CN216565729U

CN216565729U - A dust protected PCBA mainboard for audio amplifier

Info

Publication number: CN216565729U
Application number: CN202220036952.9U
Authority: CN
Inventors: 王利; 王向阳
Original assignee: Shenzhen Kelichuang Electronics Co ltd
Current assignee: Shenzhen Kelichuang Electronics Co ltd
Priority date: 2022-01-07
Filing date: 2022-01-07
Publication date: 2022-05-17
Anticipated expiration: 2032-01-07

Abstract

The utility model belongs to the technical field of PCBA (printed circuit board assembly) mainboards, and discloses a dustproof PCBA mainboard for a sound box, which comprises a mainboard, wherein side frames are respectively installed at two symmetrical sides of the mainboard, clamping grooves are respectively formed in the two side frames, side grooves are respectively formed in the two side frames close to the clamping grooves, clamping frames are respectively installed in the two clamping grooves, a dustproof cover is installed between the two clamping frames, jacks are formed in one side of each clamping frame close to the corresponding clamping groove, and springs are installed in the side grooves. According to the utility model, the clamping frame is inserted into the clamping groove in the side frame, and the insertion rod is pushed and extruded by the spring in the side groove, so that the insertion rod is inserted into the insertion hole in the clamping frame, thereby fixing the clamping frame and the dust cover.

Description

A dust protected PCBA mainboard for audio amplifier

Technical Field

The utility model belongs to the technical field of PCBA (printed circuit board assembly) mainboards, and particularly relates to a dustproof PCBA mainboard for a sound box.

Background

PCBA mainboard is a printed circuit board, also called as a printed circuit board, is an important electronic component, is a support body of an electronic element, is a provider of circuit connection of the electronic component, is called as a printed circuit board because the PCBA mainboard is manufactured by adopting an electronic printing technology,

the dust protected PCBA mainboard of current audio amplifier is through the fixed dust cover of welding mode, when the user need dismantle the dust cover, need extravagant plenty of time clearance soldering tin, the dismantlement degree of difficulty of greatly increased dust cover has reduced the dismantlement efficiency of dust cover, and most regions of mainboard have been sheltered from to current dust cover, greatly increased the heat dissipation degree of difficulty of mainboard, reduced the radiating efficiency of mainboard.

SUMMERY OF THE UTILITY MODEL

The utility model aims to provide a dustproof PCBA mainboard for a sound box, and aims to solve the problems that the dustproof cover is low in disassembly efficiency and the mainboard is difficult to dissipate heat in the background technology.

In order to achieve the purpose, the utility model provides the following technical scheme: the utility model provides a dust protected PCBA mainboard for audio amplifier, includes the mainboard, the side bearer, two are all installed to the both sides of mainboard symmetry the draw-in groove has all been seted up to the inside of side bearer, and the inside one side that is close to the draw-in groove of two side bearers has all seted up the side channel, two the card frame, two are all installed to the inside of draw-in groove install the dust cover between the card frame, the jack has been seted up to one side that the card frame is close to the draw-in groove, the internally mounted of side channel has the spring, the inserted bar is installed to the one end that the spring is close to the jack.

Preferably, the top of dust cover has seted up the mounting groove, first magnetic sheet is installed to the inner wall of mounting groove, the top of first magnetic sheet adsorbs there is the dust screen.

Preferably, pull grooves are formed in the tops of the two clamping frames.

Preferably, the inner wall of the insertion hole is mounted with a second magnetic plate.

Preferably, the heat-conducting plate is installed at the bottom of the main board, and intensive heat dissipation holes are formed in the heat-conducting plate.

Preferably, the dust screen is provided with dense air holes.

Compared with the prior art, the utility model has the beneficial effects that:

(1) according to the utility model, the clamping frame is inserted into the clamping groove in the side frame, and the insertion rod is pushed and extruded by the spring in the side groove, so that the insertion rod is inserted into the insertion hole in the clamping frame, thereby fixing the clamping frame and the dust cover.

(2) According to the dustproof structure, the dustproof net is adsorbed by the first magnetic plate in the mounting groove, so that the dustproof net is fixed in the dustproof cover, and the dustproof net is matched with the mounting groove, so that the heat dissipation difficulty of the mainboard cannot be increased after the mainboard is shielded by the dustproof cover, and the heat dissipation efficiency of the mainboard during working is greatly improved.

Drawings

FIG. 1 is a top view of the present invention;

FIG. 2 is a top view of the present invention with the dust screen removed;

FIG. 3 is a top view of the present invention with the dust cap removed;

FIG. 4 is a front view of the present invention;

FIG. 5 is an internal structural view of the side frame of the present invention when connected to a truck;

in the figure: 1. a dust screen; 2. mounting grooves; 3. groove drawing; 4. a clamping frame; 5. a side frame; 6. a dust cover; 7. a main board; 8. a first magnetic plate; 9. inserting a rod; 10. a card slot; 11. heat dissipation holes; 12. a heat conducting plate; 13. a spring; 14. a side groove; 15. a second magnetic plate; 16. and (4) inserting the jack.

Detailed Description

The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.

Referring to fig. 1-5, the present invention provides the following technical solutions: the utility model provides a dust protected PCBA mainboard for audio amplifier, including mainboard 7, side bearer 5 is all installed to the both sides of mainboard 7 symmetry, draw-in groove 10 has all been seted up to the inside of two side bearers 5, and the inside one side that is close to draw-in groove 10 of two side bearers 5 has all been seted up side channel 14, card frame 4 is all installed to the inside of two draw-in grooves 10, install dust cover 6 between two card frames 4, jack 16 has been seted up to one side that card frame 4 is close to draw-in groove 10, the internally mounted of side channel 14 has spring 13, inserted bar 9 is installed to spring 13 near the one end of jack 16, insert the inside to side bearer 5 through card frame 4 with dust cover 6, push insert bar 9 extrusion through spring 13, make inserted bar 9 insert to the jack 16 on card frame 4, make dust cover 6 be fixed in mainboard 7 top.

Further, mounting groove 2 has been seted up at the top of dust cover 6, and first magnetic sheet 8 is installed to the inner wall of mounting groove 2, and dust screen 1 has been adsorbed at the top of first magnetic sheet 8, and dust screen 1 is iron, adsorbs dust screen 1 through first magnetic sheet 8, makes dust screen 1 be fixed in dust cover 6 in, lets the radiating efficiency greatly increased of mainboard 7.

Further, pull grooves 3 have been all seted up at the top of two card framves 4, let card frame 4 be convenient for spur through pull grooves 3.

Further, second magnetic sheet 15 is installed to the inner wall of jack 16, and inserted bar 9 is iron, adsorbs inserted bar 9 through second magnetic sheet 15, makes inserted bar 9 more firm after being connected with card frame 4.

Further, heat-conducting plate 12 is installed to mainboard 7 bottom, has seted up intensive louvre 11 on the heat-conducting plate 12, through heat-conducting plate 12 and louvre 11 cooperation, greatly increased mainboard 7 radiating efficiency.

Furthermore, the dust screen 1 is provided with dense air holes.

The working principle and the using process of the utility model are as follows: the utility model discloses a when using, insert dust cover 6 to the inside draw-in groove 10 of side bearer 5 through card frame 4, support spring 13 through side slot 14, promote the extrusion of inserted bar 9 through spring 13, make inserted bar 9 insert to the inside jack 16 of card frame 4, adsorb inserted bar 9 through second magnetic sheet 15, make card frame 4 and side bearer 5 be connected the back fastening more, thereby let dust cover 6 be fixed in mainboard 7 top, shelter from mainboard 7 top through dust cover 6, thereby protect mainboard 7, adsorb dust screen 1 through first magnetic sheet 8, make dust screen 1 be fixed in inside dust cover 6, cooperate through dust screen 1 and mounting groove 2, thereby increase mainboard 7's radiating efficiency, and cooperate through louvre 11 and heat-conducting plate 12, mainboard 7's radiating efficiency has further been increased.

It is noted that, herein, relational terms such as first and second, and the like may be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus.

Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the utility model, the scope of which is defined in the appended claims and their equivalents.

Claims

1. The utility model provides a dust protected PCBA mainboard for audio amplifier which characterized in that: including mainboard (7), side bearer (5), two are all installed to the both sides of mainboard (7) symmetry draw-in groove (10) have all been seted up to the inside of side bearer (5), and two side bearer (5) inside one side of being close to draw-in groove (10) have all seted up side channel (14), two card frame (4), two are all installed to the inside of draw-in groove (10) install dust cover (6) between card frame (4), jack (16) have been seted up to card frame (4) one side of being close to draw-in groove (10), the internally mounted of side channel (14) has spring (13), inserted bar (9) are installed to spring (13) one end of being close to jack (16).

2. A dust protected PCBA mainboard for a loudspeaker box according to claim 1, characterized in that: mounting groove (2) have been seted up at the top of dust cover (6), first magnetic sheet (8) are installed to the inner wall of mounting groove (2), the top of first magnetic sheet (8) adsorbs dust screen (1).

3. A dust protected PCBA mainboard for a loudspeaker box according to claim 2, characterized in that: pull grooves (3) are formed in the tops of the two clamping frames (4).

4. A dust protected PCBA mainboard for a loudspeaker box according to claim 3, characterized in that: and a second magnetic plate (15) is arranged on the inner wall of the jack (16).

5. A dust protected PCBA mainboard for audio amplifier of claim 4, characterized in that: the heat-conducting plate (12) is installed at the bottom of the main plate (7), and dense heat dissipation holes (11) are formed in the heat-conducting plate (12).

6. A dust protected PCBA mainboard for audio amplifier of claim 5, characterized in that: the dust screen (1) is provided with dense air holes.