CN216625569U

CN216625569U - Protection mechanism of boosting low-power consumption electronic component

Info

Publication number: CN216625569U
Application number: CN202123309136.5U
Authority: CN
Inventors: 李春雨
Original assignee: Tianjin Laiyang New Energy Technology Development Co ltd
Current assignee: Tianjin Laiyang New Energy Technology Development Co ltd
Priority date: 2021-12-27
Filing date: 2021-12-27
Publication date: 2022-05-27
Anticipated expiration: 2031-12-27

Abstract

The utility model discloses a protection mechanism of a boosting low-power consumption electronic component, which comprises a bottom plate, wherein a supporting block is welded at the center of the top of the bottom plate, mounting plates are welded on the outer walls of two sides of the bottom plate, the mounting plates are arranged in groups at equal intervals, boosting low-power consumption electronic chips are placed on the top of the bottom plate, the ground steps of the boosting low-power consumption electronic chips are attached to the tops of the supporting blocks, and a sliding groove is formed in the top of the mounting plate. This low-power consumption electronic component's that steps up protection mechanism, through the protection casing that sets up cladding formula structure, make the device can protect the low-power consumption chip that steps up, the safety in utilization of the low-power consumption chip that steps up of assurance, the device is located bottom plate and roof and has set gradually supporting shoe and bracing piece simultaneously, it sets up to unsettled structure to step up the low-power consumption chip with it, it can effectually dispel the heat to get the low-power consumption chip that steps up, the life of the low-power consumption chip that has guaranteed to step up has improved the practicality of device greatly.

Description

Protection mechanism of boosting low-power consumption electronic component

Technical Field

The utility model relates to the technical field of electronic components, in particular to a protection mechanism of a boosting low-power-consumption electronic component.

Background

Electronic components are the basis of electronic products, and it is the basic of learning and mastering electronic technology to know the types, structures and performances of commonly used electronic components and to correctly select the electronic components.

However, the existing boosting low-power-consumption chip does not have an external protection mechanism, and users generally mostly adopt a protection cover of a directly added closed structure.

SUMMERY OF THE UTILITY MODEL

In view of the deficiencies of the prior art, the present invention provides a protection mechanism for an electronic component with low power consumption.

In order to achieve the purpose, the utility model adopts the following technical scheme:

a protection mechanism of a boosting low-power consumption electronic component comprises a bottom plate, wherein a supporting block is welded at the center of the top of the bottom plate, mounting plates are welded on the outer walls of two sides of the bottom plate, the mounting plates are arranged in a plurality of groups in an equidistant manner, a boosting low-power consumption electronic chip is placed on the top of the bottom plate, the boosting low-power consumption electronic chip is attached to the top of the supporting block, a chute is formed in the top of the mounting plate, a sliding block is arranged in the chute in a sliding manner, a top plate is welded on the top of the sliding block, a supporting rod is welded on the bottom of the top plate, the bottom of the supporting rod is attached to the top of the boosting low-power consumption electronic chip, the boosting low-power consumption chip can be protected by arranging a protective cover of a coating type structure, the use safety of the boosting low-power consumption chip is ensured, and meanwhile, the device is sequentially provided with the supporting block and the supporting rod on the bottom plate and the top plate, the boost low-power chip is arranged to be of a suspension structure, so that the boost low-power chip can effectively dissipate heat, the service life of the boost low-power chip is guaranteed, and the practicability of the device is greatly improved.

Preferably, the corresponding lateral wall of mounting panel has all seted up the radiating groove, and the radiating groove is located the centre of mounting panel.

Preferably, the pins of the boosting low-power consumption electronic chip are positioned at intervals of the mounting plate.

Preferably, the sliding groove is arranged in an inverted T-shaped structure.

Preferably, the number of the supporting rods is a plurality of groups and arranged at equal intervals.

Preferably, the bottom of roof is located the preceding lateral wall welded mounting of slider and has the baffle, and the back lateral wall of baffle sets up with the preceding lateral wall laminating of mounting panel.

Compared with the prior art, the utility model has the beneficial effects that: this low-power consumption electronic component's that steps up protection mechanism, through the protection casing that sets up cladding formula structure, make the device can protect the low-power consumption chip that steps up, the safety in utilization of the low-power consumption chip that steps up of assurance, the device is located bottom plate and roof and has set gradually supporting shoe and bracing piece simultaneously, it sets up to unsettled structure to step up the low-power consumption chip with it, it can effectually dispel the heat to get the low-power consumption chip that steps up, the life of the low-power consumption chip that has guaranteed to step up has improved the practicality of device greatly.

Drawings

FIG. 1 is a schematic structural view of the present invention;

FIG. 2 is a schematic view of a chute position structure according to the present invention;

FIG. 3 is a schematic diagram of a slider position structure according to the present invention.

In the figure: 1, a boosting low-power-consumption electronic chip, 2 sliding grooves, 3 mounting plates, 4 radiating grooves, 5 bottom plates, 6 supporting blocks, 7 baffle plates, 8 sliding blocks, 9 supporting rods and 10 top plates.

Detailed Description

The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.

Example (b): referring to fig. 1-3, comprising a bottom plate 5, a support block 6 is welded and installed at the center of the top of the bottom plate 5, mounting plates 3 are welded and installed on the outer walls of the two sides of the bottom plate 5, the mounting plates 3 are arranged in groups and arranged equidistantly, heat dissipation grooves 4 are formed on the corresponding side walls of the mounting plates 3, the heat dissipation grooves 4 are located at the center of the mounting plates 3, a boosting low-power-consumption electronic chip 1 is placed on the top of the bottom plate 5, the ground step of the boosting low-power-consumption electronic chip 1 is attached to the top of the support block 6, pins of the boosting low-power-consumption electronic chip 1 are located at the intervals of the mounting plates 3, a chute 2 is formed on the top of the mounting plates 3, the chute 2 is arranged in an inverted T-shaped structure, a slide block 8 is arranged in the chute 2, the slide block 8 is slidably connected with the chute 2, a top plate 10 is welded and installed at the top of the slide block 8, a support rod 9 is welded and installed at the bottom of the top plate 10, the quantity of bracing piece 9 is a plurality of groups and is the equidistance and arranges the setting, the bottom of bracing piece 9 sets up with the laminating of the top of the low-power consumption electronic chip 1 that steps up, protection casing through setting up cladding formula structure, make the device can protect the low-power consumption chip that steps up, the safety in utilization of the low-power consumption chip that steps up of assurance, the device is located bottom plate 5 and roof 10 and has set gradually supporting shoe 6 and bracing piece 9 simultaneously, set up its low-power consumption chip that steps up into unsettled structure, it can effectually dispel the heat to obtain the low-power consumption chip that steps up, the life of the low-power consumption chip that steps up has been guaranteed, the practicality of device has been improved greatly, the preceding lateral wall welded mounting that the bottom of roof 10 is located slider 8 has baffle 7, the back lateral wall of baffle 7 sets up with the laminating of the preceding lateral wall of mounting panel 3.

When in use: when the device need be installed, place its low-power consumption electronic chip 1 that steps up on bottom plate 5, cause the stitch of the low-power consumption electronic chip 1 that steps up to be located the interval department of mounting panel 3 in proper order, push spout 2 in through sliding its roof 10 this moment, cause spout 2 and slider 8 phase-match, cause the preceding lateral wall of mounting panel 3 and the laminating of baffle 7 can protect its low-power consumption electronic chip 1 that steps up.

It is noted that, herein, relational terms such as first and second, and the like may be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus.

Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the utility model, the scope of which is defined in the appended claims and their equivalents.

Claims

1. A protection mechanism of a boost low power consumption electronic component comprises a bottom plate (5) and is characterized in that, supporting shoe (6) are installed in the welding of the positive department in top of bottom plate (5), bottom plate (5) both sides outer wall all welded mounting has mounting panel (3), the quantity of mounting panel (3) is a plurality of groups and is the equidistance and arranges the setting, low-power consumption electronic chip (1) of stepping up has been placed at the top of bottom plate (5), the ground step of low-power consumption electronic chip (1) of stepping up sets up with the top laminating of supporting shoe (6), spout (2) have been seted up at the top of mounting panel (3), spout (2) built-in slider (8), slider (8) and spout (2) sliding connection set up, roof (10) are installed in the top welding of slider (8), bracing piece (9) are installed in the bottom welding of roof (10), the bottom of bracing piece (9) sets up with the top laminating of low-power consumption electronic chip (1) of stepping up.

2. The protection mechanism of a boost low power consumption electronic component according to claim 1, characterized in that the corresponding side walls of the mounting plate (3) are provided with heat dissipation grooves (4), and the heat dissipation grooves (4) are located at the center of the mounting plate (3).

3. A protection mechanism for boost low power consumption electronic component according to claim 1 characterized in that the pins of said boost low power consumption electronic chip (1) are located at the interval of the mounting board (3).

4. The protection mechanism of a boost low power consumption electronic component according to claim 1, characterized in that the chute (2) is arranged in an inverted "T" shape structure.

5. A protection mechanism for boost low power consumption electronic component according to claim 1 characterized in that the number of said support rods (9) is several groups and arranged in equidistant arrangement.

6. The protection mechanism of a boost low power consumption electronic component according to claim 1, characterized in that the baffle (7) is welded on the front side wall of the slide block (8) at the bottom of the top plate (10), and the rear side wall of the baffle (7) is attached to the front side wall of the mounting plate (3).