CN216528865U - Vertical power MOS semiconductor component - Google Patents
Vertical power MOS semiconductor component Download PDFInfo
- Publication number
- CN216528865U CN216528865U CN202121987156.5U CN202121987156U CN216528865U CN 216528865 U CN216528865 U CN 216528865U CN 202121987156 U CN202121987156 U CN 202121987156U CN 216528865 U CN216528865 U CN 216528865U
- Authority
- CN
- China
- Prior art keywords
- plate
- fixedly connected
- semiconductor component
- limiting
- heat dissipation
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Landscapes
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The utility model relates to the technical field of semiconductors and discloses a vertical power MOS semiconductor component which comprises a heat dissipation bottom plate, wherein a heat dissipation guide plate is fixedly connected to the lower surface of the heat dissipation bottom plate, a positioning contact pin is fixedly connected to the front surface of the heat dissipation bottom plate, a semiconductor component is arranged on the upper surface of the heat dissipation bottom plate, a U-shaped pressing plate is arranged on the upper surface of the semiconductor component, and an operating handle is fixedly connected to the upper surface of the U-shaped pressing plate. This vertical power MOS semiconductor component carries out spacing fixed to semiconductor component and U-shaped press plate through block board extrusion sliding support, gag lever post and spacing frame inward movement, has better spacing fixed effect to semiconductor component, is convenient for more stable carry on spacing fixed to semiconductor component, has effectively improved the stability fixed to semiconductor component, is convenient for stabilize safe use more, has effectively improved the convenience of using.
Description
Technical Field
The utility model relates to the technical field of semiconductors, in particular to a vertical power MOS semiconductor component.
Background
In the prior art, the back surface of a single tube package is a metal layer, and when the single tube package is mounted on a radiator, the radiator can be caused to have high voltage; the key point of the single tube application is to solve the problems of insulation and heat dissipation of the single tube.
For example, a power semiconductor device of chinese patent application No. 201822074060.4, which is described substantially as follows: including radiator, fixed layering and a plurality of semiconductor single tube, be equipped with a plurality of installation faces on the radiator, it is a plurality of the installation face is along sharp spaced apart setting, and is a plurality of semiconductor single tube one-to-one installs a plurality of on the installation face, the power semiconductor subassembly is fixed semiconductor assembly through fixed layering and screw cooperation, but this fixed mode operation in the use is very complicated, and the fixed process is very wasted time and energy, is unfavorable for more rapid and stable to semiconductor assembly fixed operation, has reduced the convenience of using.
SUMMERY OF THE UTILITY MODEL
Technical problem to be solved
In view of the deficiencies of the prior art, the present invention provides a vertical power MOS semiconductor device that solves the problems set forth in the background above.
(II) technical scheme
In order to achieve the purpose, the utility model provides the following technical scheme: the utility model provides a vertical power MOS semiconductor component, includes the heat dissipation bottom plate, the lower fixed surface of heat dissipation bottom plate is connected with the heat dissipation baffle, the positive fixedly connected with location contact pin of heat dissipation bottom plate, the upper surface of heat dissipation bottom plate is provided with semiconductor component, semiconductor component's upper surface is provided with the U-shaped and presses the pressing plate, the last fixed surface of U-shaped pressing plate is connected with the operating handle, the spacing fixing device of last fixed surface of heat dissipation bottom plate is connected with.
The limiting fixing device comprises a stabilizing vertical plate, a fixing support is fixedly connected to the bottom of the inner side face of the stabilizing vertical plate, a limiting rod is connected to the inner side of the fixing support in a rotating mode, a limiting frame is connected to the inner side of the limiting rod in a rotating mode, a sliding support is connected to the top of the limiting rod at the top in a rotating mode, a limiting inclined block is arranged at the top of the stabilizing vertical plate, a compression spring is fixedly connected to the outer side face of the limiting inclined block, a pulling rod is fixedly connected to the outer side face of the limiting inclined block, and a clamping plate is fixedly connected to the upper surface of a pressing plate in a U-shaped mode.
Preferably, the clamping plate inner side surface is provided with a strip-shaped through hole, the inner side surface of the limiting frame is fixedly connected with a positioning column, and the strip-shaped through hole is matched with the positioning column.
Preferably, the stable vertical plate and the clamping plate are made of cast iron, and the outer surfaces of the stable vertical plate and the clamping plate are uniformly coated with antirust coatings.
Preferably, the outer side face of the sliding support is fixedly connected with a stabilizing sliding block, the inner side face of the stabilizing vertical plate is provided with a stabilizing sliding groove, and the stabilizing sliding block is connected with the stabilizing sliding groove in a sliding mode.
Preferably, the number of the limiting rods is sixteen groups, and the length of each of the sixteen groups of limiting rods is fifty millimeters.
Preferably, the shape of the limit inclined block is trapezoidal, and the inclination angle of the inclined surface of the limit inclined block is thirty-five degrees.
(III) advantageous effects
Compared with the prior art, the utility model provides a vertical power MOS semiconductor component, which has the following beneficial effects:
1. this vertical power MOS semiconductor component carries out spacing fixed to semiconductor component and U-shaped press plate through block board extrusion sliding support, gag lever post and spacing frame inward movement, has better spacing fixed effect to semiconductor component, is convenient for more stable carry on spacing fixed to semiconductor component, has effectively improved the stability fixed to semiconductor component, is convenient for stabilize safe use more, has effectively improved the convenience of using.
2. This vertical power MOS semiconductor assembly, it is spacing fixed to assist the snap-fit board through spacing sloping block and compression spring cooperation, further guaranteed that the snap-fit board is to the fixed stability of semiconductor assembly and U-shaped pressing plate, fixed operation is simple more convenient, operates labour saving and time saving more, is convenient for more rapid and stable carry out fixed operation to semiconductor assembly, has further improved the convenience in the use, is favorable to the improvement of availability factor.
Drawings
FIG. 1 is a schematic structural view of the present invention;
fig. 2 is a schematic structural view of the limiting and fixing device of the present invention.
In the figure: 1. a heat dissipation base plate; 2. a heat dissipation guide plate; 3. positioning a contact pin; 4. a semiconductor component; 5. a U-shaped pressing plate; 6. an operating handle; 7. a limiting and fixing device; 701. stabilizing the vertical plate; 702. fixing a bracket; 703. a limiting rod; 704. a limiting frame; 705. a sliding support; 706. a limit oblique block; 707. a compression spring; 708. pulling a rod; 709. a clamping plate.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Referring to fig. 1-2, the present invention provides a technical solution: the utility model provides a vertical power MOS semiconductor component, includes radiating bottom plate 1, radiating bottom plate 1's lower fixed surface is connected with heat dissipation baffle 2, radiating bottom plate 1's positive fixedly connected with location contact pin 3, radiating bottom plate 1's upper surface is provided with semiconductor component 4, semiconductor component 4's upper surface is provided with the U-shaped and presses down board 5, the U-shaped presses down board 5's upper fixed surface to be connected with operating handle 6, radiating bottom plate 1's upper fixed surface is connected with spacing fixing device 7.
The limiting and fixing device 7 comprises a stable vertical plate 701, a fixing support 702 is fixedly connected to the bottom of the inner side surface of the stable vertical plate 701, a limiting rod 703 is rotatably connected to the inner side of the fixing support 702, a limiting frame 704 is rotatably connected to the inner side of the limiting rod 703, the sliding support 705 is extruded through a clamping plate 709, the limiting rod 703 and the limiting frame 704 move inwards to limit and fix the semiconductor component 4 and the U-shaped pressing plate 5, the semiconductor component 4 is better limited and fixed, the semiconductor component 4 is more stably and fixedly limited, the stability of fixing the semiconductor component 4 is effectively improved, the semiconductor component 4 is more stably and safely used, the convenience of use is effectively improved, the sliding support 705 is rotatably connected to the top of the limiting rod 703 at the top, a limiting inclined block 706 is arranged at the top of the stable vertical plate 701, the clamping plate 709 is assisted and limited and fixed through the cooperation of the limiting inclined block 706 and a compression spring 707, further guaranteed that block board 709 presses semiconductor component 4 and U-shaped to press the fixed stability of board 5, fixed operation is simple more convenient, the operation is labour saving and time saving more, be convenient for more rapid and stable carry out the fixed operation to semiconductor component 4, the convenience in the use has further been improved, be favorable to the improvement of availability factor, the lateral surface fixedly connected with compression spring 707 of spacing sloping block 706, the lateral surface fixedly connected with pulling rod 708 of spacing sloping block 706, the U-shaped presses the last fixed surface of board 5 to be connected with block board 709.
In order to improve the stability of limiting and fixing, the inner side surface of the clamping plate 709 is provided with a strip-shaped through hole, the inner side surface of the limiting frame 704 is fixedly connected with a positioning column, the strip-shaped through hole is matched with the positioning column, and the strip-shaped through hole on the inner side surface of the clamping plate 709 is matched with the positioning column on the inner side surface of the limiting frame 704, so that the stability of limiting and fixing is improved.
In order to prolong the service life of the vertical stabilizing plate 701 and the clamping plate 709, the vertical stabilizing plate 701 and the clamping plate 709 are made of cast iron, the outer surfaces of the vertical stabilizing plate 701 and the clamping plate 709 are uniformly coated with antirust coatings, the antirust coatings on the outer surfaces of the vertical stabilizing plate 701 and the clamping plate 709 are prevented from being corroded, and the service life of the vertical stabilizing plate 701 and the clamping plate 709 is prolonged.
In order to improve the sliding stability, a stabilizing slide block is fixedly connected to the outer side surface of the sliding support 705, a stabilizing slide groove is formed in the inner side surface of the stabilizing vertical plate 701 and is in sliding connection with the stabilizing slide groove, and the stabilizing slide block on the outer side surface of the sliding support 705 is matched with the stabilizing slide groove on the inner side surface of the stabilizing vertical plate 701, so that the sliding stability is improved.
In the utility model, in order to improve the stability of limiting and fixing, sixteen groups of limiting rods 703 are arranged, the length of each of the sixteen groups of limiting rods 703 is fifty millimeters, and the sixteen groups of limiting rods 703 are mutually matched to improve the stability of limiting and fixing.
In the utility model, in order to improve the convenience of use, the shape of the limit inclined block 706 is trapezoidal, the inclined angle of the inclined surface of the limit inclined block 706 is thirty-five degrees, and the limit inclined block 706 inclined by thirty-five degrees is convenient for the clamping plate 709 to rapidly slide downwards, so that the convenience of use is improved.
When using, place semiconductor component 4 at the upper surface of radiating bottom plate 1, control operating handle 6 afterwards places U-shaped pressing plate 5 at semiconductor component 4's upper surface, the fixed clamping plate 709 of U-shaped pressing plate 5 upper surface extrudes sliding support 705 at the in-process of downstream, sliding support 705 drives gag lever post 703 and removes, gag lever post 703 drives gag lever post 704 and removes and carry out spacing fixed with clamping plate 709, carry out spacing fixed to clamping plate 709 through compression spring 707 and spacing sloping block 706 simultaneously in the in-process that clamping plate 709 moved downstream.
To sum up, this vertical power MOS semiconductor component extrudes sliding support 705, gag lever post 703 and spacing frame 704 through snap-on board 709 and inwards moves and carries out spacing fixed to semiconductor component 4 and U-shaped press plate 5, has better spacing fixed effect to semiconductor component 4, is convenient for more stable carry out spacing fixed to semiconductor component 4, has effectively improved the stability fixed to semiconductor component 4, is convenient for more stable safe use, has effectively improved the convenience of using.
This vertical power MOS semiconductor component, it is supplementary spacing fixed to block board 709 through spacing sloping block 706 and compression spring 707 cooperation, further guaranteed that block board 709 fixes semiconductor component 4 and U-shaped according to pressing plate 5 stability, fixed operation is simple convenient more, the operation labour saving and time saving more, be convenient for more rapid stabilization fix the operation to semiconductor component 4, further improved the convenience in the use, be favorable to the improvement of availability factor.
Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the utility model, the scope of which is defined in the appended claims and their equivalents.
Claims (6)
1. A vertical power MOS semiconductor component comprising a heat-dissipating base plate (1), characterized in that: the lower surface of the heat dissipation bottom plate (1) is fixedly connected with a heat dissipation guide plate (2), the front surface of the heat dissipation bottom plate (1) is fixedly connected with a positioning contact pin (3), the upper surface of the heat dissipation bottom plate (1) is provided with a semiconductor assembly (4), the upper surface of the semiconductor assembly (4) is provided with a U-shaped pressing plate (5), the upper surface of the U-shaped pressing plate (5) is fixedly connected with an operating handle (6), and the upper surface of the heat dissipation bottom plate (1) is fixedly connected with a limiting and fixing device (7);
the limiting and fixing device (7) comprises a stabilizing vertical plate (701), a fixing support (702) is fixedly connected to the bottom of the inner side face of the stabilizing vertical plate (701), a limiting rod (703) is rotatably connected to the inner side of the fixing support (702), a limiting frame (704) is rotatably connected to the inner side of the limiting rod (703), a sliding support (705) is rotatably connected to the top of the limiting rod (703) located at the top, a limiting inclined block (706) is arranged at the top of the stabilizing vertical plate (701), a compression spring (707) is fixedly connected to the outer side face of the limiting inclined block (706), a pulling rod (708) is fixedly connected to the outer side face of the limiting inclined block (706), and a clamping plate (709) is fixedly connected to the upper surface of the U-shaped pressing plate (5).
2. A vertical power MOS semiconductor device according to claim 1, wherein: the inner side surface of the clamping plate (709) is provided with a strip-shaped through hole, the inner side surface of the limiting frame (704) is fixedly connected with a positioning column, and the strip-shaped through hole is matched with the positioning column.
3. A vertical power MOS semiconductor device according to claim 1, wherein: the stable vertical plate (701) and the clamping plate (709) are both made of cast iron, and the outer surfaces of the stable vertical plate (701) and the clamping plate (709) are uniformly coated with antirust coatings.
4. A vertical power MOS semiconductor device according to claim 1, wherein: the outer side face of the sliding support (705) is fixedly connected with a stabilizing sliding block, the inner side face of the stabilizing vertical plate (701) is provided with a stabilizing sliding groove, and the stabilizing sliding block is connected with the stabilizing sliding groove in a sliding mode.
5. A vertical power MOS semiconductor device according to claim 1, wherein: the number of the limiting rods (703) is sixteen groups, and the length of each of the sixteen groups of the limiting rods (703) is fifty millimeters.
6. A vertical power MOS semiconductor device according to claim 1, wherein: the shape of spacing sloping block (706) is trapezoidal, and the inclination of the inclined plane of spacing sloping block (706) is thirty-five degrees.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202121987156.5U CN216528865U (en) | 2021-08-23 | 2021-08-23 | Vertical power MOS semiconductor component |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202121987156.5U CN216528865U (en) | 2021-08-23 | 2021-08-23 | Vertical power MOS semiconductor component |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN216528865U true CN216528865U (en) | 2022-05-13 |
Family
ID=81515923
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202121987156.5U Active CN216528865U (en) | 2021-08-23 | 2021-08-23 | Vertical power MOS semiconductor component |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN216528865U (en) |
-
2021
- 2021-08-23 CN CN202121987156.5U patent/CN216528865U/en active Active
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN201396725Y (en) | Fin type radiator | |
| CN216528865U (en) | Vertical power MOS semiconductor component | |
| CN219660207U (en) | Building electrical protection extension board convenient to ventilation and heat dissipation | |
| CN214369697U (en) | Spotlight with built-in cup-shaped radiator | |
| CN109195401A (en) | A kind of heat dissipation equipment for large communication equipment room | |
| CN211118522U (en) | Multifunctional mounting rack for communication equipment | |
| CN111085364B (en) | Aluminum alloy profile processing spraying device | |
| CN113891547A (en) | Novel circuit board heat conduction optimization structure | |
| CN216577537U (en) | Auxiliary supporting and positioning device for disassembling old coil of motor | |
| CN220468197U (en) | Aluminum alloy die structure capable of anodic oxidation | |
| CN221695212U (en) | Mold closing cylinder seat of cold and hot die casting machine | |
| CN212628918U (en) | Movable mounting bracket structure of 5G special BBU vertical cabinet | |
| CN216850198U (en) | But quick assembly disassembly's battery mount | |
| CN211508793U (en) | Motor heat dissipation base | |
| CN213102880U (en) | Automatic oil regulation and injection control system for notebook computer shell | |
| CN212628997U (en) | Automatic fastening radiating fin structure for strong fan | |
| CN215177208U (en) | Aluminum alloy radiating fin coated with aluminum foil and used for connector | |
| CN218489116U (en) | 3D is shower nozzle for printer | |
| CN218941619U (en) | Heat radiation structure of display | |
| CN211937546U (en) | Paint spraying device is used in fin processing | |
| CN210610095U (en) | Switching power supply board fixed knot constructs | |
| CN219802184U (en) | Energy storage type solar cell module | |
| CN218242948U (en) | Novel cable clamp | |
| CN213186973U (en) | PCBA board for power supply detection | |
| CN216121992U (en) | Linear electric motor positioning device |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant |