CN216544692U

CN216544692U - Hot pressing die structure and hot bending equipment

Info

Publication number: CN216544692U
Application number: CN202122993909.XU
Authority: CN
Inventors: 蒋成超; 陈优敏
Original assignee: Guangdong Sanchao Intelligent Equipment Co ltd
Current assignee: Guangdong Sanchao Intelligent Equipment Co ltd
Priority date: 2021-11-30
Filing date: 2021-11-30
Publication date: 2022-05-17
Anticipated expiration: 2031-11-30

Abstract

The utility model provides a hot-pressing die structure and hot-bending equipment, which are technically characterized in that: the hot-pressing die structure comprises a die body and a cold-hot device, wherein the cold-hot device is arranged corresponding to the die body, and the cold-hot device comprises a semiconductor refrigerating piece which can heat and refrigerate the die body. The hot end of the semiconductor refrigerating sheet is adopted to heat the die body for hot pressing, and under the condition of keeping the closing pressure of the die body, the current direction of the semiconductor refrigerating sheet is switched, so that the hot end can be switched into the cold end, the die body is rapidly cooled, the production efficiency is greatly improved, and the energy consumption can be reduced.

Description

Hot pressing die structure and hot bending equipment

Technical Field

The utility model relates to the technical field of hot press forming, in particular to a hot press die structure and hot bending equipment.

Background

The curved surface protective film corresponding to the curved surface screen mobile phone in the market is generally made of thermoplastic materials such as PC, PET or other flexible composite materials, and the production process adopts a hot-press forming mode to hot-press a plane film into a curved surface film. In the production process, after the hot pressing and shaping of the hot pressing die are completed, if the die is directly opened, the curved surface film can be subjected to stress contraction deformation, the die can be opened and taken out after the curved surface film is cooled under the condition of keeping the pressing force of the die, the natural cooling time of the hot pressing die is too long, the hot pressing die is cooled by a cold water circulating device in the currently adopted mode, but the cooling mode needs to rapidly cool a hotter heating plate, but the hot pressing die needs to be heated to the set temperature again before the next hot pressing for the next hot pressing production, and the mode has low production efficiency and high energy waste.

SUMMERY OF THE UTILITY MODEL

The utility model aims to provide a hot-pressing die structure which can improve hot-pressing production efficiency and is lower in energy consumption, and hot-bending equipment.

In order to realize the purpose, the technical scheme adopted by the utility model is as follows:

the utility model provides a hot pressing die structure, includes the mould body, and with the cold and hot device that the mould body corresponds the setting, cold and hot device is including can be right the mould body heats and refrigerated semiconductor refrigeration piece.

In a preferred mode, the cooling and heating device is arranged on the outer surface of the die body and comprises a mounting plate fixed with the die body, and the semiconductor refrigerating sheet is clamped between the mounting plate and the die body. Further, the semiconductor refrigeration piece comprises a plurality of blocks which are arranged in a matrix. Furthermore, a supporting part adaptive to the thickness of the semiconductor chilling plate is arranged between the mounting plate and the die body.

In a preferred mode, the cooling and heating device is further provided with a liquid cooling structure. Further, the liquid cooling structure is including locating the guiding gutter of mounting panel lateral surface to and the lid fits the water conservancy diversion apron of mounting panel lateral surface.

In a preferable mode, the mold body comprises a male mold and a female mold, and the cooling and heating device comprises two groups fixed on the outer side surfaces of the male mold and the female mold.

The utility model provides a hot bending equipment for the curved surface membrane of hot bending shaping cell-phone, includes the board, foretell hot pressing mould structure, and drive the drive arrangement that hot pressing mould structure opened and shut.

The beneficial effects are that: the hot end of the semiconductor refrigerating sheet is adopted to heat the die body for hot pressing, and under the condition of keeping the closing pressure of the die body, the current direction of the semiconductor refrigerating sheet is switched, so that the hot end can be switched into the cold end, the die body is rapidly cooled, the production efficiency is greatly improved, and the energy consumption can be reduced.

Drawings

The present invention will be described in further detail with reference to the following drawings and specific examples.

FIG. 1 is an exploded view of a hot press mold according to an embodiment;

FIG. 2 is an exploded view of the cooling and heating device in the embodiment;

FIG. 3 is a schematic diagram of the inner side surface of the mounting plate in the embodiment;

fig. 4 is a schematic view of the overall structure of the hot press mold in the embodiment.

Detailed Description

The utility model is further described below with reference to the accompanying drawings:

referring to fig. 1 to 4, the present embodiment is described with a hot bending apparatus for hot bending a curved film of a mobile phone, including a machine, a hot pressing mold structure, and a driving device for driving the hot pressing mold structure to open and close. The hot-pressing die structure comprises a die body 1 and a cold-hot device 2 correspondingly arranged on the die body 1, wherein the cold-hot device 2 comprises a semiconductor refrigerating piece 21 which can heat and refrigerate the die body 1. The mold body 1 comprises a male mold 11 and a female mold 12, and the cold and hot device 2 comprises two groups which are fixed on the outer side surfaces of the male mold 11 and the female mold 12. In other embodiments, the mold body 1 may be divided into four parts, and the cooling and heating device 2 may be disposed corresponding to one or more of the plural parts of the mold body 1. Adopt semiconductor refrigeration piece 21's hot junction to heat mould body 1 in order to carry out the hot pressing, under the condition that keeps mould body 1 closing pressure, switch semiconductor refrigeration piece 21's current direction, can make the hot junction switch into the cold junction, to the quick cooling of mould body 1, greatly improved production efficiency, and can reduce the energy consumption.

The cooling and heating device 2 is arranged on the outer surface of the die body 1 and comprises a mounting plate 22 fixed with the die body 1, and the semiconductor refrigerating sheet 21 is clamped between the mounting plate 22 and the die body 1 and is usually fixed on the inner side surface of the mounting plate 22. The installation plate 22 is arranged on the cooling and heating device 2, so that the semiconductor chilling plates 21 can be conveniently installed and maintained. In other embodiments, the semiconductor chilling plate 21 may also be directly fixed on the outer side surface of the mold body 1. Further, the semiconductor chilling plate 21 comprises a plurality of blocks arranged in a matrix. The number of the semiconductor refrigerating pieces 21 is determined according to the power required by hot pressing, and the semiconductor refrigerating pieces are uniformly distributed in a serial or parallel mode. Further, a supporting portion 221 adapted to the thickness of the semiconductor chilling plate 21 is provided between the mounting plate 22 and the mold body 1. The supporting part 221 adapted to the thickness of the semiconductor refrigerating sheet 21 is arranged to protect the semiconductor refrigerating sheet 21 and prevent the ceramic sheet from being crushed. The supporting portion 221 is usually provided integrally with the mounting plate 22, and in other embodiments, the supporting portion 221 may be provided on the mold body 1, or on both the mounting plate 22 and the mold body 1.

The cooling and heating device 2 is also provided with a liquid cooling structure 23. The liquid cooling structure is including locating the guiding gutter 231 of mounting panel 22 lateral surface to and the lid fits the water conservancy diversion apron 232 of mounting panel 22 lateral surface. The liquid cooling structure 23 can be used for heat dissipation of the hot end of the semiconductor refrigeration sheet 21, and the temperature of the hot end is reduced in an active heat dissipation mode, so that the temperature of the cold end is correspondingly reduced, the lower temperature is achieved, and the production efficiency can be further improved. The guiding gutter 231 is directly arranged on the mounting plate 22, and the heat dissipation effect is good. When the cooling device is used, cooling liquid enters and exits from the flow guide cover plate 232, so that the cooling liquid circularly flows in the flow guide groove 231. In other embodiments, other cooling structures may be provided, such as by making the mounting plate 22 thin and the channels 231 on the shroud 232.

The above description is not intended to limit the technical scope of the present invention, and any modification, equivalent change and modification of the above embodiments according to the technical spirit of the present invention are still within the technical scope of the present invention.

Claims

1. The utility model provides a hot pressing die structure which characterized in that: including the mould body, and with the cold and hot device that the mould body corresponds the setting, cold and hot device is including can be right the mould body heats and refrigerated semiconductor refrigeration piece.

2. A hot press die structure according to claim 1, wherein: the cold and hot device is arranged on the outer surface of the die body and comprises a mounting plate fixed with the die body, and the semiconductor refrigerating sheet is clamped between the mounting plate and the die body.

3. A hot press die structure according to claim 2, wherein: the semiconductor refrigerating piece comprises a plurality of pieces which are arranged in a matrix.

4. A hot press die structure according to claim 3, wherein: and a supporting part adaptive to the thickness of the semiconductor chilling plate is arranged between the mounting plate and the die body.

5. A hot press die structure according to claim 4, wherein: the cold and hot device is also provided with a liquid cooling structure.

6. A hot press die structure according to claim 5, wherein: the liquid cooling structure is including locating the guiding gutter of mounting panel lateral surface to and the lid fits the water conservancy diversion apron of mounting panel lateral surface.

7. A hot press die structure according to any one of claims 1 to 6, wherein: the mold body comprises a male mold and a female mold, and the cold and hot devices comprise two groups which are fixed on the outer side surfaces of the male mold and the female mold.

8. A hot bending device is used for hot bending a curved mask of a mobile phone, and is characterized in that: the hot-pressing die structure comprises a machine table, the hot-pressing die structure according to any one of claims 1 to 7, and a driving device for driving the hot-pressing die structure to open and close.