CN216597984U - Antenna interconnection device - Google Patents
Antenna interconnection device Download PDFInfo
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- CN216597984U CN216597984U CN202123195275.XU CN202123195275U CN216597984U CN 216597984 U CN216597984 U CN 216597984U CN 202123195275 U CN202123195275 U CN 202123195275U CN 216597984 U CN216597984 U CN 216597984U
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Abstract
The utility model discloses an antenna interconnection device, which belongs to the technical field of radar communication and comprises a plurality of layers of microwave boards and an antenna array, and is characterized in that: the antenna array is fixed at the bottom of the heat dissipation cavity, a chip is bonded on the multilayer microwave board, a via hole and a coaxial ground hole are formed in the multilayer microwave board, a microstrip line and an insulator are arranged on the multilayer microwave board, the coaxial ground hole is respectively connected with the microstrip line and the ground of the microstrip line, one end of the insulator penetrates through the via hole of the multilayer microwave board and is connected with the microstrip line on the multilayer microwave board through the first gold bonding wire, the other end of the insulator penetrates through the heat dissipation cavity and is welded with the antenna array, and the chip is connected with the microstrip line through the second gold bonding wire. The utility model forms good grounding effect through the coaxial ground holes of the multiple layers of microwave boards, completes the transmission of radio frequency microwave signals, can greatly reduce the energy loss of the signals and improves the convenience of maintenance and test.
Description
Technical Field
The utility model relates to the technical field of radar communication, in particular to an antenna interconnection device.
Background
The radio frequency microwave signal interconnection structure is applied to a radar or communication antenna system to realize the transmission of microwave radio frequency signals, and the traditional multilayer microwave board is directly connected with an antenna array in a welding mode, so that a plurality of defects exist, such as: the maintainability is poor. The interconnection of traditional multilayer microwave board and antenna array all adopts and is that the welded mode goes on, and the insulator both ends are all connected through the welded mode, and in the wavefront maintenance in later stage, the multilayer microwave board is dismantled inconveniently, and is fragile after many times of overhaul, is unfavorable for the maintenance test. In a traditional radar or communication antenna system, a radio frequency chip is bonded on a cavity, and the connection between the radio frequency chip and a plurality of microwave boards is discontinuous, so that the matching of the transition part is not ideal, the grounding effect is poor, and the signal energy loss is large.
Chinese patent publication No. CN 105375116a, published 2016, 03, and 02 discloses an antenna interconnection unit, which is characterized by comprising an antenna connection sub-block and a T/R assembly connection sub-block, wherein the antenna connection sub-block comprises a first avoidance hole and a first welding hole, and the T/R assembly connection sub-block comprises a second avoidance hole and a second welding hole; the antenna connection sub-block is tightly combined with the T/R assembly connection sub-block, the first avoidance hole is aligned with the second welding hole, the second avoidance hole is aligned with the first welding hole, and the first welding hole is electrically connected with the second welding hole.
The antenna interconnection unit disclosed in the patent document effectively solves the technical problems of high cost and large volume, and is convenient and rapid to produce and assemble and has good practicability. However, the grounding effect is still poor, the signal energy loss is large, and the maintainability is poor.
SUMMERY OF THE UTILITY MODEL
In order to overcome the defects of the prior art, the utility model provides an antenna interconnection device, gold wire bonding is carried out between the microstrip lines of the multilayer microwave boards and the insulators, the insulators are welded with the antenna array, and the coaxial ground holes of the multilayer microwave boards form a good grounding effect, so that the transmission of radio frequency microwave signals is completed, the signal energy loss can be greatly reduced, the multilayer microwave boards, the heat dissipation cavity and the antenna array can be quickly stripped by picking off the bonding gold wires between the multilayer microwave boards and the insulators, and the convenience of maintenance and test is improved.
The utility model is realized by the following technical scheme:
an antenna interconnection device comprises a multilayer microwave board and an antenna array, and is characterized in that: the microwave board comprises a plurality of microwave boards, and is characterized by further comprising a first gold bonding wire, a second gold bonding wire and a heat dissipation cavity, wherein the plurality of microwave boards are radio frequency circuit boards with at least two layers of conducting layers stacked, the plurality of microwave boards are fixed on the top of the heat dissipation cavity, the antenna array is fixed at the bottom of the heat dissipation cavity, a chip is bonded on the plurality of microwave boards, a via hole and a coaxial ground hole are formed in the plurality of microwave boards, the via hole and the coaxial ground hole are respectively communicated with the heat dissipation cavity, a microstrip line and an insulator are arranged on the plurality of microwave boards, the coaxial ground hole is respectively connected with the microstrip line and the ground of the microstrip line, one end of the insulator penetrates through the via hole of the plurality of microwave boards and is connected with the microstrip line on the plurality of microwave boards through the first gold bonding wire, the other end of the insulator penetrates through the heat dissipation cavity and is welded with the antenna array, and the chip is connected with the microstrip line through the second gold bonding wire.
The chip is bonded on the top of the multi-layer microwave board, and the coaxial ground hole and the heat dissipation cavity form a heat dissipation channel for heat conduction of the chip.
The antenna array is characterized in that a welding point is arranged on the insulator and located at the bottom of the insulator, and the antenna array is welded to the welding point of the insulator.
The coaxial ground holes are arranged outside the via hole in an annular mode, and the distance between any two adjacent coaxial ground holes is 1 mm.
The multilayer microwave board is a 6-layer radio frequency circuit board, the thickness of each layer of radio frequency circuit board is 0.018mm, and the microstrip line is positioned on the top layer radio frequency circuit board of the multilayer microwave board.
The line width of the microstrip line is 0.55mm, the characteristic impedance of the microstrip line is 50 omega, and the microstrip line is etched on the top radio frequency circuit board of the multilayer microwave board.
The coaxial ground hole is connected with the ground of the microstrip line through electroplating, and an electroplating connection path is consistent with a signal transmission path.
The cross section of the microstrip line is fan-shaped or rectangular.
The upper end surface of the insulator and the microstrip lines on the multi-layer microwave board are positioned on the same horizontal plane.
The beneficial effects of the utility model are mainly shown in the following aspects:
the utility model relates to a multi-layer microwave board, which is a radio frequency circuit board with at least two conductive layers, the multi-layer microwave board is fixed on the top of a heat dissipation cavity, an antenna array is fixed on the bottom of the heat dissipation cavity, a chip is bonded on the multi-layer microwave board, a via hole and a coaxial ground hole are formed on the multi-layer microwave board, the via hole and the coaxial ground hole are respectively communicated with the heat dissipation cavity, a microstrip line and an insulator are arranged on the multi-layer microwave board, the coaxial ground hole is respectively connected with the microstrip line and the ground of the microstrip line, one end of the insulator passes through the via hole of the multi-layer microwave board and is connected with the microstrip line on the multi-layer microwave board through a first gold bonding wire, the other end of the insulator passes through the heat dissipation cavity and is welded with the antenna array, the chip is connected with the microstrip line through a second gold bonding wire, the insulator is bonded with the microstrip line of the multi-layer microwave board, the insulator is welded with the antenna array, and the coaxial ground hole of the multi-layer microwave board forms a good grounding effect, the transmission of radio frequency microwave signals is completed, the signal energy loss can be greatly reduced, the multilayer microwave boards, the heat dissipation cavity and the antenna array can be quickly stripped by picking and dropping the bonding gold wires between the multilayer microwave boards and the insulators, and the convenience of maintenance and testing is improved.
In the utility model, the chip is adhered to the top of the multilayer microwave board, the coaxial ground holes and the heat dissipation cavity form a heat dissipation channel for heat conduction of the chip, heat generated by the chip is conducted to the lower layer of the multilayer microwave board through the top layer of the multilayer microwave board through the coaxial ground holes, and the multilayer microwave board is in contact with the heat dissipation cavity to conduct the heat to the heat dissipation cavity, so that the chip can be well dissipated.
And thirdly, the insulator is provided with a welding point, the welding point is positioned at the bottom of the insulator, the antenna array is welded on the welding point of the insulator, and the insulator and the antenna array are connected through the welding point, so that the stability of signal transmission can be effectively guaranteed.
And fourthly, the coaxial ground holes are annularly arranged outside the via hole, and the distance between any two adjacent coaxial ground holes is 1mm, so that a similar coaxial structure is formed, and the grounding effect is further improved.
And fifthly, the multilayer microwave board is a 6-layer radio frequency circuit board, the thickness of each layer of radio frequency circuit board is 0.018mm, and the microstrip line is positioned on the top layer radio frequency circuit board of the multilayer microwave board, so that the whole antenna interconnection structure not only has good structural strength, but also is compact in structure.
Sixth, the utility model, the line width of the microstrip line is 0.55mm, the characteristic impedance of the microstrip line is 50 Ω, the microstrip line etches on the top radio frequency circuit board of the multi-layer microwave board, can guarantee the whole antenna interconnected structure has good transmission characteristic.
Seventh, the coaxial ground hole is connected with the ground of the microstrip line through electroplating, and the electroplating connection path is consistent with the signal transmission path, so that the problem of ground discontinuity at the connection position of the chip and the multilayer microwave board can be effectively prevented, the grounding effect is guaranteed, and the signal energy loss is reduced.
According to the utility model, the cross section of the microstrip line is fan-shaped or rectangular, so that the microstrip line can be flexibly selected according to different requirements, and the microstrip line has strong flexibility.
According to the utility model, the upper end face of the insulator and the microstrip lines on the multi-layer microwave board are positioned on the same horizontal plane, so that the microstrip lines are prevented from being bent and damaged in the use process, and the use reliability of the whole antenna interconnection structure is ensured.
Drawings
The utility model will be further described in detail with reference to the drawings and the detailed description, in which:
FIG. 1 is a schematic structural view of the present invention;
FIG. 2 is a top view of the present invention;
the labels in the figure are: 1. the microwave antenna comprises a multilayer microwave board 2, an antenna array 3, a first gold bonding wire 4, a second gold bonding wire 5, a heat dissipation cavity 6, a chip 7, a via hole 8, a coaxial ground hole 9, a microstrip line 10, an insulator 11, a ground of the microstrip line 12 and a welding point.
Detailed Description
Example 1
Referring to fig. 1 and 2, an antenna interconnection device includes a multilayer microwave board 1 and an antenna array 2, and further includes a first gold bonding wire 3, a second gold bonding wire 4 and a heat dissipation cavity 5, where the multilayer microwave board 1 is a radio frequency circuit board with at least two stacked conductive layers, the multilayer microwave board 1 is fixed at the top of the heat dissipation cavity 5, the antenna array 2 is fixed at the bottom of the heat dissipation cavity 5, a chip 6 is bonded on the multilayer microwave board 1, a via hole 7 and a coaxial ground hole 8 are formed on the multilayer microwave board 1, the via hole 7 and the coaxial ground hole 8 are respectively communicated with the heat dissipation cavity 5, a microstrip line 9 and an insulator 10 are arranged on the multilayer microwave board 1, the coaxial ground hole 8 is respectively connected with the microstrip line 9 and a ground 11 of the microstrip line, one end of the insulator 10 passes through the via hole 7 of the multilayer microwave board 1 and is connected with the microstrip line 9 on the multilayer microwave board 1 through the first gold bonding wire 3, the other end of the insulator 10 penetrates through the heat dissipation cavity 5 and is welded with the antenna array 2, and the chip 6 is connected with the microstrip line 9 through a second gold bonding wire 4.
The embodiment is the most basic implementation manner, gold wire bonding is performed on the microstrip line 9 and the insulator 10 of the multilayer microwave board 1, the insulator 10 is welded with the antenna array 2, and the coaxial ground hole 8 of the multilayer microwave board 1 forms a good grounding effect, so that transmission of radio frequency microwave signals is completed, signal energy loss can be greatly reduced, the multilayer microwave board 1 can be quickly peeled off from the heat dissipation cavity 5 and the antenna array 2 by picking and dropping the gold bonding wire between the multilayer microwave board 1 and the insulator 10, and convenience in maintenance and testing is improved.
Example 2
Referring to fig. 1 and 2, an antenna interconnection device includes a multilayer microwave board 1 and an antenna array 2, and further includes a first gold bonding wire 3, a second gold bonding wire 4 and a heat dissipation cavity 5, where the multilayer microwave board 1 is a radio frequency circuit board with at least two stacked conductive layers, the multilayer microwave board 1 is fixed at the top of the heat dissipation cavity 5, the antenna array 2 is fixed at the bottom of the heat dissipation cavity 5, a chip 6 is bonded on the multilayer microwave board 1, a via hole 7 and a coaxial ground hole 8 are formed on the multilayer microwave board 1, the via hole 7 and the coaxial ground hole 8 are respectively communicated with the heat dissipation cavity 5, a microstrip line 9 and an insulator 10 are arranged on the multilayer microwave board 1, the coaxial ground hole 8 is respectively connected with the microstrip line 9 and a ground 11 of the microstrip line, one end of the insulator 10 passes through the via hole 7 of the multilayer microwave board 1 and is connected with the microstrip line 9 on the multilayer microwave board 1 through the first gold bonding wire 3, the other end of the insulator 10 penetrates through the heat dissipation cavity 5 and is welded with the antenna array 2, and the chip 6 is connected with the microstrip line 9 through a second gold bonding wire 4.
The chip 6 is bonded on the top of the multi-layer microwave board 1, and the coaxial ground hole 8 and the heat dissipation cavity 5 form a heat dissipation channel for heat conduction of the chip 6.
In this embodiment, the chip 6 is adhered to the top of the multi-layer microwave board 1, the coaxial holes 8 and the heat dissipation cavity 5 form a heat dissipation channel for heat conduction of the chip 6, heat generated by the chip 6 is conducted to the lower layer of the multi-layer microwave board 1 through the top layer of the multi-layer microwave board 1 via the coaxial holes 8, and the multi-layer microwave board 1 is in contact with the heat dissipation cavity 5 to conduct the heat to the heat dissipation cavity 5, so that the chip 6 can be well dissipated.
Example 3
Referring to fig. 1 and 2, an antenna interconnection device includes a multilayer microwave board 1 and an antenna array 2, and further includes a first gold bonding wire 3, a second gold bonding wire 4 and a heat dissipation cavity 5, where the multilayer microwave board 1 is a radio frequency circuit board with at least two stacked conductive layers, the multilayer microwave board 1 is fixed at the top of the heat dissipation cavity 5, the antenna array 2 is fixed at the bottom of the heat dissipation cavity 5, a chip 6 is bonded on the multilayer microwave board 1, a via hole 7 and a coaxial ground hole 8 are formed on the multilayer microwave board 1, the via hole 7 and the coaxial ground hole 8 are respectively communicated with the heat dissipation cavity 5, a microstrip line 9 and an insulator 10 are arranged on the multilayer microwave board 1, the coaxial ground hole 8 is respectively connected with the microstrip line 9 and a ground 11 of the microstrip line, one end of the insulator 10 passes through the via hole 7 of the multilayer microwave board 1 and is connected with the microstrip line 9 on the multilayer microwave board 1 through the first gold bonding wire 3, the other end of the insulator 10 penetrates through the heat dissipation cavity 5 and is welded with the antenna array 2, and the chip 6 is connected with the microstrip line 9 through a second gold bonding wire 4.
The chip 6 is bonded on the top of the multi-layer microwave board 1, and the coaxial ground hole 8 and the heat dissipation cavity 5 form a heat dissipation channel for heat conduction of the chip 6.
The insulator 10 is provided with a welding point 12, the welding point 12 is located at the bottom of the insulator 10, and the antenna array 2 is welded to the welding point 12 of the insulator 10.
In this embodiment, a welding point 12 is disposed on the insulator 10, the welding point 12 is located at the bottom of the insulator 10, and the antenna array 2 is welded to the welding point 12 of the insulator 10, so that the insulator 10 and the antenna array 2 are connected by the welding point 12, which can effectively ensure the stability of signal transmission.
Example 4
Referring to fig. 1 and 2, an antenna interconnection device includes a multilayer microwave board 1 and an antenna array 2, and further includes a first gold bonding wire 3, a second gold bonding wire 4 and a heat dissipation cavity 5, where the multilayer microwave board 1 is a radio frequency circuit board with at least two stacked conductive layers, the multilayer microwave board 1 is fixed at the top of the heat dissipation cavity 5, the antenna array 2 is fixed at the bottom of the heat dissipation cavity 5, a chip 6 is bonded on the multilayer microwave board 1, a via hole 7 and a coaxial ground hole 8 are formed on the multilayer microwave board 1, the via hole 7 and the coaxial ground hole 8 are respectively communicated with the heat dissipation cavity 5, a microstrip line 9 and an insulator 10 are arranged on the multilayer microwave board 1, the coaxial ground hole 8 is respectively connected with the microstrip line 9 and a ground 11 of the microstrip line, one end of the insulator 10 passes through the via hole 7 of the multilayer microwave board 1 and is connected with the microstrip line 9 on the multilayer microwave board 1 through the first gold bonding wire 3, the other end of the insulator 10 penetrates through the heat dissipation cavity 5 and is welded with the antenna array 2, and the chip 6 is connected with the microstrip line 9 through a second gold bonding wire 4.
The chip 6 is bonded on the top of the multi-layer microwave board 1, and the coaxial ground hole 8 and the heat dissipation cavity 5 form a heat dissipation channel for heat conduction of the chip 6.
The insulator 10 is provided with a welding point 12, the welding point 12 is located at the bottom of the insulator 10, and the antenna array 2 is welded to the welding point 12 of the insulator 10.
The coaxial ground holes 8 are multiple, the multiple coaxial ground holes 8 are annularly arranged outside the via hole 7, and the distance between any two adjacent coaxial ground holes 8 is 1 mm.
In this embodiment, a plurality of coaxial ground holes 8 are provided, the plurality of coaxial ground holes 8 are annularly arranged outside the via hole 7, and a distance between any two adjacent coaxial ground holes 8 is 1mm, so as to form a coaxial structure, thereby further improving the grounding effect.
Example 5
Referring to fig. 1 and 2, an antenna interconnection device includes a multilayer microwave board 1 and an antenna array 2, and further includes a first gold bonding wire 3, a second gold bonding wire 4 and a heat dissipation cavity 5, where the multilayer microwave board 1 is a radio frequency circuit board with at least two stacked conductive layers, the multilayer microwave board 1 is fixed at the top of the heat dissipation cavity 5, the antenna array 2 is fixed at the bottom of the heat dissipation cavity 5, a chip 6 is bonded on the multilayer microwave board 1, a via hole 7 and a coaxial ground hole 8 are formed on the multilayer microwave board 1, the via hole 7 and the coaxial ground hole 8 are respectively communicated with the heat dissipation cavity 5, a microstrip line 9 and an insulator 10 are arranged on the multilayer microwave board 1, the coaxial ground hole 8 is respectively connected with the microstrip line 9 and a ground 11 of the microstrip line, one end of the insulator 10 passes through the via hole 7 of the multilayer microwave board 1 and is connected with the microstrip line 9 on the multilayer microwave board 1 through the first gold bonding wire 3, the other end of the insulator 10 penetrates through the heat dissipation cavity 5 and is welded with the antenna array 2, and the chip 6 is connected with the microstrip line 9 through a second gold bonding wire 4.
The chip 6 is bonded on the top of the multi-layer microwave board 1, and the coaxial ground hole 8 and the heat dissipation cavity 5 form a heat dissipation channel for heat conduction of the chip 6.
The insulator 10 is provided with a welding point 12, the welding point 12 is located at the bottom of the insulator 10, and the antenna array 2 is welded to the welding point 12 of the insulator 10.
The coaxial ground holes 8 are multiple, the multiple coaxial ground holes 8 are annularly arranged outside the via hole 7, and the distance between any two adjacent coaxial ground holes 8 is 1 mm.
The multilayer microwave board 1 is a 6-layer radio frequency circuit board, the thickness of each layer of radio frequency circuit board is 0.018mm, and the microstrip line 9 is positioned on the top layer radio frequency circuit board of the multilayer microwave board 1.
In this embodiment, the multi-layer microwave board 1 is a 6-layer rf circuit board, the thickness of each layer of rf circuit board is 0.018mm, and the microstrip line 9 is located on the top layer rf circuit board of the multi-layer microwave board 1, so that the whole antenna interconnection structure not only has good structural strength, but also is compact.
Example 6
Referring to fig. 1 and 2, an antenna interconnection device includes a multilayer microwave board 1 and an antenna array 2, and further includes a first gold bonding wire 3, a second gold bonding wire 4 and a heat dissipation cavity 5, where the multilayer microwave board 1 is a radio frequency circuit board with at least two stacked conductive layers, the multilayer microwave board 1 is fixed at the top of the heat dissipation cavity 5, the antenna array 2 is fixed at the bottom of the heat dissipation cavity 5, a chip 6 is bonded on the multilayer microwave board 1, a via hole 7 and a coaxial ground hole 8 are formed on the multilayer microwave board 1, the via hole 7 and the coaxial ground hole 8 are respectively communicated with the heat dissipation cavity 5, a microstrip line 9 and an insulator 10 are arranged on the multilayer microwave board 1, the coaxial ground hole 8 is respectively connected with the microstrip line 9 and a ground 11 of the microstrip line, one end of the insulator 10 passes through the via hole 7 of the multilayer microwave board 1 and is connected with the microstrip line 9 on the multilayer microwave board 1 through the first gold bonding wire 3, the other end of the insulator 10 penetrates through the heat dissipation cavity 5 and is welded with the antenna array 2, and the chip 6 is connected with the microstrip line 9 through a second gold bonding wire 4.
The chip 6 is bonded on the top of the multi-layer microwave board 1, and the coaxial ground hole 8 and the heat dissipation cavity 5 form a heat dissipation channel for heat conduction of the chip 6.
The insulator 10 is provided with a welding point 12, the welding point 12 is located at the bottom of the insulator 10, and the antenna array 2 is welded to the welding point 12 of the insulator 10.
The coaxial ground holes 8 are multiple, the multiple coaxial ground holes 8 are annularly arranged outside the via hole 7, and the distance between any two adjacent coaxial ground holes 8 is 1 mm.
The multilayer microwave board 1 is a 6-layer radio frequency circuit board, the thickness of each layer of radio frequency circuit board is 0.018mm, and the microstrip line 9 is positioned on the top layer radio frequency circuit board of the multilayer microwave board 1.
The line width of the microstrip line 9 is 0.55mm, the characteristic impedance of the microstrip line 9 is 50 Ω, and the microstrip line 9 is etched on the top radio frequency circuit board of the multilayer microwave board 1.
In this embodiment, the line width of the microstrip line 9 is 0.55mm, the characteristic impedance of the microstrip line 9 is 50 Ω, and the microstrip line 9 is etched on the top rf circuit board of the multi-layer microwave board 1, which can ensure that the whole antenna interconnection structure has good transmission characteristics.
Example 7
Referring to fig. 1 and 2, an antenna interconnection device includes a multilayer microwave board 1 and an antenna array 2, and further includes a first gold bonding wire 3, a second gold bonding wire 4 and a heat dissipation cavity 5, where the multilayer microwave board 1 is a radio frequency circuit board with at least two stacked conductive layers, the multilayer microwave board 1 is fixed at the top of the heat dissipation cavity 5, the antenna array 2 is fixed at the bottom of the heat dissipation cavity 5, a chip 6 is bonded on the multilayer microwave board 1, a via hole 7 and a coaxial ground hole 8 are formed on the multilayer microwave board 1, the via hole 7 and the coaxial ground hole 8 are respectively communicated with the heat dissipation cavity 5, a microstrip line 9 and an insulator 10 are arranged on the multilayer microwave board 1, the coaxial ground hole 8 is respectively connected with the microstrip line 9 and a ground 11 of the microstrip line, one end of the insulator 10 passes through the via hole 7 of the multilayer microwave board 1 and is connected with the microstrip line 9 on the multilayer microwave board 1 through the first gold bonding wire 3, the other end of the insulator 10 penetrates through the heat dissipation cavity 5 and is welded with the antenna array 2, and the chip 6 is connected with the microstrip line 9 through a second gold bonding wire 4.
The chip 6 is bonded on the top of the multi-layer microwave board 1, and the coaxial ground hole 8 and the heat dissipation cavity 5 form a heat dissipation channel for heat conduction of the chip 6.
The insulator 10 is provided with a welding point 12, the welding point 12 is located at the bottom of the insulator 10, and the antenna array 2 is welded to the welding point 12 of the insulator 10.
The coaxial ground holes 8 are multiple, the multiple coaxial ground holes 8 are annularly arranged outside the via hole 7, and the distance between any two adjacent coaxial ground holes 8 is 1 mm.
The multilayer microwave board 1 is a 6-layer radio frequency circuit board, the thickness of each layer of radio frequency circuit board is 0.018mm, and the microstrip line 9 is positioned on the top layer radio frequency circuit board of the multilayer microwave board 1.
The line width of the microstrip line 9 is 0.55mm, the characteristic impedance of the microstrip line 9 is 50 Ω, and the microstrip line 9 is etched on the top radio frequency circuit board of the multilayer microwave board 1.
The coaxial ground hole 8 is connected with the ground 11 of the microstrip line through electroplating, and the electroplating connection path is consistent with the signal transmission path.
The cross section of the microstrip line 9 is fan-shaped.
In this embodiment, the coaxial ground hole 8 is connected to the ground 11 of the microstrip line by electroplating, and the electroplating connection path is consistent with the signal transmission path, so as to effectively prevent the ground discontinuity at the connection between the chip 6 and the multi-layer microwave board 1, ensure the grounding effect, and reduce the signal energy loss.
Example 8
Referring to fig. 1 and 2, an antenna interconnection device includes a multilayer microwave board 1 and an antenna array 2, and further includes a first gold bonding wire 3, a second gold bonding wire 4 and a heat dissipation cavity 5, where the multilayer microwave board 1 is a radio frequency circuit board with at least two stacked conductive layers, the multilayer microwave board 1 is fixed at the top of the heat dissipation cavity 5, the antenna array 2 is fixed at the bottom of the heat dissipation cavity 5, a chip 6 is bonded on the multilayer microwave board 1, a via hole 7 and a coaxial ground hole 8 are formed on the multilayer microwave board 1, the via hole 7 and the coaxial ground hole 8 are respectively communicated with the heat dissipation cavity 5, a microstrip line 9 and an insulator 10 are arranged on the multilayer microwave board 1, the coaxial ground hole 8 is respectively connected with the microstrip line 9 and a ground 11 of the microstrip line, one end of the insulator 10 passes through the via hole 7 of the multilayer microwave board 1 and is connected with the microstrip line 9 on the multilayer microwave board 1 through the first gold bonding wire 3, the other end of the insulator 10 penetrates through the heat dissipation cavity 5 and is welded with the antenna array 2, and the chip 6 is connected with the microstrip line 9 through a second gold bonding wire 4.
The chip 6 is bonded on the top of the multi-layer microwave board 1, and the coaxial ground hole 8 and the heat dissipation cavity 5 form a heat dissipation channel for heat conduction of the chip 6.
The insulator 10 is provided with a welding point 12, the welding point 12 is located at the bottom of the insulator 10, and the antenna array 2 is welded to the welding point 12 of the insulator 10.
The coaxial ground holes 8 are multiple, the multiple coaxial ground holes 8 are annularly arranged outside the via hole 7, and the distance between any two adjacent coaxial ground holes 8 is 1 mm.
The multilayer microwave board 1 is a 6-layer radio frequency circuit board, the thickness of each layer of radio frequency circuit board is 0.018mm, and the microstrip line 9 is positioned on the top layer radio frequency circuit board of the multilayer microwave board 1.
The line width of the microstrip line 9 is 0.55mm, the characteristic impedance of the microstrip line 9 is 50 Ω, and the microstrip line 9 is etched on the top radio frequency circuit board of the multilayer microwave board 1.
The coaxial ground hole 8 is connected with the ground 11 of the microstrip line through electroplating, and the electroplating connection path is consistent with the signal transmission path.
The cross section of the microstrip line 9 is rectangular.
The upper end surface of the insulator 10 and the microstrip line 9 on the multi-layer microwave board 1 are positioned on the same horizontal plane.
The embodiment is the best implementation mode, the upper end face of the insulator 10 and the microstrip lines 9 on the multi-layer microwave board 1 are located on the same horizontal plane, which is beneficial to preventing the microstrip lines 9 from being bent and damaged in the using process and ensuring the use reliability of the whole antenna interconnection structure.
Claims (6)
1. An antenna interconnection device comprising a multilayer microwave board (1) and an antenna array (2), characterized in that: the microwave antenna further comprises a first gold bonding wire (3), a second gold bonding wire (4) and a heat dissipation cavity (5), the multilayer microwave board (1) is a radio frequency circuit board with at least two stacked conducting layers, the multilayer microwave board (1) is fixed to the top of the heat dissipation cavity (5), the antenna array (2) is fixed to the bottom of the heat dissipation cavity (5), a chip (6) is bonded to the multilayer microwave board (1), a via hole (7) and a coaxial ground hole (8) are formed in the multilayer microwave board (1), the via hole (7) and the coaxial ground hole (8) are respectively communicated with the heat dissipation cavity (5), a microstrip line (9) and an insulator (10) are arranged on the multilayer microwave board (1), the coaxial ground hole (8) is respectively connected with the microstrip line (9) and a ground (11) of the microstrip line, one end of the insulator (10) penetrates through the via hole (7) of the multilayer microwave board (1) and is connected with the microstrip line (9) on the multilayer microwave board (1) through the first gold bonding wire (3) 3) And the other end of the insulator (10) penetrates through the heat dissipation cavity (5) and is welded with the antenna array (2), and the chip (6) is connected with the microstrip line (9) through a second gold bonding wire (4).
2. An antenna interconnect device according to claim 1, wherein: the chip (6) is bonded on the top of the multi-layer microwave board (1), and the coaxial ground hole (8) and the heat dissipation cavity (5) form a heat dissipation channel for heat conduction of the chip (6).
3. An antenna interconnect device according to claim 1, further comprising: coaxial ground hole (8) are a plurality of, and a plurality of coaxial ground hole (8) are cyclic annular and arrange outside conducting hole (7), and arbitrary two adjacent coaxial ground hole (8) interval is 1 mm.
4. An antenna interconnect device according to claim 1, wherein: the multilayer microwave board (1) is a 6-layer radio frequency circuit board, the thickness of each layer of radio frequency circuit board is 0.018mm, and the microstrip line (9) is located on the top layer radio frequency circuit board of the multilayer microwave board (1).
5. An antenna interconnect device according to claim 1, wherein: the coaxial ground hole (8) is connected with the ground (11) of the microstrip line through electroplating, and the electroplating connection path is consistent with the signal transmission path.
6. An antenna interconnect device according to claim 1, wherein: the cross section of the microstrip line (9) is fan-shaped or rectangular.
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| CN202123195275.XU CN216597984U (en) | 2021-12-20 | 2021-12-20 | Antenna interconnection device |
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| CN202123195275.XU CN216597984U (en) | 2021-12-20 | 2021-12-20 | Antenna interconnection device |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115881663A (en) * | 2023-01-16 | 2023-03-31 | 成都华兴大地科技有限公司 | Novel high-power tile type TR module |
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2021
- 2021-12-20 CN CN202123195275.XU patent/CN216597984U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115881663A (en) * | 2023-01-16 | 2023-03-31 | 成都华兴大地科技有限公司 | Novel high-power tile type TR module |
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