CN216563478U - Phased array antenna device with heat dissipation mechanism - Google Patents
Phased array antenna device with heat dissipation mechanism Download PDFInfo
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- CN216563478U CN216563478U CN202122357679.8U CN202122357679U CN216563478U CN 216563478 U CN216563478 U CN 216563478U CN 202122357679 U CN202122357679 U CN 202122357679U CN 216563478 U CN216563478 U CN 216563478U
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Abstract
The utility model discloses a phased array antenna device with a heat dissipation mechanism, and relates to the field of antenna devices. The phased array antenna device with the heat dissipation mechanism comprises a phased array antenna substrate, an integrated chip and a radiator main body, wherein two groups of fixing bottom plates are fixedly connected to the top of the phased array antenna substrate, and limit clamping seats are fixedly connected to the tops of the fixing bottom plates. This phased array antenna device with heat dissipation mechanism when using, can guarantee to install fixed back in the radiator main part, it is inseparable to laminate between integrated chip and the radiator main part, can not become flexible for the radiating effect is good, guarantees phased array antenna base plate's job stabilization, and then makes phased array antenna device stable in utilization, and the radiator main part that sets up is when the installation is fixed moreover, and easy operation is convenient, labour saving and time saving, and later stage radiator main part also is convenient for regularly pull down the clearance.
Description
Technical Field
The utility model relates to the technical field of antenna devices, in particular to a phased array antenna device with a heat dissipation mechanism.
Background
The phased array antenna is an antenna which changes the shape of a directional pattern by controlling the feeding phase of a radiating element in the array antenna, and the maximum direction of the directional pattern of the antenna can be changed by controlling the phase, so that the purpose of beam scanning is achieved.
In the prior art, an integrated chip is generally arranged inside a phased array antenna device to process information such as data, most of the heat dissipation of the existing integrated chip is realized by using a radiator, so that the heat dissipation area is increased, but when the existing radiator dissipates the heat of the integrated chip of the phased array antenna device, the radiator is not attached to the surface of the chip possibly due to the vibration of the device, so that a gap is formed, the heat dissipation effect is greatly reduced, the heat dissipation performance of the chip is poor, the traditional radiator is inconvenient to disassemble and assemble, dust is easy to accumulate after the phased array antenna device is used for a long time, the heat dissipation effect is also reduced, and aiming at the defects in the prior art, the utility model discloses the phased array antenna device with a heat dissipation mechanism to solve the problems.
SUMMERY OF THE UTILITY MODEL
Technical problem to be solved
In view of the deficiencies of the prior art, the present invention discloses a phased array antenna apparatus with a heat dissipation mechanism to solve the problems set forth in the background art.
(II) technical scheme
In order to achieve the purpose, the utility model is realized by the following technical scheme: a phased array antenna apparatus with a heat dissipation mechanism, comprising:
the antenna comprises a phased array antenna substrate, wherein the top of the phased array antenna substrate is fixedly connected with two groups of fixed bottom plates, and the tops of the fixed bottom plates are fixedly connected with limiting clamping seats;
the integrated chip is fixedly arranged on the top of the phased array antenna substrate;
the radiator comprises a radiator main body, the both sides fixedly connected with spliced pole of radiator main body, the tip fixedly connected with chucking piece of spliced pole, chucking piece activity joint is inside spacing cassette, square logical groove has been seted up at the top of radiator main body, sliding connection has the slip post in the square logical groove, the bottom fixedly connected with heat conduction laminating piece of slip post, heat conduction laminating piece and integrated chip laminating, the lateral wall fixedly connected with side fixed block of slip post, be equipped with first spring between the bottom of side fixed block and radiator main body.
Preferably, the top of the sliding column is fixedly connected with a limit stop.
Preferably, the first spring is in a compressed state.
Preferably, the ratchet groove is formed in the side wall of the clamping block, the square hollow block is fixedly connected to the side wall of the limiting clamping seat, an inner cavity is formed in the square hollow block, a second spring is arranged in the inner cavity of the square hollow block, a square sliding block is fixedly connected to the end portion of the second spring, a wedge block is fixedly connected to the side wall of the square sliding block, and the wedge block penetrates through the square hollow block and the limiting clamping seat and is movably clamped in the ratchet groove.
Preferably, a sliding handle is fixedly connected to the side wall of the square sliding block, and a groove corresponding to the sliding handle is formed in the side wall of the square hollow block.
The utility model discloses a phased array antenna device with a heat dissipation mechanism, which has the following beneficial effects:
1. this phased array antenna device with heat dissipation mechanism, when using, can guarantee to install fixed back in the radiator main part, it is inseparable to laminate between integrated chip and the radiator main part, can not become flexible for the radiating effect is good, guarantees phased array antenna base plate's job stabilization, and then makes phased array antenna device stable in utilization, and the radiator main part that sets up is when the installation is fixed moreover, and easy operation is convenient, labour saving and time saving, and later stage radiator main part also is convenient for pull down the clearance regularly.
2. This phased array antenna device with heat dissipation mechanism, the wedge that sets up can realize prescribing a limit to the position of chucking piece for the chucking piece can only be done decurrent unidirectional motion, consequently when phased array antenna device vibrations, the chucking piece only can tightly can not be loose, has just so guaranteed that the surface contact of radiator main part and integrated chip is effectual, guarantees that the radiating effect is good.
Drawings
FIG. 1 is a schematic structural view of the present invention;
FIG. 2 is a front view of the device of the present invention in its entirety;
FIG. 3 is a structural view of the radiator body of the present invention;
FIG. 4 is an exploded view of the heat sink body and hollow slide post of the present invention;
FIG. 5 is a cross-sectional view of a square hollow block of the present invention.
In the figure: 1. a phased array antenna substrate; 2. an integrated chip; 3. fixing the bottom plate; 4. a limiting clamping seat; 5. A heat sink body; 501. a square through groove; 6. connecting columns; 7. a clamping block; 701. a ratchet groove; 8. a sliding post; 9. a heat conducting fitting block; 10. a limit stop block; 11. side fixed blocks; 12. a first spring; 13. A square hollow block; 14. a second spring; 15. a square slider; 16. a wedge block; 17. the handle is slid.
Detailed Description
The embodiment of the utility model discloses a phased array antenna device with a heat dissipation mechanism, as shown in figures 1-5, comprising:
the phased array antenna comprises a phased array antenna substrate 1, wherein the top of the phased array antenna substrate 1 is fixedly connected with two groups of fixed bottom plates 3, and the tops of the fixed bottom plates 3 are fixedly connected with limit clamping seats 4;
the integrated chip 2 is fixedly arranged on the top of the phased array antenna substrate 1;
radiator main part 5, radiator main part 5's both sides fixedly connected with spliced pole 6, the tip fixedly connected with chucking piece 7 of spliced pole 6, chucking piece 7 activity joint is inside spacing cassette 4, square through groove 501 has been seted up at radiator main part 5's top, sliding connection has slip post 8 in the square through groove 501, the bottom fixedly connected with heat conduction laminating piece 9 of slip post 8, heat conduction laminating piece 9 and 2 laminating of integrated chip, the lateral wall fixedly connected with side fixed block 11 of slip post 8, be equipped with first spring 12 between the bottom of side fixed block 11 and radiator main part 5.
According to the drawings of fig. 2, 3 and 4, the top of the sliding column 8 is fixedly connected with a limit stop 10, and the limit stop 10 is arranged to limit the position of the sliding column 8, so that the sliding column 8 is prevented from being separated from the square through groove 501.
According to fig. 2, the first spring 12 is in a compressed state, and the arranged first spring 12 is in a compressed state, so that the elastic effect of the first spring 12 can ensure that the heat-conducting bonding block 9 and the integrated chip 2 are good in bonding performance.
According to the attached drawings 1, 3 and 5, ratchet groove 701 has been seted up to the lateral wall of chucking block 7, the square hollow block 13 of fixedly connected with on the lateral wall of spacing cassette 4, the inside of square hollow block 13 is equipped with the inner chamber, be equipped with second spring 14 in the inner chamber of square hollow block 13, the square slider 15 of tip fixedly connected with of second spring 14, the lateral wall fixedly connected with wedge 16 of square slider 15, wedge 16 passes square hollow block 13 and spacing cassette 4 and activity joint in ratchet groove 701, the position of chucking block 7 can be realized to the wedge 16 that sets up is injectd, consequently, when phased array antenna device shakes, chucking block 7 realizes the chucking to radiator main part 5, just so guaranteed that radiator main part 5 and integrated chip 2's surface contact is effectual, guarantee that the radiating effect is good.
According to the attached drawings 1, 3 and 5, a sliding handle 17 is fixedly connected to the side wall of the square sliding block 15, a groove corresponding to the sliding handle 17 is formed in the side wall of the square hollow block 13, the sliding handle 17 is convenient for a user to slide the square sliding block 15, and the square sliding block 15 can drive the wedge block 16 to move when sliding.
The working principle is as follows: the device is when using, can guarantee to install fixed back at radiator main part 5, and it is inseparable to laminate between integrated chip 2 and the radiator main part 5, can not become flexible for the radiating effect is good, guarantees phased array antenna base plate 1's job stabilization, and then makes phased array antenna device stable in use, and the radiator main part 5 that sets up is when the installation is fixed moreover, and easy operation is convenient, labour saving and time saving, and later stage radiator main part 5 also is convenient for regularly pull down the clearance.
When the installation of radiator main part 5 is fixed, directly aim at radiator main part 5 integrated chip 2's top, and make chucking piece 7 aim at spacing cassette 4 inside card income, the back is gone into to the card, ratchet groove 701 and wedge 16 meshing, radiator main part 5 drives the motion of slip post 8 simultaneously, slip post 8 drives heat conduction laminating piece 9 and offsets with integrated chip 2's top, integrated chip 2's top pressure promotes heat conduction laminating piece 9 and extrudes first spring 12, after first spring 12 compresses, radiator main part 5 and slip post 8 also take place relative slip, the chucking of cooperation spacing cassette 4 to chucking piece 7 is fixed, the realization is fixed to the installation of radiator main part 5, the elasticity of first spring 12 can guarantee that heat conduction laminating piece 9 and integrated chip 2 are laminated closely after the installation is fixed.
When the heat sink main body 5 needs to be detached for cleaning, the sliding handle 17 is directly pulled, so that the sliding handle 17 drives the square sliding block 15 to move and extrude the second spring 14, and the wedge block 16 is synchronously driven to transversely slide and break away from the clamping of the ratchet groove 701.
The foregoing shows and describes the general principles and broad features of the present invention and advantages thereof. It will be understood by those skilled in the art that the present invention is not limited to the embodiments described above, which are described in the specification and illustrated only to illustrate the principle of the present invention, but that various changes and modifications may be made therein without departing from the spirit and scope of the present invention, which fall within the scope of the utility model as claimed. The scope of the utility model is defined by the appended claims and equivalents thereof.
Claims (5)
1. A phased array antenna apparatus with a heat dissipation mechanism, comprising:
the antenna comprises a phased array antenna substrate (1), wherein the top of the phased array antenna substrate (1) is fixedly connected with two groups of fixed bottom plates (3), and the tops of the fixed bottom plates (3) are fixedly connected with limiting clamping seats (4);
the integrated chip (2), the said integrated chip (2) is fixedly mounted on the top of the base plate (1) of phased array antenna;
radiator main part (5), both sides fixedly connected with spliced pole (6) of radiator main part (5), the tip fixedly connected with chucking piece (7) of spliced pole (6), chucking piece (7) activity joint is inside spacing cassette (4), square through groove (501) have been seted up at the top of radiator main part (5), sliding connection has slip post (8) in square through groove (501), the bottom fixedly connected with heat conduction laminating piece (9) of slip post (8), heat conduction laminating piece (9) and NULL (2) laminating, the lateral wall fixedly connected with side fixed block (11) of slip post (8), be equipped with first spring (12) between the bottom of side fixed block (11) and radiator main part (5).
2. A phased array antenna assembly with a heat dissipation mechanism as claimed in claim 1, wherein: the top of the sliding column (8) is fixedly connected with a limit stop (10).
3. A phased array antenna assembly with a heat dissipation mechanism as claimed in claim 1, wherein: the first spring (12) is in a compressed state.
4. A phased array antenna assembly with a heat dissipation mechanism as claimed in claim 1, wherein: ratchet groove (701) have been seted up to the lateral wall of chucking piece (7), square hollow block (13) of fixedly connected with on the lateral wall of spacing cassette (4), the inside of square hollow block (13) is equipped with the inner chamber, be equipped with second spring (14) in the inner chamber of square hollow block (13), the square slider (15) of tip fixedly connected with of second spring (14), the lateral wall fixedly connected with wedge (16) of square slider (15), wedge (16) pass square hollow block (13) and spacing cassette (4) and activity joint in ratchet groove (701).
5. A phased array antenna assembly with a heat dissipation mechanism as claimed in claim 4, wherein: the side wall of the square sliding block (15) is fixedly connected with a sliding handle (17), and the side wall of the square hollow block (13) is provided with a groove corresponding to the sliding handle (17).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202122357679.8U CN216563478U (en) | 2021-09-28 | 2021-09-28 | Phased array antenna device with heat dissipation mechanism |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202122357679.8U CN216563478U (en) | 2021-09-28 | 2021-09-28 | Phased array antenna device with heat dissipation mechanism |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN216563478U true CN216563478U (en) | 2022-05-17 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202122357679.8U Active CN216563478U (en) | 2021-09-28 | 2021-09-28 | Phased array antenna device with heat dissipation mechanism |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN216563478U (en) |
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2021
- 2021-09-28 CN CN202122357679.8U patent/CN216563478U/en active Active
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