CN216563166U - Silicon chip upper pressing roller assembly - Google Patents
Silicon chip upper pressing roller assembly Download PDFInfo
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- CN216563166U CN216563166U CN202123029780.7U CN202123029780U CN216563166U CN 216563166 U CN216563166 U CN 216563166U CN 202123029780 U CN202123029780 U CN 202123029780U CN 216563166 U CN216563166 U CN 216563166U
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- upper pressing
- silicon wafer
- pressing roller
- roller
- positioning
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- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Cleaning Or Drying Semiconductors (AREA)
Abstract
The utility model discloses a silicon wafer upper pressing roller assembly which comprises a Teflon roller shaft, wherein a Teflon shaft sleeve is fixedly sleeved on the axial direction of the roller shaft, upper pressing rollers are sleeved on the radial direction of the shaft sleeve, and at least three upper pressing rollers are sleeved on the shaft sleeve in parallel along the axial direction; both ends of the rolling shaft are provided with straight toothed spur gears made of Teflon materials; the upper pressing roller is made of acid and alkali resistant modified polyethylene, and arc-shaped chamfers are arranged at two ends of the radial surface of the upper pressing roller, which is in contact with the silicon wafer. The utility model can reduce the generation of scratches when the silicon wafer passes by, and the increased contact area reduces the pressure, so that the film on the surface of the silicon wafer is less prone to damage.
Description
Technical Field
The utility model relates to the technical field of photovoltaic cell production equipment, in particular to a silicon wafer upper pressing roller assembly.
Background
When photovoltaic cells are produced, silicon wafers need to be soaked in a process groove filled with liquid medicine in the cleaning and texturing process, and in order to prevent the silicon wafers from floating through the process groove and causing the silicon wafer track to deviate, an upper pressure roller needs to be adopted to limit the silicon wafers so as to avoid the silicon wafers from floating. In the prior art, the contact width of an upper pressure roller and a silicon wafer is only 1mm, and the contact area is small, so that scratches are easily generated on the surface of the silicon wafer, and the surface performance of the silicon wafer is influenced. For this reason, it is necessary to develop a new structure of the upper pressure roller assembly to avoid the above problems.
SUMMERY OF THE UTILITY MODEL
In order to solve the technical problem, the utility model provides a silicon wafer upper pressing roller assembly which comprises a Teflon roller shaft, wherein the length of the Teflon roller shaft is greater than the width of the silicon wafer in the running direction, a Teflon shaft sleeve is fixedly sleeved on the axial direction of the roller shaft, the length of the shaft sleeve is greater than the width of the silicon wafer in the running direction, upper pressing rollers are sleeved on the shaft sleeve in the radial direction, and at least three upper pressing rollers are sleeved on the shaft sleeve in parallel along the axial direction so as to respectively correspond to the two ends and the middle part of the silicon wafer in the running direction; both ends of the rolling shaft are provided with straight toothed spur gears made of Teflon materials;
the upper pressing roller is made of acid and alkali resistant modified polyethylene, and arc-shaped chamfers are arranged at two ends of the radial surface of the upper pressing roller, which is in contact with the silicon wafer, so that the silicon wafer is prevented from being scratched.
The axial two ends of the upper pressing roller are also provided with positioning pieces made of modified polyethylene materials, and the positioning pieces are arranged on the shaft sleeve in a matched manner and are used for positioning the upper pressing roller, and the radius of each positioning piece is smaller than that of the upper pressing roller.
The positioning piece is provided with a positioning piece, the positioning piece is provided with an outer thread, and the positioning piece is screwed into the inner threads at the two axial ends of the upper pressing roller when the positioning piece and the upper pressing roller are assembled.
The shaft sleeve is radially provided with a spring positioning pin for positioning the upper pressure roller, and the radial inner side of the upper pressure roller is provided with a positioning hole corresponding to the spring positioning pin.
Through the technical scheme, the utility model has the following beneficial effects:
1. the components such as the rolling shaft, the shaft sleeve and the like are processed by adopting a Teflon material, and the upper pressing roller in contact with the silicon wafer is processed by adopting modified polypropylene or modified polyethylene with the characteristics of wear resistance, corrosion resistance, self-lubrication and the like, so that the generation of scratches can be reduced when the silicon wafer passes through, and the increased contact area reduces the pressure, so that the film on the surface of the silicon wafer is less prone to damage;
2. the original two-end pressing is changed into the existing two-end pressing with at least three upper pressing rollers in the middle to press the silicon wafer, so that the contact area is increased, the track deviation caused by the floating of the silicon wafer can be better prevented, and the surface film of the silicon wafer is prevented from being scratched.
Drawings
In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings used in the description of the embodiments will be briefly introduced below.
FIG. 1 is a schematic view of an upper pressure wheel assembly disclosed in embodiment 1 of the present invention;
FIG. 2 is an enlarged view of the portion I of FIG. 1;
fig. 3 is an enlarged schematic view of the part I disclosed in embodiment 2 of the present invention.
In the figure: 10. a roller; 20. a shaft sleeve; 30. pressing the roller upwards; 40. positioning plates; 50. a spur gear; 60. and a spring positioning pin.
Detailed Description
The technical solution in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention.
Example 1:
referring to fig. 1-2, the silicon wafer upper pressing roller assembly provided in embodiment 1 includes a teflon roller 10, wherein the length of the roller 10 is greater than the width of the silicon wafer in the moving direction, a teflon shaft sleeve 20 is fixedly sleeved on the axial direction of the roller 10, the length of the shaft sleeve 20 is greater than the width of the silicon wafer in the moving direction, at least three upper pressing rollers 30 are radially sleeved on the shaft sleeve 20, and the upper pressing rollers 30 are axially sleeved on the shaft sleeve 20 in parallel to respectively correspond to two ends and a middle portion of the silicon wafer in the moving direction; both ends of the roller 10 are provided with straight spur gears 50 made of Teflon; the upper pressing roller 30 is made of acid and alkali resistant modified polyethylene, and arc chamfers are arranged at two ends of the radial surface of the upper pressing roller 30 contacting the silicon wafer to prevent the silicon wafer from being scratched.
Wherein, the axial both ends of the upper pressure roller 30 are also provided with the locating plate 40 made of modified polyethylene, the locating plate 40 is arranged on the shaft sleeve 20 in an interference fit manner and locates the upper pressure roller 30, and the radius of the locating plate 40 is smaller than that of the upper pressure roller 30; the axial both ends of going up pressure roller 30 are provided with the internal thread that corresponds locating piece 40, and the inboard of locating piece 40 is provided with the locating piece that has the external screw thread, and when locating piece 40 and last pressure roller 30 equipment, the internal thread at last pressure roller 30 axial both ends is gone into to the locating piece screw thread lock.
In embodiment 1, the components such as the roller 10 and the shaft sleeve 20 are made of teflon, and the upper pressing roller 30 in contact with the silicon wafer is made of modified polyethylene (PE1000) with characteristics of wear resistance, corrosion resistance, self-lubrication, and the like, so that scratches can be reduced when the silicon wafer passes through, and the increased contact area reduces pressure, so that a film on the surface of the silicon wafer is less prone to damage; the original two-end pressure is changed into the existing two-end pressure and at least three upper pressure rollers 30 in the middle to press the silicon wafer, so that the contact area is increased, the track deviation caused by the floating of the silicon wafer can be better prevented, and the surface film of the silicon wafer is prevented from being scratched.
Example 2:
based on embodiment 1 and referring to fig. 3, embodiment 2 is different from embodiment 1 in that a spring positioning pin 60 for positioning the upper pressure roller 30 is provided in the radial direction of the sleeve 20, and a positioning hole corresponding to the spring positioning pin 60 is provided in the radial inner side of the upper pressure roller 30.
The previous description of the disclosed embodiments is provided to enable any person skilled in the art to make or use the present invention. Various modifications to the above-described embodiments will be readily apparent to those skilled in the art, and the generic principles defined herein may be applied to other embodiments without departing from the spirit or scope of the utility model. Thus, the present invention is not intended to be limited to the embodiments shown herein but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.
Claims (4)
1. The silicon wafer upper pressing roller assembly is characterized by comprising a Teflon roller (10), wherein the length of the roller (10) is greater than the width of a silicon wafer in the running direction, a Teflon shaft sleeve (20) is fixedly sleeved on the axial direction of the roller (10), the length of the shaft sleeve (20) is greater than the width of the silicon wafer in the running direction, upper pressing rollers (30) are sleeved on the shaft sleeve (20) in the radial direction of the shaft sleeve (20), at least three upper pressing rollers (30) are axially sleeved on the shaft sleeve (20) in parallel to correspond to the two ends and the middle of the silicon wafer in the running direction respectively; both ends of the rolling shaft (10) are provided with straight toothed spur gears (50) made of Teflon materials;
the upper pressing roller (30) is made of acid and alkali resistant modified polyethylene, and arc-shaped chamfers are arranged at two ends of the radial surface, in contact with the silicon wafer, of the upper pressing roller (30) so as to avoid scratching the silicon wafer.
2. The silicon wafer upper pressing roller assembly according to claim 1, wherein positioning plates (40) made of modified polyethylene are further arranged at two axial ends of the upper pressing roller (30), the positioning plates (40) are arranged on the shaft sleeve (20) in an interference fit mode and are used for positioning the upper pressing roller (30), and the radius of each positioning plate (40) is smaller than that of the upper pressing roller (30).
3. The silicon wafer upper pressing roller assembly according to claim 2, wherein the upper pressing roller (30) is provided at both axial ends thereof with internal threads corresponding to the positioning plate (40), a positioning block having external threads is provided at the inner side of the positioning plate (40), and the positioning block is screwed into the internal threads at both axial ends of the upper pressing roller (30) when the positioning plate (40) and the upper pressing roller (30) are assembled.
4. The silicon wafer upper pressure roller assembly according to claim 1, wherein the bushing (20) is radially provided with a spring positioning pin (60) for positioning the upper pressure roller (30), and a radially inner side of the upper pressure roller (30) is provided with a positioning hole corresponding to the spring positioning pin (60).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202123029780.7U CN216563166U (en) | 2021-12-03 | 2021-12-03 | Silicon chip upper pressing roller assembly |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202123029780.7U CN216563166U (en) | 2021-12-03 | 2021-12-03 | Silicon chip upper pressing roller assembly |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN216563166U true CN216563166U (en) | 2022-05-17 |
Family
ID=81539252
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202123029780.7U Active CN216563166U (en) | 2021-12-03 | 2021-12-03 | Silicon chip upper pressing roller assembly |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN216563166U (en) |
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2021
- 2021-12-03 CN CN202123029780.7U patent/CN216563166U/en active Active
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