herein, without departing from the spirit and scope of the general concept as defined by the appended claims and their equivalents.

Claims (9)

1. A chip supporting structure is used for supporting at least two chips with different thicknesses and is characterized by comprising a circuit board, a shielding case and a shell; an accommodating groove is formed in one side of the shell, the shielding cover is fixed to the bottom of the accommodating groove, the circuit board covers the accommodating groove and is fixedly connected with the shell, and the chip is arranged on the circuit board and is accommodated in the accommodating groove; the shielding cover is characterized in that a plurality of supporting parts which are in one-to-one correspondence with the chips and are used for supporting the chips are formed on one side close to the circuit board through stamping, a plurality of supporting bulges in one-to-one correspondence with the chips are arranged at the bottom of the accommodating groove, and a supporting groove matched with one supporting bulge is formed on one side, far away from the circuit board, of each supporting part.

2. The chip supporting structure according to claim 1, wherein an elastic pad for pressing the chip is attached to the supporting portion.

3. The chip support structure of claim 2, wherein the resilient pad is mylar sheet having a regular shape.

4. The chip supporting structure of claim 1, wherein the shielding case includes a bottom plate and at least one side plate extending from an edge of the bottom plate, the supporting portions are disposed on the bottom plate at intervals, and the side plate abuts against an inner wall of the receiving slot.

5. The chip supporting structure according to claim 4, wherein a limiting ring is further fixed on the side plate, and the limiting ring is further abutted between the circuit board and the bottom plate.

6. The chip supporting structure according to claim 5, wherein the limiting ring comprises a lower abutting portion abutting against the bottom plate, an upper abutting portion abutting against the circuit board, and a connecting portion connected between the lower abutting portion and the upper abutting portion and fixedly connected to the inner side of the side plate.

7. The chip supporting structure according to claim 6, wherein the lower abutting portion has a ring plate shape and has a through hole formed in a middle portion thereof for the supporting portion to pass through.

8. The chip supporting structure according to claim 6, wherein the side plate has a plurality of first fixing holes, and the connecting portion has second fixing holes corresponding to the first fixing holes.

9. An electronic device comprising the chip support structure according to any one of claims 1 to 8.

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