CN216540523U - Stamping die structure with buffer protection function - Google Patents
Stamping die structure with buffer protection function Download PDFInfo
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- CN216540523U CN216540523U CN202122958396.9U CN202122958396U CN216540523U CN 216540523 U CN216540523 U CN 216540523U CN 202122958396 U CN202122958396 U CN 202122958396U CN 216540523 U CN216540523 U CN 216540523U
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Abstract
The utility model relates to the field of stamping dies, and particularly discloses a stamping die structure with a buffer protection function, which comprises a base, wherein a lower section die is arranged on the upper surface of the base, a female die is arranged inside the lower section die, an elastic rotating shaft is arranged on one side of the upper surface of the female die, a buffer plate is arranged at one end of the elastic rotating shaft, a telescopic rod is arranged on one side, located on the lower section die, of the base, a spring is arranged inside the telescopic rod, a buffer seat is arranged on the upper surface of the spring, buffer rubber is arranged on the upper surface of the buffer seat, a supporting rod is arranged at the upper end of the buffer rubber, an upper die plate is connected to the upper end of the supporting rod, and a male die fixing plate is arranged on the lower surface of the upper die plate. Through setting up the buffer board in die upper surface one side, can play the effect of buffering to punch plate, reduced the impact of mould to the material when the compound die, also can play spacing effect to the terrace die simultaneously.
Description
Technical Field
The utility model relates to the field of stamping dies, in particular to a stamping die structure with a buffer protection function.
Background
The stamping is a press working method which uses a die mounted on a press machine to apply pressure to a material at room temperature to separate or plastically deform the material so as to obtain a required part.
However, in the existing stamping die on the market, certain impact force exists during die assembly, so that impact damage to materials during die assembly is increased.
SUMMERY OF THE UTILITY MODEL
Aiming at the existing problems, the utility model provides a stamping die structure with a buffer protection function, and the device can effectively solve the problems in the background technology.
In order to solve the problems, the utility model adopts the following technical scheme:
the utility model provides a stamping die structure with buffering protect function, the upper surface of base is provided with down the section mould, the inside of lower section mould is provided with the die, upper surface one side of die is provided with the elasticity pivot, the buffer board is installed to the one end of elasticity pivot, the base is located and keeps away from down section mould one side and is provided with the telescopic link, the inside spring that is provided with of telescopic link, the upper surface of spring is provided with the buffer seat, the upper surface of buffer seat is provided with cushion rubber, branch is installed to cushion rubber's upper end.
As a still further scheme of the utility model: an upper template is arranged on the outer surface of the upper end of the supporting rod.
As a still further scheme of the utility model: and a male die fixing plate is arranged on the lower surface of the upper die plate.
As a still further scheme of the utility model: and a male die is arranged at the lower end of the male die fixing plate.
As a still further scheme of the utility model: the base is located and keeps away from one side of telescopic link installs the support column.
As a still further scheme of the utility model: the outer surface of the upper end of the supporting column is provided with a sleeve.
As a still further scheme of the utility model: an upper template is arranged on the outer surface of the sleeve.
Compared with the prior art, the utility model has the beneficial effects that:
1. the buffer plate arranged on one side of the upper surface of the female die can buffer the male die fixing plate, so that the impact of the die in die assembly is reduced, the male die can be limited, and the damage to materials in die assembly is reduced.
2. Move to the inner chamber of telescopic link through branch to extrude buffer spring atress deformation to buffer spring, cushion rubber and buffer seat cushion lower section mould and cope match-plate pattern, impact force to the production of stamping die when reducing the punching press, thereby increased the life-span of punching press through the mould.
Drawings
FIG. 1 is a structural diagram of a stamping die structure with a buffer protection function;
FIG. 2 is a cross-sectional view of a stamping die structure with a cushioning protection function;
FIG. 3 is a structure diagram of a telescopic rod of a stamping die structure with a buffer protection function;
fig. 4 is a structural diagram of a buffer plate with a buffer protection function in a stamping die structure.
In the figure: 1. a base; 2. a support pillar; 3. mounting a template; 4. a male die; 5. a male die fixing plate; 6. a sleeve; 7. a strut; 8. a telescopic rod; 9. a cushion rubber; 10. a buffer seat; 11. a buffer spring; 12. a buffer plate; 13. an elastic rotating shaft; 14. a female die; 15. and (4) a lower die.
Detailed Description
The utility model is further described below in connection with specific embodiments.
As shown in fig. 1-4, in this embodiment, the embodiment is described with reference to fig. 1 to 4, and this embodiment provides a stamping die structure with a buffer protection function, which includes a base 1, a supporting pillar 2 is installed on one side of the base 1, which is located on a telescopic rod 8, a sleeve 6 is installed on an upper outer surface of the supporting pillar 2, an upper die plate 3 is installed on an outer surface of the sleeve 6, an upper die plate 3 is connected to an upper end of a supporting rod 7, a punch plate 5 is installed on a lower surface of the upper die plate 3, a punch 4 is installed at a lower end of the punch plate 5, a lower die 15 is installed on an upper surface of the base 1, when working, a worker puts a material to be stamped into the die, a switch is activated, the sleeve 6 installed on an upper outer surface of the supporting pillar 2, which is installed on one side of the telescopic rod 8, of the base 1 starts to move downwards, the sleeve 6 moves downwards to drive the upper die plate 3 installed on an outer surface of the sleeve 6 to move downwards, the upper die plate 3 moves downwards to drive the punch retainer 5 arranged on the lower surface of the upper die plate 3 to move downwards, the punch retainer 5 moves downwards to drive the punch 4 arranged on the lower surface of the punch retainer 5 to move downwards, the lower die 15 is internally provided with a female die 14, one side of the upper surface of the female die 14 is provided with an elastic rotating shaft 13, one end of the elastic rotating shaft 13 is provided with a buffer plate 12, when the punch 4 moves downwards to the female die 14 arranged in the lower die 15, the punch 4 presses one side of the buffer plate 12 arranged on one side of the upper surface of the female die 14 downwards, the other side of the buffer plate 12 tilts, after the punching is finished, the punch 4 moves upwards, the buffer plate 12 returns to the original position through the elastic rotating shaft 13 connected between the buffer plate 12 and the female die 14, the buffer plate 12 arranged on one side of the upper surface of the female die 14 can play a role in buffering for the punch retainer 5, and the impact of the die during die assembly is reduced, the die assembly accuracy is improved, meanwhile, the punch 4 can be limited, the punching accuracy is improved, the base 1 is provided with a telescopic rod 8 at one side of a lower die 15, a buffer spring 11 is arranged inside the telescopic rod 8, the upper surface of the buffer spring 11 is provided with a buffer seat 10, the upper surface of the buffer seat 10 is provided with buffer rubber 9, the upper end of the buffer rubber 9 is provided with a support rod 7, the upper end of the support rod 7 is connected with an upper die plate 3, when the upper die plate 3 moves downwards, the support rod 7 arranged at the lower end of the upper die plate 3 also moves downwards, the support rod 7 moves downwards to drive the buffer rubber 9 connected with the lower end of the support rod 7 to move downwards, when the buffer rubber 9 moves downwards, the buffer seat 10 arranged at the lower end of the buffer rubber 9 is driven to move downwards, when the buffer seat 10 moves downwards, the buffer spring 11 at the lower end of the buffer seat 10 is extruded to move downwards, and moves towards the inner cavity of the telescopic rod 8 through the support rod 7, and the buffer spring 11 is extruded to deform under stress, the buffer rubber 9 and the buffer seat 10 buffer the lower die 15 and the upper die plate 3, and the impact force generated on the stamping die during stamping is reduced, so that the service life of the stamping die is prolonged.
The working principle of the utility model is as follows: when the stamping die works, a worker puts a material to be stamped into the die, the switch is started, the sleeve 6 arranged on the outer surface of the upper end of the supporting column 2 arranged on one side of the base 1 positioned on the telescopic rod 8 starts to move downwards, the sleeve 6 moves downwards to drive the upper die plate 3 arranged on the outer surface of the sleeve 6 to move downwards, the upper die plate 3 moves downwards to drive the punch plate 5 arranged on the lower surface of the upper die plate 3 to move downwards, the punch plate 5 moves downwards to drive the punch 4 arranged on the lower surface of the punch plate 5 to move downwards, when the punch 4 moves downwards to the female die 14 arranged in the lower die 15, the punch 4 presses downwards one side of the buffer plate 12 arranged on one side of the upper surface of the female die 14, the other side of the buffer plate 12 tilts up, after the stamping, the punch 4 moves upwards, the buffer plate 12 returns to the original position through the elastic rotating shaft 13 connected between the buffer plate 12 and the female die 14, and returns to the buffer plate 12 arranged on one side of the upper surface of the female die 14, the buffering mechanism has the advantages that the buffering function can be realized on the punch retainer plate 5, the impact of a die in die assembly is reduced, the die assembly accuracy is improved, the limit function can be realized on the punch 4, the stamping accuracy is improved, when the upper die plate 3 moves downwards, the supporting rod 7 arranged at the lower end of the upper die plate 3 also moves downwards, the supporting rod 7 moves downwards to drive the buffering rubber 9 connected with the lower end of the supporting rod 7 to move downwards, the buffering seat 10 arranged at the lower end of the buffering rubber 9 is driven to move downwards when the buffering rubber 9 moves downwards, the buffering spring 11 arranged at the lower end of the buffering seat 10 moves downwards when the buffering seat 10 moves downwards, the buffering spring 11 arranged at the lower end of the buffering seat 10 moves downwards, the buffering spring 11 moves towards the inner cavity of the telescopic rod 8 through the supporting rod 7 and extrudes the buffering spring 11 to deform under the stress, the buffering rubber 9 and the buffering seat 10 buffer the lower die 15 and the upper die plate 3, and the impact force generated by a stamping die in stamping process is reduced, thereby increasing the life of the stamping die.
The above description is only for the preferred embodiment of the present invention, but the scope of the present invention is not limited thereto, and any person skilled in the art should be considered to be within the scope of the present invention, and the technical solutions and the utility model concepts of the present invention are equivalent to or changed within the scope of the present invention.
Claims (7)
1. The utility model provides a stamping die structure with buffering protect function, includes base (1), its characterized in that, the upper surface of base (1) is provided with down section mould (15), the inside of down section mould (15) is provided with die (14), upper surface one side of die (14) is provided with elasticity pivot (13), buffer board (12) are installed to the one end of elasticity pivot (13), base (1) is located to keep away from down section mould (15) one side and is provided with telescopic link (8), telescopic link (8) inside is provided with buffer spring (11), the upper surface of buffer spring (11) is provided with buffer seat (10), the upper surface of buffer seat (10) is provided with buffer rubber (9), branch (7) are installed to the upper end of buffer rubber (9).
2. The structure of a punching die with the function of buffering protection according to claim 1, characterized in that the upper outer surface of the supporting rod (7) is provided with an upper template (3).
3. The structure of a punching die with the function of buffering protection according to claim 2, characterized in that the lower surface of the upper die plate (3) is provided with a punch holder (5).
4. A stamping die structure with buffer protection function as claimed in claim 3, characterized in that the lower end of the punch retainer (5) is mounted with a punch (4).
5. The structure of a punching die with the function of buffering protection according to claim 1, characterized in that the base (1) is provided with a supporting column (2) at the side far away from the telescopic rod (8).
6. The structure of a punching die with the function of buffering protection according to claim 5, characterized in that the upper outer surface of the supporting column (2) is provided with a sleeve (6).
7. The structure of a punching die with the function of buffering protection according to claim 6, characterized in that the outer surface of the sleeve (6) is provided with an upper die plate (3).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202122958396.9U CN216540523U (en) | 2021-11-27 | 2021-11-27 | Stamping die structure with buffer protection function |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202122958396.9U CN216540523U (en) | 2021-11-27 | 2021-11-27 | Stamping die structure with buffer protection function |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN216540523U true CN216540523U (en) | 2022-05-17 |
Family
ID=81577356
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202122958396.9U Active CN216540523U (en) | 2021-11-27 | 2021-11-27 | Stamping die structure with buffer protection function |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN216540523U (en) |
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2021
- 2021-11-27 CN CN202122958396.9U patent/CN216540523U/en active Active
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