CN216531904U - Circuit board stacking structure - Google Patents
Circuit board stacking structure Download PDFInfo
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- CN216531904U CN216531904U CN202122729633.4U CN202122729633U CN216531904U CN 216531904 U CN216531904 U CN 216531904U CN 202122729633 U CN202122729633 U CN 202122729633U CN 216531904 U CN216531904 U CN 216531904U
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- conductive
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- circuit board
- circuit
- conductive trace
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- 238000003466 welding Methods 0.000 claims abstract description 18
- 239000010410 layer Substances 0.000 claims description 149
- 239000011241 protective layer Substances 0.000 claims description 3
- 238000000034 method Methods 0.000 abstract 1
- 239000000463 material Substances 0.000 description 5
- 238000004806 packaging method and process Methods 0.000 description 4
- 239000004743 Polypropylene Substances 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- -1 polypropylene Polymers 0.000 description 3
- 229920001155 polypropylene Polymers 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 239000004642 Polyimide Substances 0.000 description 2
- 239000004721 Polyphenylene oxide Substances 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 239000003822 epoxy resin Substances 0.000 description 2
- 238000002161 passivation Methods 0.000 description 2
- 229920000647 polyepoxide Polymers 0.000 description 2
- 229920000139 polyethylene terephthalate Polymers 0.000 description 2
- 239000005020 polyethylene terephthalate Substances 0.000 description 2
- 229920001721 polyimide Polymers 0.000 description 2
- 229920006380 polyphenylene oxide Polymers 0.000 description 2
- 230000000694 effects Effects 0.000 description 1
- 239000011112 polyethylene naphthalate Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
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Abstract
The application provides a circuit board stack structure, includes: the radio frequency circuit board comprises a first medium layer, a first conductive circuit layer and a second conductive circuit layer which are positioned on two opposite surfaces of the first medium layer, and a plurality of third conductive circuit layers positioned in the first medium layer, wherein the first conductive circuit layer comprises a first welding pad, one of the third conductive circuit layers comprises a grounding wire, and a containing groove is formed in the radio frequency circuit board; the mainboard comprises a second dielectric layer, and a fourth conductive circuit layer and a fifth conductive circuit layer which are positioned on two opposite surfaces of the second dielectric layer, wherein the fourth conductive circuit layer comprises a second welding pad and a third welding pad, and the second welding pad is electrically connected with the first welding pad; and the component is accommodated in the accommodating groove and is electrically connected with the third welding pad. The method and the device can improve the yield of the circuit board stacked structure.
Description
Technical Field
The application relates to the field of circuit boards, in particular to a circuit board superposition structure.
Background
The existing circuit board stack structure generally includes a radio frequency circuit board (RF board), a frame board (FB board), and a main board (MLB board). In the manufacturing process of the circuit board stack structure, the elements are packaged on the MLB board, then the FB board is packaged on the MLB board, and finally the RF board is packaged. The manufacturing process needs three times of high-temperature packaging, and has higher heat resistance requirement on the material. Meanwhile, since the manufacturing process needs to be aligned for many times, the dimensional accuracy of the RF board, the FB board, and the MLB board is also required to be high. In addition, the yield of the circuit board stacking structure is easily reduced by multiple times of packaging.
SUMMERY OF THE UTILITY MODEL
In view of the above, the present application provides a circuit board stacking structure capable of solving at least one of the above problems.
An embodiment of the present application provides a circuit board stack structure, includes:
the radio frequency circuit board comprises a first medium layer, a first conductive circuit layer and a second conductive circuit layer which are positioned on two opposite surfaces of the first medium layer, and a plurality of third conductive circuit layers positioned in the first medium layer, wherein the first conductive circuit layer comprises a first welding pad, one of the third conductive circuit layers comprises a grounding wire, and an accommodating groove is formed in the radio frequency circuit board;
the mainboard comprises a second dielectric layer, and a fourth conductive circuit layer and a fifth conductive circuit layer which are positioned on two opposite surfaces of the second dielectric layer, wherein the fourth conductive circuit layer comprises a second welding pad and a third welding pad, and the second welding pad is electrically connected with the first welding pad; and
and the component is accommodated in the accommodating groove and is electrically connected with the third welding pad.
In some possible embodiments, the receiving groove penetrates through the first conductive trace layer and at least one of the third conductive trace layers, and a bottom of the receiving groove corresponds to the ground line.
In some possible embodiments, a first conductive part and a second conductive part are disposed in the radio frequency circuit board, the first conductive part is configured to electrically connect the first conductive circuit layer and the third conductive circuit layer adjacent to the first conductive circuit layer, electrically connect the second conductive circuit layer and the third conductive circuit layer adjacent to the second conductive circuit layer, and electrically connect two of the third conductive circuit layers adjacent to a portion, and the second conductive part is configured to electrically connect two of the third conductive circuit layers adjacent to a portion.
In some possible embodiments, a third conductive trace layer adjacent to the first conductive trace layer includes the grounding line, the receiving groove penetrates through the first conductive trace layer, and a bottom of the receiving groove corresponds to the grounding line.
In some possible embodiments, a first conductive circuit layer and a second conductive circuit layer are disposed in the radio frequency circuit board, the first conductive circuit layer is configured to electrically connect the second conductive circuit layer and the third conductive circuit layer adjacent to the second conductive circuit layer, and electrically connect two adjacent third conductive circuit layers, and the second conductive circuit layer is configured to electrically connect the first conductive circuit layer, the second conductive circuit layer, and the third conductive circuit layer.
In some possible embodiments, the rf circuit board further includes a first protection layer, and the first protection layer is located on an inner wall and a bottom surface of the receiving groove.
In some possible embodiments, the depth of the receiving groove is 0.8-1.3mm, and the ratio of the cross-sectional area of the receiving groove to the cross-sectional area of the radio frequency circuit board is 80-95%.
In some possible embodiments, the circuit board stacking structure further includes a conductive member, and the conductive member is used for electrically connecting the first bonding pad and the second bonding pad.
In some possible embodiments, the conductive member is a conductive post.
In some possible embodiments, the main board further includes a sixth conductive trace layer, and the sixth conductive trace layer is located in the second dielectric layer.
In the application, the accommodating groove is formed in the radio frequency circuit board, the components are accommodated in the accommodating groove, a frame plate is prevented from being used for reducing the packaging times, the requirement on the heat resistance of the mainboard can be reduced to a certain extent, and the yield of the circuit board stacking structure can be improved. Simultaneously, this application only need the radio frequency circuit board with the mainboard counterpoints, need not the frame board with the mainboard counterpoints, thereby it is right to have reduced the radio frequency circuit board with the requirement of the master plate size precision, and then improved circuit board stacked structure's yield.
Drawings
Fig. 1 is a cross-sectional view of a radio frequency circuit board provided in a first embodiment of the present application.
Fig. 2 is a cross-sectional view of a circuit board stack structure obtained by connecting the radio frequency circuit board, the main board and the components shown in fig. 1.
Fig. 3 is a cross-sectional view of a radio frequency circuit board provided in a second embodiment of the present application.
Fig. 4 is a cross-sectional view of a circuit board stack structure obtained by connecting the radio frequency circuit board, the main board and the components shown in fig. 3.
Description of the main elements
Circuit board stacking structure 100, 200
Radio frequency circuit boards 10, 13
First dielectric layer 101
First conductive trace layer 102
Second conductive trace layer 103
Third conductive trace layer 104
First conductive parts 11, 14
Second conductive parts 12, 15
First protective layer 30
Second protective layer 31
Second dielectric layer 401
Fourth conductive line layer 402
Fifth conductive trace layer 403
Third conductive part 41
The following detailed description will further illustrate the present application in conjunction with the above-described figures.
Detailed Description
The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application, and it is obvious that the described embodiments are only a part of the embodiments of the present application, and not all of the embodiments.
Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. The terminology used herein in the description of the present application is for the purpose of describing particular embodiments only and is not intended to be limiting of the application.
To further explain the technical means and effects of the present application for achieving the intended purpose, the following detailed description is given to the present application in conjunction with the accompanying drawings and preferred embodiments.
Referring to fig. 1 and fig. 2, a first embodiment of the present application provides a circuit board stacking structure 100, where the circuit board stacking structure 100 includes a radio frequency circuit board 10, a main board 40, and a component 50.
In this embodiment, the rf circuit board 10 includes a first dielectric layer 101, a first conductive trace layer 102 and a second conductive trace layer 103 on two opposite surfaces of the first dielectric layer 101, and a plurality of third conductive trace layers 104 inside the first dielectric layer 101.
The material of the first dielectric layer 101 may be one of epoxy resin (epoxy resin), polypropylene (PP), BT resin, Polyphenylene Oxide (PPO), Polyimide (PI), Polyethylene Terephthalate (PET), Polyethylene Naphthalate (PEN), and the like. In this embodiment, the first dielectric layer 101 is made of polypropylene.
The first conductive trace layer 102 includes a first pad 1021. One of the third conductive trace layers 104 not adjacent to the first conductive trace layer 102 includes a ground line 1041. As shown in fig. 1, only ten of the third conductive trace layers 104 are shown. In practice, the number of the third conductive trace layers 104 in the rf circuit board 10 may be changed as required.
The radio frequency circuit board 10 is provided with a first conductive part 11 and a second conductive part 12. The first conductive circuit layer 11 is configured to electrically connect the first conductive circuit layer 102 and the third conductive circuit layer 104 adjacent to the first conductive circuit layer 102, electrically connect the second conductive circuit layer 103 and the third conductive circuit layer 104 adjacent to the second conductive circuit layer 103, and electrically connect two adjacent third conductive circuit layers 104. The second conductive portion 12 penetrates a portion of the third conductive trace layer 104, i.e., the second conductive portion 12 does not penetrate all of the third conductive trace layer 104. The second conductive part 12 is used for electrically connecting two adjacent third conductive circuit layers 104.
The radio frequency circuit board 10 is provided with a receiving groove 20. The receiving cavity 20 penetrates through the first conductive trace layer 102 and at least one third conductive trace layer 104, and a bottom of the receiving cavity 20 corresponds to the ground line 1041.
In this embodiment, the depth of the receiving groove 20 is 0.8-1.3 mm. In this embodiment, the cross-sectional area of the receiving cavity 20 accounts for 80-95% of the cross-sectional area of the rf circuit board 10.
In this embodiment, the rf circuit board 10 further includes a first protection layer 30 and a second protection layer 31. The first passivation layer 30 is located on the inner wall and the bottom surface of the receiving groove 20, and the second passivation layer 31 is located in the gap of the second conductive trace layer 103.
In this embodiment, the main board 40 includes a second medium layer 401, a fourth conductive trace layer 402 and a fifth conductive trace layer 403 on two opposite surfaces of the second medium layer 401, and a plurality of sixth conductive trace layers (not shown) inside the second medium layer 401.
In this embodiment, the material of the second dielectric layer 401 may be the same as the material of the first dielectric layer 101, and specifically, the material of the first dielectric layer 101 may be referred to, and will not be described in detail herein.
The fourth conductive trace layer 402 includes a second pad 4021 and a third pad 4022. The number of the sixth conductive trace layers is not limited in the present application, that is, the number of the sixth conductive trace layers in the main board 40 may be changed as needed.
Referring to fig. 2 again, the main board 40 is provided with a third conductive portion 41. The third conductive circuit portion 41 is configured to electrically connect the fourth conductive circuit layer 402 and the sixth conductive circuit layer adjacent to the fourth conductive circuit layer 402, electrically connect two adjacent sixth conductive circuit layers, and electrically connect the fifth conductive circuit layer 403 and the sixth conductive circuit layer adjacent to the fifth conductive circuit layer 403.
The component 50 is accommodated in the accommodating groove 20, and the component 50 is electrically connected to the third pads 4022, so that the component 50 is electrically connected to the main board 40.
In this embodiment, the circuit board stacking structure 100 further includes a conductive member 60. The conductive device 60 is used for electrically connecting the first bonding pad 1021 and the second bonding pad 4021, so that the first conductive circuit layer 102 and the fourth conductive circuit layer 402 are electrically connected, and thus the radio frequency circuit board 10 is electrically connected to the main board 40, and further the radio frequency circuit board 10 is electrically connected to the component 50. In this embodiment, the conductive member 60 may be a conductive pillar. Specifically, the conductive post may be made of copper. In other embodiments, the conductive member 60 may also be a conductive paste. Specifically, the conductive paste may be a solder paste, a copper paste, or the like.
Referring to fig. 3 and 4, a second embodiment of the present application provides a circuit board stacking structure 200, and the circuit board stacking structure 200 provided in the second embodiment is different from the circuit board stacking structure 100 provided in the first embodiment in that: in the rf circuit board 13, one of the third conductive trace layers 104 adjacent to the first conductive trace layer 102 includes the grounding wire 1042, and the receiving slot 21 does not penetrate any of the third conductive trace layers 104. The first conductive circuit layer 14 is used to electrically connect the second conductive circuit layer 103 and the third conductive circuit layer 104 adjacent to the second conductive circuit layer 103, and electrically connect two adjacent third conductive circuit layers 104. The second conductive part 15 penetrates all of the third conductive trace layer 104, and the second conductive part 15 is used for electrically connecting the first conductive trace layer 102, the second conductive trace layer 103 and the third conductive trace layer 104.
In the present application, the receiving groove 20 is formed in the radio frequency circuit board 10, and the component 50 is received in the receiving groove 20, so that a frame plate is not used to reduce the packaging frequency, the requirement for the heat resistance of the main board 40 can be reduced to a certain extent, and the reliability and yield of the circuit board stacking structure 100 can be improved. Meanwhile, the radio frequency circuit board 10 and the main board 40 are only required to be aligned, and a frame board and the main board 40 are not required to be aligned, so that the requirement on the size precision of the radio frequency circuit board 10 and the size precision of the main board 40 are reduced, and the yield of the circuit board stacking structure 100 is improved.
The above description is only an embodiment optimized for the present application, but in practical application, the present invention is not limited to this embodiment.
Claims (10)
1. A circuit board stack structure, comprising:
the radio frequency circuit board comprises a first medium layer, a first conductive circuit layer and a second conductive circuit layer which are positioned on two opposite surfaces of the first medium layer, and a plurality of third conductive circuit layers positioned in the first medium layer, wherein the first conductive circuit layer comprises a first welding pad, one of the third conductive circuit layers comprises a grounding wire, and an accommodating groove is formed in the radio frequency circuit board;
the mainboard comprises a second dielectric layer, and a fourth conductive circuit layer and a fifth conductive circuit layer which are positioned on two opposite surfaces of the second dielectric layer, wherein the fourth conductive circuit layer comprises a second welding pad and a third welding pad, and the second welding pad is electrically connected with the first welding pad; and
and the component is accommodated in the accommodating groove and is electrically connected with the third welding pad.
2. The circuit board stack structure of claim 1, wherein the receiving groove penetrates through the first conductive trace layer and at least one of the third conductive trace layers, and a bottom of the receiving groove corresponds to the ground line.
3. The circuit board stack structure according to claim 2, wherein a first conductive part and a second conductive part are provided in the rf circuit board, the first conductive part is configured to electrically connect the first conductive trace layer and the third conductive trace layer adjacent to the first conductive trace layer, electrically connect the second conductive trace layer and the third conductive trace layer adjacent to the second conductive trace layer, and electrically connect two of the third conductive trace layers adjacent to a portion, and the second conductive part is configured to electrically connect two of the third conductive trace layers adjacent to a portion.
4. The circuit board stack structure of claim 1, wherein a third conductive trace layer adjacent to the first conductive trace layer comprises the ground line, the receiving groove penetrates through the first conductive trace layer, and a bottom of the receiving groove corresponds to the ground line.
5. The circuit board stack structure according to claim 4, wherein a first conductive part and a second conductive part are provided in the radio frequency circuit board, the first conductive part is used for electrically connecting the second conductive circuit layer and the third conductive circuit layer adjacent to the second conductive circuit layer, and electrically connecting two third conductive circuit layers adjacent to the first conductive circuit layer, the second conductive circuit layer and the third conductive circuit layer.
6. The circuit board stack structure of claim 1, wherein the rf circuit board further comprises a first protective layer on the inner wall and the bottom surface of the receiving cavity.
7. The circuit board stack structure of claim 1, wherein the depth of the receiving groove is 0.8-1.3mm, and the ratio of the cross-sectional area of the receiving groove to the cross-sectional area of the rf circuit board is 80-95%.
8. The circuit board stack structure of claim 1, further comprising a conductive member for electrically connecting the first bonding pad and the second bonding pad.
9. The circuit board stack structure of claim 8, wherein the conductive member is a conductive post.
10. The circuit board stack structure of claim 1, wherein the motherboard further comprises a sixth conductive trace layer, the sixth conductive trace layer being located in the second dielectric layer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202122729633.4U CN216531904U (en) | 2021-11-09 | 2021-11-09 | Circuit board stacking structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202122729633.4U CN216531904U (en) | 2021-11-09 | 2021-11-09 | Circuit board stacking structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN216531904U true CN216531904U (en) | 2022-05-13 |
Family
ID=81528274
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202122729633.4U Active CN216531904U (en) | 2021-11-09 | 2021-11-09 | Circuit board stacking structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN216531904U (en) |
-
2021
- 2021-11-09 CN CN202122729633.4U patent/CN216531904U/en active Active
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