CN216566085U - Heat radiation structure of liquid cooling composite heat pipe - Google Patents
Heat radiation structure of liquid cooling composite heat pipe Download PDFInfo
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- CN216566085U CN216566085U CN202123155979.4U CN202123155979U CN216566085U CN 216566085 U CN216566085 U CN 216566085U CN 202123155979 U CN202123155979 U CN 202123155979U CN 216566085 U CN216566085 U CN 216566085U
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Abstract
The utility model relates to the technical field of board card heat dissipation, in particular to a heat dissipation structure of a liquid cooling composite heat pipe, which is used for dissipating heat of a board card in a server. This application has designed the heat-conducting piece, the heat-conducting piece corresponds the setting with the integrated circuit board in the server, the integrated circuit board passes through the heat-conducting piece at the heat of use release and transmits to the heat pipe fast, rethread hot tube transmits the heat for the radiating piece, then some heat passes through the diffusion of radiating piece in the air, another part heat is taken away the heat through the cold medium matter that flows through in the radiating piece, realize the quick heat transfer and the quick heat dissipation of integrated circuit board, can solve electronic components's on the integrated circuit board heat dissipation problem effectively.
Description
Technical Field
The utility model relates to the technical field of board card heat dissipation, in particular to a heat dissipation structure of a liquid cooling composite heat pipe.
Background
The board card is a printed circuit board, called PCB for short, and has a plug core during manufacturing, and can be inserted into a slot of a main circuit board (motherboard) of a computer to control the operation of hardware, such as a display, a collection card, and other devices, and after a driver is installed, the corresponding hardware function can be realized.
With the rapid development of electronic technology, the total power density of electronic components is greatly increased, more and more heat is released when the board card runs, the performance of the electronic components is affected by a high-temperature environment, and the heat dissipation problem of the electronic components on the board card cannot be effectively solved by the heat dissipation device for the board card in the prior art.
SUMMERY OF THE UTILITY MODEL
The utility model aims to provide a heat dissipation structure of a liquid cooling composite heat pipe, which can effectively solve the heat dissipation problem of electronic components on a board card.
The technical scheme of the utility model is realized as follows:
the heat dissipation structure of the liquid cooling composite heat pipe is used for dissipating heat of a board card in a server and comprises a heat dissipation part, a heat pipe and a heat conduction part, wherein the heat dissipation part is connected with one side of the heat conduction part through the heat pipe, and the other side of the heat conduction part corresponds to the board card.
The hot piece can be connected through the air is indirect with the integrated circuit board, and the integrated circuit board releases heat and transmits to the air on every side again promptly for leading the heat piece, perhaps leads heat piece and integrated circuit board direct contact and is connected, direct transmission is for leading the heat piece when the integrated circuit board releases the heat promptly, and preferred mode of setting is: with heat conduction spare and integrated circuit board direct contact and be connected, heat conduction efficiency is higher, faster like this, and the integrated circuit board is when the release heat, gives the heat conduction spare with the heat transfer of release, and on heat conduction spare sees through the heat pipe and transmits the heat to the radiating part rapidly, the rethread radiating part realized the heat dissipation.
Further, the heat dissipation member comprises a base plate and a cover plate, the base plate is connected with the cover plate in a bonding, bolting, nailing, welding, riveting or pin shaft connection mode, and a heat conduction groove is formed between the base plate and the cover plate.
The heat-conducting groove is convenient to process by splitting the heat-radiating piece into the base plate and the cover plate, the heat-conducting groove is arranged between the base plate and the cover plate and serves as a heat-conducting flow channel, the heat-conducting groove can be arranged on the base plate or on the cover plate or can be arranged on the base plate and the cover plate together, and the base plate and the cover plate are connected in a bonding mode, a bolt connection mode, a welding mode, a nail connection mode, a riveting mode or a pin connection mode, so that the base plate and the cover plate are connected in an intimate mode, the tightness of the heat-conducting groove is ensured, and the leakage of the cold medium in the transmission process is avoided.
Furthermore, a refrigerant pipeline is correspondingly arranged in the heat conduction groove.
The refrigerant pipeline replaces the heat conduction groove to be used as a conveying pipeline of refrigerant medium, and the refrigerant pipeline has sealing performance, so that after the refrigerant pipeline is installed, the relative requirement on air tightness between the base plate and the cover plate can be lowered a little, and in addition, two connecting pipes arranged on the heat dissipation part are respectively connected with two ends of the refrigerant pipeline.
Further, the number of the heat pipes is at least one.
The quantity of heat pipe is set for according to actual conditions, sets for the area size of heat-conducting piece according to the area of main chip region on the integrated circuit board, and preferred messenger's heat-conducting piece corresponds the setting with main chip region, and the heat pipe also can correspond the setting with heat-conducting piece, and it should be noted that, the position that corresponds heat pipe and heat-conducting piece on the heat conduction groove should set up to snakelike runner for the route that the extension refrigerant medium flowed through takes away the heat fully, realizes the heat dissipation better.
Furthermore, the position of the heat conducting groove corresponding to the heat conducting piece is provided with a snake-shaped flow channel.
The serpentine flow channel is used for prolonging the flowing route of the refrigerant medium, fully takes away heat and better realizes heat dissipation.
Furthermore, a plurality of mounting grooves are formed in the substrate, and the heat pipes are correspondingly mounted in the mounting grooves.
The number of the mounting grooves is the same as that of the heat pipes, and one heat pipe is mounted in each mounting groove.
Furthermore, the heat pipe is connected with the mounting groove and the heat pipe is connected with the heat conducting piece in a welding or bonding mode.
Furthermore, the heat dissipation piece is a heat dissipation pipeline, and the position of the heat dissipation pipeline corresponding to the heat conducting piece is provided with a snake-shaped pipeline so as to prolong the route through which the refrigerant medium flows, fully take away heat and better realize heat dissipation.
Furthermore, the heat dissipation piece is provided with an auxiliary heat conduction block, and the auxiliary heat conduction block is arranged corresponding to the board card.
When the heat conducting piece is arranged corresponding to the main chip area on the board card, the auxiliary heat conducting block can be arranged corresponding to the non-main chip area on the board card, so that the heat released by the non-main chip area can be transferred to the heat radiating piece through the auxiliary heat conducting block, and then the heat is taken away through the heat radiating piece and the heat conducting groove, so that the main chip area and the non-main chip area on the board card can realize quick heat radiation, and the heat radiation problem of the board card is effectively solved, and it is also noted that the auxiliary heat conducting block can be arranged at one side of the substrate or at one side of the cover plate, preferably the auxiliary heat conducting block is arranged at the same side of the heat pipe, namely the auxiliary heat conducting block is arranged at one side of the substrate, because the heat conducting piece is arranged at one side of the heat pipe, so that the heat conducting piece and the auxiliary heat conducting block are at the same side, the installation is convenient when the heat conducting piece is connected, and the auxiliary heat conducting block and the board card are preferably designed into an integrated structure, the integrated processing is convenient, and the processing procedures are reduced.
Further, still include the pump body, the pump body with the heat dissipation piece is connected, the pump body is used for giving the heat dissipation piece supplies refrigerant medium.
Furthermore, the heat conducting piece is of a plate-shaped structure and is arranged corresponding to the main chip area of the board card, and the heat conducting piece mainly conducts away heat in the main chip area on the board card.
Further, the heat conducting member is made of copper, gold, silver, aluminum alloy or aluminum.
The material of heat-conducting piece is in the aspect of selecting for use, can select the material that the heat conductivility is good, for example copper, gold, silver, aluminum alloy or aluminium, because the cost ratio of gold, silver is higher to and the heat conductivility of aluminum alloy is lower, and the material of preferred heat-conducting piece is copper or aluminium, designs the heat-conducting piece for copper piece or aluminium piece.
Compared with the prior art, the utility model has the beneficial effects that:
this application has designed the heat-conducting piece, the heat-conducting piece corresponds the setting with the integrated circuit board in the server, the integrated circuit board passes through the heat-conducting piece at the heat of use release and transmits to the heat pipe fast, rethread hot tube transmits the heat for the radiating piece, then some heat passes through the diffusion of radiating piece in the air, another part heat is taken away the heat through the cold medium matter that flows through in the radiating piece, realize the quick heat transfer and the quick heat dissipation of integrated circuit board, can solve electronic components's on the integrated circuit board heat dissipation problem effectively.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings needed to be used in the embodiments will be briefly described below, it should be understood that the following drawings only illustrate some embodiments of the present invention and therefore should not be considered as limiting the scope, and for those skilled in the art, other related drawings can be obtained according to the drawings without inventive efforts.
FIG. 1 is an overall structural view of embodiment 1 of the present invention;
FIG. 2 is a view of the structure of FIG. 1 from another perspective;
FIG. 3 is an exploded view of FIG. 1;
fig. 4 is a sectional view of a heat conduction groove in embodiment 1 of the present invention.
In the figure:
1-a substrate; 2-cover plate; 3-heat conducting groove; 4-a heat pipe; 5-a heat conducting member; 6-mounting grooves; 7-heat conducting block; 8-connecting pipe; 9-connecting structure.
Detailed Description
In order to make the objects, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are some, but not all, embodiments of the present invention. The components of embodiments of the present invention generally described and illustrated in the figures herein may be arranged and designed in a wide variety of different configurations.
Thus, the following detailed description of the embodiments of the present invention, presented in the figures, is not intended to limit the scope of the utility model, as claimed, but is merely representative of selected embodiments of the utility model. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
It should be noted that: like reference numbers and letters refer to like items in the following figures, and thus, once an item is defined in one figure, it need not be further defined and explained in subsequent figures.
In the description of the present invention, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings or orientations or positional relationships that the products of the present invention are conventionally placed in use, and are only for convenience of describing the present invention and simplifying the description, but do not indicate or imply that the device or element to which the description refers must have a specific orientation, be constructed in a specific orientation, and be operated, and thus should not be construed as limiting the present invention. Furthermore, the terms "first," "second," "third," and the like are used solely to distinguish one from another and are not to be construed as indicating or implying relative importance.
Furthermore, the terms "horizontal", "vertical", "overhang" and the like do not imply that the components are required to be absolutely horizontal or overhang, but may be slightly inclined. For example, "horizontal" merely means that the direction is more horizontal than "vertical" and does not mean that the structure must be perfectly horizontal, but may be slightly inclined.
In the description of the present invention, it should also be noted that, unless otherwise explicitly specified or limited, the terms "disposed," "mounted," "connected," and "connected" are to be construed broadly and may, for example, be fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meanings of the above terms in the present invention can be understood in specific cases to those skilled in the art.
Some embodiments of the utility model are described in detail below with reference to the accompanying drawings. The embodiments described below and the features of the embodiments can be combined with each other without conflict.
Example 1
As shown in fig. 1-3, fig. 1 is an overall structure diagram of the present embodiment, fig. 2 is another view-angle structure diagram of fig. 1, fig. 3 is an exploded view of fig. 1, the present embodiment provides a heat dissipation structure of a liquid-cooled composite heat pipe, which is used for dissipating heat of a board in a server, the heat dissipation structure includes a heat dissipation member, a heat pipe 4 and a heat conduction member 5, the heat dissipation member includes a base plate 1 and a cover plate 2, the heat dissipation member is separated into the base plate 1 and the cover plate 2, and is designed to facilitate processing of a heat conduction groove 3, then the heat conduction groove 3 is opened between the base plate 1 and the cover plate 2, the heat conduction groove 3 is used as a heat conduction flow channel, the heat conduction groove 3 may be disposed on the base plate 1, or on the cover plate 2, or may be disposed on both the base plate 1 and the cover plate 2, the heat dissipation member is connected to one side of the heat conduction member 5 through the heat pipe 4, and the other side of the heat conduction member 5 is disposed corresponding to the board in the server, heat-conducting member 5 and integrated circuit board can be connected through the air is indirect, and the integrated circuit board releases heat and transmits to the air on every side again for heat-conducting member 5 promptly, perhaps heat-conducting member 5 and integrated circuit board direct contact and be connected, direct transmission is for heat-conducting member 5 when the integrated circuit board releases the heat promptly, and preferred mode of setting is: the heat conducting piece 5 is directly contacted and connected with the board card, so that the heat conducting efficiency is higher and faster.
The integrated circuit board is provided with a plurality of electronic components which release heat during working, the integrated circuit board is divided into a main chip area and a non-main chip area according to the degree of heat release of the electronic components, the main chip area is a main heat release area on the integrated circuit board, the non-main chip area is an area where the integrated circuit board needs to release heat last time, and the heat conducting piece 5 is mainly connected with the main chip area on the integrated circuit board when being arranged (of course, the heat conducting piece 5 can be connected with the main chip area and can also be connected with the non-main chip area together when being connected with the main chip area).
It is worth noting that when the heat conduction groove 3 is manufactured, the base plate 1 and the cover plate 2 can be welded together through brazing, friction stir welding, electron beam welding or pressure diffusion welding processes, the sealing performance of the heat conduction groove 3 is guaranteed, and the leakage condition in the cold medium transmission process is avoided.
The heat conduction groove 3 is used as a heat conduction flow channel, two end parts of the heat conduction groove extend to the outside of the heat dissipation part, connecting pipes 8 are arranged at two end parts of the heat conduction groove 3, one of the two connecting pipes 8 is used as an inlet pipe of the heat conduction groove 3, the other one is used as an outlet pipe of the heat conduction groove 3, the two connecting pipes 8 are respectively communicated with an inlet end and an outlet end of a pump body, the pump body is used for injecting a refrigerant medium into the heat conduction groove 3 (the refrigerant medium can be refrigerant gas or refrigerant liquid), the heat conduction groove 3 and the pump body form a closed loop to be beneficial to recycling of the refrigerant medium, in addition, referring to figure 2, a connecting structure 9 is arranged at the back part of the cover plate 2, the connecting structure 9 is designed according to the internal structure of the server and can adapt to the internal space of the server, two pipelines are arranged inside the connecting structure 9, and the two pipelines are respectively communicated with the two connecting pipes 8 at two ends of the heat conduction groove 3, both connecting pipes 8 are in threaded connection with a connecting structure 9.
The number of the heat pipes 4 is set to be at least one, the number of the heat pipes is set according to actual conditions, the area size of the heat conducting piece 5 is set according to the area of the main chip area, preferably, the heat conducting piece 5 and the main chip area are correspondingly arranged, and the heat pipes 4 and the heat conducting piece 5 can also be correspondingly arranged, it needs to be noted that the positions, corresponding to the heat pipes 4 and the heat conducting piece 5, on the heat conducting groove 3 are set to be serpentine flow channels for prolonging the route through which the refrigerant medium flows, sufficiently taking away heat, and better realizing heat dissipation, as shown in fig. 4.
In addition, a plurality of mounting grooves 6 are formed in the heat sink, preferably, the number of the mounting grooves 6 is the same as that of the heat pipes 4, the mounting grooves 6 are arranged corresponding to the heat pipes 4, the heat pipes 4 are correspondingly arranged in the mounting grooves 6, the mounting grooves 6 can be arranged on one side of the base plate 1 or one side of the cover plate 2, the mounting grooves 6 are preferably arranged on one side of the base plate 1, the mounting grooves 6 are arranged, and the advantage of saving the occupied space is that the space in the server is limited, so that the occupied space is saved.
Then, set up supplementary heat conduction piece 7 on the radiating piece, when heat conduction piece 5 corresponds the setting with the main chip region on the integrated circuit board, supplementary heat conduction piece 7 can correspond the setting with the non-main chip region on the integrated circuit board, the heat that the non-main chip region released can pass through supplementary heat conduction piece 7 and transmit for the radiating piece like this, rethread radiating piece and heat conduction groove 3 take away the heat, like this, the quick heat dissipation can both be realized to main chip region and non-main chip region on the integrated circuit board, solve the integrated circuit board heat dissipation problem effectively.
It should also be noted that the auxiliary heat conducting block 7 is designed to be a rectangular plate-shaped structure, the auxiliary heat conducting block 7 can be disposed on one side of the substrate 1, and can also be disposed on one side of the cover plate 2, preferably, the auxiliary heat conducting block 7 is disposed on the same side as the heat pipe 4, that is, the auxiliary heat conducting block 7 is disposed on one side of the substrate 1, because the heat conducting member 5 is disposed on one side of the heat pipe 4, so that the heat conducting member 5 and the auxiliary heat conducting block 7 are the same side, and it is convenient to install when the board is connected, and preferably, the auxiliary heat conducting block 7 and the substrate 1 are designed to be an integrated structure, so as to facilitate the integrated processing and reduce the processing procedures, and it should also be noted that the mounting groove 6 is disposed at the middle position of one side of the substrate 1, and the auxiliary heat conducting blocks 7 are disposed on both sides of the mounting groove 6, as shown in fig. 2.
The material of heat-conducting piece 5 is chooseed for use, can select the material that the heat conductivility is good, for example copper, gold, silver, aluminum alloy or aluminium, because the cost ratio of gold, silver is higher to and the heat conductivility of aluminum alloy is lower, and the material of preferred heat-conducting piece 5 is copper or aluminium, with heat-conducting piece 5 design for plate structure's copper billet or aluminium billet, be convenient for be connected with the integrated circuit board better.
Finally, it should be noted that the heat pipe 4 and the mounting groove 6, and the heat pipe 4 and the heat conducting member 5 can be connected by welding or bonding, and the heat radiating member and the board can be connected by bonding, bolting, nailing, riveting or pin connecting when actually mounted.
Example 2
The embodiment provides another scheme, and provides a heat dissipation structure of a liquid-cooling composite heat pipe, which is used for dissipating heat of a board card in a server, and the heat dissipation structure includes a heat dissipation member, a heat pipe 4 and a heat conduction member 5, the heat dissipation member includes a base plate 1 and a cover plate 2, the heat dissipation member is split into the base plate 1 and the cover plate 2, the base plate 1 and the cover plate 2 are designed to facilitate processing of a heat conduction groove 3, then the heat conduction groove 3 is formed between the base plate 1 and the cover plate 2, a refrigerant pipeline is correspondingly arranged in the heat conduction groove 3, the refrigerant pipeline is used as a heat conduction flow channel, the heat conduction groove 3 can be arranged on the base plate 1, or can be arranged on the cover plate 2, or can be arranged on both the base plate 1 and the cover plate 2, during actual installation, the refrigerant pipeline is correspondingly arranged in the heat conduction groove 3, the heat dissipation member is connected with one side of the heat conduction member 5 through the heat pipe 4, the other side of the heat conduction member 5 is arranged correspondingly to the board card in the server, heat-conducting member 5 and integrated circuit board can be connected through the air is indirect, and the integrated circuit board releases heat and transmits to the air on every side again for heat-conducting member 5 promptly, perhaps heat-conducting member 5 and integrated circuit board direct contact and be connected, direct transmission is for heat-conducting member 5 when the integrated circuit board releases the heat promptly, and preferred mode of setting is: the heat conducting piece 5 is directly contacted and connected with the board card, so that the heat conducting efficiency is higher and faster.
It releases heat when the board card is in operation to have many electronic components on the board card, divide into main chip area and non-main chip area on the board card according to electronic components's release heat's degree, main chip area is the main exothermic region on the board card, non-main chip area is the area that the board card will release heat last time, heat-conducting member 5 is mainly connected with the main chip area on the board card when setting up (of course, heat-conducting member 5 is when being connected with main chip area, also can realize jointly connecting with non-main chip area), it is worth noting that, heat-conducting groove 3 is when making, can be through brazing, friction stir welding, electron beam welding or pressure diffusion welding technology with base plate 1 and apron 2 welding together, guarantee heat-conducting groove 3's leakproofness, avoid cold medium transmission process to take place the condition of revealing.
The refrigerant pipeline is used as a heat conduction flow channel, two end parts of the refrigerant pipeline extend to the outside of the heat dissipation part, the two end parts of the refrigerant pipeline are respectively provided with a connecting pipe 8, one of the two connecting pipes 8 is used as an inlet pipe of the refrigerant pipeline, the other one is used as an outlet pipe of the refrigerant pipeline, the two connecting pipes 8 are respectively communicated with an inlet end and an outlet end of the pump body, the pump body is used for injecting refrigerant media into the refrigerant pipeline (the refrigerant media can be refrigerant gas or refrigerant liquid), the refrigerant pipeline and the pump body form a closed loop to facilitate the recycling of the refrigerant media, in addition, the number of the heat pipes 4 is set to be at least one, the number is set according to the actual situation, the area size of the heat conduction part 5 is set according to the area of the main chip area, the heat conduction part 5 is preferably arranged corresponding to the main chip area, and the heat pipes 4 and the heat conduction part 5 can also be correspondingly arranged, it should be noted that, the positions corresponding to the heat pipe 4 and the heat conducting element 5 on the refrigerant pipeline should be set to be serpentine flow channels, so as to extend the route through which the refrigerant medium flows, and take away the heat sufficiently, and achieve heat dissipation better, as shown in fig. 4, in addition, the heat dissipating element is provided with a plurality of mounting grooves 6, preferably, the number of the mounting grooves 6 is the same as that of the heat pipes 4, the mounting grooves 6 and the heat pipes 4 are correspondingly arranged, the heat pipes 4 are correspondingly mounted in the mounting grooves 6, the mounting grooves 6 can be arranged at one side of the substrate 1, and also can be arranged at one side of the cover plate 2, here, the mounting grooves 6 are preferably arranged at one side of the substrate 1, and the advantage of arranging the mounting grooves 6 is that the occupied space is saved, and since the space in the server is limited, it is very meaningful to save the occupied space. Then, set up supplementary heat conduction piece 7 on the radiating piece, when heat conduction piece 5 corresponds the setting with the main chip region on the integrated circuit board, supplementary heat conduction piece 7 can correspond the setting with the non-main chip region on the integrated circuit board, the heat that the non-main chip region released can pass through supplementary heat conduction piece 7 and transmit for the radiating piece like this, the rethread radiating piece takes away the heat with the refrigerant pipeline, like this, main chip region and non-main chip region can both realize quick heat dissipation on the integrated circuit board, solve the integrated circuit board heat dissipation problem effectively.
It should also be noted that supplementary heat conduction piece 7 can set up the one side that is located base plate 1, also can set up the one side that is located apron 2, it is preferred to set up supplementary heat conduction piece 7 in the homonymy that is provided with heat pipe 4, be about to supplementary heat conduction piece 7 sets up the one side on base plate 1, because heat conduction piece 5 is located the one side that is provided with heat pipe 4, heat conduction piece 5 is promptly same one side with supplementary heat conduction piece 7 like this, be convenient for install when lieing in the integrated circuit board is connected, and preferably will assist heat conduction piece 7 and base plate 1 design an organic whole structure, be convenient for integrated processing.
The material of heat-conducting piece 5 is chooseed for use, can select the material that the heat conductivility is good, for example copper, gold, silver, aluminum alloy or aluminium, because gold, silver's cost is higher, and the heat conductivility of aluminum alloy is lower, the material of preferred heat-conducting piece 5 is copper or aluminium, with heat-conducting piece 5 design for copper billet or aluminium billet, it still needs to notice, between heat pipe 4 and the mounting groove 6, can connect through welding or the mode that bonds between heat pipe 4 and the heat-conducting piece 5, the radiating piece is when the actual installation with the integrated circuit board, can be through bonding, the bolt joint, the nail connects, riveting or the mode of round pin hub connection are connected.
The difference between the present embodiment and embodiment 1 lies in that the present embodiment is inside the heat conduction groove 3, and the refrigerant pipeline is correspondingly installed according to the shape structure of the heat conduction groove 3, and the refrigerant pipeline replaces the heat conduction groove 3 as a conveying pipeline of a refrigerant medium, because the refrigerant pipeline itself has a sealing property, after the refrigerant pipeline is installed, the relative requirement for air tightness between the base plate 1 and the cover plate 2 can be lower, and in addition, two connecting pipes 8 arranged on the heat dissipation member are respectively connected with two ends of the refrigerant pipeline.
Example 3
The present embodiment provides another solution, and the difference between the present embodiment and embodiment 1 is that the heat dissipation member of the present embodiment is a heat dissipation pipeline, and two ends of the heat dissipation pipeline are respectively connected to the inlet end and the outlet end of the pump body.
Moreover, the positions of the heat dissipation pipeline corresponding to the heat pipe 4 and the heat conducting piece 5 are set to be serpentine pipelines so as to prolong the flowing route of the refrigerant medium and improve the heat dissipation effect.
The utility model provides an useful part lies in, this application has designed heat-conducting piece 5, supplementary heat conduction block 7, heat pipe 4 and radiating piece, heat-conducting piece 5 mainly corresponds the regional setting of main chip on the integrated circuit board, then supplementary heat conduction block 7 mainly corresponds the regional setting of non-main chip on the integrated circuit board, such a design, make and give heat pipe 4 through heat-conducting piece 5 fast transmission after the regional release heat of main chip, realize quick heat transfer, the rethread radiating piece realizes dispelling the heat fast, non-main chip region gives the radiating piece with heat transmission through supplementary heat conduction block 7 simultaneously, realize dispelling the heat fast, just so can solve electronic components's heat dissipation problem on the integrated circuit board.
Finally, it should be noted that: the above embodiments are only used to illustrate the technical solution of the present invention, and not to limit the same; while the utility model has been described in detail and with reference to the foregoing embodiments, it will be understood by those skilled in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some or all of the technical features may be equivalently replaced; and the modifications or the substitutions do not make the essence of the corresponding technical solutions depart from the scope of the technical solutions of the embodiments of the present invention.
Furthermore, those skilled in the art will appreciate that while some embodiments herein include some features included in other embodiments, rather than other features, combinations of features of different embodiments are meant to be within the scope of the utility model and form different embodiments. For example, in the claims above, any of the claimed embodiments may be used in any combination. The information disclosed in this background section is only for enhancement of understanding of the general background of the utility model and should not be taken as an acknowledgement or any form of suggestion that this information forms the prior art already known to a person skilled in the art.
Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the utility model, the scope of which is defined in the appended claims and their equivalents.
The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention, and various modifications and changes may be made by those skilled in the art. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.
Claims (10)
1. The utility model provides a heat radiation structure of liquid cooling composite heat pipe for dispel the heat to the integrated circuit board in the server, its characterized in that, heat radiation structure includes radiating piece, heat pipe (4) and heat-conducting piece (5), the radiating piece passes through heat pipe (4) with one side of heat-conducting piece (5) is connected, the opposite side of heat-conducting piece (5) with the integrated circuit board corresponds the setting.
2. The heat dissipation structure according to claim 1, wherein the heat dissipation member comprises a base plate (1) and a cover plate (2), and the base plate (1) and the cover plate (2) are connected by means of adhesion, bolting, nailing, welding, riveting or pin connection;
a heat conducting groove (3) is formed between the base plate (1) and the cover plate (2).
3. The heat dissipation structure of claim 2, wherein a refrigerant pipeline is correspondingly arranged in the heat conduction groove (3).
4. The heat dissipation structure according to claim 1, wherein the number of the heat pipes (4) is at least one.
5. The heat dissipation structure according to claim 2, wherein the heat conduction groove (3) is provided as a serpentine flow path corresponding to the position of the heat conduction member (5).
6. The heat dissipation structure of claim 2, wherein a plurality of mounting grooves (6) are formed on the substrate (1), and the heat pipes (4) are correspondingly mounted in the mounting grooves (6).
7. The heat dissipation structure of claim 6, wherein the heat pipe (4) and the mounting groove (6) and the heat pipe (4) and the heat conductive member (5) are connected by welding or bonding.
8. The heat dissipation structure according to claim 1, wherein the heat dissipation member is a heat dissipation pipe, and the heat dissipation pipe is provided as a serpentine pipe at a position corresponding to the heat conductive member (5).
9. The heat dissipation structure of claim 1, wherein an auxiliary heat conduction block (7) is further disposed on the side of the heat dissipation member where the heat pipe (4) is disposed, and the auxiliary heat conduction block (7) is disposed corresponding to the board card.
10. The heat dissipation structure of claim 1, further comprising a pump body connected to the heat dissipation member, the pump body being configured to supply a refrigerant medium to the heat dissipation member.
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| CN202123155979.4U CN216566085U (en) | 2021-12-15 | 2021-12-15 | Heat radiation structure of liquid cooling composite heat pipe |
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| CN202123155979.4U CN216566085U (en) | 2021-12-15 | 2021-12-15 | Heat radiation structure of liquid cooling composite heat pipe |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117387401A (en) * | 2023-12-13 | 2024-01-12 | 山东光大机械制造有限公司 | Heat exchanger and engine |
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2021
- 2021-12-15 CN CN202123155979.4U patent/CN216566085U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117387401A (en) * | 2023-12-13 | 2024-01-12 | 山东光大机械制造有限公司 | Heat exchanger and engine |
| CN117387401B (en) * | 2023-12-13 | 2024-03-08 | 山东光大机械制造有限公司 | Heat exchanger and engine |
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