CN216506436U - Semiconductor plastic package mold convenient to discharge - Google Patents
Semiconductor plastic package mold convenient to discharge Download PDFInfo
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- CN216506436U CN216506436U CN202122783791.8U CN202122783791U CN216506436U CN 216506436 U CN216506436 U CN 216506436U CN 202122783791 U CN202122783791 U CN 202122783791U CN 216506436 U CN216506436 U CN 216506436U
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Abstract
The utility model discloses a semiconductor plastic package mold convenient for discharging, which comprises a base and a bottom plate, wherein the bottom plate slides on the top of the base and is horizontally arranged, the top of the bottom plate is fixedly connected with a lower mold, the top of the lower mold is provided with an upper mold, the top of the upper mold is fixedly connected with a top plate and is horizontally arranged, two ends of the top of the base are horizontally provided with clamping plates in a sliding manner, a synchronous moving mechanism for synchronously moving the two clamping plates is arranged in the base, four opposite side surfaces of the two clamping plates are fixedly connected with rectangular blocks, four ends of one symmetrical side surface of the bottom plate are respectively provided with a rectangular groove matched with the rectangular blocks, the interior of the lower mold is hollow, and a transverse plate is arranged in the lower mold in a sliding manner and is horizontally arranged. According to the plastic package mold, the transverse plate can be driven to move by repulsive force generated by the two magnets only by moving the upper mold, and the transverse plate drives the ejector rod to jack up, so that synchronous discharging can be performed, and the using effect of the plastic package mold is improved.
Description
Technical Field
The utility model relates to the technical field of semiconductor plastic package dies, in particular to a semiconductor plastic package die convenient for discharging.
Background
The mold is a tool for manufacturing a molded article, and the tool is composed of various parts, different molds are composed of different parts, and a semiconductor plastic package mold is required during semiconductor plastic package.
The existing semiconductor plastic package mold does not have the function of facilitating discharging and the function of fixing the lower mold, so that the lower mold is likely to deviate, the using effect of the semiconductor plastic package mold is reduced, and therefore the semiconductor plastic package mold facilitating discharging needs to be designed urgently.
SUMMERY OF THE UTILITY MODEL
The utility model aims to solve the defects in the prior art, and provides a semiconductor plastic package mold convenient for discharging.
In order to achieve the purpose, the utility model adopts the following technical scheme:
a semiconductor plastic package mold convenient for discharging comprises a base and a bottom plate, wherein the bottom plate slides on the top of the base and is horizontally arranged, the top of the bottom plate is fixedly connected with a lower mold, the top of the lower mold is provided with an upper mold, the top of the upper mold is fixedly connected with a top plate and is horizontally arranged, two ends of the top of the base are horizontally slid with clamping plates, a synchronous moving mechanism for synchronously moving the two clamping plates is arranged in the base, four opposite side surfaces of the two clamping plates are fixedly connected with rectangular blocks, four symmetrical side surfaces of the bottom plate are respectively provided with a rectangular groove matched with the rectangular blocks, the lower mold is hollow, a transverse plate is arranged in the lower mold in a sliding manner, a top rod is vertically fixed at the center of the periphery of the top of the transverse plate and is respectively slid in the lower mold, four top rods respectively penetrate through the top of the lower mold, four ends of one symmetrical side surface at the bottom of the lower mold are respectively provided with a connecting mechanism for connecting the transverse plate, and one side of the transverse plate is fixed with an L-shaped rod and slides in the lower die, and the top of the vertical edge of the L-shaped rod penetrates through the top of the lower die.
As a further scheme of the utility model, the synchronous moving mechanism comprises a screw rod and a sliding block, the screw rod horizontally rotates in the base, a driving motor is horizontally arranged on one side in the base, and an output shaft of the driving motor is arranged at the center of the top end of the screw rod.
As a further scheme of the utility model, the sliding block slides in the base, the screw rod is connected in the sliding block through threads, one symmetrical side surface of the sliding block is hinged with the movable rods, and two ends of the two movable rods, which are far away from each other, are hinged with the sliding plate.
As a further scheme of the utility model, the two sliding plates horizontally slide at two ends in the base respectively, C-shaped rods are fixed at four ends of the far side surfaces of the two clamping plates, and the lower transverse edges of the four C-shaped rods are fixed at four ends of two far sides of the two sliding plates respectively.
As a further scheme of the utility model, the connecting mechanism comprises a sleeve, the sleeve is fixedly connected to the inner bottom of the lower die and is vertically arranged, a loop bar slides in the sleeve, the top of the loop bar penetrates through the top of the sleeve and is fixed to the bottom of the transverse plate, and a reset mechanism for resetting the transverse plate is arranged on the surface of the loop bar.
As a further scheme of the utility model, the reset mechanism comprises a spring, the spring is sleeved on the surface of the loop bar, and two ends of the spring are respectively arranged at the bottom of the transverse plate and the top of the sleeve.
The utility model has the beneficial effects that:
1. according to the plastic package mold, when the plastic package mold is used, the upper mold and the lower mold are closed, the upper mold can extrude the L-shaped rod to enable the L-shaped rod to move towards the interior of the lower mold, the L-shaped rod can drive the transverse plate to move, the transverse plate can drive the ejector rod and the sleeve rod to move, the sleeve rod can enable the spring to generate elastic force through moving, so that the ejector rod and a mold cavity of the lower mold are flush, when discharging is needed, the transverse plate can be driven to move through the elastic force generated by the spring only by moving the upper mold, the transverse plate drives the ejector rod to jack up, synchronous discharging can be achieved, and the using effect of the plastic package mold is improved.
2. According to the limiting device, when the plastic package mold is required to be limited, the driving motor drives the lead screw to rotate, the lead screw rotates to drive the sliding block to move, the sliding block moves to drive the two movable rods to move, the two movable rods move to drive the two sliding plates to move, the two sliding plates move to drive the four C-shaped rods to move, the four C-shaped rods move to drive the two clamping plates to move, the two clamping plates move to drive the four rectangular blocks to move, and therefore the four rectangular blocks can slide into the four rectangular grooves respectively, the plastic package mold can be further limited, and the practicability of the plastic package mold is further improved.
Drawings
Fig. 1 is a schematic structural diagram of a semiconductor plastic package mold capable of facilitating discharging according to the utility model;
fig. 2 is a schematic view of the internal structure of a base of a semiconductor plastic package mold for facilitating discharging according to the present invention;
fig. 3 is a cross-sectional view of a lower mold of a semiconductor plastic package mold that can facilitate discharging according to the present invention.
In the figure: 1. a base; 2. a base plate; 3. a lower die; 4. a top plate; 5. an upper die; 6. a top rod; 7. a rectangular groove; 8. a splint; 9. a rectangular block; 10. a C-shaped rod; 11. a slide plate; 12. a screw rod; 13. a drive motor; 14. a slider; 15. a movable rod; 16. a transverse plate; 17. an L-shaped rod; 18. a sleeve; 19. a loop bar; 20. a spring.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments.
Referring to fig. 1-3, a semiconductor plastic package mold facilitating discharging comprises a base 1 and a bottom plate 2, wherein the bottom plate 2 slides on the top of the base 1 and is horizontally arranged, the top of the bottom plate 2 is fixedly connected with a lower mold 3, the top of the lower mold 3 is provided with an upper mold 5, the top of the upper mold 5 is fixedly connected with a top plate 4 and is horizontally arranged, two ends of the top of the base 1 are horizontally provided with clamping plates 8, a synchronous moving mechanism for synchronously moving the two clamping plates 8 is arranged in the base 1, four opposite side surfaces of the two clamping plates 8 are fixedly connected with rectangular blocks 9, four symmetrical side surfaces of the bottom plate 2 are respectively provided with a rectangular groove 7 matched with the rectangular blocks 9, the lower mold 3 is hollow, a transverse plate 16 slides in the lower mold 3 and is horizontally arranged, ejector rods 6 are vertically fixed at the centers of the periphery of the transverse plate 16 and slide in the lower mold 3, and four ejector pins 6 all pass the top of the lower die 3, four ends of a symmetrical side surface at the bottom in the lower die 3 are all provided with a connecting mechanism for connecting a transverse plate 16, an L-shaped rod 17 is fixed on one side of the transverse plate 16 and slides inside the lower die 3, and the top of the vertical edge of the L-shaped rod 17 passes through the top of the lower die 3.
In this embodiment, the synchronous moving mechanism includes a screw rod 12 and a slider 14, the screw rod 12 horizontally rotates inside the base 1, a driving motor 13 is horizontally installed on one side inside the base 1, and an output shaft of the driving motor 13 is installed at the center of the top end of the screw rod 12.
In this embodiment, the sliding block 14 slides inside the base 1, and the screw rod 12 is connected inside the sliding block 14 through threads, a symmetrical side surface of the sliding block 14 is hinged with a movable rod 15, and two ends of the two movable rods 15 far away are hinged with a sliding plate 11.
In this embodiment, two sliding plates 11 horizontally slide in the inside both ends of base 1 respectively, and four ends of the side that two splint 8 kept away from all are fixed with C type pole 10, and four C type pole 10 lower horizontal edges are fixed in four ends of both sides that two sliding plates 11 kept away from respectively.
In this embodiment, the connecting mechanism includes a sleeve 18, and the sleeve 18 is fixedly connected to the bottom of the lower mold 3 and vertically disposed, a sleeve rod 19 slides inside the sleeve 18, and the top of the sleeve rod 19 passes through the top of the sleeve 18 and is fixed to the bottom of the transverse plate 16, and a resetting mechanism for resetting the transverse plate 16 is disposed on the surface of the sleeve rod 19.
In this embodiment, the return mechanism includes a spring 20, and the spring 20 is sleeved on the surface of the sleeve rod 19, and two ends of the spring 20 are respectively installed at the bottom of the transverse plate 16 and the top of the sleeve 18.
The working principle of the embodiment is as follows: when the plastic package mold is used in practical use, when the plastic package mold is used, the upper mold 5 and the lower mold 3 are closed, the upper mold 5 can extrude the L-shaped rod 17 to move towards the inside of the lower mold 3, the L-shaped rod 17 can drive the transverse plate 16 to move, the transverse plate 16 can drive the ejector rod 6 and the sleeve rod 19 to move, the sleeve rod 19 can drive the spring 20 to generate elastic force, so that the mold cavities of the ejector rod 6 and the lower mold 3 are flush, when discharging is needed, the transverse plate 16 can be driven to move by the elastic force generated by the spring 20 as long as the upper mold 5 is moved upwards, the transverse plate 16 can drive the ejector rod 6 to jack up, synchronous discharging can be carried out, the using effect of the plastic package mold is improved, when the plastic package mold is needed to be limited, the lead screw 12 is driven to rotate by the driving motor 13, the lead screw 12 rotates to drive the slide block 14 to move, the slide block 14 moves to drive the two movable rods 15 to move, and the two movable rods 15 move to drive the two slide plates 11 to move, two slides 11 remove and to drive four C type poles 10 and remove, and four C type poles 10 remove and to drive two splint 8 and remove, and two splint 8 remove and to drive four rectangular block 9 and remove to can make four rectangular block 9 slide into four rectangle recess 7 respectively inside, further can carry on spacingly to the plastic envelope mould, and then improve this plastic envelope mould's practicality.
Having shown and described the basic principles and essential features of the utility model and its advantages, it will be evident to those skilled in the art that the utility model is not limited to the details of the foregoing illustrative embodiments, and that the present invention may be embodied in other specific forms without departing from the spirit or essential characteristics thereof, and it is therefore intended that the embodiments be considered as illustrative and not restrictive in all respects, the scope of the utility model being indicated by the appended claims rather than by the foregoing description, and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein, any reference signs in the claims being therefore intended to be embraced therein.
Furthermore, it should be understood that although the present description refers to embodiments, not every embodiment may contain only a single embodiment, and such description is for clarity only, and those skilled in the art should integrate the description, and the embodiments may be combined as appropriate to form other embodiments understood by those skilled in the art.
Claims (6)
1. The semiconductor plastic package mold convenient for discharging comprises a base (1) and a bottom plate (2), and is characterized in that the bottom plate (2) slides on the top of the base (1) and is horizontally arranged, the top of the bottom plate (2) is fixedly connected with a lower mold (3), the top of the lower mold (3) is provided with an upper mold (5), the top of the upper mold (5) is fixedly connected with a top plate (4) and is horizontally arranged, two ends of the top of the base (1) are horizontally slid with clamping plates (8), a synchronous moving mechanism for synchronously moving the two clamping plates (8) is arranged in the base (1), four opposite sides of the two clamping plates (8) are fixedly connected with rectangular blocks (9), four ends of a symmetrical side of the bottom plate (2) are respectively provided with rectangular grooves (7) matched with the rectangular blocks (9), the interior of the lower mold (3) is hollow, and lower mould (3) inside slides there are diaphragm (16) and level setting, diaphragm (16) top center department all around is vertical all be fixed with ejector pin (6) and all slide inside lower mould (3), and four ejector pins (6) all pass lower mould (3) top, bottom symmetry side four ends all are equipped with the coupling mechanism who is used for connecting diaphragm (16) in lower mould (3), and diaphragm (16) one side is fixed with L shaped rod (17) and slides inside lower mould (3), lower mould (3) top is passed at L shaped rod (17) perpendicular limit top.
2. The semiconductor plastic package mold convenient for discharging according to claim 1, wherein the synchronous moving mechanism comprises a screw rod (12) and a slide block (14), the screw rod (12) horizontally rotates inside the base (1), a driving motor (13) is horizontally installed on one side inside the base (1), and an output shaft of the driving motor (13) is installed at the center of the top end of the screw rod (12).
3. The semiconductor plastic package mold convenient to discharge according to claim 2, wherein the sliding block (14) slides inside the base (1), the lead screw (12) is connected inside the sliding block (14) through threads, a symmetrical side surface of the sliding block (14) is hinged with the movable rod (15), and two ends of the two movable rods (15) away from each other are hinged with the sliding plate (11).
4. A semiconductor plastic package mold convenient for discharging according to claim 3, wherein two sliding plates (11) horizontally slide at two ends inside the base (1) respectively, and C-shaped rods (10) are fixed at four ends of the far side of the two clamping plates (8), and the lower transverse edges of the four C-shaped rods (10) are fixed at four ends of two far sides of the two sliding plates (11) respectively.
5. The semiconductor plastic package mold convenient to discharge according to claim 4, wherein the connecting mechanism comprises a sleeve (18), the sleeve (18) is fixedly connected to the inner bottom of the lower mold (3) and vertically arranged, a loop bar (19) slides inside the sleeve (18), the top of the loop bar (19) penetrates through the top of the sleeve (18) and is fixed to the bottom of the transverse plate (16), and a resetting mechanism for resetting the transverse plate (16) is arranged on the surface of the loop bar (19).
6. The semiconductor plastic package mold convenient to discharge according to claim 5, wherein the reset mechanism comprises a spring (20), the spring (20) is sleeved on the surface of the loop bar (19), and two ends of the spring (20) are respectively installed at the bottom of the transverse plate (16) and the top of the sleeve (18).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202122783791.8U CN216506436U (en) | 2021-11-15 | 2021-11-15 | Semiconductor plastic package mold convenient to discharge |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202122783791.8U CN216506436U (en) | 2021-11-15 | 2021-11-15 | Semiconductor plastic package mold convenient to discharge |
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| Publication Number | Publication Date |
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| CN216506436U true CN216506436U (en) | 2022-05-13 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN202122783791.8U Active CN216506436U (en) | 2021-11-15 | 2021-11-15 | Semiconductor plastic package mold convenient to discharge |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117690832A (en) * | 2024-01-02 | 2024-03-12 | 浙江大学 | Semiconductor device packaging device |
| CN117690832B (en) * | 2024-01-02 | 2024-05-24 | 浙江大学 | Semiconductor device packaging device |
-
2021
- 2021-11-15 CN CN202122783791.8U patent/CN216506436U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117690832A (en) * | 2024-01-02 | 2024-03-12 | 浙江大学 | Semiconductor device packaging device |
| CN117690832B (en) * | 2024-01-02 | 2024-05-24 | 浙江大学 | Semiconductor device packaging device |
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