CN216620345U

CN216620345U - Air-cooled semiconductor refrigeration module assembly

Info

Publication number: CN216620345U
Application number: CN202123311327.5U
Authority: CN
Inventors: 邢维莹
Original assignee: Shenzhen Yileng Technology Co ltd
Current assignee: Shenzhen Yileng Technology Co ltd
Priority date: 2021-12-27
Filing date: 2021-12-27
Publication date: 2022-05-27
Anticipated expiration: 2031-12-27

Abstract

The utility model provides an air-cooled semiconductor refrigeration module assembly, which relates to the technical field of semiconductor refrigeration modules and comprises a refrigeration box body and a semiconductor core plate, wherein heat dissipation windows are arranged on two sides of the refrigeration box body in a linear array manner, T-shaped limiting grooves are arranged on two sides of each heat dissipation window, a guide sliding groove is arranged in the vertical direction of each T-shaped limiting groove, a heat dissipation device is arranged in each heat dissipation window and comprises a T-shaped limiting block and a heat dissipation fan, two T-shaped limiting blocks are arranged, a positioning frame is arranged between the T-shaped limiting blocks, connecting sliding blocks are fixedly arranged on two sides of each positioning frame, connecting sliding grooves are arranged on opposite side surfaces of the two T-shaped limiting blocks, the positioning frames are in clearance fit with the heat dissipation windows, the T-shaped limiting blocks are embedded with the T-shaped limiting grooves in a sliding manner, the positioning frames slide into the heat dissipation windows through the connecting sliding blocks, the positioning frames are used for carrying out adaptive heat dissipation on the heat dissipation windows, and the heat dissipation devices can be moved and installed to carry out heat dissipation work at different positions of the heat dissipation windows according to the heat dissipation conditions when in use, the heat dissipation is more uniform, the structure is simple, and the use is convenient.

Description

Air-cooled semiconductor refrigeration module assembly

Technical Field

The utility model relates to the technical field of semiconductor refrigeration modules, in particular to an air-cooled semiconductor refrigeration module assembly.

Background

The semiconductor refrigeration is a current transduction type refrigeration mode, can refrigerate and heat, and can realize high-precision control on temperature through controlling input current. The semiconductor refrigeration plate generally comprises two ceramic plates and a semiconductor material clamped between the two ceramic plates, and the two ceramic plates are connected through a sealant to seal the semiconductor material.

The semiconductor refrigeration heating needs to be effectively radiated after being used, the existing radiating mode aiming at the problem mostly adopts a fixed radiating structure, the problem that the area radiating effect is poor and the internal radiating is uneven is easily caused, and the semiconductor refrigeration heating is not beneficial to practical use.

SUMMERY OF THE UTILITY MODEL

The utility model aims to solve the defects in the prior art and provides an air-cooled semiconductor refrigeration module assembly.

In order to achieve the purpose, the utility model adopts the following technical scheme: the utility model provides an air-cooled semiconductor refrigeration module subassembly, includes refrigeration box and semiconductor core, the fixed semiconductor core that is equipped with of the inside top surface of refrigeration box, the heat dissipation window has been seted up to refrigeration box both sides linear array, T type spacing groove has been seted up to heat dissipation window both sides, the direction spout has been seted up to T type spacing groove vertical direction, the inside heat abstractor that is equipped with of heat dissipation window, heat abstractor includes T type stopper and cooling fan, T type stopper is equipped with two, be equipped with the locating frame between the T type stopper, the fixed connecting sliding block that is equipped with in locating frame both sides, two the connecting spout has been seted up to the side that T type stopper is relative, locating frame and heat dissipation window clearance fit.

Preferably, the inside central point of refrigeration box puts the fixed master control motor that is equipped with, the fixed heat dissipation arc piece that is equipped with of output circumference array of master control motor, the inside both sides of refrigeration box are equipped with the biax cylinder, the expansion end of biax cylinder all is fixed and is equipped with the arc scraper blade, arc scraper blade bottom surface and the inside bottom surface sliding connection of refrigeration box.

Preferably, a T-shaped limiting groove is formed between the adjacent heat dissipation windows, the guide sliding grooves are formed in the horizontal direction of the two sides of the refrigeration box body, and the guide sliding grooves and the T-shaped limiting groove are all penetrated.

Preferably, the width of the inner wall of the guide chute is the same as that of the connecting chute, and the position of the guide chute is the same as that of the connecting chute.

Preferably, the length of one end of the T-shaped limiting block is 2 times of the thickness of the heat dissipation window, the bearing frame is fixed on the inner wall of the positioning frame, and the surface of the bearing frame is fixed with the back of the heat dissipation fan.

Preferably, the double-shaft air cylinder runs synchronously, and the bottom ends of the heat dissipation arc pieces at the top end of the arc-shaped scraper are positioned on the same horizontal line.

Advantageous effects

According to the utility model, the heat dissipation devices are arranged at the heat dissipation windows on the two sides of the refrigeration box body, the T-shaped limiting block and the T-shaped limiting groove are slidably embedded, the positioning frame slides into the heat dissipation windows through the connecting sliding block, the positioning frame is used for carrying out adaptive heat dissipation on the heat dissipation windows, and the heat dissipation devices can be moved and installed according to the heat dissipation conditions to carry out heat dissipation work at different heat dissipation window positions when the refrigeration box is used, so that the heat dissipation is more uniform, the structure is simple, and the refrigeration box is convenient to use.

According to the utility model, the central position in the refrigeration box body is adopted to drive the heat dissipation arc piece to rotate through the main control motor so as to accelerate the internal air circulation, the arc scraper plate is driven by the double-shaft cylinder to repeatedly move towards two sides so as to quickly discharge the internal air towards the two sides, and meanwhile, the heat dissipation device at the heat dissipation window is matched to quickly exchange the internal air and the external air, so that the air circulation speed is accelerated, and the heat dissipation efficiency is improved by utilizing air cooling.

Drawings

FIG. 1 is a schematic perspective view of an air-cooled semiconductor refrigeration module assembly;

FIG. 2 is an enlarged view of FIG. 1 at A;

FIG. 3 is a front cross-sectional view of an air-cooled semiconductor refrigeration module assembly;

fig. 4 is a side cross-sectional view of an air-cooled semiconductor refrigeration module assembly.

Illustration of the drawings:

1. a refrigeration box body; 2. a heat dissipation window; 3. a T-shaped limiting groove; 4. a guide chute; 5. a heat sink; 501. a T-shaped limiting block; 502. a positioning frame; 503. a bearing frame; 504. a heat radiation fan; 505. connecting the sliding block; 506. connecting the sliding chute; 6. a semiconductor core board; 7. a master control motor; 8. a heat dissipation arc sheet; 9. a double-shaft cylinder; 10. an arc-shaped scraper.

Detailed Description

In order to make the technical means, the original characteristics, the achieved purposes and the effects of the utility model easily understood, the utility model is further described below with reference to the specific embodiments and the attached drawings, but the following embodiments are only the preferred embodiments of the utility model, and not all embodiments. Based on the embodiments in the implementation, other embodiments obtained by those skilled in the art without any creative efforts belong to the protection scope of the present invention.

Specific embodiments of the present invention are described below with reference to the accompanying drawings.

The specific embodiment is as follows:

referring to fig. 1-4, an air-cooled semiconductor refrigeration module assembly comprises a refrigeration box body 1 and a semiconductor core 6, wherein the semiconductor core 6 is fixedly arranged on the top surface inside the refrigeration box body 1, two linear arrays of heat dissipation windows 2 are arranged on two sides of the refrigeration box body 1, T-shaped limiting grooves 3 are arranged on two sides of the heat dissipation windows 2, guide sliding grooves 4 are arranged in the vertical direction of the T-shaped limiting grooves 3, a heat dissipation device 5 is arranged inside the heat dissipation windows 2, the heat dissipation device 5 comprises T-shaped limiting blocks 501 and a heat dissipation fan 504, two T-shaped limiting blocks 501 are arranged, a positioning frame 502 is arranged between the T-shaped limiting blocks 501, connecting sliding blocks 505 are fixedly arranged on two sides of the positioning frame 502, connecting sliding grooves 506 are arranged on the opposite sides of the two T-shaped limiting blocks 501, the positioning frame 502 is in clearance fit with the heat dissipation windows 2, the semiconductor core 6 is powered on for refrigeration, and the top surface of the semiconductor core 6 is abutted against the refrigeration box body 1 for refrigeration, when the heat dissipation device 5 is installed and used, firstly, the positioning frame 502 slides to a position closest to the end of the T-shaped limiting block 501 through the connecting slide block 505, the collinear two ends of the T-shaped limiting block 501 are inserted into the T-shaped limiting groove 3 to slide, the T-shaped limiting groove 3 penetrates through the top surface of the refrigeration box body 1 along the vertical direction of the refrigeration box body 1, the T-shaped limiting block 501 is inserted into the T-shaped limiting groove 3 along the top surface of the refrigeration box body 1 to slide downwards to the bottom, at the moment, the positioning frame 502 corresponds to the position of the heat dissipation window 2, the connecting slide block 505 slides along the connecting slide groove 506 by pushing the positioning frame 502 to the position of the heat dissipation window 2, the T-shaped limiting block enters the interior of the heat dissipation window 2 through the guide slide groove 4 to install the heat dissipation device 5 and the heat dissipation window 2, when the heat dissipation device is disassembled, firstly, the positioning frame 502 slides to a side far away from the heat dissipation window 2, then vertically pulling the T-shaped limiting block 501 upwards to leave the interior of the T-shaped limiting groove 3, completing the disassembly, arranging the heat dissipation devices 5 at the heat dissipation windows 2 at the two sides of the refrigeration box body 1, sliding and embedding the T-shaped limiting block 501 and the T-shaped limiting groove 3, sliding the positioning frame 502 into the heat dissipation windows 2 through the connecting slide block 505, adaptively dissipating heat of the heat dissipation windows 2 by the positioning frame 502, moving and installing the heat dissipation devices 5 according to the heat dissipation situation during the use to dissipate heat at different positions of the heat dissipation windows 2, so that the heat dissipation is more uniform, the structure is simple, the use is convenient, the main control motor 7 is fixedly arranged at the central position in the refrigeration box body 1, the heat dissipation arc sheets 8 are fixedly arranged on the circumference array of the output end of the main control motor 7, the double-shaft cylinders 9 are arranged at the two sides in the refrigeration box body 1, the arc-shaped scraping plates 10 are fixedly arranged at the movable ends of the double-shaft cylinders 9, and the bottom surfaces of the arc-shaped scraping plates 10 are connected with the bottom surfaces in the refrigeration box body 1 in a sliding manner, the double-shaft cylinder 9 runs synchronously, the bottom end of the heat dissipation arc piece 8 at the top end of the arc scraper 10 is positioned at the same horizontal line, the central position in the refrigeration box body 1 is adopted to drive the heat dissipation arc piece 8 to rotate through the main control motor 7 so as to accelerate the air circulation at the central position in the refrigeration box body 1, the double-shaft cylinder 9 drives the arc scraper 10 to repeatedly move towards two sides so as to quickly discharge the internal air towards two sides, so that the air in the internal space of the refrigeration box body 1 simultaneously and quickly flows, the heat dissipation device 5 at the heat dissipation window 2 is matched to quickly exchange the internal air and the external air, the air circulation speed is accelerated, the heat dissipation efficiency is improved by air cooling, a T-shaped limiting groove 3 is arranged between the adjacent heat dissipation windows 2, the guide sliding grooves 4 are arranged at two sides of the refrigeration box body 1 in the horizontal direction, the guide sliding grooves 4 and the T-shaped limiting grooves 3 are all penetrated, the groove width of the inner walls of the guide sliding grooves 4 is the same as the groove width of the connecting sliding grooves 506, the position of the guide chute 4 is the same as that of the connecting chute 506, so that the positioning frame 502 and the heat dissipation window 2 can be conveniently installed in a sliding fit manner, the length of one end of the T-shaped limiting block 501 is 2 times of the thickness of the heat dissipation window 2, the bearing frame 503 is fixed on the inner wall of the positioning frame 502, and the surface of the bearing frame 503 is fixed on the back of the heat dissipation fan 504, so that the installation and the fit of the T-shaped limiting block 501 and the T-shaped limiting groove 3 are not influenced when the positioning frame 502 can slide to the surface of the T-shaped limiting block 501.

In the present invention, unless otherwise expressly stated or limited, "above" or "below" a first feature means that the first and second features are in direct contact, or that the first and second features are not in direct contact but are in contact with each other via another feature therebetween. Also, the first feature being "on," "above" and "over" the second feature includes the first feature being directly on and obliquely above the second feature, or merely indicating that the first feature is at a higher level than the second feature. A first feature being "under," "below," and "beneath" a second feature includes the first feature being directly under and obliquely below the second feature, or simply meaning that the first feature is at a lesser elevation than the second feature.

The foregoing shows and describes the general principles, essential features, and advantages of the utility model. It will be understood by those skilled in the art that the present invention is not limited to the embodiments described above, and the preferred embodiments of the present invention are described in the above embodiments and the description, and are not intended to limit the present invention. The scope of the utility model is defined by the appended claims and equivalents thereof.

Claims

1. The utility model provides an air-cooled semiconductor refrigeration module subassembly, includes refrigeration box (1) and semiconductor core board (6), its characterized in that: the fixed semiconductor core board (6) that is equipped with of inside top surface of refrigeration box (1), heat dissipation window (2) have been seted up to refrigeration box (1) both sides linear array, T type spacing groove (3) have been seted up to heat dissipation window (2) both sides, guide chute (4) have been seted up to T type spacing groove (3) vertical direction, inside heat abstractor (5) that is equipped with of heat dissipation window (2), heat abstractor (5) are including T type stopper (501) and cooling fan (504), T type stopper (501) are equipped with two, be equipped with between T type stopper (501) locating frame (502), locating frame (502) both sides are fixed and are equipped with connecting slide block (505), two connecting chute (506) have been seted up to the side that T type stopper (501) are relative, locating frame (502) and heat dissipation window (2) clearance fit.

2. The air-cooled semiconductor refrigeration module assembly of claim 1, wherein: the refrigerator is characterized in that a main control motor (7) is fixedly arranged at the center inside the refrigerator body (1), heat dissipation arc pieces (8) are fixedly arranged on an output end circumference array of the main control motor (7), double-shaft cylinders (9) are arranged on two sides inside the refrigerator body (1), arc-shaped scraping plates (10) are fixedly arranged at movable ends of the double-shaft cylinders (9), and the bottom surfaces of the arc-shaped scraping plates (10) are connected with the bottom surface inside the refrigerator body (1) in a sliding mode.

3. The air-cooled semiconductor refrigeration module assembly of claim 1, wherein: adjacent be equipped with a T type spacing groove (3) between heat dissipation window (2), direction spout (4) have been seted up to refrigeration box (1) both sides horizontal direction, and direction spout (4) all run through with T type spacing groove (3).

4. The air-cooled semiconductor refrigeration module assembly of claim 1, wherein: the groove width of the inner wall of the guide sliding groove (4) is the same as that of the connecting sliding groove (506), and the position of the guide sliding groove (4) is the same as that of the connecting sliding groove (506).

5. The air-cooled semiconductor refrigeration module assembly of claim 1, wherein: one end of the T-shaped limiting block (501) is 2 times as long as the thickness of the heat dissipation window (2), the inner wall of the positioning frame (502) is fixed with the bearing frame (503), and the surface of the bearing frame (503) is fixed with the back of the heat dissipation fan (504).

6. The air-cooled semiconductor refrigeration module assembly of claim 2, wherein: the double-shaft air cylinder (9) runs synchronously, and the bottom ends of the heat dissipation arc sheets (8) at the top ends of the arc-shaped scraping plates (10) are located on the same horizontal line.