CN216528760U

CN216528760U - Wafer processing equipment and system

Info

Publication number: CN216528760U
Application number: CN202122541909.6U
Authority: CN
Inventors: 史蒂文·贺·汪; 林鹏鹏
Original assignee: Xinyang Guimi Shanghai Semiconductor Technology Co ltd
Current assignee: Xinyang Guimi Shanghai Semiconductor Technology Co ltd
Priority date: 2021-10-21
Filing date: 2021-10-21
Publication date: 2022-05-13
Anticipated expiration: 2031-10-21

Abstract

The utility model provides a wafer processing device and a wafer processing system, which are used for pre-wetting or corroding a wafer and comprise a first box body, a containing cavity for introducing a wafer processing liquid, a wafer driving disc for fixing the wafer and driving the wafer to rotate, a driving metal positioned on the wafer driving disc, a driving device and an electromagnetic device, wherein the driving device drives the electromagnetic device to rotate, the driving metal rotates along with the electromagnetic device under the action of electromagnetic induction, and the driving metal drives the wafer driving disc to rotate. The driving device is arranged outside the first box body by utilizing the electromagnetic induction principle, so that the passive driving of the rotation of the wafer in the first box body is realized, and the problem that the driving device cannot be soaked in the wafer treatment liquid is solved. The wafer processing equipment disclosed by the utility model is simple in structure, the sealing degree and the vacuumizing efficiency of the first box body can be improved, the wafer is driven to rotate when being wetted or corroded, the uniformity of pre-wetting and corrosion is improved, and the wafer processing efficiency is favorably improved.

Description

Wafer processing equipment and system

Technical Field

The utility model relates to the field of wafer preparation, in particular to a wafer processing device and a wafer processing system, wherein the processing refers to pre-wetting before wafer electroplating or corrosion after wafer electroplating.

Background

Before the electroplating of the wafer, the wafer is soaked and vacuumized, otherwise, the electroplating is insufficient. The pre-wetting liquid can enter the holes through the pre-wetting, so that the next electroplating process is facilitated, and the electroplating quality of the wafer is improved. If the wafer is not pre-wetted before electroplating, gas bubbles are easily formed at the solid-liquid interface between the electroplating solution and the wafer surface due to the surface tension of the electroplating solution during electroplating, which causes pinch-off of the plated metal of the wafer, thereby leaving voids at the feature bottom of the wafer and causing defects, such as circuit lines being blocked.

After the wafer is electroplated, a large amount of chemical liquid medicine, such as sulfuric acid or hydrofluoric acid, is used, the corrosivity of the chemical liquid medicine is utilized to remove specific materials or remove pollutants, the time difference of the contact between the liquid medicine and the surface of the wafer can cause uneven corrosion on the surface of the wafer, the quality of a subsequent process can be directly influenced, the performance of a chip is poor, and the product yield is reduced.

In order to carry out pre-wetting before electroplating or corrosion treatment after electroplating on a wafer, the wafer can be placed on a wafer chuck, the wafer chuck is arranged in a closed chamber, wafer treatment liquid is filled into the closed chamber, the liquid level of the wafer treatment liquid submerges a part of the area of the wafer clamped by the wafer chuck, the environment in the closed chamber is adjusted to be vacuum and ensures that the wafer treatment liquid is in a liquid phase state, the center of the wafer chuck is connected to a driver such as a rotating motor through a transmission rod, the transmission rod drives the wafer chuck to rotate under the driving of the rotating motor, and in the treatment process, a support needs to be kept in a rotating state to drive the wafer to rotate. Since the rotary electric machine cannot be immersed in the wafer processing liquid, a hermetic case is required to be attached to the rotary electric machine, for example, the wafer processing liquid is corrosive, and the hermetic case is also required to use a corrosion-resistant material. The technical scheme of the prior art is complex in structure and inconvenient to operate, waterproof and corrosion-resistant treatment needs to be carried out on the driver, the processing difficulty and the processing cost are increased, if the waterproof shell leaks, potential safety hazards can be brought when wafer processing liquid enters the driver, and the wafer processing liquid can be polluted. In addition, in order to remove bubbles in the wafer processing liquid to achieve uniform infiltration or corrosion, the sealed chamber needs to be vacuumized, the driving devices such as the rotating motor and the like are arranged in the sealed chamber, and in order to ensure the sealing performance of the sealed chamber, sealing measures need to be taken for the power supply line of the driving devices, so that the processing difficulty and the cost of equipment are increased. Therefore, it is an urgent need to solve the problems of water resistance and corrosion resistance of the wafer driving device.

SUMMERY OF THE UTILITY MODEL

In view of the defects in the prior art, the present invention provides a wafer processing apparatus and system, which can be used for wafer pre-wetting before electroplating or wafer etching after electroplating.

The utility model is realized by the following technical scheme:

a wafer processing device is used for pre-wetting or corroding a wafer and comprises a first box body, wherein an accommodating cavity is formed in the first box body and is used for introducing wafer processing liquid; at least one driving metal is arranged on the wafer driving disc; the wafer processing equipment further comprises a driving device, the driving device is arranged outside the first box body and connected with the electromagnetic device, the driving device drives the electromagnetic device to rotate, the driving metal rotates along with the electromagnetic device under the action of electromagnetic induction, and the driving metal drives the wafer driving disc to rotate.

In this technical scheme, through adopting above structure, can place drive arrangement outside first box, realize carrying out passive drive to the wafer that is located first box, above simple structure, drive arrangement is located first box and is favorable to improving the leakproofness and the evacuation efficiency in holding chamber outward, also need not carry out waterproof and corrosion-resistant processing to drive arrangement, can also provide power for the wafer rotation simultaneously, be favorable to improving the efficiency of prewetting or corroding of wafer, improve the wetting and the corruption homogeneity of wafer.

Further, the driver metal is embedded in the plastic to form a driver clad metal. The plastic used for driving the cladding metal is selected from plastic which does not obstruct electromagnetic driving and plastic which does not react with the wafer processing liquid, such as PTFE or PFA coating film.

In the technical scheme, by adopting the structure, when the wafer is processed, the reaction of the wafer processing liquid and the driving metal can be effectively avoided, and the wafer processing liquid is ensured not to be damaged; meanwhile, the electromagnetic induction of the driving metal and the electromagnetic device is not influenced, and the driving metal is ensured to drive the wafer driving disc to rotate so as to drive the wafer to rotate.

The electromagnetic device is connected with the driving device through the connecting arm, and the driving device is positioned at the position where the axial extension line of the circle center of the wafer driving disc is intersected with the outer surface of one side of the first box body; the driving metal is positioned on one side of the wafer driving disc close to the driving device, the electromagnetic device is driven by the driving device to rotate, the rotation track of the electromagnetic device can cover at least one electromagnetic induction area of the driving metal on the wafer driving disc, and then electromagnetic induction is generated to drive the wafer driving disc to rotate.

In this technical scheme, through adopting above structure, the rotation track of electromagnetic means can cover the electromagnetic induction region of at least one drive metal on the wafer driving-disc, and then takes place electromagnetic induction and drive the rotation of wafer driving-disc. If necessary, a plurality of driving metals can be arranged according to the size of the wafer and the rotating speed, the positions of the driving metals are adjusted, and the electromagnetic device is easier to generate electromagnetic induction with the driving metals in the rotating process.

Furthermore, the wafer driving disc comprises two circular surfaces and at least one wafer clamping groove, the wafer is placed between the two circular surfaces, the wafer clamping groove is located between the two circular surfaces and used for fixing the wafer, and the wafer clamping grooves are distributed along the circumference of the wafer driving disc. Furthermore, the length of the wafer clamping grooves which are continuously distributed along the circumference of the wafer driving disk does not exceed half of the circumference of the wafer driving disk.

In this technical scheme, through adopting above structure, be favorable to improving the stability of wafer, let the wafer rotate along with wafer driving disc together, and do not influence placing and taking out of wafer.

Further, the lateral wall of first box is equipped with extraction opening, pressure release mouth, relief valve, and the extraction opening is used for connecting air exhaust device, and the extraction opening position is higher than the highest position of the wafer treatment liquid of holding intracavity, and first box is equipped with inlet and leakage fluid dram, and the inlet is used for inputing wafer treatment liquid, and the leakage fluid dram is used for discharging wafer treatment liquid, and inlet and leakage fluid dram are located first box downside.

In this technical scheme, through adopting above structure, be favorable to wafer treatment facility to connect air exhaust device, and then be favorable to reducing the pressure of the gas in the first box to be favorable to wafer treatment liquid to steadily get into first box under the effect of atmospheric pressure, also be favorable to reducing the dissolved amount of the interior gas of wafer treatment liquid, be favorable to discharging the bubble that blocks in structures such as slotted hole on the wafer more thoroughly, also be favorable to discharging the bubble in the wafer treatment liquid.

Further, the wafer processing equipment comprises a driving mechanism, and the driving mechanism drives the wafer processing equipment to incline from the vertical position to the horizontal position.

In the technical scheme, by adopting the structure, the dissolved gas in the wafer processing liquid can be more easily overflowed.

Further, the wafer processing equipment swings back and forth under the driving of the driving mechanism.

In the technical scheme, by adopting the structure, the boundary layer is reduced by swinging the wafer inclination angle by utilizing the viscous force of the wafer treatment liquid, so that the dissolved gas is easier to overflow to increase the soaking humidity of the wafer.

Furthermore, the inclination angle of the wafer processing equipment is 0-30 degrees, and the swing speed of the wafer processing equipment is 0-1 radian/minute.

In the technical scheme, the dissolved gas in the wafer processing liquid can be better overflowed by controlling the inclination angle of the first box body and the swing speed of the first box body.

A wafer processing system comprising a wafer processing apparatus as described above.

Further, the wafer processing system also comprises an air extractor and a liquid storage tank, wherein the air extractor is communicated with the wafer processing equipment; the liquid storage tank is used for storing the wafer processing liquid and communicated with the wafer processing equipment by a pipeline.

In the technical scheme, by adopting the structure, the liquid storage tank is used for providing the wafer processing liquid, the air extractor is used for extracting air from the wafer processing equipment, so that the wafer processing equipment can be kept in a vacuum state, the wafer processing liquid can smoothly enter the first box body under the action of atmospheric pressure, the dissolving amount of gas in the wafer processing liquid can be reduced, and bubbles in the wafer processing liquid can be discharged.

Furthermore, the wafer processing system also comprises a first controller, a first actuator and a first liquid level sensor, wherein the first liquid level sensor is arranged in the liquid storage tank, and the first controller is in communication connection with the first actuator and the first liquid level sensor; when the liquid level of the wafer processing liquid in the liquid storage tank reaches a first preset position, the first liquid level sensor is used for sending a filling signal to the first controller; when the first controller receives the full signal, the first controller is used for sending a closing signal to the first actuator, and the first actuator closes the wafer processing liquid inlet of the liquid storage tank.

Further, when the liquid level of the wafer processing liquid in the liquid storage tank reaches the first preset position, the volume of the wafer processing liquid in the liquid storage tank is larger than the volume of the wafer processing liquid required for the first tank body to submerge the highest point of the wafer. In the technical scheme, by adopting the structure and utilizing the first liquid level sensor arranged in the liquid storage tank, the volume of the wafer processing liquid in the liquid storage tank can be controlled more accurately; the first controller and the first actuator are utilized, so that the process steps of wafer processing are simplified, and the efficiency of wafer processing is improved; by defining the volume of wafer processing liquid in the reservoir when in the first predetermined position, the wafer is enabled to be in sufficient and uniform contact with the wafer processing liquid.

Further, before the wafer processing liquid enters the first box body, the first actuator is also used for opening the first box body, putting the wafer into the wafer driving disc, closing and sealing the first box body; the first controller is also in communication connection with the air extracting device, and after the first box body is sealed, the first controller is used for sending a starting signal to the air extracting device, and the air extracting device is used for continuously extracting the gas in the first box body within a preset time period.

In the technical scheme, by adopting the structure, the wafer is placed into the wafer driving disc by the first actuator, so that the process steps of wafer processing are simplified; the gas in the first box body is pumped out by the air pumping device, so that the pressure of the gas in the first box body is reduced, the wafer processing liquid can enter the first box body stably under the action of atmospheric pressure, the dissolving amount of the gas in the wafer processing liquid is reduced, bubbles clamped in structures such as slotted holes on a wafer can be discharged more thoroughly, and the bubbles in the wafer processing liquid can be discharged.

Further, the air exhaust device is also communicated with the liquid storage tank, and the first controller is in communication connection with the air exhaust device;

when the liquid level of the wafer processing liquid in the liquid storage tank reaches a first preset position, the first liquid level sensor is used for sending an air exhaust signal to the air exhaust device, and the air exhaust device is used for exhausting gas in the liquid storage tank.

In this technical scheme, through adopting above structure, utilize air exhaust device to bleed the reservoir to reduce the gas pressure in the reservoir, be favorable to reducing the dissolved amount of the interior gas of wafer treatment liquid, be favorable to discharging the bubble in the wafer treatment liquid more thoroughly.

Furthermore, the wafer processing system also comprises a second controller, a second actuator and a second liquid level sensor, wherein the second liquid level sensor is arranged in the first box body, and the second controller is in communication connection with the second actuator and the second liquid level sensor; when the liquid level of the wafer processing liquid in the first box body is reduced to a second preset position, the second liquid level sensor is used for sending a taking-out signal to the second controller; and when the second controller receives the taking-out signal, the second controller is used for sending an opening signal to the second actuator, and the second actuator opens the first box body and takes out the wafer in the first box body.

Further, when the liquid level of the wafer processing liquid in the first tank body is lowered to the second preset position, the liquid level of the wafer processing liquid in the first tank body is lower than the lowest point of the wafer in the first tank body.

In the technical scheme, by adopting the structure, the wafer is not soaked in the wafer processing liquid when the wafer is taken out, so that the infiltration transition or corrosion transition of the part of the lower part of the wafer, which is submerged by the wafer processing liquid when the wafer is taken out, is avoided, and the uniformity of the wafer is improved; the time of finishing the wafer processing can be controlled more accurately, the wafer can be taken out in time, and the wafer processing efficiency can be improved.

Furthermore, the wafer processing system also comprises a third controller, a third actuator and a third liquid level sensor, wherein the third liquid level sensor is arranged in the first box body, and the third controller is in communication connection with the third actuator and the third liquid level sensor; when the liquid level of the wafer processing liquid in the first box body reaches a third preset position, the third liquid level sensor is used for sending a stop signal to the third controller; and when the third controller receives the stop signal, the third controller is used for sending the stop signal to the third actuator, and the third actuator closes the inlet of the wafer processing liquid of the first box body.

Further, when the liquid level of the wafer processing liquid in the first box body reaches a third preset position, the liquid level of the wafer processing liquid in the first box body is higher than the highest point of the wafer.

In the technical scheme, the liquid level height of the wafer processing liquid is controlled by adopting the structure, so that the wafer processing liquid submerges all the wafers, and the full contact between each part and the wafer processing liquid is favorably ensured when the wafers rotate.

In other embodiments, the level of the wafer processing liquid may be set to submerge a portion of the wafer as desired.

Furthermore, the third controller is in communication connection with the air extracting device, and after the third controller receives the stop signal, the third controller is used for sending a start signal to the air extracting device, and the air extracting device is used for continuously extracting the gas in the first box within a preset time period.

In this technical scheme, through adopting above structure, can reduce the gas pressure in the first box, be favorable to reducing the dissolved quantity of the interior gas of wafer treatment liquid, be favorable to discharging the bubble in the wafer treatment liquid more thoroughly, also be favorable to discharging the bubble that blocks in structures such as slotted hole on the wafer more thoroughly.

Furthermore, the system also comprises a fourth controller and a fourth liquid level sensor, wherein the fourth liquid level sensor is arranged in the first box body, and the fourth controller is in communication connection with the driving device and the fourth liquid level sensor; when the liquid level of the wafer processing liquid in the first box body reaches a fourth preset position, the fourth liquid level sensor is used for sending a rotation signal to the fourth controller; after the fourth controller receives the rotation signal, the fourth controller is used for sending the rotation signal to the driving device, and the driving device rotates to drive the electromagnetic device to rotate.

In this technical scheme, through adopting above structure, prevent to carry out the wafer corrosion inhomogeneous that leads to because of wafer treatment fluid gets into from the below and contacts with wafer lower part earlier to be favorable to guaranteeing the even contact of each part of wafer and wafer treatment fluid.

Further, when the liquid level of the wafer processing liquid in the first box body reaches the fourth preset position, the liquid level of the wafer processing liquid in the first box body does not exceed the lowest point of the wafer in the first box body.

In the technical scheme, by adopting the structure, when the liquid level of the wafer processing liquid reaches the lowest point of the wafer or before the liquid level reaches the lowest point of the wafer, the wafer is prevented from being corroded unevenly due to the fact that the wafer processing liquid enters from the lower part and contacts with the lower part of the wafer firstly, and therefore the uniform contact between each part of the wafer and the wafer processing liquid is guaranteed.

Furthermore, the wafer processing system also comprises a fifth controller and a fifth liquid level sensor, wherein the fifth liquid level sensor is arranged in the first box body, and the fifth controller is in communication connection with the driving device and the fifth liquid level sensor; when the liquid level of the wafer processing liquid in the first box body is reduced to a fifth preset position, the fifth liquid level sensor is used for sending a rotation stopping signal to the fifth controller; and when the fifth controller receives the rotation stopping signal, the fifth controller is used for sending a rotation stopping signal to the driving device, the driving device stops rotating, and the electromagnetic device stops rotating.

In the technical scheme, by adopting the structure, the wafer rotation is stopped after the wafer processing is finished, and the part of the wafer processing liquid, which submerges the wafer, is prevented from having longer contact time relative to the part which does not submerge, so that the uniform contact between each part of the wafer and the wafer processing liquid is favorably ensured.

Further, when the liquid level of the wafer processing liquid in the first tank body is lowered to the fifth preset position, the liquid level of the wafer processing liquid in the first tank body is lower than the lowest point of the wafer in the first tank body.

In the technical scheme, by adopting the structure, the wafer is stopped rotating after the liquid level of the wafer processing liquid is reduced to be lower than the lowest point of the wafer, so that the part, which is submerged by the wafer processing liquid, is prevented from having longer contact time relative to the part, which is not submerged, of the wafer processing liquid, and thus, the uniform contact between each part of the wafer and the wafer processing liquid is favorably ensured.

On the basis of the common knowledge in the field, the above preferred conditions can be combined randomly to obtain the preferred embodiments of the utility model.

Compared with the prior art, the utility model has the following beneficial effects:

the driving device is arranged outside the first box body, so that the rotation of the wafer in the first box body is passively driven. Wafer treatment facility simple structure, drive arrangement are located first box and are favorable to improving the leakproofness and the evacuation efficiency in holding chamber outward, also need not carry out waterproof and corrosion-resistant processing to drive arrangement, can also provide power for the rotation of brilliant circle simultaneously, are favorable to improving the prewetting or the efficiency of corruption of wafer, are favorable to improving the homogeneity of wafer corruption.

The driving metal is embedded into the plastic to form the driving cladding metal, the driving cladding metal can generate electromagnetic induction with the electromagnetic device so as to drive the wafer driving disc to rotate, meanwhile, the driving cladding metal cannot generate chemical reaction with the wafer processing liquid, the wafer processing liquid can be effectively prevented from reacting with the driving metal when the wafer is processed, and the wafer processing liquid is ensured not to be damaged.

Drawings

Other features, objects and advantages of the utility model will become more apparent upon reading of the detailed description of non-limiting embodiments with reference to the following drawings:

FIG. 1 is a schematic view of a wafer processing apparatus

FIG. 2 is a front view of a wafer processing apparatus

FIG. 3 is a sectional view taken along line A-A of FIG. 2

FIG. 4 is an exploded view of a wafer processing apparatus

FIG. 5 is a schematic view of the structure of the wafer driving disk and the driving metal

FIG. 6 is a top view of a wafer drive disk and drive cladding metal

FIG. 7 is a schematic view of the driving mechanism

FIG. 8 is a schematic view of a wafer processing system according to embodiment 2 of the present invention

Fig. 9 is a schematic structural diagram of a liquid storage tank of a wafer processing system according to embodiment 2 of the utility model

Fig. 10 is a schematic cross-sectional structural view of a liquid storage tank of a wafer processing system according to embodiment 2 of the present invention

Description of reference numerals:

wafer processing apparatus 100

Drive mechanism 200

First casing 11

The accommodating chamber 12

Box cover 13

The air suction port 14

Pressure relief port 15

Liquid inlet 16

Liquid discharge port 17

Drive unit 18

Connecting arm 19

Electromagnetic device 20

Wafer driving disk 21

Wafer slot 22

Drive cladding metal 23

Wafer 91

Wafer processing liquid L

System 400

Air extraction device 41

Valve 42

Reservoir 50

Outflow port 51

Inflow opening 52

Return port 53

Level gauge 54

Fixing plate 55

Detailed Description

In order to make the objects, technical solutions and advantages of the embodiments of the present application clearer, the technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application, and it is obvious that the described embodiments are some embodiments of the present application, but not all embodiments. The components of the embodiments of the present application, generally described and illustrated in the figures herein, can be arranged and designed in a wide variety of different configurations.

Thus, the following detailed description of the embodiments of the present application, presented in the accompanying drawings, is not intended to limit the scope of the claimed application, but is merely representative of selected embodiments of the application. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.

It should be noted that: like reference numbers and letters refer to like items in the following figures, and thus, once an item is defined in one figure, it need not be further defined and explained in subsequent figures. Further, all directional indicators in this application (such as up, down, left, right, front, back, bottom …) are only used to explain the relative positional relationship between the components, the motion, etc. at a particular attitude (as shown in the drawings), and if the particular attitude changes, the directional indicator changes accordingly. Further, the descriptions in this application referring to "first", "second", etc. are for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicit to the number of technical features indicated.

Example 1

As shown in fig. 1 to 6, the present embodiment is a wafer processing apparatus 100, which is used for pre-wetting or etching a wafer 91, and includes a first box 11, wherein the first box 11 has a receiving chamber 12 inside, the receiving chamber 12 is used for introducing a wafer processing liquid, and further includes a wafer driving disk 21, the wafer driving disk 21 is disposed inside the first box 11 and can rotate relative to the first box 11, the wafer driving disk 21 is used for fixing the wafer 91, so that the wafer 91 rotates along with the wafer driving disk 21; at least one driving clad metal 23 is arranged on the wafer driving disc 21, and the driving clad metal is a driving metal coated PTFE or PFA film; the wafer driving device comprises a first box body 11, a driving device 18, an electromagnetic device 20, a driving device 18 and a cladding metal 23, wherein the driving device 18 is arranged outside the first box body 11, the driving device 18 is connected with the electromagnetic device 20, the driving device 18 drives the electromagnetic device 20 to rotate, the cladding metal 23 is driven to rotate along with the electromagnetic device 20 under the action of electromagnetic induction, and the driving cladding metal 23 drives a wafer driving disc 21 to rotate. In this embodiment, the wafer 91 is fixed by the wafer driving disk 21 disposed in the first box 11, and then the accommodating cavity 12 is filled with the wafer processing liquid, the driving device 18 located outside the first box drives the electromagnetic device 20 to rotate, the electromagnetic device 20 drives the driving cladding metal 23 located in the first box 11 to rotate through electromagnetic induction, and then drives the wafer driving disk 21 to rotate, the wafer driving disk 21 rotates to drive the wafer 91 to rotate, so that the outer surface of the wafer 91 contacts with the wafer processing liquid, in this embodiment, the driving device can be disposed outside the first box, and the rotation of the wafer located in the first box is passively driven. The wafer processing equipment 100 of this embodiment simple structure, drive arrangement are located and are favorable to improving the leakproofness and the evacuation efficiency in holding chamber outside the first box, also need not carry out waterproof and corrosion-resistant processing to drive arrangement, can also provide power for the wafer rotation simultaneously, are favorable to improving the efficiency of prewetting or corruption of wafer 91, are favorable to improving the corruption homogeneity of wafer 91. In the present invention, the drive clad metal 23 needs to be made of a metal having good magnetic permeability. In the utility model, the PTFE or PFA coated on the periphery of the metal is driven to not react with the wafer processing liquid chemically, and the wafer processing liquid can be ensured not to be damaged when the wafer is processed; meanwhile, the driving cladding metal 23 can generate electromagnetic induction with the electromagnetic device 20, so as to drive the wafer driving disk 21 to rotate.

The driving device 18 in this embodiment may be a rotary motor, a rotary servo motor, or a speed-adjustable rotary cylinder.

For the wafer 91 to be etched, the wafer processing liquid may be sulfuric acid or hydrofluoric acid, as a specific embodiment. For the wafer 91 to be pre-wetted, the wafer processing liquid may be deionized water, as one specific embodiment. In this embodiment, the wetted area of the wafer 91 is not limited, and the portion that is not desired to be wetted may be covered with the moisture-proof film in advance. The moisture-proof film may be a waterproof film or the like. The moisture-proof film is generally a plastic film having an adhesive property on one surface thereof and is adhered to the side surface of the wafer 91.

As a preferred embodiment, as shown in fig. 6, the wafer driving disk 21 has a wafer slot 22, the wafer slot 22 is located inside the wafer driving disk 21 and at the edge of the wafer driving disk 21, and the wafer slot 22 is used for fixing the outer circular surface of the wafer 91. In the embodiment, the wafer slot 22 with a simple structure is used to fix the wafer 91, so that the wafer 91 can rotate with the wafer driving disk 21 while the wafer processing apparatus 100 is simplified. In other embodiments, there may be a plurality of wafer slots 22, and the plurality of wafer slots 22 may be distributed along the circumference of the wafer driving disk without affecting the removal and placement of the wafer 91, wherein in one embodiment, the length of the plurality of wafer slots distributed continuously along the circumference of the wafer driving disk is less than half of the circumference of the wafer driving disk. In another embodiment, the plurality of wafer slots are continuously distributed along the circumference of the wafer driving disk for a length equal to half of the circumference of the wafer driving disk. In the embodiment, the plurality of wafer slots 22 disposed in the wafer driving disk 21 are utilized to improve the stability of the wafer 91, so that the wafer 91 rotates along with the wafer driving disk 21, and each part of the wafer contacts with the wafer processing liquid, thereby improving the uniformity of wafer corrosion.

The number of the driving coating metals 23 is more than 1, in one embodiment, as shown in fig. 3 and 5, the number of the driving metals is 6, the driving metals are uniformly distributed on the outer circumference of the wafer driving disk, the electromagnetic device is connected with the driving device 18 through the connecting arm 19, the driving device 18 is located at a position where an axial extension line of the center of the wafer driving disk 21 intersects with the outer surface of one side of the first box, the driving coating metals 23 are located on one side of the wafer driving disk 21 close to the driving device 18, the electromagnetic device 20 is driven by the driving device 18 to rotate, the rotation track of the electromagnetic device 20 can cover at least one electromagnetic induction area of the driving coating metals 23 on the wafer driving disk 21, and then electromagnetic induction is generated to drive the wafer driving disk 21 to rotate.

As a specific embodiment, as shown in fig. 1, the sidewall of the first chamber 11 may further include an air pumping port 14, a pressure relief port 15, and a pressure relief valve, the air pumping port 14 is used to connect an air pumping device, and the position of the air pumping port 14 is higher than the highest position of the wafer processing liquid in the accommodating chamber 12. In this embodiment, the pumping hole 14 is utilized to facilitate the wafer processing apparatus 100 to connect with a pumping device, so as to facilitate reducing the pressure of the gas in the first box 11, thereby facilitating the wafer processing liquid to smoothly enter the first box 11 under the effect of atmospheric pressure, and also facilitating reducing the dissolved amount of the gas in the wafer processing liquid, facilitating more thoroughly discharging bubbles stuck in structures such as slots on the wafer 91, and also facilitating discharging bubbles in the wafer processing liquid.

In fig. 1, a liquid inlet 16 and a liquid outlet 17 are provided at the bottom of the first tank 11, the liquid inlet 16 is used for inputting wafer processing liquid, and the liquid outlet 17 is used for discharging wafer processing liquid. The present embodiment utilizes the liquid inlet 16 disposed at the bottom to enable the wafer processing liquid to smoothly enter the first tank 11, which is beneficial to reducing the fluctuation of the wafer processing liquid.

As an embodiment, one side surface of the first casing 11 may be transparent, and all of the 4 side surfaces may be transparent. The material of the side surface can be acrylic, glass, resin and the like. The first box 11 in fig. 1 is further provided with an openable box cover 13, and the inner side surface of the box cover 13 may be further coated with silicone oil in order to improve sealability.

As a specific implementation manner, for the wafer having the TSV trench with the aspect ratio of 10:1, after the wafer processing apparatus 100 of the present embodiment is used for performing the pre-wetting process, the effect of the subsequent electroplating experiment is better. Compared with the wafer without prewetting, the method has the advantages that the electroplating yield is greatly improved, the electroplating uniformity is improved, and the defects of cavities (void) and gaps (seam) are eliminated.

The wafer processing apparatus 100 of the present embodiment has a better pre-wetting effect on the wafer, especially for the wafer having an aspect ratio in the range of (3-500): the wafer with the characteristic 1 has better pre-wetting effect, and the electroplating yield is obviously improved after pre-wetting.

As a specific implementation manner, for the wafer with the aspect ratio of 10:1, the wafer processing apparatus 100 of the present embodiment may perform etching after electroplating to achieve better uniformity. Compared with the wafer which is not electroplated by the wafer processing equipment, all parts of the wafer can be fully and uniformly corroded.

The wafer processing apparatus 100 of the present embodiment has a better etching effect on the wafer, especially on the wafer having an aspect ratio in the range of (3-500): the wafer with the 1 characteristic has better corrosion effect.

As a specific embodiment, as shown in fig. 7, the present embodiment further includes a driving mechanism 200, the driving mechanism 200 drives the wafer processing apparatus 100 to tilt from the vertical position to the horizontal position, and the wafer processing apparatus 100 swings back and forth under the driving of the driving mechanism 200; in a preferred embodiment, the wafer processing apparatus 100 is tilted at an angle of 0 to 30 degrees and the wafer processing apparatus 100 is oscillated at a rate of 0 to 1 radian/minute. Through the structure, the boundary layer is reduced by swinging the wafer inclination angle by utilizing the viscous force of the wafer treatment liquid, so that the dissolved gas is easier to overflow, and the wettability of the wafer can be effectively increased.

Example 2

As shown in fig. 8-10, the present embodiment is a wafer processing system 400, the wafer processing system 400 including the wafer processing apparatus 100 of embodiment 1. For convenience of explanation, the present embodiment continues to use the reference numerals in embodiment 1. By using the wafer processing apparatus 100, each portion of the wafer 91 can be in full and uniform contact with the wafer processing liquid, which is beneficial to improving the pre-wetting or etching efficiency of the wafer 91.

As a preferred embodiment, the wafer processing system 400 may further include an air pumping device 41 and a liquid storage tank 50, wherein the air pumping device 41 is in communication with the wafer processing apparatus 100; the liquid storage tank 50 is used for storing a wafer processing liquid, and the liquid storage tank 50 is communicated with the wafer processing apparatus 100 by a pipe. In the embodiment, the liquid storage tank 50 is used for supplying the wafer processing liquid, and the air extractor 41 is used for extracting air from the wafer processing apparatus 100, so that the wafer processing apparatus 100 can be kept in a vacuum state, thereby facilitating the wafer processing liquid to smoothly enter the first box 11 under the action of atmospheric pressure, reducing the dissolved amount of gas in the wafer processing liquid, facilitating the more thorough discharge of bubbles stuck in structures such as slots on the wafer 91, and facilitating the discharge of bubbles in the wafer processing liquid.

As a specific embodiment, the air extracting device 41 may be a vacuum extracting device such as a vacuum pump, a micro air extracting and inflating pump, and the like.

In a preferred embodiment, when the wafer processing liquid enters the first chamber 11, the evacuation device evacuates the first chamber 11 to a vacuum degree of-0.03 Mpa to-0.02 Mpa. The vacuum degree of the first tank 11 is controlled, so that the wafer processing liquid can stably and slowly enter the first tank 11, and the wafer processing liquid can be kept in a liquid state.

As a preferred embodiment, the wafer processing system 400 may further include a first controller, a first actuator, and a first liquid level sensor, the first liquid level sensor is disposed in the liquid storage tank 50, and the first controller is in communication connection with the first actuator and the first liquid level sensor; when the liquid level of the wafer processing liquid in the liquid storage tank 50 reaches a first preset position, the first liquid level sensor is used for sending a full signal to the first controller; when the first controller receives the full signal, the first controller is configured to send a close signal to the first actuator, and the first actuator closes the wafer processing liquid inlet of the liquid storage tank 50. In the embodiment, the first liquid level sensor arranged in the liquid storage tank 50 is utilized, so that the volume of the wafer processing liquid in the liquid storage tank 50 can be more accurately controlled; the first controller and the first actuator are utilized, so that the process steps of wafer processing are simplified, and the efficiency of wafer processing is improved. Preferably, when the level of the wafer processing liquid in the liquid storage tank 50 reaches the first predetermined position, the volume of the wafer processing liquid in the liquid storage tank 50 is larger than the volume of the wafer processing liquid required to submerge the highest point of the wafer 91 in the first tank 11. The present embodiment enables the wafer 91 to be fully and uniformly contacted with the wafer in the rotating state by defining the volume of the wafer processing liquid in the liquid storage tank 50 at the first preset position to be larger than the volume of the wafer processing liquid required to pass through the highest point of the wafer 91 in the first box 11. In other embodiments, the first predetermined position within the reservoir 50 may be adjusted according to specific requirements.

In other embodiments, the first actuator may also be used to open the first chamber 11 and place the wafer 91 into the wafer drive disk 21, close and seal the first chamber 11 before the wafer processing liquid enters the first chamber 11. In the embodiment, the first actuator is used to place the wafer 91 into the wafer driving disk 21, which is beneficial to simplifying the processing steps of wafer processing.

In other embodiments, the first controller is further communicatively connected to the gas exhausting device 41, and the first controller is configured to send an activation signal to the gas exhausting device 41 when the first box 11 is sealed, and the gas exhausting device 41 is configured to continuously exhaust the gas in the first box 11 for a preset time period. The gas in the first box 11 is pumped out by the pumping device in the embodiment, which is beneficial to reducing the pressure of the gas in the first box 11, thereby being beneficial to the wafer processing liquid to smoothly enter the first box 11 under the action of atmospheric pressure, also being beneficial to reducing the dissolved amount of the gas in the wafer processing liquid, being beneficial to more thoroughly discharging bubbles blocked in structures such as slotted holes on the wafer 91, and also being beneficial to discharging bubbles in the wafer processing liquid.

As a preferred embodiment, the air extracting device 41 can also be communicated with the liquid storage tank 50, and the first controller is in communication connection with the air extracting device 41; when the liquid level of the wafer processing liquid in the liquid storage tank 50 reaches the first preset position, the first liquid level sensor is used for sending an air exhaust signal to the air exhaust device 41, and the air exhaust device 41 is used for exhausting the gas in the liquid storage tank 50. In the embodiment, the air extractor 41 is used for extracting air from the liquid storage tank 50, so that the gas pressure in the liquid storage tank 50 is reduced, the dissolving amount of the gas in the wafer processing liquid is reduced, and bubbles in the wafer processing liquid are discharged more thoroughly.

As a preferred embodiment, the wafer processing system 400 may further include a second controller, a second actuator, and a second liquid level sensor, wherein the second liquid level sensor is disposed in the first box 11, and the second controller is in communication connection with the second actuator and the second liquid level sensor; when the liquid level of the wafer processing liquid in the first box body 11 is lowered to a second preset position, the second liquid level sensor is used for sending a taking-out signal to the second controller; after the second controller receives the take-out signal, the second controller is configured to send an open signal to the second actuator, and the second actuator opens the first box 11 and takes out the wafer 91 in the first box 11. The second liquid level sensor arranged in the first box body 11 is utilized in the embodiment, so that the time for processing the wafer can be controlled more accurately, the wafer can be taken out in time, and the wafer processing efficiency can be improved. Preferably, when the level of the wafer processing liquid in the first tank 11 reaches the second preset position, the level of the wafer processing liquid in the first tank 11 is lower than the lowest point of the wafer 91 in the first tank 11. In the embodiment, the wafer 91 is not soaked in the wafer processing liquid when being taken out, so that the lower part of the wafer is prevented from being soaked and transited or corroded by the wafer processing liquid in the process of taking out the wafer.

As a preferred embodiment, the wafer processing system 400 may further include a third controller, a third actuator, and a third liquid level sensor, wherein the third liquid level sensor is disposed in the first box 11, and the third controller is in communication connection with the third actuator and the third liquid level sensor; when the liquid level of the wafer processing liquid in the first box body 11 reaches a third preset position, the third liquid level sensor is used for sending a stop signal to the third controller; when the third controller receives the stop signal, the third controller is configured to send a stop signal to the third actuator, and the third actuator closes the inlet of the wafer processing liquid in the first tank 11. The third liquid level sensor arranged in the first box body 11 is utilized in the embodiment, so that the volume of the liquid processed by the wafer in the first box body 11 can be controlled more accurately, the third controller and the third actuator are utilized, the process steps of processing the wafer 91 can be simplified, and the efficiency of processing the wafer 91 can be improved. Preferably, when the liquid level of the wafer processing liquid in the liquid storage tank 50 reaches the third preset position, the liquid level of the wafer processing liquid in the first tank 11 is higher than the highest point of the wafer 91 in the first tank 11. In the embodiment, the liquid level of the wafer processing liquid is set to just exceed the highest point of the wafer 91, so that the wafer 91 is ensured to be fully contacted with the wafer processing liquid when rotating.

As a preferred embodiment, the third controller may be further communicatively connected to the air extracting device 41, and when the third controller receives the stop signal, the third controller is configured to send a start signal to the air extracting device 41, and the air extracting device 41 is configured to continuously extract the gas in the first box 11 within a preset time period; the preset time period ranges from 30 seconds to 90 seconds. In the embodiment, the air extractor 41 is used to extract air from the first box 11, so as to reduce the gas pressure in the first box 11, thereby being beneficial to reducing the dissolved amount of the gas in the wafer processing liquid, being beneficial to discharging bubbles in the wafer processing liquid more thoroughly, and being beneficial to discharging bubbles stuck in structures such as slots on the wafer 91 more thoroughly.

In one embodiment, when the liquid level of the wafer processing liquid in the first chamber 11 reaches the third predetermined position, the air extractor 41 evacuates the first chamber 11 and maintains the vacuum degree of the first chamber between-0.04 Mpa and-0.07 Mpa.

As a preferred embodiment, the wafer processing system 400 may further include a fourth controller and a fourth liquid level sensor, the fourth liquid level sensor is disposed in the first box, and the fourth controller is in communication with the driving device 18 and the fourth liquid level sensor; when the liquid level of the wafer processing liquid in the first box body reaches a fourth preset position, the fourth liquid level sensor is used for sending a rotation signal to the fourth controller; when the fourth controller receives the rotation signal, the fourth controller is configured to send a rotation signal to the driving device 18, and the driving device 18 rotates to drive the electromagnetic device to rotate. Preferably, the fourth level sensor is configured to send a rotation signal to the fourth controller when the level of the wafer processing liquid in the first tank 11 is just brought into contact with the lowest point of the wafer 91; when the fourth controller receives the rotation signal, the fourth controller is configured to send a rotation signal to the driving device 18, and the driving device 18 rotates to drive the electromagnetic device to rotate. In the embodiment, the wafer 91 starts to rotate when the wafer processing liquid starts to contact with the lowest point of the wafer, so that the wafer corrosion is prevented from being uneven due to the fact that the wafer processing liquid enters from the lower part and contacts with the lower part of the wafer first, and therefore, the wafer processing liquid can be ensured to be in even contact with all parts of the wafer 91.

As a preferred embodiment, the wafer processing system 400 further includes a fifth controller and a fifth liquid level sensor, the fifth liquid level sensor is disposed in the first box 11, and the fifth controller is in communication connection with the driving device 18 and the fifth liquid level sensor; when the liquid level of the wafer processing liquid in the first box body 11 is lowered to a fifth preset position, the fifth liquid level sensor is used for sending a rotation stopping signal to the fifth controller; when the fifth controller receives the rotation stop signal, the fifth controller is configured to send a rotation stop signal to the driving device 18, so that the driving device 18 stops the rotation of the electromagnetic device. Preferably, when the liquid level of the wafer processing liquid in the first tank body is lowered to the lowest point of the wafer and just leaves the lowest point of the wafer, the fifth liquid level sensor is used for sending a rotation stopping signal to the fifth controller; when the fifth controller receives the rotation stop signal, the fifth controller is configured to send a rotation stop signal to the driving device 18, so that the driving device 18 stops the rotation of the electromagnetic device. The embodiment stops the rotation of the wafer 91 when the liquid level of the wafer processing liquid is lowered to be lower than the lowest point of the wafer 91, so as to prevent the wafer processing liquid from contacting the wafer part which is submerged for a longer time than the part which is not submerged, thereby being beneficial to ensuring that all parts of the wafer 91 are uniformly contacted with the wafer processing liquid.

In other embodiments, the first controller, the second controller, the third controller, the fourth controller, and the fifth controller may also be integrated into one controller. The first actuator, the second actuator and the third actuator can be related equipment operated by a mechanical hand or related equipment operated by a human.

In the reservoir 50 of the present embodiment, one side surface of the reservoir 50 may be transparent, and of course, all of the 4 side surfaces may be transparent. The material of the side surface can be acrylic, glass, resin and the like. As shown in fig. 10, the liquid level meter 54 of the present embodiment is a float level meter 54, and is installed in the reservoir tank 50 by a fixing plate 55. In other embodiments, a different level gauge 54 may be used. The reservoir 50 is further provided with an outlet 51, an inlet 52, and a return port 53, and as shown in fig. 1, the inlet 52 is used for introducing the wafer processing liquid L. The outlet 51 communicates with the wafer processing apparatus 100, and is used for supplying the wafer processing apparatus 100 with the wafer processing liquid L. The circular processing liquid L flowing out from the drain port 17 of the wafer processing apparatus 100 may flow into the reservoir 50 again through the return port 53, or may be directly discharged to a sewage treatment apparatus. The flow direction of the round treatment liquid L can be controlled and regulated by means of the respective valve 42.

While the embodiments of the present invention have been described, it is clear that various changes and modifications can be made by workers in the field without departing from the technical spirit of the present invention.

Claims

1. A wafer processing device for pre-wetting or corroding wafers comprises a first box body, wherein a containing cavity is formed in the first box body and is used for introducing wafer processing liquid,

the wafer processing equipment also comprises a wafer driving disc, the wafer driving disc is arranged in the first box body and can rotate relative to the first box body, and the wafer driving disc is used for fixing a wafer so as to enable the wafer to rotate along with the wafer driving disc; at least one driving metal is arranged on the wafer driving disc;

the wafer processing equipment further comprises a driving device, the driving device is arranged outside the first box body and connected with the electromagnetic device, the driving device drives the electromagnetic device to rotate, the driving metal rotates along with the electromagnetic device under the action of electromagnetic induction, and the driving metal drives the wafer driving disc to rotate.

2. The wafer processing apparatus of claim 1,

the drive metal is embedded in the plastic to form a drive clad metal.

3. The wafer processing apparatus of claim 1,

the electromagnetic device is connected with a driving device through the connecting arm, and the driving device is positioned at the position where the axial extension line of the center of a circle of the wafer driving disc is intersected with the outer surface of one side of the first box body;

the driving metal is positioned on one side, close to the driving device, of the wafer driving disc, the electromagnetic device is driven by the driving device to rotate, the rotation track of the electromagnetic device can cover an electromagnetic induction area of at least one driving metal on the wafer driving disc, and then electromagnetic induction is generated to drive the wafer driving disc to rotate.

4. The wafer processing apparatus of claim 1,

the wafer driving disc comprises two circular surfaces and at least one wafer clamping groove, a wafer is placed between the two circular surfaces, the wafer clamping groove is located between the two circular surfaces and used for fixing the wafer, and the wafer clamping grooves are distributed along the circumference of the wafer driving disc.

5. The wafer processing apparatus of claim 1,

the lateral wall of first box is equipped with extraction opening, pressure release mouth, relief valve, the extraction opening is used for connecting air exhaust device, the extraction opening position is higher than the highest position of the wafer treatment fluid of holding intracavity, first box is equipped with inlet and leakage fluid dram, the inlet is used for inputing wafer treatment fluid, the leakage fluid dram is used for discharging wafer treatment fluid, the inlet with the leakage fluid dram is located first box downside.

6. The wafer processing apparatus of claim 1,

the wafer processing equipment is driven to incline from the vertical position to the horizontal position by the driving mechanism.

7. The wafer processing apparatus of claim 6,

the wafer processing equipment swings back and forth under the driving of the driving mechanism.

8. The wafer processing apparatus of claim 7,

the inclination angle of the wafer processing equipment is 0-30 degrees, and the swing speed of the wafer processing equipment is 0-1 radian/minute.

9. A wafer processing system, characterized in that,

the wafer processing system comprises the wafer processing apparatus as claimed in any one of claims 1 to 5.

10. The wafer processing system of claim 9,

the wafer processing system also comprises an air extractor and a liquid storage tank, wherein the air extractor is communicated with the wafer processing equipment; the liquid storage tank is used for storing wafer processing liquid and communicated with the wafer processing equipment through a pipeline.

11. The wafer processing system of claim 10,

the wafer processing system further comprises a first controller, a first actuator and a first liquid level sensor, wherein the first liquid level sensor is arranged in the liquid storage tank, and the first controller is in communication connection with the first actuator and the first liquid level sensor;

when the liquid level of the wafer processing liquid in the liquid storage tank reaches a first preset position, the first liquid level sensor is used for sending a full signal to the first controller;

and when the first controller receives the full signal, the first controller is used for sending a closing signal to the first actuator, and the first actuator closes the wafer processing liquid inlet of the liquid storage tank.

12. The wafer processing system of claim 11,

when the liquid level of the wafer processing liquid in the liquid storage tank reaches a first preset position, the volume of the wafer processing liquid in the liquid storage tank is larger than the volume of the wafer processing liquid required by the first tank body to submerge the highest point of the wafer.

13. The wafer processing system of claim 11,

before the wafer processing liquid enters the first box body, the first actuator is also used for opening the first box body, putting a wafer into the wafer driving disc, and closing and sealing the first box body; the first controller is further in communication connection with the air extracting device, when the first box body is sealed, the first controller is used for sending a starting signal to the air extracting device, and the air extracting device is used for continuously extracting gas in the first box body within a preset time period.

14. The wafer processing system of claim 11,

the air extractor is also communicated with the liquid storage tank, and the first controller is in communication connection with the air extractor;

15. The wafer processing system of claim 10,

the wafer processing system further comprises a second controller, a second actuator and a second liquid level sensor, wherein the second liquid level sensor is arranged in the first box body, and the second controller is in communication connection with the second actuator and the second liquid level sensor;

when the liquid level of the wafer processing liquid in the first box body is lowered to a second preset position, the second liquid level sensor is used for sending a taking-out signal to the second controller;

and after the second controller receives the taking-out signal, the second controller is used for sending an opening signal to the second actuator, and the second actuator opens the first box body and takes out the wafer in the first box body.

16. The wafer processing system of claim 15,

when the liquid level of the wafer processing liquid in the first box body is lowered to a second preset position, the liquid level of the wafer processing liquid in the first box body is lower than the lowest point of the wafer in the first box body.

17. The wafer processing system of claim 10,

the wafer processing system further comprises a third controller, a third actuator and a third liquid level sensor, wherein the third liquid level sensor is arranged in the first box body, and the third controller is in communication connection with the third actuator and the third liquid level sensor;

when the liquid level of the wafer processing liquid in the first box body reaches a third preset position, the third liquid level sensor is used for sending a stop signal to the third controller;

and when the third controller receives the stop signal, the third controller is used for sending the stop signal to the third actuator, and the third actuator closes the inlet of the wafer processing liquid of the first box body.

18. The wafer processing system of claim 17,

when the liquid level of the wafer processing liquid in the first box body reaches a third preset position, the liquid level of the wafer processing liquid in the first box body is higher than the highest point of the wafer.

19. The wafer processing system of claim 17,

the third controller is also in communication connection with the air extracting device, and when the third controller receives the stop signal, the third controller is used for sending a start signal to the air extracting device, and the air extracting device is used for continuously extracting the gas in the first box body within a preset time period.

20. The wafer processing system of claim 10,

the wafer processing system further comprises a fourth controller and a fourth liquid level sensor, the fourth liquid level sensor is arranged in the first box body, and the fourth controller is in communication connection with the driving device and the fourth liquid level sensor;

when the liquid level of the wafer processing liquid in the first box body reaches a fourth preset position, the fourth liquid level sensor is used for sending a rotation signal to the fourth controller;

and after the fourth controller receives the rotation signal, the fourth controller is used for sending a rotation signal to the driving device, and the driving device rotates to drive the electromagnetic device to rotate.

21. The wafer processing system of claim 20,

when the liquid level of the wafer processing liquid in the first box body reaches the fourth preset position, the liquid level of the wafer processing liquid in the first box body does not exceed the lowest point of the wafer in the first box body.

22. The wafer processing system of claim 10,

the wafer processing system further comprises a fifth controller and a fifth liquid level sensor, the fifth liquid level sensor is arranged in the first box body, and the fifth controller is in communication connection with the driving device and the fifth liquid level sensor;

when the liquid level of the wafer processing liquid in the first tank body is lowered to a fifth preset position, the fifth liquid level sensor is used for sending a rotation stopping signal to the fifth controller;

and after the fifth controller receives the rotation stopping signal, the fifth controller is used for sending a rotation stopping signal to the driving device, the driving device stops rotating, and the electromagnetic device stops rotating.

23. The wafer processing system of claim 22,

when the liquid level of the wafer processing liquid in the first box body is lowered to a fifth preset position, the liquid level of the wafer processing liquid in the first box body is lower than the lowest point of the wafer in the first box body.