CN216600600U

CN216600600U - Power management chip with heat radiation structure

Info

Publication number: CN216600600U
Application number: CN202123037819.XU
Authority: CN
Inventors: 任留涛
Original assignee: Nantong Gerp Microelectronics Co ltd
Current assignee: Nantong Gerp Microelectronics Co ltd
Priority date: 2021-12-06
Filing date: 2021-12-06
Publication date: 2022-05-24
Anticipated expiration: 2031-12-06

Abstract

The utility model relates to the technical field of power management chips, in particular to a power management chip with a heat dissipation structure, which comprises a chip main body, wherein the outer wall of the chip main body is provided with a shell, heat dissipation cavities are formed in the inner walls of the upper side and the lower side of the shell at equal intervals, a heat dissipation assembly is arranged on the inner wall of the shell and comprises first springs, the first springs are respectively welded on the upper side and the lower side of the inner wall of the shell, limiting blocks are respectively welded at the other ends of the first springs, and the close sides of the two groups of limiting blocks are respectively attached to the middle parts of the upper side and the lower side of the chip main body. The chip main body is in a suspension state in the inner wall of the shell, the outer wall of the chip main body cannot be in contact with the inner wall of the shell, when the chip main body generates heat in the working period, the heat cannot be accumulated at one position, and ventilation and heat dissipation are performed through the heat dissipation holes and the heat dissipation cavity, so that the heat can be dissipated timely, and the heat generated by the power management chip during working is effectively reduced.

Description

Power management chip with heat radiation structure

Technical Field

The utility model relates to the technical field of power management chips, in particular to a power management chip with a heat dissipation structure.

Background

The power management chip is a chip which plays roles of conversion, distribution, detection and other electric energy management of electric energy in an electronic equipment system, is mainly responsible for converting source voltage and current into a power supply which can be used by loads such as a microprocessor, a sensor and the like, is indispensable for an electronic system, has direct influence on the performance of the whole machine due to the advantages and disadvantages of the performance, has wide application range, and has important significance for improving the performance of the whole machine by developing the power management chip.

The power management chip can produce a large amount of heats during operation, and the radiating effect of current power management chip is not very ideal, and long-time heat is gathered together, if can not carry out timely heat dissipation to it, leads to the power management chip to receive the damage very easily, leads to its can not normal use, influences the performance of power management chip, consequently needs a power management chip with heat radiation structure to solve above-mentioned problem urgently.

SUMMERY OF THE UTILITY MODEL

In order to overcome the above technical problems, an object of the present invention is to provide a power management chip with a heat dissipation structure, so as to solve the problems that the conventional power management chip proposed in the above background art has an unsatisfactory heat dissipation effect, and cannot dissipate heat in time when heat is gathered together.

In order to achieve the purpose, the utility model provides the following technical scheme: a power management chip with a heat dissipation structure, comprising:

the chip comprises a chip main body, wherein the outer wall of the chip main body is provided with a shell, and the inner walls of the upper side and the lower side of the shell are provided with heat dissipation cavities at equal intervals;

the heat dissipation assembly is positioned on the inner wall of the shell and comprises first springs, the first springs are welded on the upper side and the lower side of the inner wall of the shell respectively, limiting blocks are welded at the other ends of the first springs, one sides, close to the two groups of limiting blocks, of the two groups of limiting blocks are attached to the middle parts of the upper side and the lower side of the chip main body respectively, and heat dissipation holes are formed in the inner walls of the limiting blocks at equal intervals;

the dustproof assembly is located on the inner wall of the heat dissipation cavity and comprises a filter plate.

Preferably, two sets of one side that the stopper deviates from mutually all equidistance has a hinge bar through pivot swing joint, both sides are all equidistance has another hinge bar through pivot swing joint about the shell inner wall, and pass through pivot swing joint between two sets of corresponding hinge bars.

Preferably, the filter plate is located the heat dissipation intracavity wall, and the cavity has all been seted up to filter plate both sides inner wall, the welding of cavity inner wall has the second spring, and the welding of the second spring other end has even the board, even the board opposite side is fixed with the fixed block, and the fixed block other end inserts and establishes in the hole that the heat dissipation intracavity wall was seted up.

Preferably, a handle is fixed at the front end of the connecting plate, and a channel matched with the handle is formed in the inner wall of the front end of the filter plate.

Preferably, the two ends of the connecting plate are both fixed with sliding blocks, and the two sides of the inner wall of the cavity are both provided with sliding grooves matched with the sliding blocks.

Preferably, the two sides of the bottom end of the filter plate are both attached with supporting plates, and the supporting plates are fixed on the inner wall of the shell at equal intervals.

Compared with the prior art, the utility model has the beneficial effects that:

1. the power management chip with the heat dissipation structure is provided with the first spring, the limiting block and the heat dissipation holes, firstly, the limiting block can clamp the chip main body under the elastic action of the first spring, so that the chip main body can be clamped in the middle of the inner wall of the shell, at the moment, the chip main body is in a suspension state on the inner wall of the shell, the outer wall of the chip main body cannot be in contact with the inner wall of the shell, when the chip main body generates heat during working, the heat cannot be accumulated at one position, and then ventilation and heat dissipation are carried out through the heat dissipation holes and the heat dissipation cavity, so that the heat can be dissipated in time, and the heat generated by the power management chip during working is effectively reduced;

2. this power management chip with heat radiation structure is provided with the filter plate, the second spring, even board and fixed block, when the heat dissipation chamber is carrying out radiating, the dust can enter into shell inner wall through the heat dissipation chamber, thereby lead to chip main part outer wall to pile up the dust, influence the radiating efficiency of chip main part, be provided with the filter plate through at heat dissipation intracavity wall, utilize under the elastic action of second spring, make even board drive fixed block and fix the filter plate, under the effect of sheltering from through the filter plate, the dust volume that can effectual reduction shell inner wall contains, thereby improve the operational environment of power management chip greatly.

Drawings

FIG. 1 is a schematic sectional elevation view of the structure of the present invention;

FIG. 2 is a schematic top view of the structure of the limiting block and the heat dissipating hole in FIG. 1 according to the present invention;

FIG. 3 is an enlarged view of the structure at A in FIG. 1 according to the present invention;

FIG. 4 is a schematic front view of a portion of the filter plate of FIG. 1 according to the present invention;

fig. 5 is a left side view of the structure of fig. 4.

In the figure: 1. a chip body; 2. a housing; 3. a heat dissipation cavity; 11. a first spring; 12. a limiting block; 13. heat dissipation holes; 14. a hinged lever; 21. filtering the plate; 22. a second spring; 23. connecting plates; 24. a fixed block; 25. a handle; 26. a slider; 27. and a support plate.

Detailed Description

The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.

Referring to fig. 1-5, an embodiment of the present invention is shown: a power management chip with a heat dissipation structure, comprising:

the chip comprises a chip body 1, wherein a shell 2 is arranged on the outer wall of the chip body 1, and heat dissipation cavities 3 are formed in the inner walls of the upper side and the lower side of the shell 2 at equal intervals;

radiator unit, radiator unit is located 2 inner walls of shell, and radiator unit includes first spring 11, first spring 11 welds both sides about 2 inner walls of shell respectively, and the stopper 12 has all been welded to the first spring 11 other end, the equal equidistance of one side that two sets of stoppers 12 deviate from mutually has hinge bar 14 through pivot swing joint, the equal equidistance of both sides has another hinge bar 14 through pivot swing joint about 2 inner walls of shell, and through pivot swing joint between corresponding two sets of hinge bar 14, through being provided with hinge bar 14 and another hinge bar 14, when stopper 12 presss from both sides tightly chip main part 1 under first spring 11's elastic action, can effectual improvement stopper 12 stability.

The side, close to each other, of each of the two groups of limiting blocks 12 is respectively attached to the middle parts of the upper side and the lower side of the chip main body 1, heat dissipation holes 13 are formed in the inner walls of the limiting blocks 12 at equal intervals, the chip main body 1 is in a suspension state on the inner wall of the shell 2 through clamping of the limiting blocks 12, the outer wall of the chip main body 1 cannot be in contact with the inner wall of the shell 2 at the moment, therefore, when the chip main body 1 generates heat during working, the heat cannot be accumulated at one position, ventilation and heat dissipation are performed through the heat dissipation holes 13 and the heat dissipation cavity 3 at the moment, the heat can be dissipated in time, and the heat generated by the power management chip during working is effectively reduced;

dustproof subassembly, dustproof subassembly is located 3 inner walls in heat dissipation chamber, and dustproof subassembly includes filter plate 21, filter plate 21 is located 3 inner walls in heat dissipation chamber, the backup pad 27 has all been laminated to filter plate 21 bottom both sides, and backup pad 27 all equidistance is fixed at shell 2 inner walls, through being provided with backup pad 27, install when 3 inner walls in heat dissipation chamber when filter plate 21, can carry on spacingly to filter plate 21, and filter plate 21 both sides inner wall has all seted up the cavity, the cavity inner wall welding has second spring 22, and the welding of the second spring 22 other end has even board 23, even board 23 both ends all are fixed with slider 26, and the spout of mutually supporting with slider 26 has all been seted up to cavity inner wall both sides, when even board 23 round trip movement in the cavity, slider 26 removes in the spout, make even more smooth and easy that board 23 removed.

Even board 23 front end is fixed with handle 25, and filter plate 21 front end inner wall set up with handle 25 mutually supported's passageway, through being provided with handle 25, make handle 25 round trip movement in the passageway, can make things convenient for the staff to install filter plate 21, even board 23 opposite side is fixed with fixed block 24, and the fixed block 24 other end is inserted and is established in the hole that 3 inner walls of heat dissipation chamber were seted up, under the effect of sheltering from through filter plate 21, the dust volume that can 2 inner walls of effectual reduction shell contains, thereby improve the operational environment of power management chip greatly.

The working principle is as follows: firstly, under the elastic action of the first spring 11, the limiting block 12 clamps the chip main body 1, and at the moment, the chip main body 1 can be clamped in the middle of the inner wall of the shell 2;

and then, the connecting plate 23 is pulled, so that the fixing block 24 moves along with the connecting plate 23, then the filter plate 21 is installed in the heat dissipation chamber 3, at this time, the connecting plate 23 drives the fixing block 24 to fix the filter plate 21 under the elastic action of the second spring 22, and the operation is finished.

It will be evident to those skilled in the art that the utility model is not limited to the details of the foregoing illustrative embodiments, and that the present invention may be embodied in other specific forms without departing from the spirit or essential attributes thereof. The present embodiments are therefore to be considered in all respects as illustrative and not restrictive, the scope of the utility model being indicated by the appended claims rather than by the foregoing description, and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein. Any reference sign in a claim should not be construed as limiting the claim concerned.

Claims

1. A power management chip with a heat dissipation structure, comprising:

the chip comprises a chip main body (1), wherein a shell (2) is arranged on the outer wall of the chip main body (1), and heat dissipation cavities (3) are formed in the inner walls of the upper side and the lower side of the shell (2) at equal intervals;

the heat dissipation assembly is positioned on the inner wall of the shell (2) and comprises first springs (11), the first springs (11) are respectively welded on the upper side and the lower side of the inner wall of the shell (2), limiting blocks (12) are welded at the other ends of the first springs (11), one sides, close to the two groups of limiting blocks (12), are respectively attached to the middle parts of the upper side and the lower side of the chip main body (1), and heat dissipation holes (13) are formed in the inner walls of the limiting blocks (12) at equal intervals;

the dustproof assembly is positioned on the inner wall of the heat dissipation cavity (3) and comprises a filter plate (21).

2. The power management chip with a heat dissipation structure of claim 1, wherein: two sets of one side that stopper (12) deviate from mutually all equidistance has articulated rod (14) through pivot swing joint, both sides all equidistance have another articulated rod (14) through pivot swing joint about shell (2) inner wall, and through pivot swing joint between two sets of corresponding articulated rods (14).

3. The power management chip with a heat dissipation structure of claim 1, wherein: the filter plate (21) is located heat dissipation chamber (3) inner wall, and the cavity has all been seted up to filter plate (21) both sides inner wall, the welding of cavity inner wall has second spring (22), and the welding of second spring (22) other end has even board (23), even board (23) opposite side is fixed with fixed block (24), and the fixed block (24) other end inserts and establish in the hole that heat dissipation chamber (3) inner wall was seted up.

4. The power management chip with the heat dissipation structure as set forth in claim 3, wherein: the front end of the connecting plate (23) is fixed with a handle (25), and the inner wall of the front end of the filter plate (21) is provided with a channel matched with the handle (25).

5. The power management chip with the heat dissipation structure as set forth in claim 3, wherein: the two ends of the connecting plate (23) are both fixed with sliding blocks (26), and the two sides of the inner wall of the cavity are both provided with sliding grooves matched with the sliding blocks (26).

6. The power management chip with the heat dissipation structure as set forth in claim 3, wherein: the bottom end of the filter plate (21) is attached with support plates (27) on two sides, and the support plates (27) are fixed on the inner wall of the shell (2) at equal intervals.