CN216597723U

CN216597723U - Composite heat management structure, battery module and battery pack

Info

Publication number: CN216597723U
Application number: CN202122408549.2U
Authority: CN
Inventors: 秦平; 郭继鹏; 马洪涛
Original assignee: Evergrande New Energy Technology Shenzhen Co Ltd
Current assignee: Evergrande New Energy Technology Shenzhen Co Ltd
Priority date: 2021-09-30
Filing date: 2021-09-30
Publication date: 2022-05-24
Anticipated expiration: 2031-09-30

Abstract

The utility model relates to the field of power batteries and discloses a composite heat management structure, a battery module and a battery pack. This compound heat management structure includes the heat-conducting layer, and the both sides of heat-conducting layer are equipped with the semiconductor refrigeration piece respectively, and the tip of keeping away from the heat-conducting layer of semiconductor refrigeration piece is connected with power supply unit. The battery module comprises a shell, a plurality of battery cell modules and a plurality of composite heat management structures. The battery pack comprises a plurality of battery modules. The composite heat management structure comprises a heat conduction layer and a semiconductor refrigeration piece, if the ambient temperature of the battery module is higher, current is introduced into the semiconductor refrigeration piece, so that the semiconductor refrigeration piece performs refrigeration, the semiconductor refrigeration piece absorbs heat generated by the battery, releases the heat to the heat conduction layer, then transmits the heat to a corresponding contact component, dissipates the heat, and plays a role in rapid heat dissipation.

Description

Composite heat management structure, battery module and battery pack

Technical Field

The utility model relates to the field of power batteries, in particular to a composite heat management structure, a battery module and a battery pack.

Background

The power battery is the only power source of the new energy automobile, and the performance of the power battery directly influences the dynamic property, safety and economical efficiency of the whole automobile. The performance, service life and safety of the power battery are sensitive to temperature, the battery is affected by over-high temperature, over-low temperature and uneven distribution among battery modules or battery monomers, and especially, safety problems such as burning, explosion and the like can be caused when the temperature is over-high. Therefore, the heat management of the battery is very necessary, and the heat management technology of the battery pack also becomes a key technology for restricting the development of the electric automobile.

Traditional battery module generally adopts harmonica tubular water-cooling board or punching press board as heat radiation structure, and harmonica tubular water-cooling board or punching press board setting are between the casing of battery module bottom and battery package, if directly set up in the casing, then area of contact is great between harmonica tubular water-cooling board or punching press board and the casing, and the heat transmits for the casing through harmonica tubular water-cooling board or punching press board very easily, causes calorific loss. For this reason, harmonica formula water-cooling board or punching press board bottom are usually provided with the thermal-insulated cotton of one deck, set up thermal-insulated cotton of bubble and can reduce the heat transfer between harmonica tubular water-cooling board and the casing of battery package. However, the thermal insulation foam needs to support the harmonica type water cooling plate or the punching plate, so that the requirement on the material of the thermal insulation foam is high, the cost is high, and the Z-direction height of the battery pack is increased.

SUMMERY OF THE UTILITY MODEL

In order to solve the technical problems or at least partially solve the technical problems, the utility model provides a composite thermal management structure, a battery module and a battery pack.

The utility model provides a composite heat management structure which comprises a heat conducting layer, wherein semiconductor refrigerating sheets are respectively arranged on two sides of the heat conducting layer, and the end parts, far away from the heat conducting layer, of the semiconductor refrigerating sheets are connected with a power supply device.

Preferably, the heat conductive layer is an elastic heat conductive layer.

Preferably, the thermally conductive layer is a graphene aerogel layer.

Preferably, the thickness of the heat conducting layer is 1-2 mm.

Preferably, the heat conducting layer is connected with the semiconductor refrigeration sheet through adhesive, hot melting or buckling.

Preferably, the heat conducting layer and the semiconductor chilling plates have the same area.

The utility model also provides a battery module which comprises a shell, wherein a plurality of battery cell modules arranged in parallel are arranged in the shell, and the composite heat management structure is arranged between every two adjacent battery cell modules.

Preferably, a plurality of electric core modules and a plurality of compound thermal management structure set up in turn and constitute the module body, are connected through the heat conduction glue between the bottom plate of module body and casing.

Preferably, both ends of the cell module and the composite heat management structure are abutted against the inner wall of the casing.

The utility model also provides a battery pack which comprises a plurality of the battery modules arranged in parallel.

Compared with the prior art, the technical scheme provided by the embodiment of the utility model has the following advantages:

the composite heat management structure comprises a heat conduction layer and semiconductor refrigeration pieces, wherein if the ambient temperature is low, the semiconductor refrigeration pieces are not electrified, the heat generated by the battery is transferred to the heat conduction layer through the semiconductor refrigeration pieces and then transferred to corresponding contact parts for heat dissipation, if the ambient temperature of the battery module is high, current is introduced into the semiconductor refrigeration pieces to enable the semiconductor refrigeration pieces to refrigerate, the semiconductor refrigeration pieces absorb the heat generated by the battery, release heat to the heat conduction layer and then transfer the heat to the corresponding contact parts to dissipate the heat, and the effect of rapid heat dissipation is achieved.

Drawings

The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments consistent with the utility model and together with the description, serve to explain the principles of the utility model.

In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, and it is obvious for those skilled in the art that other drawings can be obtained according to the drawings without inventive exercise.

Fig. 1 is a schematic structural diagram of a battery module according to an embodiment of the present invention;

fig. 2 is an exploded view of a battery module according to an embodiment of the present invention;

fig. 3 is a schematic diagram of a positional relationship between a composite thermal management structure and a cell module according to an embodiment of the present invention;

FIG. 4 is an exploded view of a composite thermal management structure according to an embodiment of the present invention.

Description of the reference numerals

1. A battery module; 2. an upper cover; 3. a composite thermal management structure; 4. an end plate; 5. a cell module; 6. a side plate; 7. a heat-conducting adhesive layer; 8. a base plate; 9. a semiconductor refrigeration sheet; 10. a thermally conductive layer.

Detailed Description

In order that the above objects, features and advantages of the present invention may be more clearly understood, a solution of the present invention will be further described below. It should be noted that the embodiments of the present invention and features of the embodiments may be combined with each other without conflict.

In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present invention, but the utility model may be practiced otherwise than as described herein; it is to be understood that the embodiments described in the specification are only a part of the embodiments of the present invention, and not all of them.

As shown in fig. 4, the composite thermal management structure provided by the embodiment of the present invention includes a heat conducting layer 10, and the semiconductor chilling plates 9 are respectively disposed on two sides of the heat conducting layer 10, that is, the heat conducting layer 10 is located in the middle, and the semiconductor chilling plates 9 are located on two sides, so as to form a sandwich structure. The heat conducting layer 10 and the semiconductor refrigerating sheet 9 are connected through adhesive or hot melting or buckling to form a complete structure. Wherein, the connected mode between heat-conducting layer 10 and the semiconductor refrigeration piece 9 is unrestricted, as long as can satisfy the joint strength demand, simultaneously, can not influence heat-conducting layer 10 and the normal use of semiconductor refrigeration piece 9 can. The end part, far away from the heat conducting layer 10, of the semiconductor refrigeration piece 9 is connected with a power supply device, the specific setting position and the setting form of the power supply device are not limited, and the power supply device can provide current for the semiconductor refrigeration piece 9 as long as the current is satisfied, and the current is guaranteed to be adjustable.

The semiconductor refrigeration sheet 9 utilizes the peltier effect, when current passes through a galvanic couple formed by connecting different semiconductor materials in series, one end can absorb heat from the outside, the other end can release heat to the outside, and when the current directions are opposite, the hot end can become the cold end and absorb heat from the outside. The cooling capacity and the cooling speed can be adjusted by the magnitude of the current, which is not described herein too much since the peltier effect is a well-known technique, and the adjustment of the current can be based on a feedback system, i.e. when a large cooling capacity is required, the current is increased and vice versa, which is also prior art, and therefore not described herein too much.

The composite heat management structure 3 comprises a heat conduction layer 10 and semiconductor refrigeration pieces 9, if the ambient temperature is low, the semiconductor refrigeration pieces 9 are not electrified, and heat generated by a battery is transferred to the heat conduction layer 10 through the semiconductor refrigeration pieces 9 and then transferred to corresponding contact parts for heat dissipation. If battery module 1's ambient temperature is higher, let in the electric current in the semiconductor refrigeration piece 9, make semiconductor refrigeration piece 9 refrigerate, semiconductor refrigeration piece 9 absorbs the heat that the battery produced, and release heat to heat-conducting layer 10, transmit again on corresponding contact member, dispel the heat, play quick radiating effect, and compound heat management structure 3 sets up between two electric core modules 5, the battery package need not upwards set up the liquid cooling structure at Z, save Z to space and cost, improve space utilization, reduce casing weight, improve energy density, promote the driving experience of whole car.

Heat-conducting layer 10 is the elasticity heat-conducting layer, and heat-conducting layer 10 adopts the elasticity material promptly, and then makes heat-conducting layer 10 can stretch out and draw back in the thickness direction of self, and then can provide breathing space, extension battery life for electric core charge-discharge process. Preferably, the heat conducting layer 10 is a graphene aerogel layer, and the thickness of the heat conducting layer 10 is preferably 1-2 mm. The graphene aerogel material has excellent heat dissipation capacity, good compressibility and light weight. The graphene has a very high heat conductivity coefficient, is a carbon material with the highest heat conductivity coefficient at present, has excellent heat dissipation performance, and can solve the heat dissipation problem in the working process of the cell module 5. The inside three-dimensional porous structure that is of graphite alkene aerogel has fine compressibility, can absorb the inflation of 5 charge-discharge in-process of electric core module, and this kind of high specific surface area and three-dimensional porous structure make graphite alkene aerogel quality very light moreover, can improve the energy density of battery package. The main methods for preparing graphene at present are as follows: mechanical lift-off, redox, epitaxy of silicon carbide, Hummer and chemical vapour deposition. Since the graphene aerogel is an existing material, a technology for producing the graphene aerogel is also an existing technology, and thus, not described herein too much.

Further optimally, the heat conduction layer 10 has the same area as the semiconductor refrigeration piece 9, and the design mode can effectively increase the heat transfer effect between the heat conduction layer 10 and the semiconductor refrigeration piece 9, so that the heat dissipation of the battery cell module 5 is facilitated.

With reference to fig. 1 to 3, the present invention further provides a battery module, where the battery module 1 includes a casing, a plurality of battery cell modules 5 arranged in parallel are disposed inside the casing, and the composite thermal management structure 3 is disposed between every two adjacent battery cell modules 5, so that the composite thermal management structure 3 is in direct contact with a large surface of the battery cell modules 5, where the composite thermal management structure 3 includes all technical features of the composite thermal management structure 3, and therefore, not described herein.

Specifically, as shown in fig. 2, the casing includes an upper cover 2, a bottom plate 8, two end plates 4 and two side plates 6, the two end plates 4 are arranged relatively, the two side plates 6 are arranged relatively, the two end plates 4 and the two side plates 6 are arranged alternately to form a surrounding plate structure, the upper cover 2 and the bottom plate 8 are arranged at the top and the bottom of the surrounding plate structure respectively, the plurality of battery cell modules 5 are arranged at intervals along the length direction of the side plates 6, and a composite thermal management structure 3 is arranged between every two battery cell modules 5. A plurality of electric core modules 5 and a plurality of compound thermal management structure 3 set up in turn and constitute the module body, are connected through heat-conducting adhesive layer 7 between the bottom plate 8 of module body and casing. And, the both ends of electric core module 5 and compound thermal management structure 3 all with the inner wall butt of casing. This design facilitates heat dissipation from the composite thermal management structure 3.

During operation, if the ambient temperature is lower, the semiconductor refrigeration piece 9 is not electrified, the heat generated by the battery is transferred to the heat conduction layer 10 through the semiconductor refrigeration piece 9, then is transferred to the heat conduction glue, the bottom plate 8 and the two side plates 6 through the heat conduction layer 10, and finally is dissipated through the bottom plate 8 and the side plates 6. If the ambient temperature of the battery module 1 is high, current is introduced into the semiconductor refrigerating sheet 9, so that the semiconductor refrigerating sheet 9 refrigerates, the semiconductor refrigerating sheet 9 absorbs heat generated by the battery, releases heat to the heat conducting layer 10, transfers the heat to the heat conducting glue and the bottom plate 8 and the two side plates 6, and finally dissipates the heat through the bottom plate 8 and the side plates 6.

The battery module 1 adopting the design mode has the following advantages:

(1) composite heat management structure 3 sets up between two electric core modules 5, and the heat transmits for the casing through composite heat management structure 3 for the battery package need not set up the liquid cooling structure in Z upwards, saves Z to space and cost, improves space utilization, reduces casing weight, improves energy density, promotes the driving experience of whole car.

(2) The contact between liquid cold drawing and the casing can not take place, causes the waste of cold volume, enables electric core module 5 at the work of suitable temperature interval, promotes electric core module 5's temperature uniformity nature.

(3) Need not set up thermal-insulated bubble cotton between battery module 1 bottom and box, reduced the material to reduce cost.

(4) The heat-conducting layer 10 adopts the elasticity material, and then makes the heat-conducting layer 10 can stretch out and draw back in the thickness direction of self, and then can provide breathing space, extension battery life for electric core charge-discharge process.

The utility model further provides a battery pack, which comprises a plurality of the battery modules 1 arranged in parallel, wherein the battery modules 1 comprise all the technical characteristics of the battery modules 1 and further comprise all the technical characteristics of the composite heat management structure 3, and therefore, the description is not repeated.

It is noted that, in this document, relational terms such as "first" and "second," and the like, may be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising an … …" does not exclude the presence of other identical elements in a process, method, article, or apparatus that comprises the element.

The foregoing are merely exemplary embodiments of the present invention, which enable those skilled in the art to understand or practice the present invention. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the generic principles defined herein may be applied to other embodiments without departing from the spirit or scope of the utility model. Thus, the present invention is not intended to be limited to the embodiments shown herein but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.

Claims

1. The utility model provides a compound thermal management structure, its characterized in that, compound thermal management structure (3) include heat-conducting layer (10), the both sides of heat-conducting layer (10) are equipped with semiconductor refrigeration piece (9) respectively, keeping away from of semiconductor refrigeration piece (9) be connected with power supply unit on the tip of heat-conducting layer (10).

2. The composite thermal management structure of claim 1, wherein the thermally conductive layer (10) is an elastic thermally conductive layer.

3. The composite thermal management structure of claim 2, wherein the thermally conductive layer (10) is a graphene aerogel layer.

4. The composite thermal management structure according to claim 1, characterized in that the thickness of the thermally conductive layer (10) is 1-2 mm.

5. The composite thermal management structure according to claim 1, characterized in that the thermally conductive layer (10) is connected to the semiconductor chilling plate (9) by means of an adhesive or a hot-melt or snap-fit connection.

6. The composite thermal management structure according to claim 1, characterized in that the thermally conductive layer (10) is the same area as the semiconductor chilling plates (9).

7. A battery module, characterized in that, the battery module (1) includes a casing, a plurality of cell modules (5) arranged side by side are arranged in the casing, and a composite heat management structure (3) according to any one of claims 1 to 6 is arranged between every two adjacent cell modules (5).

8. The battery module according to claim 7, wherein the plurality of cell modules (5) and the plurality of composite heat management structures (3) are alternately arranged to form a module body, and the module body is connected with the bottom plate (8) of the housing through a heat-conducting adhesive layer (7).

9. The battery module according to claim 7, characterized in that both ends of the cell module (5) and the composite thermal management structure (3) are in abutment with the inner wall of the casing.

10. A battery pack characterized by comprising a plurality of battery modules (1) as recited in any one of claims 7 to 9 arranged in parallel.