CN216606846U - TNF mother-son module structure - Google Patents
TNF mother-son module structure Download PDFInfo
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- CN216606846U CN216606846U CN202122909986.2U CN202122909986U CN216606846U CN 216606846 U CN216606846 U CN 216606846U CN 202122909986 U CN202122909986 U CN 202122909986U CN 216606846 U CN216606846 U CN 216606846U
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Abstract
The utility model belongs to the technical field of semiconductor packaging punching and provides a TNF (tumor necrosis factor) primary-secondary die module structure which comprises an upper die and female die frame, an upper die sub-die, a lower die and female die sub-dies, wherein the upper die and female die frame is matched with the upper die sub-dies, the lower die and female die frame is matched with the lower die sub-dies, the upper die and female die frame comprises an upper base, two upper die side baffles arranged on the side edge of the upper base and an upper die rear baffle arranged behind the upper base, the lower die and female die frame comprises a lower base, two lower die side baffles arranged on the side edge of the lower base and a lower die rear baffle arranged behind the lower base, and the upper die and female die frame are respectively and movably connected with an upper die quick-disassembly fixing plate and a lower die quick-disassembly fixing plate. The female die set is kept unchanged, the whole die does not need to be disassembled, and switching production of different products is quickly realized through a mode of quickly disassembling and replacing the sub die. The purpose of quickly disassembling and replacing the die is achieved through a simple structure, and the applicability and the compatibility of equipment are enhanced.
Description
Technical Field
The utility model belongs to the technical field of semiconductor packaging punching, and particularly relates to a TNF (tumor necrosis factor) child-mother module structure.
Background
Today, semiconductor devices applied in the field of electronic technology are widely used and have higher quality requirements. After the semiconductor element is packaged, the semiconductor element needs to be punched and shaped to meet the application requirement, the types of the semiconductor element are many, and the sub-film needs to be replaced frequently. The die carrier and the die core in one set of die are designed in a matched manner in the prior art, when equipment is replaced to produce new semiconductor products, the equipment is complex in design, the whole die needs to be detached when the new products are replaced, the time cost is long, the capacity of the equipment is wasted, the production efficiency is reduced, in addition, the technical requirement on operators is high, and certain knowledge in the aspect of the die is needed.
In view of the above disadvantages, in order to meet the requirements of producing different types of semiconductor products and quickly, efficiently, safely and conveniently replacing the sub-modules, it is necessary to provide a TNF sub-module structure.
SUMMERY OF THE UTILITY MODEL
In order to overcome the problems of the existing punching process for replacing semiconductor products, the utility model provides an easy-to-assemble TNF (tumor necrosis factor) master-slave module structure.
In order to achieve the above purpose, the technical scheme of the utility model is as follows: the TNF primary and secondary die module structure comprises an upper die and female die set, an upper die sub die, a lower die and female die set and a lower die sub die, wherein the upper die and female die set is matched with the upper die sub die, the lower die and female die set is matched with the lower die sub die, the upper die and female die set comprises an upper base, two upper die side baffles arranged on the side edges of the upper base and an upper die rear baffle arranged behind the upper base, the lower die and female die set comprises a lower base, two lower die side baffles arranged on the side edges of the lower base and a lower die rear baffle arranged behind the lower base, and the upper die and female die set and the lower die set are respectively and movably connected with an upper die quick-disassembly fixing plate and a lower die quick-disassembly fixing plate.
As a preferable scheme of the utility model, a first flange is arranged at the top of the inner side of the upper die side baffle, a groove is defined by the inner side of the upper die side baffle, the first flange and the upper base, and second flanges are respectively arranged at the top of the inner side of the upper die rear baffle and the top of the inner side of the lower die rear baffle.
As a preferable mode of the present invention, the upper mold side guard is detachably mounted with a plurality of first attachment plates, and the first flange is an extension of the first attachment plate protruding from the upper mold side guard.
As a preferred scheme of the present invention, the upper base and the upper die side baffle are of an integral structure, the lower base and the lower die side baffle are of an integral structure, the upper die rear baffle and the lower die rear baffle are respectively provided with a screw hole, the upper die rear baffle is screwed with the upper base through the screw hole, and the lower die rear baffle is screwed with the lower base through the bolt hole.
As a preferred scheme of the utility model, an upper groove is arranged on the inner side of the upper die quick-release fixing plate, a lower groove is arranged on the top of the inner side of the lower die quick-release fixing plate, the upper groove is used for clamping the upper die female die frame and the upper die sub-die, and the lower groove is used for clamping the lower die female die frame and the lower die sub-die.
As a preferable scheme of the present invention, the upper groove is provided with two first bosses, and the lower groove is provided with two second bosses.
As a preferable scheme of the utility model, the upper die and female die frame is connected with the upper die quick-release fixing plate through screws, and the lower die and female die frame is connected with the lower die quick-release fixing plate through screws.
As a preferable scheme of the present invention, an upper mold sensor mounting plate is installed on the upper mold and female mold frame, and a lower mold sensor mounting plate is installed on the lower mold and female mold frame.
As a preferred scheme of the present invention, the upper mold sensor mounting plate is provided with an upper mold sensing through hole, the lower mold sensor mounting plate is provided with a lower mold sensing through hole, the upper mold backplate is provided with an upper through hole, the lower mold backplate is provided with a lower through hole, the upper mold sensing through hole corresponds to the upper through hole, and the lower mold sensing through hole corresponds to the lower through hole.
As a preferred scheme of the present invention, a plurality of functional holes are respectively formed in the upper base, the lower base, the upper mold sub-mold and the lower mold sub-mold, the functional holes of the upper mold sub-mold correspond to the functional holes of the upper base, and the functional holes of the lower mold sub-mold correspond to the functional holes of the lower base.
The utility model has the following beneficial effects and main advantages:
the female die frame is kept unchanged, the whole die does not need to be disassembled, and switching production of different products is quickly realized by means of quick disassembly and replacement of the sub dies. The purpose of quickly disassembling and replacing the die is achieved through a simple structure, the applicability and compatibility of equipment are enhanced, the die replacement time is reduced, the productivity is saved, and the production efficiency is improved. The method for replacing the sub-mold is simple and convenient, and can reduce the labor intensity and technical requirements of operators. The female die frame with the same model can be compatible with various sub dies at most, and the utilization rate of equipment is further improved.
Drawings
FIG. 1 is an exploded view of the structure of the present invention;
FIG. 2 is a schematic perspective view of the present invention;
FIG. 3 is a schematic structural diagram of an upper mold and a female mold of the present invention;
FIG. 4 is a schematic structural view of a lower die and a master die carrier of the utility model;
FIG. 5 is a schematic view of the upper mold sensor mounting plate structure of the present invention;
FIG. 6 is a schematic view of a lower die sensor mounting plate according to the present invention;
FIG. 7 is an enlarged view of FIG. 3A;
FIG. 8 is an enlarged view of FIG. 4B;
in the figure: 1. an upper die and a female die frame; 2. an upper die sub-die; 3. a lower die female die frame; 4. a lower die sub-die; 5. an upper base; 6. an upper die side baffle; 7. a rear baffle of the upper die; 8. a lower base; 9. a lower die side baffle; 10. a lower die rear baffle; 11. an upper die quick-release fixing plate; 12. a lower die quick-release fixing plate; 13. a first flange; 14. a second flange; 15. a first add-on plate; 16. a screw hole; 17. an upper groove; 18. a lower groove; 19. a first boss; 20. a second boss; 21. an upper die inductor mounting plate; 22. a lower die inductor mounting plate; 23. an upper die induction through hole; 24. a lower die induction through hole; 25. an upper through hole; 26. a lower through hole; 27. and (4) a functional hole.
Detailed Description
The present invention is further described below with reference to specific embodiments, and it should be noted that, without conflict, any combination between the embodiments or technical features described below may form a new embodiment.
In the description of the present invention, it should be noted that, for the terms of orientation, such as "central", "lateral", "longitudinal", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "first", "second", etc., indicate an orientation and a positional relationship based on that shown in the drawings, and are only for convenience of describing the present invention and simplifying the description, but do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and should not be construed as limiting the specific scope of the present invention.
As shown in fig. 1, 2, 3 and 4, the screw hole TNF primary-secondary mold modular structure includes an upper mold-female mold frame 1, an upper mold sub-mold 2, a lower mold-female mold frame 3 and a lower mold sub-mold 4, the upper mold-female mold frame 1 is adapted to the upper mold sub-mold 2, the lower mold-female mold frame 3 is adapted to the lower mold sub-mold 4, the upper mold-female mold frame 1 includes an upper base 5, two upper mold side baffles 6 arranged at the side of the upper base 5 and an upper mold back baffle 7 arranged at the back of the upper base 5, the lower mold-female mold frame 3 includes a lower base 8, two lower mold side baffles 9 arranged at the side of the lower base 8 and a lower mold back baffle 10 arranged at the back of the lower base 8, and the upper mold-female mold frame 1 and the lower mold-female mold frame 3 are respectively and movably connected with an upper mold quick-release fixing plate 11 and a lower mold quick-release fixing plate 12. During installation, the upper sub-mold or the lower sub-mold slides into the sliding grooves formed by the upper mold base, the lower mold base, the corresponding side baffle and the corresponding rear baffle respectively, and then the upper mold quick-release fixing plate 11 and the lower mold quick-release fixing plate 12 fix the corresponding upper sub-mold or the corresponding lower sub-mold, so that the quick and stable installation of the sub-molds is realized.
As shown in fig. 2, 4, 7 and 8, a first flange 13 is arranged at the top of the inner side of the upper mold side baffle 6, a groove is defined by the inner side of the upper mold side baffle 6, the first flange 13 and the upper base 5, and second flanges 14 are respectively arranged at the top of the inner side of the upper mold back baffle 7 and the top of the inner side of the lower mold back baffle 10.
Referring to fig. 3, the upper mold side baffle 6 is detachably provided with a first installing plate 15, the first installing plate 15 is provided with a plurality of first installing plates, the first flange 13 is an extension part protruding out of the first installing plate 15 and of the upper mold side baffle 6, when different upper sub molds are installed, the first installing plates can be adapted through different first installing plates, in addition, the first installing plates are used in an overlapping mode, the bearing force of the upper mold and female mold frame 2 on the sub molds can be enhanced, the sub molds are prevented from falling off, and safe production is realized.
As shown in fig. 3, 4, 7 and 8, the upper base 5 and the upper mold side baffle 6 are of an integral structure, the lower base 8 and the lower mold side baffle 9 are of an integral structure, the upper mold back baffle 7 and the lower mold back baffle 10 are respectively provided with a screw hole 16, the upper mold back baffle 7 is in threaded connection with the upper base 5 through the screw hole 16, and the lower mold back baffle 10 is in threaded connection with the lower base 8 through a bolt hole. The upper base 5 and the upper die side baffle 6 are of an integral structure, and the lower base 8 and the lower die side baffle 9 are of an integral structure, so that the base is convenient to manufacture.
As shown in fig. 6 and 7, an upper groove 17 is arranged on the inner side of the upper mold quick-release fixing plate 11, a lower groove 18 is arranged on the top of the inner side of the lower mold quick-release fixing plate 12, the upper groove 17 is used for clamping the upper mold and female mold frame 1 and the upper mold and sub-mold 2, and the lower groove 18 is used for clamping the lower mold and female mold frame 3 and the lower mold and sub-mold 4, so that the stability of sub-mold installation is improved, and the noise of the device is reduced.
Further, the upper groove 17 is provided with two first bosses 19, and the lower groove 18 is provided with two second bosses 20. As shown in fig. 6 and 7, the first bosses 19 and the second bosses 20 are respectively located at both sides of the upper and lower grooves, so that the quick positioning of the installation between the master mold frame and the sub mold is improved and a certain stress is released.
As shown in fig. 1, 3 and 4, the upper mold and female mold frame 1 is connected to an upper mold quick-release fixing plate 11 by screws, and the lower mold and female mold frame 3 is connected to a lower mold quick-release fixing plate 12 by screws.
As shown in fig. 3, 4, 7 and 8, an upper sensor mounting plate 21 is attached to the upper die set 1, and a lower sensor mounting plate 22 is attached to the lower die set 3. Further, it is equipped with mould response through-hole 23 to go up mould inductor mounting panel 21, lower mould inductor mounting panel 22 is equipped with lower mould response through-hole 24, it is equipped with through-hole 25 to go up mould backplate 7, lower mould backplate 10 is equipped with down through-hole 26, go up mould response through-hole 23 with it corresponds to go up through-hole 25, lower mould response through-hole 24 with through-hole 26 corresponds down. After the upper and lower die sensor mounting plates are respectively provided with the induction sensors, the induction sensors can sense the model of the sub-die through the upper and lower induction through holes and the upper and lower through holes.
As shown in fig. 3 and 5, a plurality of function holes 27 are respectively formed in the upper base 5, the lower base 8, the upper mold sub-mold 2, and the lower mold sub-mold 4, the function holes 27 of the upper mold sub-mold 2 correspond to the function holes 27 of the upper base 5, and the function holes 27 of the lower mold sub-mold 4 correspond to the function holes 27 of the lower base 8. The number of the functional holes on the upper base and the lower base is more than or equal to that of the functional holes of any upper sub-die and any lower sub-die matched with the functional holes, so that the stroke requirements of a cutter or parts are met when different semiconductors are processed. The punching positions of different semiconductor products are different, so that the semiconductor products need to be punched by using sub-dies with different internal structures, in the embodiment, the upper die sensor mounting plate and the lower die sensor mounting plate are respectively provided with three through holes, each through hole can be internally provided with an induction sensor, and the corresponding sub-dies are provided with different induction points, so that the utility model can induce 8 different sub-dies by only using a common inductor, and therefore, the model master die frame can be compatible with 8 sub-dies at most.
The working process of the utility model is as follows:
when a mould is replaced, mounting screws on an upper mould quick-disassembly fixing plate 11 and a lower mould quick-disassembly fixing plate 12 are disassembled, the upper mould quick-disassembly fixing plate 11 and the lower mould quick-disassembly fixing plate 12 are disassembled, an upper mould sub-mould 2 and a lower mould sub-mould 4 are respectively taken out in a sliding manner from inside to outside from an upper mould-female mould frame 1 and a lower mould-female mould frame 3, a new upper mould sub-mould 2 and a new lower mould sub-mould 4 which need to be replaced are taken out, the upper mould quick-disassembly fixing plate 11 and the lower mould quick-disassembly fixing plate 12 are fastened after sliding into a female mould through sliding grooves which are respectively surrounded by baffles of the upper mould-female mould frame 1 and the lower mould-female mould frame 3; the sub-model number is sensed by sensors mounted on the upper die sensor mounting plate 21 and the lower die sensor mounting plate 22, and is produced cooperatively.
While particular embodiments of the present invention have been illustrated and described, it would be obvious that various other changes and modifications can be made without departing from the spirit and scope of the utility model. It is therefore intended to cover in the appended claims all such changes and modifications that are within the scope of this invention.
Claims (10)
- TNF primary and secondary module structure, its characterized in that: comprises an upper die and a female die frame (1), an upper die sub-die (2), a lower die and a female die frame (3) and a lower die sub-die (4), the upper die and female die set (1) is matched with the upper die sub-die (2), the lower die and female die set (3) is matched with the lower die sub-die (4), the upper die and female die mold frame (1) comprises an upper base (5), two upper die side baffles (6) arranged on the side edges of the upper base (5) and an upper die rear baffle (7) arranged on the rear edge of the upper base (5), the lower die female die frame (3) comprises a lower base (8), two lower die side baffles (9) arranged at the side edges of the lower base (8) and a lower die rear baffle (10) arranged at the rear edge of the lower base (8), the upper die and female die set (1) and the lower die and female die set (3) are respectively movably connected with an upper die quick-dismantling fixing plate (11) and a lower die quick-dismantling fixing plate (12).
- 2. The TNF sub-master module structure of claim 1, wherein: go up mould side shield (6) inboard top and be equipped with first flange (13), it is inboard to go up mould side shield (6) first flange (13) with go up base (5) and enclose into the recess, go up mould backplate (7) inboard top with lower mould backplate (10) inboard top is equipped with second flange (14) respectively.
- 3. The TNF sub-master module structure of claim 2, wherein: go up mould side shield (6) detachable and install first additional board (15), first additional board (15) have a plurality of, first flange (13) do the protrusion on first additional board (15) go up the extension of mould side shield (6).
- 4. The TNF sub-master module structure of claim 1, wherein: go up base (5) with go up mould side shield (6) structure as an organic whole, down base (8) with lower mould side shield (9) structure as an organic whole, go up mould backplate (7) with lower mould backplate (10) are equipped with screw (16) respectively, it passes through screw (16) spiro union to go up mould backplate (7) go up base (5), lower mould backplate (10) pass through the bolt hole spiro union base (8) down.
- 5. The TNF sub-master module structure of claim 1, wherein: the mould is characterized in that an upper groove (17) is formed in the inner side of the upper mould quick-release fixing plate (11), a lower groove (18) is formed in the top of the inner side of the lower mould quick-release fixing plate (12), the upper groove (17) is used for clamping the upper mould female mould frame (1) and the upper mould sub-mould (2), and the lower groove (18) is used for clamping the lower mould female mould frame (3) and the lower mould sub-mould (4).
- 6. The TNF sub-master module structure of claim 5, wherein: the upper groove (17) is provided with two first bosses (19), and the lower groove (18) is internally provided with two second bosses (20).
- 7. The TNF sub-master module structure of claim 1, wherein: the upper die and female die set (1) is connected with an upper die quick-dismantling fixing plate (11) through screws, and the lower die and female die set (3) is connected with a lower die quick-dismantling fixing plate (12) through screws.
- 8. The TNF sub-master module structure of claim 1, wherein: an upper die sensor mounting plate (21) is mounted on the upper die and female die frame (1), and a lower die sensor mounting plate (22) is mounted on the lower die and female die frame (3).
- 9. The TNF sub-master module structure of claim 8, wherein: go up mould inductor mounting panel (21) and be equipped with mould response through-hole (23), lower mould inductor mounting panel (22) are equipped with lower mould response through-hole (24), it is equipped with through-hole (25) to go up mould backplate (7), lower mould backplate (10) are equipped with down through-hole (26), go up mould response through-hole (23) with it corresponds to go up through-hole (25), lower mould response through-hole (24) with through-hole (26) correspond down.
- 10. The TNF sub-master module structure of claim 1, wherein: the upper base (5), the lower base (8), the upper die sub-die (2) and the lower die sub-die (4) are respectively provided with a plurality of functional holes (27), the functional holes (27) of the upper die sub-die (2) correspond to the functional holes (27) of the upper base (5), and the functional holes (27) of the lower die sub-die (4) correspond to the functional holes (27) of the lower base (8).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202122909986.2U CN216606846U (en) | 2021-11-22 | 2021-11-22 | TNF mother-son module structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202122909986.2U CN216606846U (en) | 2021-11-22 | 2021-11-22 | TNF mother-son module structure |
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| Publication Number | Publication Date |
|---|---|
| CN216606846U true CN216606846U (en) | 2022-05-27 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202122909986.2U Active CN216606846U (en) | 2021-11-22 | 2021-11-22 | TNF mother-son module structure |
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| Country | Link |
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| CN (1) | CN216606846U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115027010A (en) * | 2022-08-11 | 2022-09-09 | 烟台精锐模具有限公司 | High-precision injection mold for manufacturing column head membrane of medical chromatographic column |
-
2021
- 2021-11-22 CN CN202122909986.2U patent/CN216606846U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115027010A (en) * | 2022-08-11 | 2022-09-09 | 烟台精锐模具有限公司 | High-precision injection mold for manufacturing column head membrane of medical chromatographic column |
| CN115027010B (en) * | 2022-08-11 | 2022-11-08 | 烟台精锐模具有限公司 | High-precision injection mold for manufacturing column head membrane of medical chromatographic column |
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