CN216540779U - Split type mould of large-scale communication piece of 5G - Google Patents
Split type mould of large-scale communication piece of 5G Download PDFInfo
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- CN216540779U CN216540779U CN202122557570.9U CN202122557570U CN216540779U CN 216540779 U CN216540779 U CN 216540779U CN 202122557570 U CN202122557570 U CN 202122557570U CN 216540779 U CN216540779 U CN 216540779U
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Abstract
The utility model discloses a split die for a 5G large-scale communication part, which belongs to the field of dies and comprises a base plate, a movable die sleeve plate and a movable die insert, wherein the movable die insert is arranged in the movable die sleeve plate, the movable die insert comprises at least two inserts, the at least two inserts are spliced and fixed with each other, the split die for the 5G large-scale communication part also comprises a support pillar, the support pillar is fixed on the base plate and supports the movable die sleeve plate, the height of the support pillar is greater than the distance between the base plate and the movable die sleeve plate, in the stamping process, the pressure borne by the movable die insert is transmitted to the support pillar, and the support pillar is higher in height design and is flush with a cushion block after slight deformation, so that support is provided for an insert movable die, the movable die insert is prevented from deforming due to split design and impact force, and the deformation of a product is avoided.
Description
Technical Field
The utility model relates to the field of dies, in particular to a split die for a 5G large-scale communication piece.
Background
In the high-pressure casting technique, since a product is cast at a high temperature, the demand for a casting mold is extremely high. The selection of the die material needs to have good temperature resistance and overall performance, but the die material is very expensive, and enterprises need to invest in mass production cost; many products are quite complex in shape, resulting in high production costs for the corresponding molds.
Some die manufacturers design the insert of the die into a split type, so that the cost is reduced, but the split type design causes the deformation of the product due to the reduction of the die rigidity.
SUMMERY OF THE UTILITY MODEL
In order to overcome the defects of the prior art, the utility model aims to provide a split mold for a 5G large-scale communication part.
One of the purposes of the utility model is realized by adopting the following technical scheme:
the utility model provides a large-scale communication piece split type mould of 5G, includes that bottom plate, movable mould lagging and movable mould insert, the movable mould insert install in the movable mould lagging, the movable mould insert including at least two insert, at least two it is fixed to insert each other the concatenation, large-scale communication piece split type mould of 5G still includes the support column, the support column is fixed in the bottom plate supports the movable mould lagging, the height of support column is greater than the bottom plate with distance between the movable mould lagging.
Furthermore, the split type die for the 5G large-scale communication parts further comprises a cushion block, the cross section of the cushion block is shaped like a Chinese character 'hui', the cushion block is fixed on the bottom plate, the top of the cushion block is in contact with the movable die sleeve plate, and the cushion block supports the movable die sleeve plate.
Further, the supporting column is located in the hollow portion of the cushion block.
Further, the supporting column is perpendicular to the bottom plate.
Furthermore, the number of the supporting columns is multiple, and the height of the supporting columns in the middle of the bottom plate is larger than the height of the supporting columns on two sides of the bottom plate.
Furthermore, the height of the support column positioned in the middle of the bottom plate is 0.3mm larger than the distance between the bottom plate and the movable die sleeve plate, and the height of the support column positioned on the side part of the bottom plate is 0.15mm larger than the distance between the bottom plate and the movable die sleeve plate.
Further, the cross section of the support column is circular or rectangular.
Furthermore, the split type die for the 5G large-sized communication part further comprises a fixing plate and a plurality of push rods fixed on the fixing plate, the fixing plate is located between the base plate and the movable die sleeve plate, and the push rods stretch into the movable die sleeve plate and the movable die insert.
Compared with the prior art, the movable die insert of the split die for the 5G large-scale communication parts comprises at least two inserts, the at least two inserts are spliced and fixed with each other, the supporting column is fixed on the base plate and supports the movable die sleeve plate, the height of the supporting column is larger than the distance between the base plate and the movable die sleeve plate, in the stamping process, the pressure borne by the movable die insert is transmitted to the supporting column, and the supporting column is higher in height design and is just level to the cushion block after slight deformation, so that support is provided for the movable die insert, the movable die insert is prevented from being deformed due to split design and impact force, and deformation of products is avoided.
Drawings
FIG. 1 is a perspective view of a split mold for a 5G large-scale communication part according to the present invention;
fig. 2 is a partial structure perspective view of the split mold for the 5G large-scale communication part of fig. 1;
fig. 3 is a sectional view of the split mold for the 5G large-sized communication member of fig. 1.
In the figure: 21. a movable die sleeve plate; 22. a movable die insert; 220. a fourth insert; 221. a fifth insert; 222. a sixth insert; 23. cushion blocks; 24. a base plate; 25. a support pillar; 26. a fixing plate; 27. a push rod.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
It will be understood that when an element is referred to as being "secured to" another element, it can be directly on the other element or intervening elements may also be present, secured by intervening elements. When a component is referred to as being "connected" to another component, it can be directly connected to the other component or intervening components may also be present. When an element is referred to as being "disposed on" another element, it can be directly disposed on the other element or intervening elements may also be present. The terms "vertical," "horizontal," "left," "right," and the like as used herein are for illustrative purposes only.
Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. The terminology used in the description of the utility model herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the utility model. As used herein, the term "and/or" includes any and all combinations of one or more of the associated listed items.
Fig. 1 to 3 show a split mold for a 5G large-scale communication part according to the present invention, wherein the split mold for a 5G large-scale communication part comprises a movable mold sleeve plate 21, a movable mold insert 22, a spacer 23, a bottom plate 24, a support pillar 25, a fixed plate 26 and a push rod 27.
The movable die insert 22 is mounted on the movable die sleeve plate 21. The movable die insert 22 is of a split structure, and the movable die insert 22 comprises a plurality of inserts. In the present embodiment, the movable die insert 22 includes a fourth insert 220, a fifth insert 221 and a sixth insert 222. The fourth insert 220, the fifth insert 221 and the sixth insert 222 are connected to each other. The fifth insert 221 is located between the fourth insert 220 and the sixth insert 222.
The cushion block 23 is fixed on the edge of the bottom plate 24, and the movable die sleeve plate 21 is fixed on the cushion block 23. The cross section of the cushion block 23 is in a shape of Chinese character 'hui'.
The supporting column 25 is fixed on the bottom plate 24 and is positioned in the hollow part of the cushion block 23. The supporting columns 25 are perpendicular to the bottom plate 24 and support the movable die sleeve plate 21 to prevent the middle of the movable die sleeve plate 21 from being suspended, and the integral rigidity of the die is enhanced. The height of the support pillar 25 is larger than the distance between the bottom plate 24 and the movable die sleeve plate 21, and the height of the support pillar 25 located at the center of the bottom plate 24 is larger than the height of the support pillar 25 located at the side of the bottom plate 24. Because the middle part of the movable die insert 22 is easier to deform during die casting, the supporting column 25 corresponding to the middle part of the movable die insert 22 needs to be higher. Specifically, the height of the support column 25 in the middle part is 0.3mm greater than the distance between the bottom plate 24 and the movable die sleeve plate 21. The height of the side supporting column 25 is 0.15mm larger than the distance between the bottom plate 24 and the movable die sleeve plate 21. The height of the support columns 25 in the middle is 0.15mm greater than the height of the support columns 25 in the sides.
When the split die for the 5G large-scale communication part is used, the product is positioned on the movable die insert 22. In the casting process, the pressure that the movable mould insert 22 received is transmitted to the support column 25, because the high design of support column 25 is higher, just in time flush with cushion 23 after slightly warping, provides the support for movable mould insert 22, prevents because the movable mould insert 22 that split type design and impact force's reason lead to warp, avoids product deformation.
The movable die insert 22 of the split die for the 5G large-scale communication parts comprises a plurality of inserts, and the movable die insert 22 is designed into a split mode, so that the manufacturing difficulty and the production cost of the die are reduced; the supporting column 25 is fixed on the bottom plate 24 and supports the movable die sleeve plate 21, so that the rigidity of the split type die of the 5G large-scale communication piece is enhanced, and the product deformation is prevented.
The above examples only show some embodiments of the present invention, and the description thereof is more specific and detailed, but not to be construed as limiting the scope of the utility model. It should be noted that, for those skilled in the art, variations and modifications can be made without departing from the spirit of the utility model, and all equivalent modifications and changes can be made to the above embodiments according to the essential technology of the utility model, which falls into the protection scope of the utility model.
Claims (8)
1. The utility model provides a large-scale communication piece split type mould of 5G, includes bottom plate, movable mould lagging and movable mould insert, the movable mould insert install in the movable mould lagging, its characterized in that: the split type die for the 5G large-scale communication parts further comprises supporting columns, the supporting columns are fixed on the bottom plate and support the movable die sleeve plate, and the height of each supporting column is larger than the distance between the bottom plate and the movable die sleeve plate.
2. The split mold for 5G large-sized communication parts according to claim 1, wherein: the split type die for the 5G large-scale communication parts further comprises a cushion block, the cross section of the cushion block is shaped like a Chinese character 'hui', the cushion block is fixed on the bottom plate, the top of the cushion block is in contact with the movable die sleeve plate, and the cushion block supports the movable die sleeve plate.
3. The split mold for 5G large-sized communication parts according to claim 2, wherein: the supporting column is located in the hollow portion of the cushion block.
4. The split mold for 5G large-sized communication parts according to claim 1, wherein: the support column is perpendicular to the bottom plate.
5. The split mold for 5G large-sized communication parts according to claim 1, wherein: the number of the supporting columns is multiple, and the height of the supporting columns in the middle of the bottom plate is larger than the height of the supporting columns on two sides of the bottom plate.
6. The split mold for 5G large-sized communication parts according to claim 5, wherein: the height of the support column positioned in the middle of the bottom plate is 0.3mm larger than the distance between the bottom plate and the movable die sleeve plate, and the height of the support column positioned on the side part of the bottom plate is 0.15mm larger than the distance between the bottom plate and the movable die sleeve plate.
7. The split mold for 5G large-sized communication parts according to claim 5, wherein: the cross section of the support column is circular or rectangular.
8. The split mold for 5G large-sized communication parts according to claim 1, wherein: the split type die for the 5G large-scale communication parts further comprises a fixing plate and a plurality of push rods fixed on the fixing plate, the fixing plate is located between the base plate and the movable die sleeve plate, and the push rods stretch into the movable die sleeve plate and the movable die insert.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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CN202122557570.9U CN216540779U (en) | 2021-10-21 | 2021-10-21 | Split type mould of large-scale communication piece of 5G |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
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CN202122557570.9U CN216540779U (en) | 2021-10-21 | 2021-10-21 | Split type mould of large-scale communication piece of 5G |
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CN216540779U true CN216540779U (en) | 2022-05-17 |
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CN202122557570.9U Active CN216540779U (en) | 2021-10-21 | 2021-10-21 | Split type mould of large-scale communication piece of 5G |
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2021
- 2021-10-21 CN CN202122557570.9U patent/CN216540779U/en active Active
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