CN216596159U

CN216596159U - Cooling device of treater

Info

Publication number: CN216596159U
Application number: CN202123163506.9U
Authority: CN
Inventors: 郭明皓; 王嘉丰
Original assignee: Xian University of Posts and Telecommunications
Current assignee: Xian University of Posts and Telecommunications
Priority date: 2021-12-16
Filing date: 2021-12-16
Publication date: 2022-05-24
Anticipated expiration: 2031-12-16

Abstract

The utility model discloses a cooling device of a processor, which comprises a processor body, and the cooling device of the processor also comprises: the heat conduction mechanism is arranged on the surface of the processor body and used for conducting working heat of the processor, the heat conduction mechanism comprises a heat conduction plate which is in contact with the surface of the processor body, a copper pipe frame penetrates through the interior of the heat conduction plate, and a pipeline on one side of the copper pipe frame is connected with a circulating liquid pump; and the heat dissipation mechanism is arranged on one side of the heat conduction mechanism, which is far away from the processor body, and is used for quickly dissipating heat conducted by the heat conduction mechanism. The cooling device for the processor designed by the utility model effectively ensures the high-efficiency work of the processor and maintains the working low-temperature environment of the processor by utilizing the combined use mode of liquid heat conduction and wind power quick heat dissipation, and has a utilizable value in the technical field of processor cooling.

Description

Cooling device of treater

Technical Field

The utility model relates to the technical field of processor cooling, in particular to a cooling device of a processor.

Background

The existing processor heat dissipation device is insufficient in heat dissipation capacity, adopts a metal heat conduction mode to dissipate heat, and has the problem that the temperature of the working environment of the processor is gradually increased, so that the working efficiency of the processor is influenced.

SUMMERY OF THE UTILITY MODEL

In order to solve the problems of the background art, an object of the present invention is to provide a cooling device for a processor, which has the advantages of fast heat dissipation and low temperature environment maintenance of the processor, and solves the problem of insufficient heat dissipation of the processor.

In order to achieve the purpose, the utility model provides the following technical scheme: including the treater body, the cooling device of treater still includes:

the heat conduction mechanism is arranged on the surface of the processor body and used for conducting working heat of the processor, the heat conduction mechanism comprises a heat conduction plate which is in contact with the surface of the processor body, a copper pipe frame penetrates through the interior of the heat conduction plate, and a pipeline on one side of the copper pipe frame is connected with a circulating liquid pump; and

the heat dissipation mechanism is arranged on one side, far away from the processor body, of the heat conduction mechanism and used for rapidly dissipating heat conducted by the heat conduction mechanism, the heat dissipation mechanism comprises a heat dissipation cylinder connected with the other side of the copper pipe support through a pipeline, the heat dissipation cylinder is provided with a liquid flowing unit and used for separating and dredging liquid, and an air flowing unit is arranged inside the heat dissipation cylinder and used for rapidly replacing air inside the heat dissipation cylinder.

Preferably, the cooling device of the processor further includes:

and the device mounting mechanism is arranged at the connecting position of the heat conduction mechanism and the processor body and is used for mounting and fixing the processor body and the device.

Preferably, the device mounting mechanism comprises insertion seats symmetrically and fixedly arranged on the same side face of the processor body, clamping and snapping seats are rotatably arranged in the insertion seats on two sides, a torsion spring is arranged at the rotating center of each clamping and snapping seat, an embedding head is arranged at one end of each clamping and snapping seat and embedded in the insertion frame, the centers of the insertion frames on two sides are fixedly connected with the heat conducting mechanism, supporting frames are symmetrically and fixedly arranged on one side of the insertion frame, which is far away from the processor body, and the heat radiating mechanism is fixedly connected between the supporting frames on two sides.

Preferably, the liquid flow unit comprises a plurality of liquid separation channels arranged inside the wall of the radiating cylinder, liquid passing channels are arranged inside two sides of the radiating cylinder, the liquid separation channels are communicated with the liquid passing channels on two sides, the liquid passing channel on one side is connected with the circulating liquid pump, and the liquid passing channel on the other side is connected with the copper pipe frame.

Preferably, the air flow unit comprises a driving part fixedly arranged in the heat dissipation cylinder, the driving part is a double-output shaft type motor, and the output ends at two sides of the driving part are respectively provided with a heat dissipation fan blade.

Compared with the prior art, the utility model has the following beneficial effects:

1. according to the utility model, the heat conducting mechanism is arranged, the heat of the processor is quickly transferred out by utilizing the quick heat conducting capability of the heat conducting plate, and the heat is conducted by the liquid in the copper pipe, so that the low-temperature operation of the processor can be kept, and the problem that the temperature of the metal heat conducting processor is gradually increased is avoided.

2. By arranging the heat dissipation mechanism, the utility model can effectively increase the heat dissipation area of the liquid, promote the heat dissipation of the liquid, ensure the cooling efficiency and keep the temperature of the liquid heat conduction mechanism lower all the time.

3. By arranging the device mounting mechanism, the device can be quickly dismounted and mounted, the device is conveniently subjected to dust removal treatment, and the high efficiency of the device is ensured.

Drawings

FIG. 1 is a schematic structural view of the present invention;

FIG. 2 is a schematic diagram of the right view structure of the present invention;

FIG. 3 is a schematic view of the structure of the copper pipe frame of the present invention;

FIG. 4 is a schematic cross-sectional view of a heat-dissipating cylinder in the present invention.

In the figure: 1. a copper pipe frame; 2. a processor body; 3. a circulating liquid pump; 4. a heat conducting plate; 5. a plug-in mounting seat; 6. clamping the breaking-off seat; 7. a plug-in frame; 8. a support frame; 9. a liquid separation channel; 10. a heat-dissipating cylinder; 11. a drive member; 12. a heat dissipation fan blade; 13. and (4) passing through the liquid channel.

Detailed Description

The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.

As shown in fig. 1 to 4, the cooling device includes a processor body 2, and further includes:

the heat conduction mechanism is arranged on the surface of the processor body 2 and used for conducting working heat of the processor, the heat conduction mechanism comprises a heat conduction plate 4 which is arranged on the surface of the processor body 2 in a contact manner, a copper pipe frame 1 penetrates through the interior of the heat conduction plate 4, and a pipeline on one side of the copper pipe frame 1 is connected with a circulating liquid pump 3; and

the heat dissipation mechanism is arranged on one side, far away from the processor body 2, of the heat conduction mechanism and used for rapidly dissipating heat conducted by the heat conduction mechanism, the heat dissipation mechanism comprises a heat dissipation cylinder 10 which is connected with the other side of the copper pipe support 1 through a pipeline, the heat dissipation cylinder 10 is provided with a liquid flowing unit and used for separating and dredging liquid, and an air flowing unit is arranged inside the heat dissipation cylinder 10 and used for rapidly replacing air inside the heat dissipation cylinder 10.

As a technical optimization scheme of the utility model, the heat conducting mechanism is arranged, the heat of the processor is quickly transferred out by utilizing the quick heat conducting capability of the heat conducting plate 4, the heat conduction is carried out by the liquid in the copper pipe, the low-temperature operation of the processor can be kept, the problem that the temperature of the metal heat conducting processor is gradually increased is avoided, the heat radiating area of the liquid can be effectively increased by arranging the heat radiating mechanism, the heat dissipation of the liquid is promoted, the cooling efficiency is ensured, and the temperature of the heat conducting mechanism for the liquid is always kept lower.

Referring to fig. 1, the cooling apparatus of the processor further includes:

and the device mounting mechanism is arranged at the connecting position of the heat conduction mechanism and the processor body 2 and is used for mounting and fixing the processor body 2 and the device.

Referring to fig. 1-2, the device mounting mechanism includes a cartridge holder 5 symmetrically and fixedly disposed on the same side of the processor body 2, the cartridge holder 5 is rotatably disposed on the two sides and internally provided with a clamping and snapping seat 6, a torsion spring is disposed at the rotation center of the clamping and snapping seat 6, an embedding head is disposed at one end of the clamping and snapping seat 6 and embedded in a cartridge holder 7, the cartridge holder 7 is fixedly connected with a heat conducting mechanism at the center, one side of the cartridge holder 7 away from the processor body 2 is symmetrically and fixedly provided with brackets 8, and a heat dissipating mechanism is fixedly connected between the brackets 8 at the two sides.

As a technical optimization scheme of the utility model, the device installation mechanism is arranged, so that the device can be quickly disassembled and assembled, the dust removal treatment of the device is convenient, and the high efficiency of the device is ensured.

Referring to fig. 1 and 4, the liquid flow unit includes a plurality of liquid separating channels 9 arranged inside the wall of the heat dissipating cylinder 10, liquid passing channels 13 are arranged inside two sides of the heat dissipating cylinder 10, the liquid passing channels 13 on two sides are connected through the liquid separating channels 9, one side of the liquid passing channels 13 is connected with the circulating liquid pump 3 through a pipeline, and the other side of the liquid passing channels 13 is connected with the copper pipe frame 1 through a pipeline.

As a technical optimization scheme of the utility model, the heat dissipation efficiency is effectively increased by arranging the liquid flow unit.

Referring to fig. 1, the air flowing unit includes a driving member 11 fixedly disposed inside a heat dissipating cylinder 10, the driving member 11 is a dual output shaft type motor, and the output ends of both sides of the driving member 11 are respectively provided with a heat dissipating fan blade 12.

The air flow unit is arranged to increase the air circulation speed.

The working principle and the using process of the utility model are as follows: when using this device to be used for the cooling of treater, at first, it is fixed with the device installation through cartridge 5, then open circulating liquid pump 3 and driving piece 11, circulating liquid pump 3 can drive liquid and circulate in copper pipe support 1 to radiating cylinder 10 is inside, liquid is when copper pipe support 1, heat conduction through heat-conducting plate 4 transmits the heat of treater to the inside liquid of copper pipe support 1, liquid impels radiating cylinder 10 through circulating liquid pump 3's effect, separate through dividing liquid channel 9, then under the air flow effect that driving piece 11 drove radiating fan blade 12 and arouse, divide the inside liquid heat of liquid channel 9 to take out through the air flow, with this circulation, when needs dismounting device, break the clamp and break seat 6 off with the fingers and thumb, can take out the device, thereby the use of cost device is accomplished.

It is noted that, herein, relational terms such as first and second, and the like may be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus.

Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the utility model, the scope of which is defined in the appended claims and their equivalents.

Claims

1. A cooling device of a disposer, comprising a disposer body (2), characterized in that: the cooling apparatus of the processor further includes:

the heat conduction mechanism is arranged on the surface of the processor body (2) and used for conducting working heat of the processor, the heat conduction mechanism comprises a heat conduction plate (4) which is in contact with the surface of the processor body (2), a copper pipe frame (1) penetrates through the heat conduction plate (4), and a pipeline on one side of the copper pipe frame (1) is connected with a circulating liquid pump (3); and

the heat dissipation mechanism is arranged on one side, far away from the processor body (2), of the heat conduction mechanism and used for rapidly dissipating heat conducted by the heat conduction mechanism, the heat dissipation mechanism comprises a heat dissipation cylinder (10) which is connected with the other side of the copper pipe support (1) through a pipeline, the heat dissipation cylinder (10) is provided with a liquid flowing unit and used for separating and dredging liquid, and an air flowing unit is arranged inside the heat dissipation cylinder (10) and used for rapidly replacing air inside the heat dissipation cylinder (10).

2. A cooling apparatus for a processor according to claim 1, wherein: the cooling apparatus of the processor further includes:

and the device mounting mechanism is arranged at the connecting position of the heat conduction mechanism and the processor body (2) and is used for mounting and fixing the processor body (2) and the device.

3. A cooling apparatus for a processor according to claim 2, wherein: device installation mechanism includes that the symmetry is fixed establishes cartridge seat (5), both sides on the same side of treater body (2) cartridge seat (5) inside is rotated and is equipped with the clamp and breaks seat (6) off with the fingers and thumb, and the clamp is tight to break seat (6) rotation center off with the fingers and thumb and is equipped with the torsional spring, presss from both sides the clamp and breaks seat (6) one end off with the fingers and thumb and is equipped with the scarf and inlay and establish in inserting frame (7), both sides inserting frame (7) central fixed connection heat conduction mechanism, inserting frame (7) one side symmetry of keeping away from treater body (2) is fixed and is equipped with strut (8), fixed connection heat dissipation mechanism between both sides strut (8).

4. A cooling apparatus for a processor according to claim 1, wherein: the liquid flow unit comprises a plurality of liquid separating channels (9) arranged inside the wall of the radiating cylinder (10), liquid passing channels are arranged inside two sides of the radiating cylinder (10), the liquid passing channels are communicated with the two sides of the liquid separating channels (9), one side of the liquid passing channels are connected with the circulating liquid pump (3) through a pipeline, and the other side of the liquid passing channels are connected with the copper pipe frame (1) through a pipeline.

5. The cooling apparatus for a processor according to claim 1 or 4, wherein: the air flow unit comprises a driving part (11) fixedly arranged in the heat dissipation cylinder (10), the driving part (11) is a double-output shaft type motor, and heat dissipation fan blades (12) are arranged at output ends of two sides of the driving part (11).