CN216514082U - Evaporation source pre-melting baffle structure of semiconductor evaporation coating equipment - Google Patents
Evaporation source pre-melting baffle structure of semiconductor evaporation coating equipment Download PDFInfo
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- CN216514082U CN216514082U CN202122745518.6U CN202122745518U CN216514082U CN 216514082 U CN216514082 U CN 216514082U CN 202122745518 U CN202122745518 U CN 202122745518U CN 216514082 U CN216514082 U CN 216514082U
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Abstract
The utility model relates to an evaporation source pre-melting baffle plate structure of semiconductor evaporation coating equipment in the technical field of baffle plate structures, which comprises an evaporation source pre-melting baffle plate and a connecting rod, wherein the evaporation source pre-melting baffle plate is connected to the connecting rod through a fixing block bolt, the connecting rod is installed on a rotating shaft of the semiconductor evaporation coating equipment, and the evaporation source pre-melting baffle plate is positioned right above an evaporation source. The utility model effectively prevents molecules or atoms generated by the evaporation source during dispersion and premelting from leaking onto the product through the baffle, improves the quality of the product and reduces the cost; the baffle plate can be effectively rotated by using the connecting rod, so that the baffle plate is convenient to use.
Description
Technical Field
The utility model relates to the technical field of baffle plate structures, in particular to an evaporation source pre-melting baffle plate structure of semiconductor evaporation coating equipment.
Background
When the semiconductor evaporation coating equipment is used, evaporation raw materials need to be added into a crucible of the equipment, and the added evaporation raw materials need to be pre-melted before normal evaporation coating, so that the upper surface of the raw materials in the crucible is kept flat and uniform. Atoms or molecules evaporated when the evaporation raw material in the crucible is pre-melted are not allowed to leak onto the product, so that the product is not adversely affected. When the semiconductor evaporation coating equipment is used, atoms or molecules emitted by an evaporation source (the evaporation source: evaporation raw material added into a crucible) during pre-melting of the evaporation source are found to leak onto a product, so that adverse effects are caused on the product, and the equipment cannot completely shield the atoms or molecules emitted by the evaporation source during pre-melting; the design can solve the problem that atoms or molecules emitted by the evaporation source leak to a product to cause bad products when the evaporation source is pre-melted.
The utility model discloses an evaporation source baffle structure, which belongs to the technical field of baffle structures and can effectively solve the problem of material cross contamination caused by simultaneous heating of a plurality of materials in a cavity on an OLED test line and a mass production line, and is found by the search of the prior art patent documents, wherein the utility model has the patent publication number of CN 103834921A; the phenomenon of hole blocking caused by material falling due to the fact that the material is deposited on the evaporation source baffle plate on an OLED test line and a mass production line can be effectively prevented; the used OLED material can be better collected and used for material recovery and purification, and the cost is reduced. Comprises a plurality of metal baffles which are adjacent to each other but not in contact; the metal baffle plates comprise arc-shaped shielding surfaces, one surfaces of the shielding surfaces, which face away from the evaporation source, are convex surfaces, one surfaces of the shielding surfaces, which face towards the evaporation source, are concave surfaces, and the arc surface angles of the shielding surfaces of two adjacent metal baffle plates are consistent; two ends of the shielding surface are respectively bent towards the direction of the evaporation source to form two lower edges with the same length, and an inner notch is formed between the lower edges and the shielding surface. The utility model provides a rotatable baffle plate structure, which solves the problem that molecules or atoms emitted by an evaporation source leak to a product to cause poor product when the evaporation source is pre-melted. Therefore, the method disclosed in the document and the utility model belong to different inventive concepts.
SUMMERY OF THE UTILITY MODEL
Aiming at the defects in the prior art, the utility model aims to provide an evaporation source pre-melting baffle plate structure of a semiconductor evaporation coating device.
The evaporation source premelting baffle plate structure of the semiconductor evaporation coating equipment comprises an evaporation source premelting baffle plate and a connecting rod, wherein the evaporation source premelting baffle plate is connected to the connecting rod through a fixing block bolt;
the evaporation source premelting baffle comprises an arc-shaped plate and a first inner thread screw hole, the first inner thread screw hole is located on the arc-shaped plate, and the first inner thread screw hole is connected with a fixing block bolt.
In some embodiments, one surface of the arc-shaped plate facing the evaporation source is a concave surface, and the other surface of the arc-shaped plate facing away from the evaporation source is a convex surface.
In some embodiments, the connecting rod comprises a rod body, a connecting rod fixing hole and a reserved fixing hole, wherein the connecting rod fixing hole is formed in one end of the rod body, and the reserved fixing hole is formed in the other end of the rod body.
In some embodiments, the first internal thread screw hole is aligned with the axis of the connecting rod fixing hole, and the fixing block bolt passes through the connecting rod fixing hole and is connected with the first internal thread screw hole.
In some embodiments, the fixing block bolt is an outer screw bolt, and the fixing block bolt is clamped in the inner screw hole.
In some embodiments, the body is a one-piece T-bar.
In some embodiments, the reserved fixing hole connects the connecting rod to a rotating shaft of the semiconductor evaporation coating equipment through a fixed jackscrew bolt.
In some embodiments, the connecting rod further comprises a second internal thread screw hole, the second internal thread screw hole is connected to the side edge of the rod body, the second internal thread screw hole is connected with the reserved fixing hole, and the fixed jackscrew bolt is locked through the second internal thread screw hole.
In some embodiments, the arcuate plates are elliptical.
Compared with the prior art, the utility model has the following beneficial effects:
according to the utility model, molecules or atoms emitted from the evaporation source during pre-melting are effectively prevented from leaking onto the product through the baffle plate, the quality of the product is improved, and the cost is reduced; the baffle plate can be effectively rotated by using the connecting rod, so that the baffle plate is convenient to use.
Drawings
Other features, objects and advantages of the utility model will become more apparent upon reading of the detailed description of non-limiting embodiments with reference to the following drawings:
FIG. 1 is a top view of the present invention;
FIG. 2 is a front view of the present invention;
FIG. 3 is a schematic structural diagram of an evaporation source premelting baffle according to the present invention;
FIG. 4 is a top view of the connecting rod of the present invention;
fig. 5 is a right side view of the connecting rod of the present invention.
Detailed Description
The present invention will be described in detail with reference to specific examples. The following examples will assist those skilled in the art in further understanding the utility model, but are not intended to limit the utility model in any way. It should be noted that it would be obvious to those skilled in the art that various changes and modifications can be made without departing from the spirit of the utility model. All falling within the scope of the present invention.
Example 1
The utility model provides an evaporation source pre-melting baffle structure of semiconductor evaporation coating equipment, which comprises an evaporation source pre-melting baffle 1 and a connecting rod 2, wherein the evaporation source pre-melting baffle 1 is connected to the connecting rod 2 through a fixed block bolt 3, the connecting rod 2 is arranged on a rotating shaft of the semiconductor evaporation coating equipment, and the evaporation source pre-melting baffle 1 is positioned right above an evaporation source. The evaporation source premelting baffle plate 1 comprises an arc-shaped plate 11 and a first internal thread screw hole 12, wherein the first internal thread screw hole 12 is positioned on the arc-shaped plate 11, one surface of the arc-shaped plate 11 facing the evaporation source is a concave surface, and the other surface of the arc-shaped plate facing away from the evaporation source is a convex surface.
The connecting rod 2 comprises a rod body 21, a connecting rod fixing hole 22, a reserved fixing hole 23 and a second internal thread screw hole 24, and preferably, the rod body 21 is an integrated T-shaped rod. One end of the rod body 21 is provided with a connecting rod fixing hole 22, and the other end of the rod body 21 is provided with a reserved fixing hole 23. The second internal thread screw hole 24 is connected to the side of the rod body 21, and the second internal thread screw hole 24 is connected to the reserved fixing hole 23. The fixed jackscrew bolt 4 penetrates through the reserved fixing hole 23 and is locked through the second internal thread screw hole 24, so that the connecting rod 2 is connected to a rotating shaft of the semiconductor evaporation coating equipment. Preferably, the rotating shaft of the semiconductor evaporation coating equipment is a rotating shaft for controlling the opening and closing of the pre-melting baffle of the evaporation source.
The first internal thread screw hole 12 and the axis of the connecting rod fixing hole 22 are maintained on the same vertical line, and the fixing block bolt 3 passes through the connecting rod fixing hole 22 to be connected with the first internal thread screw hole 12. Preferably, the fixing block bolt 3 is an outer screw bolt, and the fixing block bolt 3 is clamped in the first inner screw hole 12.
Example 2
This embodiment 2 is completed on the basis of embodiment 1, and the arc plate 11 is oval, specifically:
the arcuate plate 11 is an elliptical shape including, but not limited to, an elliptical shape with equal wall thickness. The advantage of oval wall thickness arc 11 structure such as: the reserved opening above the crucible evaporation source is rectangular, the ellipse is easier to block molecules or atoms emitted by the evaporation source when the evaporation source is pre-melted than a circular baffle, and the ellipse has no sharp corner part, so that the space occupied by the ellipse is more saved than a square baffle; the equal-wall-thickness arc-shaped plate is easier to block molecules or atoms emitted by the evaporation source when the evaporation source is pre-melted than the plane plate.
In the description of the present application, it is to be understood that the terms "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", and the like indicate orientations or positional relationships based on those shown in the drawings, and are only for convenience in describing the present application and simplifying the description, but do not indicate or imply that the referred device or element must have a specific orientation, be constructed in a specific orientation, and be operated, and thus, should not be construed as limiting the present application.
The foregoing description of specific embodiments of the present invention has been presented. It is to be understood that the present invention is not limited to the specific embodiments described above, and that various changes or modifications may be made by one skilled in the art within the scope of the appended claims without departing from the spirit of the utility model. The embodiments and features of the embodiments of the present application may be combined with each other arbitrarily without conflict.
Claims (9)
1. An evaporation source pre-melting baffle structure of semiconductor evaporation coating equipment is characterized by comprising an evaporation source pre-melting baffle (1) and a connecting rod (2), wherein the evaporation source pre-melting baffle (1) is connected to the connecting rod (2) through a fixing block bolt (3), the connecting rod (2) is installed on a rotating shaft of the semiconductor evaporation coating equipment, and the evaporation source pre-melting baffle (1) is positioned right above an evaporation source;
the evaporation source premelting baffle plate (1) comprises an arc-shaped plate (11) and a first internal thread screw hole (12), the first internal thread screw hole (12) is located on the arc-shaped plate (11), and the first internal thread screw hole (12) is connected with the fixing block bolt (3).
2. The evaporation source pre-melting baffle structure of semiconductor evaporation coating equipment according to claim 1, wherein one side of the arc-shaped plate (11) facing the evaporation source is concave, and the other side facing away from the evaporation source is convex.
3. The evaporation source premelting baffle structure of the semiconductor evaporation coating equipment according to claim 1, wherein the connecting rod (2) comprises a rod body (21), a connecting rod fixing hole (22) and a reserved fixing hole (23), the connecting rod fixing hole (22) is arranged at one end of the rod body (21), and the reserved fixing hole (23) is arranged at the other end of the rod body (21).
4. The evaporation source pre-melting baffle structure of semiconductor evaporation coating equipment according to claim 3, wherein the first female screw hole (12) is maintained at the same vertical line with the axis of the connecting rod fixing hole (22), and the fixing block bolt (3) passes through the connecting rod fixing hole (22) to connect with the first female screw hole (12).
5. The evaporation source premelting baffle structure of the semiconductor evaporation coating equipment according to claim 1, wherein the fixed block bolt (3) is an outer screw bolt, and the fixed block bolt (3) is clamped in the inner screw hole (12).
6. The evaporation source pre-melting baffle structure of semiconductor evaporation coating equipment according to claim 3, wherein the rod body (21) is an integral T-shaped rod.
7. The evaporation source premelting baffle structure of the semiconductor evaporation coating equipment according to claim 3, wherein the reserved fixing holes (23) connect the connecting rod (2) to a rotating shaft of the semiconductor evaporation coating equipment through fixing jackscrew bolts (4).
8. The evaporation source premelting baffle structure of the semiconductor evaporation coating equipment according to claim 7, wherein the connecting rod (2) further comprises a second internal thread screw hole (24), the second internal thread screw hole (24) is connected to the side edge of the rod body (21), the second internal thread screw hole (24) is communicated with the reserved fixing hole (23), and the fixed jackscrew bolt (4) is locked through the second internal thread screw hole (24).
9. The evaporation source pre-melting baffle structure of semiconductor evaporation coating equipment according to claim 1, wherein the arc plate (11) is oval.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202122745518.6U CN216514082U (en) | 2021-11-10 | 2021-11-10 | Evaporation source pre-melting baffle structure of semiconductor evaporation coating equipment |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202122745518.6U CN216514082U (en) | 2021-11-10 | 2021-11-10 | Evaporation source pre-melting baffle structure of semiconductor evaporation coating equipment |
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| CN216514082U true CN216514082U (en) | 2022-05-13 |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114481036A (en) * | 2022-01-19 | 2022-05-13 | 安徽光智科技有限公司 | Crucible baffle for coating film |
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2021
- 2021-11-10 CN CN202122745518.6U patent/CN216514082U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114481036A (en) * | 2022-01-19 | 2022-05-13 | 安徽光智科技有限公司 | Crucible baffle for coating film |
| CN114481036B (en) * | 2022-01-19 | 2023-12-05 | 安徽光智科技有限公司 | Crucible baffle for coating film |
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