CN216527000U

CN216527000U - High heat dissipating core mainboard

Info

Publication number: CN216527000U
Application number: CN202122703698.1U
Authority: CN
Inventors: 苗华祥; 彭卫华; 伍贤龙
Original assignee: Shenzhen Guoshuohong Electronics Co ltd
Current assignee: Shenzhen Guoshuohong Electronics Co ltd
Priority date: 2021-11-07
Filing date: 2021-11-07
Publication date: 2022-05-13
Anticipated expiration: 2031-11-07

Abstract

The utility model discloses a core mainboard with high heat dissipation performance, which comprises a mainboard body; the bottom of the main board body is provided with a fixed plate, the upper surface of the fixed plate is fixedly connected with a connecting plate, a cavity is formed in the connecting plate, an air bag is arranged in the cavity, the top end of the connecting plate is provided with an air outlet hole, the air outlet hole is communicated with the air bag, the top end of the air bag is fixedly connected with a movable plate, and the upper end of the movable plate penetrates through the side wall of the cavity and is fixedly connected with the main board body.

Description

High heat dissipating core mainboard

Technical Field

The utility model relates to the technical field of motherboards, in particular to a core mainboard with high heat dissipation performance.

Background

The mainboard (also known as mainboard, system board, logic board, motherboard, bottom plate, etc. are the center or the main circuit board that constitutes complicated electronic system such as electronic computer, will realize the vibrations to the mainboard body at the in-process that computer terminal removed, however the vibrations of the mainboard body are generally not realized to current high heat dissipating core mainboard, consequently the damage of mainboard body appears easily, simultaneously because the mainboard body will produce the heat at the staff, if the heat does not dispel for a long time, then influences the performance of mainboard body.

SUMMERY OF THE UTILITY MODEL

The present invention is directed to a core motherboard with high heat dissipation capability, which solves the above problems.

In order to achieve the purpose, the utility model provides the following technical scheme:

the core mainboard with high heat dissipation performance comprises a mainboard body;

the improved air bag structure is characterized in that a fixing plate is arranged at the bottom of the main board body, the upper surface of the fixing plate is fixedly connected with a connecting plate, a cavity is formed in the connecting plate, an air bag is arranged in the cavity, an air outlet hole is formed in the top end of the connecting plate and is communicated with the air bag, a movable plate is fixedly connected to the top end of the air bag, and the upper end of the movable plate penetrates through the side wall of the cavity and is fixedly connected with the main board body.

As a further scheme of the utility model: an air inlet is formed in the side wall of the connecting plate, and the air bag is communicated with the air inlet.

As a further scheme of the utility model: and a one-way valve is fixedly connected in the air inlet.

As a further scheme of the utility model: the lower surface of the moving plate is fixedly connected with an elastic pad, and the bottom end of the elastic pad is fixedly connected to the bottom of the cavity.

As a further scheme of the utility model: the elastic cushion is made of rubber elastic materials.

As a further scheme of the utility model: the venthole is communicated with the air bag through a first soft pipe.

As a further scheme of the utility model: the air bag is communicated with the air inlet through a second soft pipe.

Compared with the prior art, the utility model has the beneficial effects that: at the in-process of mainboard body vibrations, because movable plate fixed connection is at the lower surface of mainboard body, consequently will realize the movable plate and reciprocate at the in-process of mainboard body vibrations, will realize the extrusion to the air bag at the in-process that the movable plate moves down to realize that the gas in the air bag is discharged to the venthole through first soft pipe, realize the heat dissipation of blowing to mainboard body bottom through the venthole.

According to the utility model, the gas in the airbag bag is blown to the bottom of the main board body in the vibration process of the main board body, so that the heat dissipation of the bottom of the main board body is realized.

Drawings

FIG. 1 is a schematic diagram of a core motherboard with high heat dissipation;

FIG. 2 is a side view of a core motherboard with high heat dissipation;

FIG. 3 is a schematic diagram of a core motherboard with high heat dissipation;

in the figure: 1. a main board body; 2. a fixing plate; 3. a connection plate; 4. a cavity; 5. an air bag; 6. an air outlet; 7. moving the plate; 8. an air inlet; 9. a one-way valve; 10. an elastic pad; 11. a first soft tube; 12. a second soft tube.

Detailed Description

The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.

Referring to fig. 1-3, in the embodiment of the utility model, the core motherboard with high heat dissipation performance includes a motherboard body 1;

the bottom of the main board body 1 is provided with a fixed plate 2, the upper surface of the fixed plate 2 is fixedly connected with a connecting plate 3, a cavity 4 is formed in the connecting plate 3, an air bag 5 is arranged in the cavity 4, an air outlet 6 is formed in the top end of the connecting plate 3, the air outlet 6 is communicated with the air bag 5, a movable plate 7 is fixedly connected to the top end of the air bag 5, and the upper end of the movable plate 7 penetrates through the side wall of the cavity 4 and is fixedly connected with the main board body 1.

An air inlet hole 8 is arranged on the side wall of the connecting plate 3, and the air bag 5 is communicated with the air inlet hole 8.

A one-way valve 9 is fixedly connected in the air inlet hole 8.

The lower surface of the moving plate 7 is fixedly connected with an elastic pad 10, and the bottom end of the elastic pad 10 is fixedly connected to the bottom of the cavity 4.

The material of the elastic pad 10 is a rubber elastic material.

The air outlet 6 is communicated with the air bag 5 through a first soft tube 11.

The air bag 5 is communicated with the air inlet hole 8 through a second soft tube 12.

When the air bag type air-conditioner is used, in the vibration process of the main board body 1, the movable plate 6 is fixedly connected to the lower surface of the main board body 1, so that the movable plate 6 moves up and down in the vibration process of the main board body 1, the air bag 5 is extruded in the downward movement process of the movable plate 6, and therefore air in the air bag 5 is discharged into the air outlet hole 6 through the first soft tube 11, and air blowing and heat dissipation of the bottom of the main board body 1 are achieved through the air outlet hole 6.

In the process that the moving plate 6 moves upwards, the air bag 5 is relaxed, so that the purpose that outside air enters the air bag 5 through the air inlet hole 8 to inflate the air bag 5 is achieved.

"fixedly connected" as described in the present invention means that two parts connected to each other are fixed together, typically by welding, screwing or gluing; "rotationally coupled" means that two components are coupled together and capable of relative motion.

Although the present description is described in terms of embodiments, not every embodiment includes only a single embodiment, and such description is for clarity only, and those skilled in the art should be able to integrate the description as a whole, and the embodiments can be appropriately combined to form other embodiments as will be understood by those skilled in the art.

Therefore, the above description is only a preferred embodiment of the present application, and is not intended to limit the scope of the present application; all changes which come within the meaning and range of equivalency of the claims are to be embraced within their scope.

Claims

1. The core mainboard with high heat dissipation performance is characterized by comprising a mainboard body (1);

mainboard body (1) bottom is provided with fixed plate (2), the last fixed surface of fixed plate (2) is connected with board (3) mutually, cavity (4) have been seted up in board (3) mutually, be provided with air bag (5) in cavity (4), venthole (6) have been seted up on the top of board (3) mutually, venthole (6) are linked together with air bag (5), the top fixedly connected with movable plate (7) of air bag (5), the upper end of movable plate (7) pass the lateral wall of cavity (4) and with mainboard body (1) fixed connection.

2. The core motherboard with high heat dissipation performance as recited in claim 1, wherein the side wall of the connection board (3) is opened with an air inlet hole (8), and the airbag (5) is communicated with the air inlet hole (8).

3. The core motherboard with high heat dissipation performance as recited in claim 2, wherein a check valve (9) is fixedly connected in the air inlet hole (8).

4. The core motherboard with high heat dissipation performance as claimed in claim 1, wherein an elastic pad (10) is fixedly connected to the lower surface of the moving plate (7), and the bottom end of the elastic pad (10) is fixedly connected to the bottom of the cavity (4).

5. The core motherboard with high heat dissipation performance as recited in claim 4, wherein the material of the elastic pad (10) is a rubber elastic material.

6. The core board with high heat dissipation performance according to claim 1, wherein the air outlet hole (6) is communicated with the airbag (5) through a first soft tube (11).

7. The core board with high heat dissipation performance according to claim 2, wherein the airbag (5) is communicated with the air inlet hole (8) through a second hose (12).