CN216600186U - Circuit board and terminal - Google Patents

Abstract

The application discloses a circuit board and a terminal. The circuit board is used for comprising a substrate, a first wire arranged on the substrate, a connecting piece and a second wire arranged on the substrate. The first sub-wiring comprises a first sub-wiring and a second sub-wiring, the first sub-wiring and the second sub-wiring are arranged at intervals, the first sub-wiring comprises a first end, the second sub-wiring comprises a second end, and the first end and the second end are arranged at intervals. The connecting piece includes this somatic part and connecting portion, and connecting portion set up between this somatic part and first line, and this somatic part passes through connecting portion and first line electric connection of walking, and connecting portion enclose into the line space including setting up the first connecting portion at first end and setting up the second connecting portion at the second end at this somatic part, connecting portion and base plate. The second wire is positioned between the first end and the second end and penetrates through the wire space, and the thickness of the connecting part is determined according to the preset distance between the second wire and the body part. The circuit board and the terminal of the embodiment of the application ensure that no interference is generated when the signal is transmitted through the first routing and the second routing, and the signal quality is ensured.

Description

Circuit board and terminal

Technical Field

The application relates to the technical field of communication, in particular to a circuit board and a terminal.

Background

With the development of technology, the functions of electronic devices are rapidly increasing, and the product design of electronic devices is developing toward high-density integration and integration. At present, communication products are more and more complete in function, more and more frequency bands are supported, signals of 2G, 3G, 4G and 5G exist, and radio frequency signals are more and more complicated. However, the communication device is not increased in size, and needs to be designed to be smaller, which poses a great challenge to hardware design. However, in the case of very complicated signals, the signal quality is often low due to the small size of the communication device.

SUMMERY OF THE UTILITY MODEL

The embodiment of the application provides a circuit board and a terminal.

The circuit board of the embodiment of the application is used for comprising a substrate, a first wire arranged on the substrate, a connecting piece and a second wire arranged on the substrate. The first routing comprises a first sub-routing and a second sub-routing which are arranged at intervals, the first sub-routing comprises a first end, the second sub-routing comprises a second end, and the first end and the second end are arranged at intervals. The connecting piece comprises a body part and a connecting part, the connecting part is arranged between the body part and the first wire, the body part is electrically connected with the first wire through the connecting part, the connecting part comprises a first connecting part arranged at the first end and a second connecting part arranged at the second end, and a wire space is enclosed by the body part, the connecting part and the substrate. The second wire is located between the first end and the second end and penetrates through the wire space, and the thickness of the connecting portion is determined according to a preset distance between the second wire and the body portion.

In some embodiments, the first end is provided with a first pad, the second end is provided with a second pad, the first connection portion is provided at the first pad, and the second connection portion is provided at the second pad.

In some embodiments, the first pad and the second pad have the same resistance value.

In some embodiments, the circuit board further includes a first reference pad and a second reference pad, and the distance between the first reference pad and the first pad is determined according to the size of the first reference pad, the size of the first pad, and a preset resistance value of the first pad; and the distance between the second reference bonding pad and the second bonding pad is determined according to the size of the second reference bonding pad, the size of the second bonding pad and a preset resistance value of the second bonding pad.

In some embodiments, the first connection portion and the first pad are coincident in projection on the substrate, and the second connection portion and the second pad are coincident in projection on the substrate.

In some embodiments, the second trace is located at a central position of a line connecting the first end and the second end.

In some embodiments, the connector is welded to the first trace with a steel mesh.

In some embodiments, the thickness of the connection portion is determined according to the thickness of the steel mesh; or, the steel mesh comprises a steel mesh body and a step part, the step part is arranged around an opening formed in the steel mesh body, the first pad and the second pad are located in the opening, and the thickness of the connecting part is determined according to the sum of the thicknesses of the steel mesh body and the step part.

In some embodiments, the preset distance is determined according to a signal interference strength between the connector and the second trace.

The circuit board of this application embodiment includes the casing and above-mentioned any embodiment, the circuit board sets up in the casing.

In the circuit board and the terminal according to the embodiment of the application, the first trace includes the first sub-trace and the second sub-trace which are arranged at an interval, the connecting portion is arranged between the body portion and the first trace, and the connecting portion includes a first connecting portion provided at the first end and a second connecting portion provided at the second end, thereby the body part, the connecting part and the substrate are surrounded to form a wiring space, the second wiring is arranged between the first sub-wiring and the second sub-wiring and penetrates the wiring space, so as to avoid intersecting the first trace and the second trace arranged on the same surface of the substrate, and because the thickness of the connecting part is determined according to the preset distance between the second trace and the body part, therefore, the second wiring is ensured to be far away from the body part as far as possible, so that the first wiring and the second wiring can not generate signal interference when the signals are transmitted through the first wiring and the second wiring, and the signal quality is ensured.

Additional aspects and advantages of embodiments of the present application will be set forth in part in the description which follows and, in part, will be obvious from the description, or may be learned by practice of embodiments of the present application.

Drawings

The above and/or additional aspects and advantages of the present application will become apparent and readily appreciated from the following description of the embodiments, taken in conjunction with the accompanying drawings of which:

FIG. 1 is a schematic perspective view of a circuit board according to some embodiments of the present application;

FIG. 2 is a schematic plan view of a terminal according to some embodiments of the present application;

FIG. 3 is a schematic plan view of a circuit board of certain embodiments of the present application;

FIG. 4 is a schematic plan view of a first reference pad and a second reference pad of a circuit board of certain embodiments of the present application;

fig. 5 and 6 are schematic views of a circuit board scenario according to some embodiments of the present application.

Detailed Description

Reference will now be made in detail to embodiments of the present application, examples of which are illustrated in the accompanying drawings, wherein like or similar reference numerals refer to the same or similar elements or elements having the same or similar function throughout. The embodiments described below by referring to the drawings are exemplary only for the purpose of explaining the embodiments of the present application, and are not to be construed as limiting the embodiments of the present application.

In the description of the present application, it is to be understood that the terms "center," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise" indicate orientations or positional relationships based on the orientation or positional relationships illustrated in the drawings, and are used merely for convenience in describing the present application and for simplicity in description, and do not indicate or imply that the referenced device or element must have a particular orientation, be constructed in a particular orientation, and be operated, and therefore should not be considered as limiting the present application. Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, features defined as "first", "second", may explicitly or implicitly include one or more of the described features. In the description of the present application, "a plurality" means two or more unless specifically limited otherwise.

In the description of the present application, it is to be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, e.g., as meaning either a fixed connection, a removable connection, or an integral connection; may be mechanically connected, may be electrically connected or may be in communication with each other; either directly or indirectly through intervening media, either internally or in any other relationship. The specific meaning of the above terms in the present application can be understood by those of ordinary skill in the art as appropriate.

In this application, unless expressly stated or limited otherwise, the first feature "on" or "under" the second feature may comprise direct contact of the first and second features, or may comprise contact of the first and second features not directly but through another feature in between. Also, the first feature being "on," "above" and "over" the second feature includes the first feature being directly on and obliquely above the second feature, or merely indicating that the first feature is at a higher level than the second feature. A first feature being "under," "below," and "beneath" a second feature includes the first feature being directly under and obliquely below the second feature, or simply meaning that the first feature is at a lesser elevation than the second feature.

The following disclosure provides many different embodiments or examples for implementing different features of the application. In order to simplify the disclosure of the present application, specific example components and arrangements are described below. Of course, they are merely examples and are not intended to limit the present application. Moreover, the present application may repeat reference numerals and/or letters in the various examples, such repetition is for the purpose of simplicity and clarity and does not in itself dictate a relationship between the various embodiments and/or configurations discussed. In addition, examples of various specific processes and materials are provided herein, but one of ordinary skill in the art may recognize applications of other processes and/or use of other materials.

Referring to fig. 1, the present embodiment provides a circuit board 100. The circuit board 100 includes a substrate 10, a first trace 20 disposed on the substrate 10, a connector 30, and a second trace 40 disposed on the substrate 10. The first trace 20 includes a first sub-trace 21 and a second sub-trace 22 arranged at an interval, the first sub-trace 21 includes a first end 211, the second sub-trace 22 includes a second end 221, and the first end 211 and the second end 221 are arranged at an interval. The connector 30 includes a body portion 31 and a connecting portion 32, the connecting portion 32 is disposed between the body portion 31 and the first trace 20, the body portion 31 is electrically connected to the first trace 20 through the connecting portion 32, the connecting portion 32 includes a first connecting portion 321 disposed at the first end 211 and a second connecting portion 322 disposed at the second end 221, and the body portion 31, the connecting portion 32 and the substrate 10 enclose a trace space 50. The second trace 40 is located between the first end 211 and the second end 221, and passes through the trace space 50, and the thickness of the connecting portion 30 is determined according to a preset distance between the second trace 40 and the body portion 31.

In the circuit board 100 of the embodiment of the application, the first trace 20 includes the first sub-trace 21 and the second sub-trace 22 that are disposed at an interval, the connection portion 32 is disposed between the body portion 31 and the first trace 20, and the connection portion 32 includes the first connection portion 321 disposed at the first end 211 and the second connection portion 322 disposed at the second end 221, so that the body portion 31, the connection portion 32, and the substrate 10 are enclosed to form the trace space 50, and the second trace 40 is disposed between the first sub-trace 21 and the second sub-trace 22, and the trace space 50 is further penetrated, so as to avoid intersecting the first trace 20 and the second trace 40 that are disposed on the same surface of the substrate 10, and since the thickness of the connection portion 32 is determined according to the preset distance between the second sub-trace 40 and the body portion 31, so as to ensure that the second trace 40 is as far away from the body portion 31 as possible, so as to ensure that when the signal is transmitted through the first trace 20 and the second trace 40, the first trace 20 and the second trace 40 do not generate signal interference, and signal quality is guaranteed.

The following description is further made with reference to the accompanying drawings.

Referring to fig. 2, terminal 1000 includes housing 200 and circuit board 100.

Terminal 1000 can be a cell phone, a tablet computer, a display device, a laptop computer, a teller machine, a gate, a smart watch, a head-up display device, a game console, and the like. As shown in fig. 2, in the embodiment of the present application, terminal 1000 is a mobile phone as an example for explanation, and it is understood that the specific form of terminal 1000 is not limited to the mobile phone.

Circuit board 100 can be a printed circuit board 100, an aluminum-based circuit board 100, a flexible circuit board 100, etc., and circuit board 100 is disposed inside housing 200 to provide mechanical support for mounting and assembly of the various components within terminal 1000, and to provide electrical connection of the various components.

Referring to fig. 1, the circuit board 100 includes a substrate 10, a first trace 20 and a second trace 40. Wherein, the first trace 20 and the second trace 40 are both disposed on the substrate 10.

The first trace 20 includes a first sub-trace 21 and a second sub-trace 22, the first sub-trace 21 and the second sub-trace 22 are respectively connected to the connector 30, and the first sub-trace 21 and the second sub-trace 22 are connected by the connector 30.

Specifically, the first sub-trace 21 includes a first end 211, the second sub-trace 22 includes a second end 221, the first end 211 of the first sub-trace 21 and the second end 221 of the second sub-trace 22 are disposed at an interval, and the first end 211 of the first sub-trace 21 and the second end 221 of the second sub-trace 22 are connected by the connection component 30 respectively.

Referring to fig. 1 and fig. 3, a first end 211 of the first sub-trace 21 is provided with a first bonding pad 212, a second end 221 of the second sub-trace 22 is provided with a second bonding pad 222, and the first bonding pad 212 and the second bonding pad 222 are used for soldering the connector 30, that is, the first sub-trace 21 can be connected to the connector 30 through the first bonding pad 212, and the second sub-trace 22 can be connected to the connector 30 through the second bonding pad 222.

The first pad 212 and the second pad 222 have the same resistance, so that impedance discontinuity between the first sub-trace 21 and the second sub-trace 22 can be reduced, and the quality of signals is better when the circuit board 100 transmits the signals through the first trace 20.

Referring to fig. 1 and 4, in some embodiments, the circuit board 100 further includes a first reference pad 60 and a second reference pad 70.

The first reference pad 60 is disposed on the substrate and spaced apart from the first pad 212, and a distance between the first reference pad 60 and the first pad 212 may be determined according to a size of the first reference pad 60, a size of the first pad 212, and a predetermined resistance value of the first pad 212. Wherein, when the size of the first reference pad 60 is larger, the resistance value of the first reference pad 60 is larger; when the first reference pad 60 is closer to the first pad 212, the resistance value of the first pad 212 is smaller; when the circuit board 100 is selected, the size of the first pad 212 is also determined, i.e., the size of the first pad 212 is a known value. Therefore, after a desired preset resistance value of the first pad 212 is set, since the size of the first pad 212 is fixed, if the size of the first reference pad 60 is fixed, the distance between the first reference pad 60 and the first pad 212 may be determined. Similarly, the distance between the first reference pad 60 and the first pad 212 may be fixed, and the size of the first reference pad 60 may be determined.

Similarly, the second reference pad 70 is disposed on the substrate 10 and spaced apart from the second pad 222, and the distance between the second reference pad 70 and the second pad 222 may be determined according to the size of the second reference pad 70, the size of the second pad 222, and a predetermined resistance value of the second pad 222. Wherein, when the size of the second reference pad 70 is larger, the resistance value of the second reference pad 70 is larger; when the distance between the second reference pad 70 and the second pad 222 is shorter, the resistance value of the second pad 222 is smaller; when the circuit board 100 is selected, the size of the second pad 222 is also determined, i.e., the size of the second pad 222 is a known value. Therefore, after a desired preset resistance value of the second pad 222 is set, since the size of the second pad 222 is fixed, if the size of the second reference pad 70 is given, the distance between the second reference pad 70 and the second pad 222 can be determined. Similarly, the distance between the second reference pad 70 and the second pad 222 may be fixed, and the size of the second reference pad 70 may be determined.

In the circuit board 100 of the present application, the first pads 212 and the second pads 222 have the same resistance value, if the resistance values of the first and second pads 212 and 222 are both 50 ohms (omega), that is, the preset resistance value of the first pad 212 and the preset resistance value of the second pad 222 are both 50 Ω, and therefore, after the predetermined resistance values of the first and second pads 212 and 222 are determined, since the sizes of the first and second pads 212 and 222 are determined to be known values after the circuit board 100 is selected, thus, if the distance between the first reference pad 60 and the first pad 212, and the distance between the second reference pad 70 and the second pad 222 are fixed, the sizes of the first reference pad 60 and the second reference pad 70 can be determined, or if the size of the first reference pad 60 and the size of the second reference pad 70 are fixed, the distance of the first pad 212 of the first reference pad 60 and the distance of the second reference pad 70 and the second pad 222 may be determined. Therefore, the resistance values of the first bonding pad 212 and the second bonding pad 222 can be ensured to be the same, so that the situation of discontinuous impedance in the routing is reduced, and the signal quality is ensured to be better.

Referring to fig. 1 and 3, the connecting member 30 includes a body 31 and a connecting portion 32. The connecting portion 32 is disposed between the main portion 31 and the first trace 20, and the main portion 31 is electrically connected to the first trace 20 through the connecting portion 32. The body portion 31, the connecting portion 32 and the substrate 10 further enclose a routing space 50.

The connection portion 32 includes a first connection portion 321 and a second connection portion 322.

Specifically, the first connection portion 321 is disposed at the first end 211 of the first sub-trace 21, and the second connection portion 322 is disposed at the second end 221 of the second sub-trace 22, that is, the first connection portion 321 is connected to the first pad 212 disposed at the first end 211 of the first sub-trace 21, the second connection portion 322 is connected to the second pad 222 disposed at the second end 221 of the second sub-trace 22, and the first connection portion 321 and the second connection portion 322 are disposed at the same interval. When the signal passes through the first trace 20, the signal can be transmitted from the first sub-trace 21 to the main body 31 through the first connection portion 321, and then transmitted from the main body 31 to the second sub-trace 22 through the second connection portion 322, so as to complete the transmission of the signal from left to right. Alternatively, the signal can be transmitted from the second sub-trace 22 to the main body 31 through the second connection portion 322, and then transmitted from the main body 31 to the first sub-trace 21 through the first connection member 30, so as to complete the transmission of the signal from right to left.

More specifically, the connector 30 is welded on the first trace 20 through the steel mesh 80, that is, the first connector 30 is welded on the first pad 212 of the first end 211 of the first sub-trace 21 through the steel mesh 80, and the second connector 30 is welded on the second pad 222 of the second end 221 of the second sub-trace 22 through the steel mesh 80.

As shown in fig. 5, the steel mesh 80 is provided with a plurality of openings 801, the steel mesh 80 can be disposed on the substrate 10, the first pads 212 and the second pads 222 are disposed in the different openings 801, and then, the surface of the steel mesh 80 can be coated with solder paste to completely cover the openings 801, at this time, the solder paste in the openings 801 can form the connection portions 32, that is, the first connection portions 321 are formed corresponding to the openings 801 of the first pads 212, the second connection portions 322 are formed corresponding to the openings 801 of the second pads 222, the first connection portions 321 and the first pads 212 are soldered, and the second connection portions 322 are connected to the second pads 222. After that, the steel net 80 on the base plate 10 is removed, and the main body 31 is welded to the connecting portion 32, that is, one end of the main body 31 is welded to the first connecting portion 321, and the other end is welded to the second connecting portion 322.

The thickness of the connecting portion 32 can be determined by the thickness of the steel mesh 80, specifically: the thickness of the connection portion 32 is the thickness of the steel mesh 80 minus the thickness of the pad. If the thickness of the first connection portion 321 is the thickness of the steel net 80 minus the thickness of the first pad 212, and the thickness of the second connection portion 322 is the thickness of the steel net 80 minus the thickness of the second steel plate.

Referring to fig. 6, in some embodiments, the steel net 80 may further include a steel net body 81 and a step 82.

The steel mesh body 81 is provided with a plurality of openings 801. The number of the steps 82 is the same as the number of the openings 801 opened in the steel mesh body 81, and if two openings 801 are opened in the steel mesh body 81, the number of the steps 82 is also two. Wherein each step 82 is arranged around one opening 801.

Specifically, when the steel mesh 80 is placed on the substrate 10, the first pad 212 and the second pad 222 may be disposed in different openings 810, and when the solder paste is applied to the surface of the steel mesh 80 to form the connection portion 32, the solder paste is applied to the surface of the step portion 82 so that the step portion 82 is completely covered with the solder paste, and at this time, the solder paste in the openings 810 and the step portion 82 may form the connection portion 32, the first connection portion 321 is formed corresponding to the opening 810 of the first pad 212, the second connection portion 322 is formed corresponding to the opening 810 of the second pad 222, the first connection portion 321 is soldered to the first pad 212, and the second connection portion 322 is soldered to the second pad 222. After that, the steel net 80 on the base plate 10 is removed, and the main body 31 is welded to the connecting portion 32, that is, one end of the main body 31 is welded to the first connecting portion 321, and the other end is welded to the second connecting portion 322.

In this case, the thickness of the connection portion 32 is determined by the sum of the thickness of the steel net body 81 and the thickness of the step portion 82. The method specifically comprises the following steps: the thickness of the connecting portion 32 is the sum of the thickness of the steel mesh body 81 and the thickness of the step portion 82 minus the thickness of the pad. If the thickness of the first connection portion 321 is the sum of the thickness of the steel mesh body 81 and the thickness of the step portion 82 minus the thickness of the first pad 212, the thickness of the second connection portion 322 is the sum of the thickness of the steel mesh body 81 and the thickness of the step portion 82 minus the thickness of the second pad 222.

Therefore, by the steel mesh 80 with the step 82, the thickness of the connecting portion 32, that is, the preset distance between the body 31 and the second trace 40 can be further increased when the connecting portion 32 is formed, so as to reduce the signal interference strength between the connector 30 and the second trace 40.

In addition, the first connection portion 321 and the first pad 212 are overlapped in projection on the substrate 10, and the second connection portion 322 and the second pad 222 are overlapped in projection on the substrate 10, so that it is known that the surface of the first connection portion 321 in contact with the first pad 212 is the same as the size of the first pad 212, and the surface of the second connection portion 322 in contact with the second pad 222 is the same as the size of the second pad 222, so as to ensure that the first connection portion 321 and the first pad 212 are firmly connected, the second connection portion 322 and the second pad 222 are firmly connected, and further ensure the stability of the first trace 20 in signal transmission.

Referring to fig. 1 and fig. 3, the second trace 40 is located between the first end 211 of the first sub-trace 21 and the second end 221 of the second sub-trace 22, that is, the second trace 40 is located between the first pad 212 and the second pad 222, and the second trace 40 further passes through the trace space 50, that is, the second trace 40 crosses the trace direction of the first trace 20.

At present, when the routing directions of two wires are crossed, in order to avoid the two wires from being connected together to form a short circuit, one wire needs to be routed on the surface layer, and the other wire needs to be routed through the hole on the circuit board 100 to avoid the crossing in a manner of routing the inner layer. And the mode through the trompil makes the line wear to establish the trompil and walks the line all the way, then can lead to this line can form the discontinuous point of impedance in the position of punching, so when passing through this line transmission signal, can destroy the integrality of signal, make the quality variation of signal, and punch and still can cause the line loss.

As can be seen from the above description, the first trace 20 does not pass through the trace space 50, and therefore, although the first trace 20 and the second trace 40 are both routed from the surface layer of the circuit board 100, the first trace 20 and the second trace 40 that are located on the same plane do not intersect each other. Therefore, short circuit can not occur in the circuit board 100, and holes are prevented from being formed in the circuit board 100, so that the integrity of signals can not be damaged when the signals are transmitted through the first wires 20 and the second wires 40, and the quality of the signals is ensured. In addition, the number of layers of the circuit board 100 is not required to be increased, and the material cost is reduced.

In addition, as shown in fig. 1 or fig. 3, since the second trace 40 is located in the trace space 50, and the connection portion 32 is located between the body portion 31 and the first trace 20, the second trace 40 and the body portion 31 are vertically spaced, and the predetermined distance of the spacing is the thickness of the connection portion 32. Therefore, the thickness of the connection portion 32 is determined according to the preset distance between the second trace 40 and the body portion 31. When the preset distance is larger, the mutual coupling interference between signals when the first trace 20 and the second trace 40 work simultaneously can be reduced. Therefore, the predetermined distance can be set to a distance corresponding to a smaller signal interference strength when the first trace 20 and the second trace 40 are simultaneously operated. If the signal interference strength is small when the first trace 20 and the second trace 40 operate at the preset distance of 2 mm, the thickness of the connection portion 32 may be set to 2 mm. Therefore, the preset distance can be further determined according to the signal interference strength between the first trace 20 and the second trace 40 corresponding to the connector 30.

It should be noted that the preset distance also needs to take the whole thickness of the actual circuit board 100 into consideration, and preferably, a corresponding distance, that is, the thickness of the connection portion 32, when the interference strength of the two routing signals is small in a distance range that can be accepted by the circuit board 100 can be selected. Therefore, when the connecting portion 32 is set to be as thick as possible, the strength of signal interference when the first trace 20 and the second trace 40 operate simultaneously can be reduced.

Furthermore, the second trace 40 can be disposed at a central position of the connection between the first end 211 of the first sub-trace 21 and the second end 221 of the second sub-trace 22, so that the distance between the second trace 40 and the first sub-trace 21 can be ensured to be the same as the distance between the second trace 40 and the second sub-trace 22, and thus even if the second trace 40 generates signal interference to the first sub-trace 21 and the second sub-trace 22, the signal interference generated by the second trace 40 to the first sub-trace 21 and the second sub-trace 22 can be ensured to be the same, and similarly, the signal interference generated by the first sub-trace 21 and the second sub-trace 22 to the second trace 40 is the same, thereby ensuring the stability of the first trace 20 and the second trace 40 in transmitting signals.

The housing 200 can be used to mount functional modules of the terminal 1000, such as a display device, an imaging device, a power supply device, and a communication device, so that the housing provides protection for the functional modules, such as dust prevention, drop prevention, and water prevention.

In the description herein, reference to the terms "certain embodiments," "one embodiment," "some embodiments," "illustrative embodiments," "examples," "specific examples," or "some examples" means that a particular feature, structure, material, or characteristic described in connection with the embodiments or examples is included in at least one embodiment or example of the application. In this specification, schematic representations of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.

Although embodiments of the present application have been shown and described above, it is understood that the above embodiments are exemplary and should not be construed as limiting the present application, and that variations, modifications, substitutions and alterations of the above embodiments may be made by those of ordinary skill in the art within the scope of the present application, which is defined by the claims and their equivalents.

Claims (10)

1. A circuit board, comprising:

a substrate;

the first routing is arranged on the substrate and comprises a first sub-routing and a second sub-routing which are arranged at intervals, the first sub-routing comprises a first end, the second sub-routing comprises a second end, and the first end and the second end are arranged at intervals;

the connecting piece comprises a body part and a connecting part, the connecting part is arranged between the body part and the first routing, the body part is electrically connected with the first routing through the connecting part, the connecting part comprises a first connecting part arranged at the first end and a second connecting part arranged at the second end, and the body part, the connecting part and the substrate enclose a routing space; and

and the second routing is arranged on the substrate, is positioned between the first end and the second end and penetrates through the routing space, and the thickness of the connecting part is determined according to the preset distance between the second routing and the body part.

2. The circuit board of claim 1, wherein the first end is provided with a first pad, the second end is provided with a second pad, the first connection portion is provided at the first pad, and the second connection portion is provided at the second pad.

3. The circuit board of claim 2, wherein the first pad and the second pad have the same resistance.

4. The circuit board of claim 2, further comprising a first reference pad and a second reference pad, wherein the distance between the first reference pad and the first pad is determined according to the size of the first reference pad, the size of the first pad, and a preset resistance value of the first pad; and the distance between the second reference bonding pad and the second bonding pad is determined according to the size of the second reference bonding pad, the size of the second bonding pad and a preset resistance value of the second bonding pad.

5. The circuit board of claim 2, wherein the first connection portion and the first land coincide in projection on the substrate, and the second connection portion and the second land coincide in projection on the substrate.

6. The circuit board of claim 1, wherein the second trace is located at a center of a line connecting the first end and the second end.

7. The circuit board of claim 1, wherein the connector is soldered to the first trace using a steel mesh.

8. The circuit board according to claim 7, wherein the thickness of the connection part is determined according to the thickness of the steel mesh; or, the steel mesh comprises a steel mesh body and a step part, the step part is arranged around an opening formed in the steel mesh body, the first pad and the second pad are located in the opening, and the thickness of the connecting part is determined according to the sum of the thicknesses of the steel mesh body and the step part.

9. The circuit board of claim 1, wherein the predetermined distance is determined according to a signal interference strength between the connector and the second trace.

10. A terminal, characterized in that the terminal comprises a housing and a circuit board according to any of claims 1-9, which circuit board is arranged in the housing.

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