CN216565223U - Earphone module and electronic equipment - Google Patents

Abstract

The disclosure relates to an earphone module and an electronic device. The earphone module sets up seal assembly in the main part of earphone main part, because the main part is located between vocal portion and the open portion on the thickness direction of earphone main part, therefore avoided seal assembly to occupy earphone module thickness space, and sealed in electronic equipment's inside confined space with open portion through seal assembly and the sealed cooperation of electronic equipment casing, in order to avoid liquid, impurity gets into the earphone through open portion inside and influence the sound playback, the light and thin nature and the whole sealed effect of electronic equipment of earphone module and use above-mentioned earphone module have been promoted.

Description

Earphone module and electronic equipment

Technical Field

The present disclosure relates to the field of electronic technologies, and in particular, to an earphone module and an electronic device.

Background

Electronic equipment such as a mobile phone generally includes an earpiece for implementing a sound playing function in a voice call or the like, and the earpiece needs to be sealed during an assembly process to prevent water, impurities and the like from entering the inside through an open portion of the earpiece to affect the sound playing function.

However, since the earpiece itself belongs to the electronic component with a large structural size, the end of the earpiece in the thickness direction of the earpiece needs to be bonded with the casing through bonding structures such as foam adhesive to realize fixation and sealing, which affects the overall thickness and sealing effect of the earpiece module and the electronic device.

SUMMERY OF THE UTILITY MODEL

The present disclosure provides an earphone module and an electronic device, so as to improve the thinness and sealing effect of the earphone module.

According to a first aspect of this disclosure, an earphone module is provided, which is applied to an electronic device, the earphone module includes:

a handset body including a body portion, a sounding portion, and an opening portion; the main body portion is disposed between the sounding portion and the open portion in a thickness direction of the earpiece main body;

and the sealing assembly is arranged on the main body part, is in sealing fit with the shell of the electronic equipment to form an internal sealing space, and the opening part is positioned in the internal sealing space.

Optionally, the sealing assembly includes a supporting member and a sealing member, the supporting member and the sealing member are fixedly disposed on the main body portion, and the sealing member is respectively in abutting fit with the supporting member and the electronic device housing to form a seal.

Optionally, the sealing member and the main body portion are fixed by dispensing.

Optionally, the supporting member includes a connecting portion and a supporting portion bent relative to the connecting portion, the connecting portion is fixedly connected to the main body portion, and the supporting portion is in abutting fit with the sealing member.

Optionally, the support member comprises a continuous structure surrounding the body portion.

Optionally, the sealing assembly includes a plurality of the supporting members, and the plurality of the supporting members are arranged at intervals along the circumference of the main body portion.

Optionally, the sealing element comprises an elastic material; and/or the material of the support comprises metal.

Optionally, in the thickness direction of the earpiece module, the earpiece main body includes an inner end and an outer end that are oppositely disposed; the sounding part is arranged at the outer end part, the opening part is arranged at the inner end part, the main body part comprises a side surface connecting the inner end part and the outer end part, and the sealing component is arranged at the side surface.

According to a second aspect of the present disclosure, an electronic device is provided, where the electronic device includes a housing and any one of the earphone modules of the first aspect, and the sealing assembly is in sealing fit with the housing.

Optionally, the housing includes a front shell and a rear shell, and the earpiece module includes an inner end and an outer end in the thickness direction of the earpiece module; the rear shell is positioned at the inner side of the inner side end part; the front shell comprises a side structure positioned on the side surface of the earphone module and a supporting structure positioned on the outer side of the outer side end;

the sealing assembly is respectively abutted and sealed with the rear shell and the side surface structure, and the earphone module is abutted and matched with the supporting structure.

The technical scheme provided by the embodiment of the disclosure can have the following beneficial effects:

the utility model discloses a earphone module sets up seal assembly in the main part of earphone main part, because the main part is located between vocal portion and the opening in the thickness direction of earphone main part, therefore avoided seal assembly to occupy earphone module thickness space, and sealed in electronic equipment's inside confined space with opening through the sealed cooperation of seal assembly and electronic equipment casing, in order to avoid liquid, impurity gets into the earphone through opening inside and influence the sound broadcast, the light and thin nature and the whole sealed effect of the electronic equipment of earphone module and use above-mentioned earphone module have been promoted.

It is to be understood that both the foregoing general description and the following detailed description are exemplary and explanatory only and are not restrictive of the disclosure.

Drawings

The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments consistent with the present disclosure and together with the description, serve to explain the principles of the disclosure.

Fig. 1 is a schematic cross-sectional structure diagram of an earpiece module in an exemplary embodiment of the disclosure;

fig. 2 is a schematic cross-sectional view of an earpiece module according to another exemplary embodiment of the disclosure;

fig. 3 is a cross-sectional structural schematic view of an earpiece body and support in an exemplary embodiment of the present disclosure;

fig. 4 is a cross-sectional structural schematic view of an earpiece body and support in another exemplary embodiment of the present disclosure;

fig. 5 is a schematic cross-sectional view of an earpiece module according to another exemplary embodiment of the disclosure.

Detailed Description

Reference will now be made in detail to the exemplary embodiments, examples of which are illustrated in the accompanying drawings. When the following description refers to the accompanying drawings, like numbers in different drawings represent the same or similar elements unless otherwise indicated. The embodiments described in the following exemplary embodiments do not represent all embodiments consistent with the present disclosure. Rather, they are merely examples of apparatus and methods consistent with certain aspects of the present disclosure, as detailed in the appended claims.

Electronic equipment such as a mobile phone generally includes an earpiece for implementing a sound playing function in a voice call or other scenes, and the earpiece needs to be sealed during an assembling process to prevent water, impurities and the like from entering the inside through an open portion of the earpiece to affect the sound playing function. However, since the earpiece itself belongs to the electronic component with a large structural size, the end of the earpiece in the thickness direction of the earpiece needs to be bonded with the casing through bonding structures such as foam adhesive to realize fixation and sealing, which affects the overall thickness and sealing effect of the earpiece module and the electronic device.

The present disclosure provides an earphone module applied to an electronic device. Fig. 1 is a schematic cross-sectional structure view of an earpiece module according to an exemplary embodiment of the disclosure, and as shown in fig. 1, the earpiece module 1 includes an earpiece body 11 and a sealing assembly 12. The earpiece body 11 includes a main body portion 113, a sound emitting portion 112, and an open portion 111, and the main body portion 113 is disposed between the sound emitting portion 112 and the open portion 111 in the thickness direction of the earpiece body 11. The sealing member 12 is disposed on the main body portion 113, the sealing member 12 is in sealing fit with the housing 21 of the electronic device to enclose the internal sealed space 13, and the opening portion 111 is located in the internal sealed space 13.

It should be noted that the sound emitting portion 112 may be a vibrating diaphragm of the earpiece module 1, so as to form sound and transmit the sound to the outside of the electronic device. The opening 111 may be a portion communicating with the inside of the electronic device, so that a space where the electronic component in the earpiece body 11 is located communicates with the inside of the electronic device.

Because the earphone module 1 sets the sealing component 12 on the main body portion 113 of the earphone main body 11, and the main body portion 113 is located between the sound generating portion 112 and the opening portion 111 in the thickness direction of the earphone main body 11, occupation of the sealing component 12 on the thickness space of the earphone module 1 is avoided, and the opening portion 111 is sealed in the internal sealing space 13 of the electronic device through the sealing matching of the sealing component 12 and the electronic device shell 21, so as to avoid influence on sound playing caused by liquid and impurities entering the earphone through the opening portion 111, and improve the lightness and thinness and the overall sealing effect of the earphone module 1 and the electronic device using the earphone module 1.

After earphone module 1 is assembled in electronic equipment, can directly realize sealedly through the butt of seal assembly 12 with casing 21, avoided realizing sealedly receiving structure tolerance and installation tolerance's influence problem through earphone module 1 through adhesive structure, further promoted sealed reliability.

In some embodiments, in the thickness direction of the earpiece module 1, the earpiece body 11 includes an inner end and an outer end which are oppositely disposed, the sounding portion 112 is disposed at the outer end, the open portion 111 is disposed at the inner end, the body portion 113 includes a side surface connecting the inner end and the outer end, and the sealing member 12 is disposed at the side surface. The above arrangement allows the sound-emitting portion 112 to face the outside of the electronic device, the opening portion 111 to face the internal sealed space 13 inside the electronic device, and the sealing member 12 to abut against and seal the housing 21 when the earpiece module 1 is assembled in the electronic device.

In some embodiments, as shown in fig. 2, the sealing assembly 12 may include a supporting member 122 and a sealing member 121, and the supporting member 122 and the sealing member 121 are fixedly disposed on the body portion 113, so that the earpiece body 11 and the sealing assembly 12 are assembled to the electronic device as a whole. The sealing member 121 is in abutting engagement with the support member 122 and the electronic apparatus housing 21, respectively, to form a seal. When the earpiece module 1 is assembled to the electronic device, the sealing member 121 abuts against the electronic device housing 21 to form a seal, and the supporting member 122 abuts against the sealing member 121 to support the sealing member 121, so that the sealing failure problems that the sealing member 121 falls off due to the abutting pressure with the electronic device housing 21 and the like are avoided, and the fixing strength and the overall sealing effect of the sealing member 121 are improved.

The electronic device housing 21 may include a rear case 211 and a front case 212, the rear case 211 is located at an inner side in a thickness direction of the earpiece body 11, and the front case 212 may include a side structure 2121 located at a side of the earpiece body 11. The sealing member 121 may include a first sealing surface fitted to the rear case 211 and a second sealing surface fitted to the front case 212, the abutment of the first sealing surface with the rear case 211 realizes the sealing of the earpiece body 11 in the thickness direction, and the abutment of the second sealing surface with the front case 212 realizes the sealing of the earpiece body 11 in the side surface, increasing the sealing direction of the sealing member 121, and further improving the sealing effect of the sealing member 121.

In the above embodiment, the sealing member 121 may be fixed to the main body 113 by dispensing, so as to improve the connection stability of the sealing member 121 with the main body 113. The supporting member 122 may be fixedly disposed on the main body 113 by bonding, clipping, welding, etc. so as to improve the structure of the earpiece main body 11. Alternatively, the supporting member 122 may be integrally formed with the body portion 113 to improve the stability of the supporting member 122.

In some embodiments, the supporting member 122 may include a connecting portion 1221 and a supporting portion 1222 bent with respect to the connecting portion 1221, the connecting portion 1221 is fixedly connected with the main body portion 113, and the supporting portion 1222 is in abutting engagement with the sealing member 121. The structure of the supporting member 122 for realizing the fixed connection function and the sealing support function is separated, so that the connection stability and the sealing effect are increased, and the structural interference between the connecting portion 1221 and the supporting portion 1222 is avoided.

In some embodiments, the seal 121 may be a continuous structure that surrounds the body portion 113 to effect a seal around the entire circumference of the body portion 113. As shown in fig. 3, the supporting member 122 may include a continuous structure surrounding the main body 113, so that the sealing member 121 is supported by the supporting member 122 in the circumferential direction of the main body 113, thereby improving the sealing effect of the sealing member 121 and facilitating the arrangement and processing of the supporting member 122. For example, when the main body portion 113 has a rectangular structure, the supporting member 122 may have a frame-shaped structure disposed in the circumferential direction of the main body portion 113.

In other embodiments, as shown in fig. 4, the sealing assembly 12 may include a plurality of supporting members 122, and the plurality of supporting members 122 are spaced along the circumference of the main body portion 113 to reduce the material cost of the supporting members 122 while achieving the supporting function of the sealing member 121.

It should be noted that the sealing member 121 may be made of an elastic material to enhance the sealing effect by elastic pressing. For example, the sealing member 121 may be made of soft rubber such as silicon rubber or rubber. And/or, the material of the supporting member 122 may be metal, for example, the material of the supporting member 122 may be steel, so as to enhance the structural strength of the supporting member 122.

In other embodiments, as shown in FIG. 5, the seal assembly 12 may also include a seal member 121 and a connecting structure 123 that secures the seal member 121 to the body portion 113. The connecting structure 123 may be an adhesive structure, a screw connecting structure 123, a snap structure, or the like, to fix the sealing member 121 to the main body 113.

The present disclosure further proposes an electronic device, which includes a housing 21 and the earphone module 1, wherein the sealing assembly 12 is in sealing fit with the housing 21.

Because the earphone module 1 sets the sealing component 12 on the main body portion 113 of the earphone main body 11, and the main body portion 113 is located between the sound generating portion 112 and the opening portion 111 in the thickness direction of the earphone main body 11, occupation of the sealing component 12 on the thickness space of the earphone module 1 is avoided, and the opening portion 111 is sealed in the internal sealing space 13 of the electronic device through the sealing matching of the sealing component 12 and the electronic device shell 21, so as to avoid liquid and impurities from entering the inside of the earphone through the opening portion 111 to influence sound playing, and the lightness, thinness and integral sealing effect of the earphone module 1 and the electronic device using the earphone module 1 are improved.

In some embodiments, the housing 21 may comprise a front shell 212 and a rear shell 211, the earpiece module 1 comprising an inner end and an outer end in the thickness direction of the earpiece module 1, the rear shell 211 being located inside the inner end, the front shell 212 comprising a side structure 2121 at the side of the earpiece module 1 and a support structure 2122 outside the outer end. The sealing assembly 12 is respectively abutted and sealed with the rear housing 211 and the side structure 2121, and the earphone module 1 is abutted and matched with the supporting structure 2122, so that the earphone module 1 can be assembled in an electronic device and a desired sealing effect can be realized through the above structure.

The electronic device may further include a battery cover 22, and the battery cover 22 is disposed behind the rear cover in the thickness direction of the earpiece module 1 to implement packaging of the electronic device.

It should be noted that the electronic device may be a mobile phone, a wearable device, a tablet computer, a television, an advertisement screen, a vehicle-mounted terminal, a medical terminal, and the like, which is not limited in this disclosure.

Other embodiments of the disclosure will be apparent to those skilled in the art from consideration of the specification and practice of the disclosure disclosed herein. This disclosure is intended to cover any variations, uses, or adaptations of the disclosure following, in general, the principles of the disclosure and including such departures from the present disclosure as come within known or customary practice within the art to which the disclosure pertains. It is intended that the specification and examples be considered as exemplary only, with a true scope and spirit of the disclosure being indicated by the following claims.

It will be understood that the present disclosure is not limited to the precise arrangements described above and shown in the drawings and that various modifications and changes may be made without departing from the scope thereof. The scope of the present disclosure is limited only by the appended claims.

Claims (10)

1. The utility model provides an earphone module which characterized in that is applied to electronic equipment, earphone module includes:

a handset body including a main body portion, a sound emitting portion, and an opening portion; the main body portion is disposed between the sound emitting portion and the open portion in a thickness direction of the earpiece main body;

and the sealing assembly is arranged on the main body part, is in sealing fit with the shell of the electronic equipment to form an internal sealing space, and the opening part is positioned in the internal sealing space.

2. The earpiece module of claim 1, wherein the sealing assembly includes a support member and a sealing member, the support member and the sealing member being fixedly disposed on the body portion, the sealing member being in abutting engagement with the support member and the electronics housing, respectively, to form a seal.

3. The earpiece module of claim 2, wherein the sealing member is affixed to the body portion.

4. The earphone module of claim 2 wherein the support member comprises a connecting portion and a support portion bent with respect to the connecting portion, the connecting portion being fixedly connected to the main body portion, the support portion being in abutting engagement with the sealing member.

5. The earpiece module of claim 2, wherein the support member comprises a continuous structure surrounding the body portion.

6. The earpiece module of claim 2, wherein the sealing assembly includes a plurality of the support members spaced apart along a circumference of the body portion.

7. The earpiece module of claim 2, wherein the seal comprises an elastomeric material; and/or the material of the support comprises metal.

8. The earpiece module of claim 1, wherein the earpiece body includes, in a thickness direction of the earpiece module, an inboard end and an outboard end that are oppositely disposed; the sounding part is arranged at the outer end part, the opening part is arranged at the inner end part, the main body part comprises a side surface connecting the inner end part and the outer end part, and the sealing component is arranged at the side surface.

9. An electronic device comprising a housing and an earpiece module as set forth in any of claims 1-8, the sealing assembly sealingly engaging the housing.

10. The electronic device of claim 9, wherein the housing comprises a front shell and a rear shell, and the earpiece module comprises an inboard end and an outboard end in the earpiece module thickness direction; the rear shell is positioned at the inner side of the inner side end part; the front shell comprises a side structure positioned on the side surface of the earphone module and a supporting structure positioned on the outer side of the outer side end;

the sealing assembly is respectively abutted and sealed with the rear shell and the side surface structure, and the earphone module is abutted and matched with the supporting structure.

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