CN216605292U - Device for bonding micro-fluidic chip by vacuumizing - Google Patents
Device for bonding micro-fluidic chip by vacuumizing Download PDFInfo
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- CN216605292U CN216605292U CN202122418067.5U CN202122418067U CN216605292U CN 216605292 U CN216605292 U CN 216605292U CN 202122418067 U CN202122418067 U CN 202122418067U CN 216605292 U CN216605292 U CN 216605292U
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Abstract
The utility model relates to a device for bonding a microfluidic chip by vacuumizing, which comprises pins, a chip supporting plate, a chip bottom plate and a packaging bag, wherein the pins are arranged on the chip supporting plate; the chip supporting plate and the chip bottom plate are connected into a whole through pins, and a required bonding chip is placed in the chip bottom plate horizontally and then placed in the packaging bag for vacuumizing; the left side and the right side of the chip supporting plate are provided with chip supporting plate pin holes, and the middle part of the chip supporting plate is provided with a chip supporting plate cavity; chip bottom plate's the left and right sides both sides are equipped with chip bottom plate cotter hole, chip bottom plate's middle part is equipped with chip bottom cavity, and required bonded chip keeps flat in chip bottom cavity, both sides are equipped with the permanent magnet chamber about chip bottom plate's the bottom for place the permanent magnet, and the chip bottom plate side that corresponds with the permanent magnet chamber is equipped with chip bottom plate cotter hole, through the fixed permanent magnet of chip bottom plate pin.
Description
Technical Field
The utility model relates to the field of detection and analysis of microfluidic chips, in particular to a device for bonding a microfluidic chip by utilizing vacuum of the microfluidic chip, which can stably improve the chip bonding effect.
Background
The micro-fluidic chip technology integrates basic operation units such as sample preparation, reaction, separation, detection and the like in the biological, chemical and medical analysis process on a micron-scale chip, and can complete functions such as pretreatment, micro-analysis, mixing or separation and the like through precise control of micro-fluid in a chip channel so as to complete the whole analysis process. For example, enrichment sorting chips, are commonly used to capture, enrich, sort biomolecules or cells, such as circulating tumor cells.
In the process of preparing the microfluidic chip, after the microstructure is processed, a layer of material (cover plate) is covered above the flow channel to complete the sealing of the flow channel, namely the bonding of the microfluidic chip. The bonding forms a closed micro-cavity structure with physical and chemical analysis functions of sample introduction, flowing, separation and the like. In the bonding process, the microstructure of the chip substrate is required not to deform/block, and the like, so that the realization of the subsequent analysis function is influenced. Particularly, for the microfluidic chip with the function of screening circulating tumor cells, the complex microstructure including the excessive number of micro-pillars and the high aspect ratio makes it very challenging to package or bond.
Polydimethylsiloxane (PDMS), which is an organic polymer material, has advantages of easy molding, low cost, and the like, and has been widely studied as a material for manufacturing microfluidic chips. A PDMS substrate having a microstructure is generally bonded to a cover plate made of PDMS, glass, polymethyl methacrylate (PMMA), Polycarbonate (PC), or the like, after the surface is treated with oxygen plasma. When bonding, certain pressure is applied to the base sheet and the cover sheet to achieve the required bonding effect. The pressure is generally performed manually by an operator according to experience by using a roller or a pressing block, and the methods have the problems that the pressure is difficult to control, the bonding pressure is insufficient, the bonding pressure is too high, the bonding pressure is not uniform and the like, so that a chip microstructure can generate certain deformation to influence the bonding effect.
SUMMERY OF THE UTILITY MODEL
The utility model relates to the field of microfluidic chip detection and analysis, in particular to a device for bonding a microfluidic chip by utilizing a vacuum packaging machine, which can stably improve the chip bonding effect.
In order to achieve the above purposes, the technical scheme adopted by the utility model is as follows:
a device for bonding a microfluidic chip by vacuumizing comprises a pin 1, a chip supporting plate 2, a chip bottom plate 5 and a packaging bag 9;
the chip supporting plate 2 and the chip bottom plate 5 are connected into a whole through the pin 1, and a required bonding chip is placed in the chip bottom plate 5 in a flat mode and then placed in the packaging bag 9 for vacuumizing;
the left side and the right side of the chip supporting plate 2 are provided with chip supporting plate pin holes 3, and the middle part of the chip supporting plate 2 is provided with a chip supporting plate cavity 4;
the left side and the right side of the chip bottom plate 5 are provided with chip bottom plate pin holes 6, and the middle part of the chip bottom plate 5 is provided with a chip bottom cavity 7;
the required bonding chip is horizontally placed in the chip bottom cavity;
the permanent magnet cavity 10 is arranged on the left side and the right side of the bottom of the chip bottom plate 5 and used for placing a permanent magnet, the chip bottom plate pin hole 6 is arranged on the side face of the chip bottom plate 5 corresponding to the permanent magnet cavity 10, and the permanent magnet is fixed through the chip bottom plate pin.
On the basis of the scheme, the number of the chip supporting plates 2 can be selected according to the thickness of the bonded chip.
On the basis of the scheme, the length of the pin 1 can be selected according to the thickness of a required bonded chip.
On the basis of the scheme, 1 chip supporting plate pin hole 3 is respectively arranged on the left side and the right side of the chip supporting plate 2, and the chip supporting plate pin holes 3 are through holes and are distributed diagonally.
On the basis of the scheme, 1 chip baseplate pin hole 6 is respectively arranged on the left side and the right side of the chip baseplate 5, and the chip baseplate pin holes 6 are blind holes and are distributed diagonally.
On the basis of the scheme, 1 permanent magnet cavity 10 is arranged on the left side and the right side of the bottom of the chip bottom plate 5, and the permanent magnet cavities 10 are distributed diagonally.
On the basis of the scheme, the pin holes 6 of the chip bottom plate are blind holes.
On the basis of the scheme, the positions of the chip supporting plate pin hole 3, the chip bottom plate pin hole 6 and the permanent magnet cavity 10 correspond to each other, the pin 1 connects the chip supporting plate 2 and the chip bottom plate 5 into a whole through the chip supporting plate pin hole 3 and the chip bottom plate pin hole 6, and the permanent magnet fixes the pin 1 by utilizing magnetic force.
The use method of the utility model comprises the following steps:
the chip supporting plate 2 and the chip bottom plate 5 are connected into a whole through the pin 1, the device is assembled and placed with a chip to be bonded, and then the chip is transferred into the packaging bag 9, a commercially available vacuumizing device is adopted to vacuumize the packaging bag, and the chip bonding is completed under the assistance of atmospheric pressure.
Compared with the prior art, the utility model has the following advantages:
the utility model relates to a device for bonding a microfluidic chip by vacuumizing. The utility model has simple operation, can provide uniform bonding pressure, and flexibly controls the size of the bonding pressure and the bonding pressure time according to the adjustment of the vacuum degree so as to achieve excellent chip bonding effect.
Drawings
FIG. 1 is a view showing the entire device
FIG. 2 is a bottom view of a chip tray
In the above drawings:
1. a pin; 2. a chip supporting plate; 3. chip support plate pin holes; 4. a chip support plate cavity; 5. a chip chassis; 6. chip bottom plate pin holes; 7. a chip bottom cavity; 8. fixing the permanent magnet screw hole; 9. packaging the mixture in a bag; 10. a permanent magnet cavity.
Detailed Description
Preferred embodiments of the present invention will be described in detail below with reference to the accompanying drawings 1-2, so that the advantages and features of the utility model can be more easily understood by those skilled in the art. It should be noted that the description of the embodiments is provided to help understanding of the present invention, but the present invention is not limited thereto.
As shown in FIGS. 1-2, the present invention provides a device for bonding a microfluidic chip by vacuum pumping. The device is simple and convenient to operate, can provide uniform bonding pressure, and can flexibly control the size of the bonding pressure and the bonding pressure time according to the adjustment of the vacuum degree.
To achieve this object, the apparatus of the present invention comprises: the packaging structure comprises a pin 1, a chip supporting plate 2, a chip bottom plate 5 and a packaging bag 9; the chip supporting plate 2 and the chip bottom plate 5 are fixed through a pin 1;
the chip supporting plate 2 is provided with a chip supporting plate pin hole 3 and a chip supporting plate cavity 4; chip backup pad cotter hole 3 is the through-hole, has two chip backup pad cotter holes 3 on the chip backup pad 2, is diagonal distribution.
The chip supporting plate 2 can adjust the required number of the chips according to the height of the chips.
The chip bottom plate 4 is provided with a chip bottom plate pin hole 6, a chip bottom cavity 7, a fixed permanent magnet screw hole 8 and a permanent magnet cavity 10;
a required bonded chip is flatly placed in a chip bottom cavity, a chip bottom plate pin hole 6 is a blind hole, a permanent magnet in a permanent magnet cavity 10 can be fixed through a fixed permanent magnet screw hole 8 by using a chip bottom plate pin, the permanent magnet cavity 10 is a blind hole, and a pin 1 is fixed by using magnetic force.
The using method of the utility model comprises the following steps:
after the device is assembled and the chip to be bonded is placed, the chip is transferred into the packaging bag 9, a commercially available vacuumizing device is adopted to vacuumize the packaging bag, and the chip bonding is completed under the assistance of atmospheric pressure.
The using method and the process of the utility model are as follows:
example 1:
1, firstly, a permanent magnet is filled in a permanent magnet cavity 10 on a chip bottom plate 5 and is fixed through a permanent magnet fixing screw hole 8;
2 selecting a proper number of chip supporting plates 2 according to the thickness of the chip;
3 selecting a pin 1 with a proper length according to the thickness of the chip, and inserting the pin into a pin hole 6 of the chip bottom plate through a pin hole 3 of the chip supporting plate;
4, flatly placing the chip to be bonded into a chip bottom cavity 7 on a chip bottom plate 5, and then putting the whole body into a packaging bag 9;
5. and closing the heat sealing device by adopting a commercially available vacuumizing device, vacuumizing the packaging bag, stopping vacuumizing after a proper time (1-15 minutes), and taking out the chip to be bonded to complete bonding.
Example 2:
1, firstly, a permanent magnet is filled in a permanent magnet cavity 10 on a chip bottom plate 5 and is fixed through a permanent magnet fixing screw hole 8;
2 selecting a proper number of chip supporting plates 2 according to the thickness of the chip;
3 selecting a pin 1 with a proper length according to the thickness of the chip, and inserting the pin into a pin hole 6 of the chip bottom plate through a pin hole 3 of the chip supporting plate;
4, flatly placing the chip to be bonded into a chip bottom cavity 7 on a chip bottom plate 5, and then putting the whole body into a packaging bag 9;
5. and (3) opening a heat-sealing device by using a commercially available vacuumizing device, vacuumizing the packaging bag, stopping vacuumizing, sealing an opening of the packaging bag by hot pressing, placing the packaging bag in a temperature control box, and after a period of time (15 minutes to 7 days), cutting the packaging bag, taking out the chip, and thus completing bonding.
Those not described in detail in this specification are within the skill of the art.
Claims (8)
1. The device for bonding the microfluidic chip by vacuumizing is characterized by comprising a pin (1), a chip supporting plate (2), a chip bottom plate (5) and a packaging bag (9);
the chip supporting plate (2) and the chip bottom plate (5) are connected into a whole through the pin (1), and a required bonding chip is flatly placed in the chip bottom plate (5) and then placed in the packaging bag (9) for vacuumizing;
chip supporting plate pin holes (3) are formed in the left side and the right side of the chip supporting plate (2), and a chip supporting plate cavity (4) is formed in the middle of the chip supporting plate (2);
chip bottom plate pin holes (6) are formed in the left side and the right side of the chip bottom plate (5), and a chip bottom cavity (7) is formed in the middle of the chip bottom plate (5);
the required bonding chip is horizontally placed in the chip bottom cavity (7);
the permanent magnet storage device is characterized in that permanent magnet cavities (10) are arranged on the left side and the right side of the bottom of the chip bottom plate (5) and used for containing permanent magnets, chip bottom plate pin holes (6) are formed in the side face of the chip bottom plate (5) corresponding to the permanent magnet cavities (10), and the permanent magnets are fixed through chip bottom plate pins.
2. The apparatus for microfluidic chip bonding using evacuation according to claim 1, wherein the number of the chip support plates (2) can be selected according to the thickness of the desired bonded chip.
3. The device for bonding microfluidic chips by evacuation according to claim 1, wherein the length of the pin (1) can be selected according to the thickness of the bonded chip required.
4. The device for bonding microfluidic chips by vacuum pumping according to claim 1, wherein the chip supporting plate (2) has 1 chip supporting plate pin hole (3) on each of the left and right sides, and the chip supporting plate pin holes (3) are through holes and are diagonally distributed.
5. The device for bonding microfluidic chips by vacuum pumping according to claim 4, wherein the chip base plate (5) has 1 chip base plate pin hole (6) on each of the left and right sides, and the chip base plate pin holes (6) are diagonally distributed.
6. The device for bonding microfluidic chips by evacuation according to claim 5, wherein the chip bottom plate pin holes (6) are blind holes.
7. The device for bonding microfluidic chips by vacuum pumping according to claim 6, wherein the bottom of the chip base plate (5) is provided with 1 permanent magnet cavity (10) at the left and right sides, and the permanent magnet cavities (10) are blind holes and are distributed diagonally.
8. The apparatus for bonding microfluidic chips by vacuum pumping according to claim 7, wherein the chip supporting plate pin holes (3), the chip base plate pin holes (6) and the permanent magnet cavities (10) are positioned to correspond, the pin (1) connects the chip supporting plate (2) and the chip base plate (5) into a whole through the chip supporting plate pin holes (3) and the chip base plate pin holes (6), and the permanent magnet fixes the pin (1) by magnetic force.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202122418067.5U CN216605292U (en) | 2021-10-08 | 2021-10-08 | Device for bonding micro-fluidic chip by vacuumizing |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202122418067.5U CN216605292U (en) | 2021-10-08 | 2021-10-08 | Device for bonding micro-fluidic chip by vacuumizing |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN216605292U true CN216605292U (en) | 2022-05-27 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202122418067.5U Active CN216605292U (en) | 2021-10-08 | 2021-10-08 | Device for bonding micro-fluidic chip by vacuumizing |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN216605292U (en) |
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2021
- 2021-10-08 CN CN202122418067.5U patent/CN216605292U/en active Active
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