CN216597573U

CN216597573U - High-power high-voltage transient suppression diode

Info

Publication number: CN216597573U
Application number: CN202123044429.5U
Authority: CN
Inventors: 孙孝兵
Original assignee: Lianyungang Ruiersheng Electronic Technology Co ltd
Current assignee: Lianyungang Ruiersheng Electronic Technology Co ltd
Priority date: 2021-12-06
Filing date: 2021-12-06
Publication date: 2022-05-24
Anticipated expiration: 2031-12-06

Abstract

The utility model discloses a high-power high-voltage transient suppression diode which comprises a diode body, wherein pin bodies are arranged at two ends of the diode body, a plastic package shell is sleeved outside the diode body, graphene radiating fins are uniformly arranged on the outer side of the plastic package shell, supporting blocks are arranged at two ends of the diode body, and a protection mechanism is arranged on one side of each supporting block. According to the utility model, the supporting blocks are arranged at the two ends of the diode body, the sliding grooves are arranged on the side walls of the supporting blocks, and then the sliding blocks are matched with the sliding grooves, so that the sliding blocks slide in the sliding grooves, and the metal heat conduction sleeve is sleeved outside the pin body, so that when the diode body is used, the protection of the pin body is enhanced through the metal heat conduction sleeve, the situation that the pin body is completely exposed outside and broken due to breakage is avoided, and the material can be effectively saved.

Description

High-power high-voltage transient suppression diode

Technical Field

The utility model relates to the technical field of diodes, in particular to a high-power high-voltage transient suppression diode.

Background

The transient voltage suppressor diode is called TVS for short, has wider application range as a protective device in circuit design, has the advantages of quick response time, large transient power, low leakage current, breakdown voltage deviation, easy control of clamping voltage, no damage limit, small volume and the like, and is applied to various fields of computer systems, communication equipment, instruments and meters and the like;

when the existing high-voltage transient suppression diode is used, the pin protection performance is poor, and in frequent use, the pin is easy to break, so that the diode is damaged, needs to be manufactured and reused, and wastes materials.

SUMMERY OF THE UTILITY MODEL

The utility model aims to provide a high-power high-voltage transient suppression diode, which is used for solving the problem of poor pin protection of the high-voltage transient suppression diode in the background technology.

In order to achieve the purpose, the utility model provides the following technical scheme: the utility model provides a high-power high-voltage transient suppression diode, includes the diode body, the pin body is all installed at the both ends of diode body, the outside cover of diode body is equipped with the plastic envelope shell, and evenly installs the fin of graphite alkene in the outside of plastic envelope shell, the supporting shoe is all installed at the both ends of diode body, and one side of supporting shoe all is provided with protection mechanism, the inside of plastic envelope shell is provided with heat conduction silicone grease layer, the inside of plastic envelope shell evenly is provided with buffer gear.

When the high-power high-voltage transient suppression diode is used, the plastic package shell is sleeved outside the diode body, so that the protection of the diode body is enhanced, then the radiating fins with multiple groups of graphene are mounted on the plastic package shell and are matched with the heat-conducting silicone layer, so that heat generated by the diode body is rapidly led out, and a good radiating effect is achieved.

Preferably, the sections of the graphene radiating fins are rectangular, and the graphene radiating fins are annularly distributed on the outer wall of the plastic package shell. The multiple groups of radiating fins are arranged on the graphene, so that the heat conduction efficiency is high, heat is not easy to accumulate, and the diode body is not easy to burn out.

Preferably, the protection mechanism comprises a sliding groove, the sliding groove is formed in the supporting block, a sliding block is slidably mounted in the sliding groove, a metal heat conduction sleeve is mounted on one side of the sliding block, and a positioning pin is connected to one side of the supporting block outside the sliding groove in a threaded mode. The metal heat conduction sleeve is sleeved on the pin body, so that the pin body can be effectively prevented from being broken.

Preferably, the outer diameter of the sliding block and the inner part of the sliding groove are matched with each other, and the sliding block and the sliding groove form a sliding mechanism.

Preferably, buffer gear includes telescopic sleeve, and telescopic sleeve sets up in the inside of plastic envelope shell, telescopic column is all installed to telescopic sleeve's one end, and telescopic column's one end installs the damping ring, telescopic column's the even winding in outside has buffer spring. Support the diode body through the damping ring to ensure the stability of plastic envelope shell protection, make it when protecting simultaneously, have the effect of certain shock attenuation buffering, make the diode body be difficult for rocking, the safety in utilization is higher.

Preferably, four groups of telescopic sleeves are arranged in the plastic package shell, and the telescopic sleeves are respectively arranged at four corners in the plastic package shell.

Compared with the prior art, the utility model has the beneficial effects that: the high-power high-voltage transient suppression diode is convenient for protecting the pin of the high-voltage transient suppression diode, can strengthen the protection of the high-voltage transient suppression diode and prevents the high-voltage transient suppression diode from being impacted and damaged in use;

(1) the supporting blocks are arranged at the two ends of the diode body, the sliding grooves are formed in the side walls of the supporting blocks, and then the sliding blocks are matched with the sliding grooves, so that the sliding blocks slide in the sliding grooves, the metal heat conduction sleeves are connected to the outer portions of the pin bodies in a sleeved mode, the pin bodies are protected by the metal heat conduction sleeves in a reinforced mode when the diode is used, the situation that the pin bodies are all exposed outside and broken due to breakage is avoided, and materials can be effectively saved;

(2) the plastic package shell is sleeved outside the diode body, so that the protection of the diode body is enhanced, meanwhile, the shock absorption ring is abutted to the side wall of the diode body, the telescopic column is extruded to shrink, the buffer spring is compressed, a better buffer protection function is realized, the internal chip can be effectively prevented from being damaged when being impacted, so that the high-voltage transient diode is effectively protected, and the service life of the diode body is prolonged.

Drawings

In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below, and it is obvious that the drawings in the following description are some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to these drawings without creative efforts.

FIG. 1 is a schematic front view of the present invention;

FIG. 2 is a schematic structural view of a main cross section of the present invention;

FIG. 3 is a schematic side view of the present invention;

FIG. 4 is a schematic diagram of the structure at A in FIG. 2 according to the present invention;

fig. 5 is a schematic structural diagram at B in fig. 3 according to the present invention.

The reference numerals in the figures illustrate: 1. a diode body; 2. plastic packaging the shell; 3. a graphene heat sink; 4. a support block; 5. a lead body; 6. a protection mechanism; 601. a metal heat conductive sleeve; 602. a slider; 603. a chute; 604. positioning pins; 7. a thermally conductive silicone layer; 8. a buffer mechanism; 801. a telescopic sleeve; 802. a telescopic column; 803. a shock-absorbing ring; 804. a buffer spring.

Detailed Description

In order to make the objects, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are some, but not all, embodiments of the present invention. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without any inventive step, are within the scope of the present invention.

Referring to fig. 1-5, an embodiment of the present invention is shown: a high-power high-voltage transient suppression diode comprises a diode body 1, wherein pin bodies 5 are mounted at two ends of the diode body 1, a plastic package shell 2 is sleeved outside the diode body 1, and graphene radiating fins 3 are uniformly mounted on the outer side of the plastic package shell 2;

the sections of the graphene radiating fins 3 are rectangular, and the graphene radiating fins 3 are annularly distributed on the outer wall of the plastic package shell 2;

specifically, as shown in fig. 1, when in use, the plastic package housing 2 is provided with the plurality of graphene radiating fins 3, so that heat generated by the diode body 1 can be rapidly conducted out, the radiating effect is good, heat accumulation can be effectively prevented, and the service life of the diode body 1 is prolonged;

two ends of the diode body 1 are both provided with supporting blocks 4, and one side of each supporting block 4 is provided with a protection mechanism 6;

the protection mechanism 6 comprises a sliding groove 603, the sliding groove 603 is arranged inside the supporting block 4, a sliding block 602 is slidably mounted inside the sliding groove 603, a metal heat conduction sleeve 601 is mounted on one side of the sliding block 602, and a positioning pin 604 is in threaded connection with one side of the supporting block 4 outside the sliding groove 603;

the outer diameter of the slide block 602 is matched with the inner part of the slide groove 603, and the slide block 602 and the slide groove 603 form a sliding mechanism;

specifically, as shown in fig. 2 and 4, when in use, the sliding block 602 is matched with the sliding groove 603, so that the sliding block 602 slides in the sliding groove 603, and then the metal heat conduction sleeve 601 is sleeved outside the pin body 5 to protect the pin body 5, thereby avoiding the situation that the pin body 5 is completely exposed outside and damaged to cause fracture, and effectively saving materials;

a heat-conducting silicone grease layer 7 is arranged inside the plastic package shell 2, and buffer mechanisms 8 are uniformly arranged inside the plastic package shell 2;

the buffer mechanism 8 comprises a telescopic sleeve 801, the telescopic sleeve 801 is arranged inside the plastic package shell 2, telescopic columns 802 are arranged at one ends of the telescopic sleeve 801, a shock absorption ring 803 is arranged at one end of each telescopic column 802, and buffer springs 804 are uniformly wound outside the telescopic columns 802;

four groups of telescopic sleeves 801 are arranged inside the plastic package shell 2, and the telescopic sleeves 801 are respectively arranged at four corners inside the plastic package shell 2;

specifically, as shown in fig. 2 and 3, during the use, heat conduction silicone grease layer 7 is good in heat conduction effect, so that the heat can be rapidly led out to plastic package shell 2, the heat conduction effect is good, and simultaneously, by shrinking of telescopic column 802 in telescopic sleeve 801, extrusion buffer spring 804 shrinks, and a certain buffering effect is achieved, so that the protection to diode body 1 is strengthened, diode body 1 is prevented from shaking, and the stability of diode body 1 in use is improved.

The working principle is as follows: when the diode is used, firstly, the plastic package shell 2 is sleeved outside the diode body 1, meanwhile, the side wall of the diode body 1 is abutted to the damping ring 803, the telescopic column 802 is pushed to move towards the telescopic sleeve 801, meanwhile, the buffer spring 804 is extruded to shrink, then, a certain damping effect is achieved through the damping ring 803, meanwhile, the protection on the diode body 1 is enhanced through the plastic package shell 2, then, the heat conduction silicone layer 7 is arranged in the diode body 1, therefore, heat generated in the diode body 1 is quickly conducted to the plastic package shell 2, then, the heat is quickly conducted out through the radiating fins 3 of graphene, and meanwhile, the radiating efficiency can be improved due to the fact that the plurality of groups of radiating fins 3 of graphene are arranged;

secondly, the metal heat conduction sleeve 601 is sleeved on the pin body 5, then the sliding block 602 is slid into the sliding groove 603, the sliding block 602 slides in the sliding groove 603, then the pin body 5 is slidably mounted on the supporting block 4, then the positioning pin 604 is rotated to penetrate through the supporting block 4 to abut on the metal heat conduction sleeve 601, so as to ensure the mounting stability of the metal heat conduction sleeve 601, and then the protection of the pin body 5 is enhanced through the metal heat conduction sleeve 601 when in use.

In the description of the present invention, it should be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, e.g., as meaning either a fixed connection, a removable connection, or an integral connection; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meanings of the above terms in the present invention can be understood in a specific case to those of ordinary skill in the art.

The above-described embodiments of the apparatus are merely illustrative, and the units described as separate parts may or may not be physically separate, and parts displayed as units may or may not be physical units, may be located in one place, or may be distributed on a plurality of network units. Some or all of the modules may be selected according to actual needs to achieve the purpose of the solution of the present embodiment. One of ordinary skill in the art can understand and implement it without inventive effort.

Finally, it should be noted that: the above examples are only intended to illustrate the technical solution of the present invention, but not to limit it; although the present invention has been described in detail with reference to the foregoing embodiments, it should be understood by those of ordinary skill in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some technical features may be equivalently replaced; and such modifications or substitutions do not depart from the spirit and scope of the corresponding technical solutions of the embodiments of the present invention.

Claims

1. A high-power high-voltage transient suppression diode comprises a diode body (1), and is characterized in that: the lead bodies (5) are installed at two ends of the diode body (1), the plastic package shell (2) is sleeved on the outer portion of the diode body (1), radiating fins (3) of graphene are evenly installed on the outer side of the plastic package shell (2), supporting blocks (4) are installed at two ends of the diode body (1), a protection mechanism (6) is arranged on one side of each supporting block (4), a heat conduction silicone grease layer (7) is arranged inside the plastic package shell (2), and a buffer mechanism (8) is evenly arranged inside the plastic package shell (2).

2. A high power high voltage transient suppression diode as recited by claim 1, wherein: the cross section of each graphene radiating fin (3) is rectangular, and the graphene radiating fins (3) are annularly distributed on the outer wall of the plastic package shell (2).

3. A high power high voltage transient suppression diode as recited in claim 1, wherein: protection machanism (6) include spout (603), and spout (603) set up in the inside of supporting shoe (4), the inside slidable mounting of spout (603) has slider (602), and one side of slider (602) installs metal heat conduction cover (601), one side threaded connection of supporting shoe (4) of spout (603) outside has locating pin (604).

4. A high power high voltage transient suppression diode as recited in claim 3, wherein: the outer diameter of the sliding block (602) is matched with the inner part of the sliding groove (603), and the sliding block (602) and the sliding groove (603) form a sliding mechanism.

5. A high power high voltage transient suppression diode as recited in claim 1, wherein: buffer gear (8) are including telescopic sleeve (801), and telescopic sleeve (801) set up in the inside of plastic envelope shell (2), telescopic column (802) are all installed to the one end of telescopic sleeve (801), and shock ring (803) are installed to the one end of telescopic column (802), buffer spring (804) have evenly been twined in the outside of telescopic column (802).

6. The high power high voltage transient suppression diode of claim 5, wherein: the four groups of telescopic sleeves (801) are arranged in the plastic package shell (2), and the telescopic sleeves (801) are arranged at four corners in the plastic package shell (2) respectively.